CN103489993A - High-reliability flip LED light source and LED module light source - Google Patents
High-reliability flip LED light source and LED module light source Download PDFInfo
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- CN103489993A CN103489993A CN201310469888.9A CN201310469888A CN103489993A CN 103489993 A CN103489993 A CN 103489993A CN 201310469888 A CN201310469888 A CN 201310469888A CN 103489993 A CN103489993 A CN 103489993A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
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Abstract
The invention discloses a high-reliability flip LED light source and an LED module light source. The high-reliability flip LED light source comprises a flip LED chip and a reflection cup, wherein the reflection cup is composed of a first half cup body, a second half cup body and an insulation base, the first half cup body and the second half cup body are arranged oppositely, the insulation base is located on the bottom of the reflection cup and is arranged at the position where the two half cup bodies are connected, the LED chip is installed on the bottom of the reflection cup, the P electrode and the N electrode of the LED chip are electrically connected with the two half cup bodies respectively, the first half cup body and the second half cup body are formed integrally by high-radiating metal materials, the outer side of the first half cup body and the outer side of the second half cup body are wrapped with insulating material layers respectively, and an optical transformation substance layer is further arranged in the reflection cup in a pouring mode. Compared with the prior art, the high-reliability flip LED light source and the LED module light source have the advantages of being more excellent in radiating performance, better in reliability, and good in luminous efficiency.
Description
Technical field
The invention belongs to the LED technical field, be specifically related to a kind of heat dispersion more high reliability flip LED light source and LED die set light source thereof.
Background technology
Along with the LED application is increasingly extensive, competition is also white-hot day by day, thereby high performance-price ratio becomes LED product breakthrough sharp weapon.In order to pursue high performance-price ratio, industry adopts the small-sized package body usually, increases the chip drives electric current, has agreed with to a certain extent current development trend.Along with drive current constantly promotes, the heat that LED chip produces is more and more, and how industry is placed on the thermal endurance aspect of lifting bracket plastic material by attentiveness, and plastic cement material has also experienced the differentiation from PPA, PCT, EMC to SMC.Although above-mentioned plastic cement material heat resistance promotes successively, have the common defects of poor thermal conductivity, and above-mentioned plastic cement is not suitable for needing the special procedures such as the flip chip bonding of high-temperature operation environment and eutectic.
At present, LED product basic structure is all that LED chip is fixed on a substrate.
Wherein, the LED chip structure comprises three kinds of positive assembling structure, vertical stratification and inverted structures, and flip LED chips is very common a kind of in LED light source, and its P, N electrode be the relative another side in the LED chip light-emitting area all.
Wherein, the LED substrate mostly is aluminium base or copper base copper-clad plate, its structure comprises the metallic substrates that is positioned at bottom, is positioned at the insulating barrier on described metallic substrates and is positioned at the circuit layer on described insulating barrier, the P of the LED chip of inverted structure, N electrode are with regard to the electrical connection of the circuit layer on direct and substrate, and circuit layer is as extraction electrode.The metallic substrates of LED substrate aluminium, the copper metal material splendid by pyroconductivity made, the insulating barrier of LED substrate is made by high molecular polymer, because the conductive coefficient of macromolecular material is only 0.2～0.5W/mK, cause the pyroconductivity of metal-based circuit board (MCPCB) that 1W/mK～3W/mK is also only arranged, and then make the heat conductivility of existing LED light source not good.
The LED light source heat conductivility is not good, will directly affect the reliabilities such as useful life of LED light source.Therefore, how to obtain the LED light source of the better high reliability of heat conductivility extremely urgent.
Summary of the invention
For the above deficiency of prior art, the high reliability flip LED light source that provides a kind of heat dispersion better is provided the first purpose of the present invention, and the LED die set light source that provides a kind of heat dispersion better is provided the second purpose of the present invention.
In order to realize the first goal of the invention of the present invention, the technical solution used in the present invention is as follows:
A kind of high reliability flip LED light source, the LED chip that comprises inverted structure, this LED light source also comprises a reflector, described reflector by the first half cups that are oppositely arranged and the second half cups and the insulator foot of the two halves cup connecting portion at the bottom of being positioned at glass form; Described LED chip is arranged on the bottom of reflector, and the P electrode of this LED chip and N electrode are electrically connected with half cup respectively; Described the first half cups and the second half cups are one-body molded by high heat radiating metal material; The outside at described the first half cups and the second half cups also is coated with insulation material layer; Also be perfused with light transformation substance layer in described reflector.
Further, be filled with high reflection white glue between described LED chip and reflector sidewall.
Further, in described emission cup, also be perfused with layer of silica gel, described layer of silica gel is positioned on LED chip, and described smooth transformation substance layer is positioned on described layer of silica gel.
Further, at described reflector opening, be provided with anti-creep glue step, described anti-creep glue step is concordant with the upper surface of layer of silica gel.
Further, the step surface of described anti-creep glue step is rough interfaces.
Further, be outside equipped with optical lens at described smooth transformation substance layer.
Further, described insulator foot is convex.
Further, described insulator foot and insulation material layer are made by diamond-film-like (DLC) or diamond film or ceramic membrane.
Further, the inwall of described reflector is sphere, parabola or hyperboloid through precise polished.
Further, also be electroplate with the high reflecting metal material thin-layer on the inwall of described reflector.
In order to realize the second goal of the invention of the present invention, the technical solution used in the present invention is as follows:
A kind of LED die set light source, this die set light source consists of the aforesaid high reliability flip LED of a plurality of any one light source.
Further, each high reliability flip LED light source arranges separately an optical lens or shares an optical lens.
The present invention breaks through Traditional Thinking in order to improve heat dispersion, removed traditional substrate, but directly reflector is divided into to two and half cups, two electrodes of packed LED chip directly are electrically connected with two and half cups, the supporting role of original substrate has been played in the bottom of two and half cups, also have the extraction electrode effect of substrate circuit layer simultaneously concurrently, and can also be used for reflecting the LED chip bright dipping to improve light extraction efficiency.Moreover, each half cup is one-body molded by high heat radiating metal material, and the heat that absorbs simultaneously and conduct heat that LED chip bottom produces and gather in reflector when luminous, improve radiating effect of the present invention greatly.
Certainly, in order to prevent short circuit between LED chip two electrodes, the present invention is provided with insulator foot at two halves cup connecting portion.
And, in order further to improve reliability of the present invention, the present invention also is coated with insulation material layer in the outside of described the first half cups and the second half cups.
Therefore, LED light source of the present invention and LED die set light source, with respect to prior art, not only heat dispersion is better, better reliability, and also luminous efficiency is also fine.
The accompanying drawing explanation
The picture that this accompanying drawing explanation provides is used for assisting a further understanding of the present invention, forms the application's a part, does not form inappropriate limitation of the present invention, in the accompanying drawings:
Fig. 1 is the structural representation of LED light source embodiment 1 of the present invention;
Fig. 2 is the structural representation of LED light source embodiment 2 of the present invention;
Fig. 3 is the structural representation of LED light source embodiment 3 of the present invention;
Fig. 4 is the structural representation of LED light source embodiment 4 of the present invention;
Fig. 5 is the structural representation of LED light source embodiment 5 of the present invention;
Fig. 6 is a kind of structural representation of LED light source embodiment 6 of the present invention;
Fig. 7 is the another kind of structural representation of LED light source embodiment 7 of the present invention.
In figure:
101, LED chip 102, the first half cups
103, the second half cups 104, insulator foot
105, insulation material layer 106, light transformation substance layer
107, high reflection white glue 108, layer of silica gel
109, anti-creep glue step 110, optical lens
Embodiment
In order to understand fully purpose of the present invention, feature and effect, the technique effect below with reference to accompanying drawing and specific embodiment to design of the present invention, concrete structure and generation is described further.
Embodiment 1:
As shown in Figure 1, the present embodiment discloses a kind of high reliability flip LED light source, comprises the LED chip 101 of inverted structure and the reflector of LED chip is installed, and reflector is the zone that the first half cups 102 in figure, the second half cups 103 and insulator foot 104 surround.
Wherein, reflector by the first half cups 102 that are oppositely arranged and the second half cups 103 and the insulator foot 104 of two halves cup (102, the 103) connecting portion at the bottom of being positioned at glass form, being equivalent to the present invention unites two into one substrate and reflector, and make the first half cups 102 and the second half cups 103 one-body molded by high heat radiating metal material, improve heat dispersion.So reflector of the present invention is fixed and supports LED chip and launch LED to go out light action except original, be exactly mainly for heat radiation, because the first half cups 102 and the second half cups 103 are all the moulding of high heat radiating metal material monolithic, its heat dispersion will obviously be promoted.Wherein, high heat radiating metal material is aluminium (Al), copper (Cu), the good metal materials of heat conductivility such as brill copper, gold (Au) or nickel (Ni).Insulator foot 104 of the present invention is exactly in order to prevent short circuit between LED chip two electrodes.
Wherein, LED chip 101 is arranged on the bottom of reflector, and the P electrode of this LED chip and N electrode are electrically connected with half cup (102,103) respectively, plays outside the original substrate supporting role, also as the electrode use, has therefore simplified structure of the present invention.
Wherein, easily with water in air vapour, react generation verdigris in the first half cups 102 of preparation of metals and the second half exposed air of cup 103, and exposed airborne metallic reflection cup easily leaks electricity, in order to improve reliability of the present invention, the outside at described the first half cups 102 and the second half cups 103 also is coated with insulation material layer 105
The insulator foot 104 of the present embodiment and insulation material layer 105 are made by diamond-film-like (DLC) or diamond film or ceramic membrane, the good insulating material of thermal conductivity such as diamond-film-like (DLC), diamond film and ceramic membrane, can significantly improve the product heat dispersion, especially the introducing of diamond-film-like (DLC), diamond film.Diamond-film-like (DLC) has splendid thermal conductivity (600-1200W/mk), has the remarkable advantages such as 12 times of heat diffusivities to copper material, the high strength of materials, invading property of high resistance.
More firm in order to make the first half cups 102, the second half cups 103 be connected with insulator foot 104, described insulator foot 104 is convex.
In order further to improve the light extraction efficiency of LED of the present invention, the inwall of reflector is sphere, parabola or hyperboloid through precise polished, through polishing, makes its interface smooth, and the light that is conducive to the LED reflection penetrates reflector through the reflector inner counter.
In order further to improve the light extraction efficiency of LED of the present invention, also be electroplate with the high reflecting metal material thin-layer on the inwall of described reflector.
For the light that LED chip is sent converts other colors to, also be perfused with light transformation substance layer 106 in described reflector, light transformation substance layer 106 is organic dyestuff, rare earth organic complex, the rare earth phosphor, perhaps semiconductor-quantum-point, organic dyestuff specifically can be selected fragrant alkane dyestuff, azo dyes etc., rare earth organic complex specifically can be selected europium doping dibenzoyl methane (DBM:Eu2+), terbium doped P-hydroxybenzoic acid (PHBA:Tb3+) etc., the rare earth phosphor specifically can be selected yttrium-aluminium-garnet (YAG), aluminic acid lutetium (LuAG) etc., semiconductor-quantum-point specifically can be selected cadmium sulfide (CdS), indium phosphide (InP) etc.Light transformation substance layer 107, photochromicly be converted into want photochromic for what LED chip 101 was sent, as blue light is converted into to white light etc.
Embodiment 2:
As shown in Figure 2, the present embodiment is from the different of embodiment 1: be filled with high reflection white glue 107 between described LED chip 101 and reflector sidewall.
The silica gel base material matter that this white glue 107 is high patience, in the light emission meeting chip that this reflection white glue 107 sends the LED chip sidewall, thereby promote the LED chip luminous flux.
Embodiment 3:
As shown in Figure 3, the present embodiment is from the different of embodiment 2: also be perfused with layer of silica gel 108 in described emission cup, described layer of silica gel 108 is positioned on LED chip 101, and described smooth transformation substance layer 106 is positioned on described layer of silica gel 108.
These layer of silica gel 108 refractive indexes are between 1.4～1.55, and layer of silica gel 108 upper surfaces have light transformation substance layer 106, and this light transformation substance layer 106 is layered arrangement, and concrete is the flourescent sheet structure.This embodiment adopts the remote fluorescence chip technology, owing between LED chip 101 and light transformation substance layer 106, being filled with layer of silica gel 108, makes light transformation substance layer 106 away from the LED thermal source, and product reliability is good.
Further, in the present embodiment, at described reflector opening, be provided with anti-creep glue step 109, described anti-creep glue step 109 is concordant with the upper surface of layer of silica gel 108, so that processing light transformation substance layer 106.
More excellent, the step surface of described anti-creep glue step 109 is rough interfaces, increases the adhesion between light transformation substance layer 106 and reflector.
Embodiment 4:
As shown in Figure 4, this example is different from embodiment 3 is: the present embodiment is outside equipped with optical lens 110 at light transformation substance layer 106.
This optical lens 110 be shaped as a kind of in hemisphere, square, oval, Fresnel shape, honeycombed, peanut shape, taper shape, regular hexagon, dried persimmon shape.Different shapes can realize the light type requirement that this encapsulating structure is different, and its material is one or several in Merlon (PC), polymethyl methacrylate (PMMA), silica gel (Silicone), polypropylene (EP), polyphenyl dioctyl phthalate glycol ester (PET) and glass.It realizes technique, can be traditional mold injection molding or mould and determines moulding.
Embodiment 5:
As shown in Figure 5, the present embodiment discloses a kind of LED die set light source, and this die set light source consists of Multi-instance to the described high reliability flip LED of 1-3 any one light source.
Embodiment 6:
The present embodiment discloses a kind of LED die set light source, and the present embodiment has increased optical lens on the basis of embodiment 5, and each high reliability flip LED light source arranges separately an optical lens or shares an optical lens 110.
Wherein, be illustrated in figure 7 the situation that each high reliability LED light source arranges separately an optical lens 110.
Wherein, be illustrated in figure 6 the situation that each high reliability LED light source shares an optical lens 110.
This optical lens 100 be shaped as a kind of in hemisphere, square, oval, Fresnel shape, honeycombed, peanut shape, taper shape, regular hexagon, dried persimmon shape.Different shapes can realize the light type requirement that this encapsulating structure is different, and its material is one or several in Merlon (PC), polymethyl methacrylate (PMMA), silica gel (Silicone), polypropylene (EP), polyphenyl dioctyl phthalate glycol ester (PET) and glass.It realizes technique, can be traditional mold injection molding or mould and determines moulding.
More than describe preferred embodiment of the present invention in detail, should be appreciated that those of ordinary skill in the art just can design according to the present invention make many modifications and variations without creative work.Therefore, all technical staff in the art according to the present invention design on the prior art basis by logic analysis, reasoning or according to the available technical scheme of limited experiment, all should be among the determined protection range by these claims.
Claims (12)
1. a high reliability flip LED light source comprises and it is characterized in that the LED chip of inverted structure:
This LED light source also comprises a reflector, described reflector by the first half cups that are oppositely arranged and the second half cups and the insulator foot of the two halves cup connecting portion at the bottom of being positioned at glass form;
Described LED chip is arranged on the bottom of reflector, and the P electrode of this LED chip and N electrode are electrically connected with half cup respectively;
Described the first half cups and the second half cups are one-body molded by high heat radiating metal material;
The outside at described the first half cups and the second half cups also is coated with insulation material layer;
Also be perfused with light transformation substance layer in described reflector.
2. high reliability flip LED light source according to claim 1 is characterized in that:
Be filled with high reflection white glue between described LED chip and reflector sidewall.
3. high reliability flip LED light source according to claim 2 is characterized in that:
Also be perfused with layer of silica gel in described emission cup, described layer of silica gel is positioned on LED chip, and described smooth transformation substance layer is positioned on described layer of silica gel.
4. high reliability flip LED light source according to claim 3 is characterized in that:
Be provided with anti-creep glue step at described reflector opening, described anti-creep glue step is concordant with the upper surface of layer of silica gel.
5. high reliability flip LED light source according to claim 4 is characterized in that:
The step surface of described anti-creep glue step is rough interfaces.
6. high reliability flip LED light source according to claim 3 is characterized in that:
Be outside equipped with optical lens at described smooth transformation substance layer.
7. according to the described high reliability flip LED of claim 1-6 any one light source, it is characterized in that:
Described insulator foot is convex.
8. according to the described high reliability flip LED of claim 1-6 any one light source, it is characterized in that:
Described insulator foot and insulation material layer are made by diamond-film-like (DLC) or diamond film or ceramic membrane.
9. according to the described high reliability flip LED of claim 1-6 any one light source, it is characterized in that:
The inwall of described reflector is sphere, parabola or hyperboloid through precise polished.
10. according to the described high reliability flip LED of claim 1-6 any one light source, it is characterized in that:
Also be electroplate with the high reflecting metal material thin-layer on the inwall of described reflector.
11. a LED die set light source is characterized in that: this die set light source consists of the described high reliability flip LED of a plurality of claim 1-10 any one light source.
12. LED die set light source according to claim 11 is characterized in that:
Each high reliability flip LED light source arranges separately an optical lens or shares an optical lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310469888.9A CN103489993A (en) | 2013-10-10 | 2013-10-10 | High-reliability flip LED light source and LED module light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310469888.9A CN103489993A (en) | 2013-10-10 | 2013-10-10 | High-reliability flip LED light source and LED module light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103489993A true CN103489993A (en) | 2014-01-01 |
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| CN103855293A (en) * | 2014-01-26 | 2014-06-11 | 上海瑞丰光电子有限公司 | Led |
| CN105720164A (en) * | 2014-12-05 | 2016-06-29 | 江西省晶瑞光电有限公司 | Method for preparing white LED |
| CN106384775A (en) * | 2016-10-27 | 2017-02-08 | 广东工业大学 | LED upside-down mounting structure |
| CN108644630A (en) * | 2018-06-13 | 2018-10-12 | 宁波升谱光电股份有限公司 | A kind of patch type light modulation toning LED light and preparation method thereof |
| CN110404174A (en) * | 2018-04-26 | 2019-11-05 | 卓越商用有限公司 | Use the heat pad of infrared LEDs |
| CN110444650A (en) * | 2019-09-06 | 2019-11-12 | 华引芯（武汉）科技有限公司 | A kind of DCAM lamp bead and preparation method thereof |
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| CN110404174A (en) * | 2018-04-26 | 2019-11-05 | 卓越商用有限公司 | Use the heat pad of infrared LEDs |
| CN108644630A (en) * | 2018-06-13 | 2018-10-12 | 宁波升谱光电股份有限公司 | A kind of patch type light modulation toning LED light and preparation method thereof |
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