CN103496042A - Slurry flow guide rod mechanism of solar silicon wafer fretsaw cutting machine - Google Patents
Slurry flow guide rod mechanism of solar silicon wafer fretsaw cutting machine Download PDFInfo
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- CN103496042A CN103496042A CN201310448958.2A CN201310448958A CN103496042A CN 103496042 A CN103496042 A CN 103496042A CN 201310448958 A CN201310448958 A CN 201310448958A CN 103496042 A CN103496042 A CN 103496042A
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- cutting machine
- flow guide
- solar silicon
- diversion rod
- rod mechanism
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Abstract
The invention discloses a slurry flow guide rod mechanism of a solar silicon wafer fretsaw cutting machine, and relates to the technical field of solar silicon wafer cutting machines. The slurry flow guide rod mechanism at least comprises two flow guide rods, and the flow guide rods are respectively provided with a length telescopic mechanism. The flow guide rods of the slurry flow guide rod mechanism of the solar silicon wafer fretsaw cutting machine are in sliding fit with a sliding rail through sliding blocks, and the sliding rail is perpendicular to the length direction of the flow guide rods. The slurry flow guide rod mechanism has the advantages that through the length telescopic mechanisms, the sliding blocks and the sliding rail of the slurry flow guide rod mechanism of the solar silicon wafer fretsaw cutting machine, the length and the horizontal positions of the flow guide rods can be adjusted according to the width of a fretsaw and the width of a cut silicon ingot, slurry is saved, the processing adaptability of the solar silicon wafer fretsaw cutting machine is improved, and working efficiency is improved.
Description
Technical field
The present invention relates to solar silicon wafers slicer technical field.
Background technology
In the solar silicon wafers process of manufacture, need through steps such as polishing, chamfering, cutting, cleaning, detections.In the cutting technique of silicon chip, the machine guide wheel is at the middle drive line of cut that runs up, thereby by line of cut, cutting fluid delivered to cutting area, in the running up of line of cut with silicon ingot occur the to have rubbed process of cutting.In the silicon chip cutting process in order to stablize the flow of cutting fluid, cutting fluid can be spread on line of cut uniformly, need to a nozzle be installed at the cutting fluid pipe end, thereby control the flow direction of cutting fluid, in nozzle ends, a diversion rod respectively is installed, prevent that cutting fluid is retracted to together because of surface tension effects, stablize and the heavy curtain of uniform cutting fluid to form one.
At present, existing diversion rod is fixed by screws on workbench and cannot moves, and the length of diversion rod is changeless, so diversion rod can not be regulated according to the broadband of steel wire can not be according to the position of the width adjusting horizontal direction of silicon ingot, make the practicality of scroll saw descend, and also wasted slurry.
Summary of the invention
The technical problem to be solved in the present invention is to provide that a kind of length can be stretched, position transportable solar silicon wafers scroll saw cutting machine slurry diversion rod mechanism, it can adjust diversion rod length according to the length of steel wire, width adjustment position according to silicon ingot, improved the flexibility (adaptability) of operation of solar silicon wafers scroll saw cutting machine, and saved slurry, improved operating efficiency.
The technical solution used in the present invention is to provide a kind of solar silicon wafers scroll saw cutting machine slurry diversion rod mechanism, at least comprises two diversion rods, and described diversion rod is all with telescopic mechanism.
Preferably, the diversion rod of solar silicon wafers scroll saw cutting machine slurry diversion rod mechanism is slidably matched by slide block and slide rail, and slide rail is vertical with the diversion rod length direction.
Preferably, the telescopic mechanism of solar silicon wafers scroll saw cutting machine slurry diversion rod mechanism comprises mozzle, flexible pipe, and described mozzle comprises the sleeve pipe that at least 3 diameters are different; Described at least 3 sleeve pipes are slidably matched and seal; Described sleeve pipe is provided with a round; The sealing of described mozzle outer end, inner end and tube socket also are fixed on slide block.
Preferably, the telescopic mechanism of solar silicon wafers scroll saw cutting machine slurry diversion rod mechanism comprises stationary pipes, sliding tube, flexible pipe, and described stationary pipes inner end and tube socket also are fixed on slide block; The sealing of sliding tube outer end; Stationary pipes is inserted in the bottom of sliding tube, and is slidably matched with sliding tube and seals; Described sliding tube is provided with a round.
The beneficial effect that the present invention produces is: solar silicon wafers scroll saw cutting machine slurry diversion rod mechanism with telescopic mechanism, slide block, slide rail make the length of diversion rod and horizontal level to be regulated according to the width of scroll saw and the width of the silicon ingot that cuts, saved slurry, improve the flexibility (adaptability) of operation of solar silicon wafers scroll saw cutting machine, improved operating efficiency.
The accompanying drawing explanation
Fig. 1 is the structural representation of the embodiment of the present invention 1;
Fig. 2 is the structural representation of the embodiment of the present invention 2.
In figure, 1 slide block, 2 slide rails, 3 mozzles, 31 sleeve pipes, 4 holes, 5 flexible pipes, 6 stationary pipes, 7 sliding tubes.
The specific embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation.
Shown in Fig. 1 embodiment, a kind of solar silicon wafers scroll saw cutting machine slurry diversion rod mechanism, at least comprise two diversion rods, it is characterized in that described diversion rod is all with telescopic mechanism.
Further, the diversion rod of solar silicon wafers scroll saw cutting machine slurry diversion rod mechanism is slidably matched by slide block 1 and slide rail 2, and slide rail 2 is vertical with the diversion rod length direction.
Further explain the present embodiment, current solar silicon wafers scroll saw cutting machine slurry diversion rod mechanism is fixed on workbench and cannot stretches up and down and translation.For the scroll saw cutting machine, the length of silicon ingot is divided into a lot of specifications.When cutting silicon wafer, will be according to the length of silicon ingot, adjust suitable saw wire winding width, the length of the diversion rod of traditional scroll saw cutting machine is changeless, so the slurry scope of ejection is also constant, the width that can not be wound around according to steel wire is regulated, and will slattern a lot of slurries like this, has increased production cost.Further, the width of the silicon ingot that the scroll saw cutting machine cuts neither be fixed, and traditional scroll saw cutting machine diversion rod cannot translation.When steel wire does not also arrive silicon ingot, a part of slurry can drip from steel wire, can not participate in the silicon ingot cutting zone, so also can cause the waste of slurry, the increase of production cost.For the present embodiment, the width that the telescopic mechanism that diversion rod has makes the length of diversion rod to be wound around according to steel wire is regulated, and allows slurry all be sprinkled upon on steel wire; The slide block 1 that diversion rod has, slide rail 2 make the diversion rod can translation on workbench, according to the width adjustment of silicon ingot, go out suitable position, slurry are sprinkled upon to the cutting zone of steel wire.By the present embodiment diversion rod telescopic mechanism, slide block 1, slide rail 2, saved slurry, improved production efficiency, reduced production cost.
Further, the telescopic mechanism of solar silicon wafers scroll saw cutting machine slurry diversion rod mechanism comprises mozzle 3, flexible pipe 5, and described mozzle 3 comprises the different sleeve pipe of at least 3 diameters 31; Described at least 3 sleeve pipes 31 are slidably matched and seal; Described sleeve pipe 31 is provided with a round 4; Described mozzle 3 outer end sealings, inner end and flexible pipe 5 are socketed and are fixed on slide block 1.
Further explain the present embodiment: the telescopic mechanism of diversion rod forms by least three sleeve pipes that are slidably matched 31, by the collapsing length between adjusting sleeve pipe 31, can adjust the length coordinated with the steel wire winding width, to guarantee that slurry all is sprinkled upon on steel wire; Round 4 effects on sleeve pipe 31 are that slurry is evenly spilt; The slide rail 2 of diversion rod mechanism and slide block 1, make diversion rod realize translation, to guarantee slurry, is sprinkled upon in cutting zone.
The difference of the present embodiment and embodiment 1 is: solar silicon wafers scroll saw cutting machine slurry diversion rod mechanism, and described telescopic mechanism comprises stationary pipes 6, sliding tube 7, flexible pipe 5, described stationary pipes 6 inner ends and flexible pipe 5 are socketed and are fixed on slide block 1; Sliding tube 7 outer end sealings; Stationary pipes 6 is inserted in the bottom of sliding tube 7, and is slidably matched and seals with sliding tube 7; Described sliding tube 7 is provided with a round 4.
Further explain the present embodiment: different from embodiment 1, the telescopic mechanism of the present embodiment is not slidably socketed and forms by a plurality of sleeve pipes 31, but by stationary pipes 6 and sliding tube 7 formation that is slidably matched.Stationary pipes 6 is fixed on slide block 1, only by sliding tube 7 stretch into and extract out the length of regulating diversion rod, the unstability of having avoided so a plurality of sleeve pipes 31 to be slidably matched, improved sealing, the reliability of diversion rod.
Claims (4)
1. a solar silicon wafers scroll saw cutting machine slurry diversion rod mechanism, at least comprise two diversion rods, it is characterized in that described diversion rod is all with telescopic mechanism.
2. solar silicon wafers scroll saw cutting machine slurry diversion rod according to claim 1 mechanism, is characterized in that diversion rod passes through slide block (1) and is slidably matched with slide rail (2), and slide rail (2) is vertical with the diversion rod length direction.
3. solar silicon wafers scroll saw cutting machine slurry diversion rod according to claim 1 mechanism, it is characterized in that described telescopic mechanism comprises mozzle (3), flexible pipe (5), described mozzle (3) comprises the different sleeve pipe of at least 3 diameters (31); Described at least 3 sleeve pipes (31) are slidably matched and seal; Described sleeve pipe (31) is provided with a round (4); The sealing of described mozzle (3) outer end, inner end and flexible pipe (5) are socketed and are fixed on slide block (1).
4. solar silicon wafers scroll saw cutting machine slurry diversion rod according to claim 1 mechanism, it is characterized in that described telescopic mechanism comprises stationary pipes (6), sliding tube (7), flexible pipe (5), described stationary pipes (6) inner end and flexible pipe (5) are socketed and are fixed on slide block (1); The sealing of sliding tube (7) outer end; Stationary pipes (6) is inserted in the bottom of sliding tube (7), and is slidably matched and seals with sliding tube (7); Described sliding tube (7) is provided with a round (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310448958.2A CN103496042B (en) | 2013-09-28 | 2013-09-28 | Solar silicon wafers saw blade cutting machine slurry diversion rod mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310448958.2A CN103496042B (en) | 2013-09-28 | 2013-09-28 | Solar silicon wafers saw blade cutting machine slurry diversion rod mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103496042A true CN103496042A (en) | 2014-01-08 |
| CN103496042B CN103496042B (en) | 2016-03-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310448958.2A Expired - Fee Related CN103496042B (en) | 2013-09-28 | 2013-09-28 | Solar silicon wafers saw blade cutting machine slurry diversion rod mechanism |
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| CN (1) | CN103496042B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104191538A (en) * | 2014-08-28 | 2014-12-10 | 北京京仪集团涿鹿光伏材料有限公司 | Flushing treatment device for wafers after slicing machine wire breakage |
| CN110315652A (en) * | 2019-07-17 | 2019-10-11 | 安徽三优光电科技有限公司 | A kind of solar silicon wafers saw blade cutting machine |
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| CN202016134U (en) * | 2011-04-25 | 2011-10-26 | 宇骏(潍坊)新能源科技有限公司 | Quick release type flow guide rod for solar silicon wafer slicing machine |
| CN202572676U (en) * | 2012-04-17 | 2012-12-05 | 上海安稷实业有限公司 | Mortar blasting device of multi-wire sawing machine |
| CN202964939U (en) * | 2012-12-21 | 2013-06-05 | 天津英利新能源有限公司 | Fretsaw cutter of silicon blocks |
| CN203008335U (en) * | 2012-12-05 | 2013-06-19 | 宜宾天仁装饰工程有限责任公司 | Coating rolling brush capable of freely changing length of brush rod |
| CN203557559U (en) * | 2013-09-28 | 2014-04-23 | 衡水英利新能源有限公司 | Slurry flow guide rod mechanism for wire sawing machine for solar silicon wafers |
-
2013
- 2013-09-28 CN CN201310448958.2A patent/CN103496042B/en not_active Expired - Fee Related
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07195358A (en) * | 1993-12-29 | 1995-08-01 | Nippei Toyama Corp | Slurry supply method and nozzle of wire saw |
| JPH10100141A (en) * | 1996-10-02 | 1998-04-21 | Mitsubishi Materials Shilicon Corp | Slurry supply apparatus of wire saw and cutting method of ingot |
| JPH10309667A (en) * | 1997-05-12 | 1998-11-24 | Nippei Toyama Corp | Slurry circulating device, wire saw, and recording medium |
| JPH10337647A (en) * | 1997-06-06 | 1998-12-22 | Nippei Toyama Corp | Wire saw and recording medium |
| US7052374B1 (en) * | 2005-03-01 | 2006-05-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Multipurpose slurry delivery arm for chemical mechanical polishing |
| US20100210189A1 (en) * | 2009-02-13 | 2010-08-19 | Taiwan Semiconductor Manufacturing Co., Ltd. | Slurry dispenser for chemical mechanical polishing (cmp) apparatus and method |
| CN202016134U (en) * | 2011-04-25 | 2011-10-26 | 宇骏(潍坊)新能源科技有限公司 | Quick release type flow guide rod for solar silicon wafer slicing machine |
| CN202572676U (en) * | 2012-04-17 | 2012-12-05 | 上海安稷实业有限公司 | Mortar blasting device of multi-wire sawing machine |
| CN203008335U (en) * | 2012-12-05 | 2013-06-19 | 宜宾天仁装饰工程有限责任公司 | Coating rolling brush capable of freely changing length of brush rod |
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| CN203557559U (en) * | 2013-09-28 | 2014-04-23 | 衡水英利新能源有限公司 | Slurry flow guide rod mechanism for wire sawing machine for solar silicon wafers |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104191538A (en) * | 2014-08-28 | 2014-12-10 | 北京京仪集团涿鹿光伏材料有限公司 | Flushing treatment device for wafers after slicing machine wire breakage |
| CN110315652A (en) * | 2019-07-17 | 2019-10-11 | 安徽三优光电科技有限公司 | A kind of solar silicon wafers saw blade cutting machine |
| CN110315652B (en) * | 2019-07-17 | 2021-07-06 | 安徽三优光电科技有限公司 | Solar silicon wafer scroll saw cutting machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103496042B (en) | 2016-03-09 |
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Granted publication date: 20160309 Termination date: 20160928 |