CN103481512B - 光电传感器及其制造方法 - Google Patents

光电传感器及其制造方法 Download PDF

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CN103481512B
CN103481512B CN201310225928.5A CN201310225928A CN103481512B CN 103481512 B CN103481512 B CN 103481512B CN 201310225928 A CN201310225928 A CN 201310225928A CN 103481512 B CN103481512 B CN 103481512B
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light
composition surface
laser
resin
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CN103481512A (zh
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井上直人
森崎祐造
后勇树
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Omron Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
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    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1654—Laser beams characterised by the way of heating the interface scanning at least one of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C66/1222—Joint cross-sections combining only two joint-segments, i.e. one of the parts to be joined comprising only two joint-segments in the joint cross-section comprising at least a lapped joint-segment
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Abstract

本发明提供高品质且通过简单的制造工序获得的树脂部件、利用那样的树脂部件的光电传感器及那样的树脂部件的制造方法。树脂壳体具有：壳体（31），具有接合面（31c），由树脂形成；中间壳体（41），通过熔敷接合在接合面（31c），由能够透射激光的树脂形成；盖罩（21），相对于中间壳体配置在与壳体相反的一侧，立设在中间壳体上，由树脂形成。盖罩（21）具有：从中间壳体（41）立起的侧部（21a）；顶部（21b），在隔着中间壳体（41）与接合面（31c）相对的位置上与侧部（21a）相交叉。若以接合面（31c）为基准，则侧部（21a）和顶部（21b）相交叉的高度H在与接合面（31c）相对的任一位置都相同。

Description

光电传感器及其制造方法
技术领域
本发明通常涉及树脂部件、光电传感器以及树脂部件的制造方法，尤其涉及组装有树脂制成的多个构件的树脂部件、利用那样的树脂部件的光电传感器、以及那样的树脂部件的制造方法。
背景技术
关于利用激光的树脂的接合方法，例如在日本特开2000-218698号公报中公开了如下的通过激光进行的树脂的接合方法以及其装置，其中，将改进接合部的加工质量(品质)作为目的(专利文献1)。
在专利文献1所公开的树脂的接合方法中，将针对激光束透明的构件配置在接近激光源的一侧，并将吸收激光束的树脂或者其它材料的构件配置在远离激光源的一侧并使之与透明的构件重合。然后，在激光源和透明的构件之间配置具有应接合的形状的开口部的掩模，并越过上述掩模来照射激光束。
另外，在日本特开2003-225946号公报中公开了将稳定粘接作为目的的激光粘接方法以及激光粘接装置(专利文献2)。
专利文献2所公开的激光粘接方法包括如下工序：从照射激光的接合部附近的正上方，通过按压夹具将透射激光的接合体按压于被接合体上的工序；从上述按压夹具的斜侧方对接合部照射激光的工序。
现有技术文献
专利文献
专利文献1：日本特开2000-218698号公报
专利文献2：日本特开2003-225946号公报
如在上述的专利文献中公开那样，已知如下的树脂的接合方法，即，使能够透射激光的透射性树脂构件与吸收激光能量的吸收性树脂构件重合，并从透射性树脂构件一侧照射激光。在这样的接合方法中，吸收性树脂构件的表面因激光能量而发热，并且上述热还传递至透射性树脂构件，由此使两个树脂构件熔化而相互接合在一起。
另一方面，根据利用上述接合方法来制造的树脂部件的形状不同，从激光器头朝向透射性树脂构件照射的激光的一部分可能被树脂部件遮挡。在该情况下，担忧在遮挡激光的树脂部件的部位发生熔化和燃烧，尤其担忧在接近激光的焦点(树脂构件的接合面)的位置发生熔化和燃烧。由此，存在树脂部件的品质下降的问题。
另外，当由于遮挡激光的一部分而在传递至接合面的能量中产生偏差时，为了回避该问题而需要强化对激光的照射能量的复杂的控制。另外，也考虑从倾斜方向对接合面照射激光来使不对激光发生干涉，但是在该情况下，用于照射激光的设备成本增加，激光器头的移动控制变得复杂。
发明内容
因此，本发明的目的在于解决上述的问题，提供一种高品质且通过简单的制造工序获得的树脂部件、利用那样的树脂部件的光电传感器以及那样的树脂部件的制造方法。
本发明的树脂部件具有：第一构件，其具有接合面，由树脂形成；中间构件，其通过熔敷接合在接合面上，由能够透射激光的树脂形成；第二构件，其相对于中间构件配置在与第一构件相反的一侧，并且立设在中间构件上，由树脂形成。第二构件具有：侧部，其从中间构件立起；顶部，其在隔着中间构件与接合面相对的位置上，与侧部相交叉。以接合面为基准，侧部和顶部相交叉的高度在与接合面相对的任一位置上都相同。
根据这样构成的树脂部件，在从中间构件一侧照射激光来将中间构件接合在第一构件的接合面时，即使激光在侧部和顶部相交叉的位置上被第二构件局部遮挡，从接合面到通过上述第二构件遮挡激光的位置为止的高度在与接合面相对的任一位置上都相同。由此，能够消除因激光的照射而在第二构件的局部发生熔化和燃烧的现象，从而能够提高树脂部件的品质。另外，抑制传递至接合面的激光的能量发生偏差，因此能够通过简单的制造工序来制造树脂部件。
另外，优选第一构件和中间构件沿着环绕成环状的接合面相接合；在用与接合面平行的平面切断第二构件的情况下，侧部具有与接合面的环绕形状相同或者相似的截面。根据这样构成的树脂部件，在使激光沿着接合面进行扫描时，能够更有效地抑制传递至接合面的能量发生偏差的情况。
另外，优选在侧部和顶部相交叉的位置上设置有倒角。更优选为，将侧部和顶部相交叉的位置切成斜面状或者弯曲面状，来形成倒角。
根据这样构成的树脂部件，能够有效地抑制在第二构件的侧部和顶部相交叉的位置上发生熔化和燃烧的情况。
本发明的光电传感器，利用上述的任一树脂部件。光电传感器具有：用于发出光的投光部以及用于接受光的受光部中的至少一个；反射镜，其使投光部所发出的光反射到检测对象物或者使从投光部朝向检测对象物发出的光反射到受光部。第一构件是容置投光部以及受光部中的至少一个的主体壳体。第二构件是容置反射镜并且隔着中间构件固定在主体壳体上的罩体。
根据这样构成的光电传感器，能够实现高品质且通过简单的制造工序获得的光电传感器。
另外，优选反射镜具有用于反射光的反射面，该反射镜以反射面沿着相对于接合面倾斜的方向延伸的方式容置于罩体中。根据这样构成的光电传感器，在具有相对于反射面倾斜地配置的反射镜的光电传感器中，能够得到上述的效果。
本发明的树脂部件的制造方法，用于制造上述的任一树脂部件。树脂部件的制造方法包括如下工序：通过熔敷将中间构件接合在第二构件上；使中间构件与接合面重合，并且将激光器头定位在与接合面相对的位置；一边使激光器头以及树脂部件以维持激光的光轴与接合面垂直的关系的方式相对移动，一边使激光越过第二构件照射接合面。
根据这样构成的光电传感器的制造方法，能够防止对激光的照射能量的控制、对激光器头或者树脂部件的移动控制变得复杂，能够防止用于照射激光的设备成本增加。
如上说明，按照本发明，能够提供一种高品质且通过简单的制造工序获得的树脂部件、利用那样的树脂部件的光电传感器以及那样的树脂部件的制造方法。
附图说明
图1是本发明的实施方式的光电传感器的整体结构图。
图2是示出图1中的光电传感器的传感器头部的剖视图。
图3是示出图1中的光电传感器的传感器头部的另一剖视图。
图4是示出从图3中的箭头IV所示的方向观察的传感器头部的立体图。
图5是示出从图3中的箭头V所示的方向观察的传感器头部的立体图。
图6是将图2中的光电传感器的传感器头部局部放大的剖视图。
图7是示出在盖罩上设置的倒角部的变形例的剖视图。
图8是示出图6中的树脂壳体的制造方法的第一工序的剖视图。
图9是示出图6中的树脂壳体的制造方法的第二工序的剖视图。
图10是示出图6中的树脂壳体的制造方法的第二工序的侧视图。
图11是示出比较例的树脂壳体的制造方法的工序的立体图。
图12是示出比较例的树脂壳体的另一制造方法的工序的立体图。
具体实施方式
参照附图，对本发明的实施方式进行说明。此外，在下面参照的附图中，对相同或者与此相当的构件标注相同的编号。
图1是本发明的实施方式的光电传感器的整体结构图。首先参照图1，对光电传感器10的整体结构进行说明，光电传感器10具有传感器头部12以及回归反射板14。
传感器头部12发出平行光即检测光A。回归反射板14与传感器头部12相向地配置，并且传感器头部12所发射的检测光A被回归反射板14反射而成为返回光B。此外，检测光A例如为可见光，但是只要是被回归反射板14回归反射的光即可，而并不特别地限定检测光A的波长区域。
在回归反射板14上配置有多个角形棱镜(cornercube)。检测光A在回归反射板14的3个面进行反射，且最终成为返回光B。返回光B是与检测光A相同的轴向的光，沿着与检测光A前进的方向相反的方向，在与检测光A的路径平行的路径上前进。
传感器头部12接受返回光B，从而生成具有与返回光B的受光量相对应的强度的电信号。传感器头部12经由电源线和信号线等一体化而成的电缆13与放大器单元15相连接，将该生成的电信号经由电缆13输出至放大器单元15。
此外，在图1中所示的光电传感器中，将传感器头部12和放大器单元15彼此分离来设置，但是也可以在传感器头部12中内置有放大器。
放大器单元15经由电缆13向传感器头部12供给驱动电压。传感器头部12接受该驱动电压来发出检测光A，并且生成表示返回光B的受光量的电信号。而且，放大器单元15经由电缆13接受来自传感器头部12的信号。放大器单元15基于该信号检测物体的存在与否，输出表示传感器头部12中的受光量的信号。
光电传感器10基于传感器头部12的受光量来检测物体的存在与否。在测定对象物体18不位于检测光A的光路上的区域16中的情况下，从传感器头部12发出的检测光A被回归反射板14反射而成为返回光B，且入射于传感器头部12。另一方面，在测定对象物体18位于区域16中的情况下，来自传感器头部12的检测光A被测定对象物体18遮挡，因此传感器头部12接受的返回光B的光量减少。
这样，在光电传感器10中，根据测定对象物体18是否位于区域16中，而传感器头部12所接受的受光量不同，因此基于该受光量来检测物体的存在与否。放大器单元15从传感器头部12接受用于表示受光量的电信号，并且例如将上述受光量和规定的阈值进行比较，由此检测区域16中的测定对象物体18的存在与否。
本实施方式的光电传感器10是投光路和受光路在传感器头部12的内部物理分离的两眼式的回归反射型光电传感器。接着，对光电传感器10的更具体的结构进行说明。
图2是示出图1中的光电传感器的传感器头部的剖视图。图3是示出图1中的光电传感器的传感器头部的另一剖视图。图4是示出从图3中的箭头IV所示的方向观察的传感器头部的立体图。图5是示出从图3中的箭头V所示的方向观察的传感器头部的立体图。
参照图2至图5，光电传感器10的传感器头部12具有发光二极管61以及光电二极管51、投光透镜66以及受光透镜56、反射镜23、壳体31、中间壳体41、盖罩21、保护罩25。
壳体31、中间壳体41以及盖罩21彼此组装在一起而呈筒状，由此构成传感器头部12的外观。壳体31形成为向一个方向开口的筒状，并且容置有发光二极管61、光电二极管51、投光透镜66以及受光透镜56。盖罩21形成为堵塞壳体31的开口端的盖状，并且容置有反射镜23。中间壳体41形成为环状，并且设置在壳体31和盖罩21之间。
中间壳体41由树脂形成。中间壳体41由能够透射激光的透射性树脂材料形成。作为这样的透射性树脂材料，例如使用聚丙烯(PP)、聚酰胺(PA)、聚乙烯(PE)、聚碳酸酯(PC)、ABS树脂、聚对苯二甲酸丁二酯(PBT)或者聚苯硫醚(PPS)。
壳体31以及盖罩21由树脂形成。壳体31以及盖罩21由吸收激光能量的吸收性树脂材料形成。作为这样的吸收性树脂材料，例如使用在上述的各种透射性树脂材料中添加具有激光吸收性的着色剂的材料。作为添加的着色剂，使用碳黑等碳系材料或复合氧化物系颜料等无机系着色材料。
壳体31和盖罩21隔着中间壳体41相互连接。壳体31和中间壳体41通过熔敷相互固定在一起。中间壳体41和盖罩21通过熔敷相互固定在一起。
在盖罩21上形成有用于使检测光A以及返回光B通过的开口部26。保护罩25安装在上述开口部26上。保护罩25由能够透射检测光A以及返回光B的构件(例如为透明树脂)形成。
设置有发光二极管61，来作为用于发出检测光A的发光部。发光二极管61包括：发光二极管芯片62，其发出检测光A；透光性树脂层64，其对发光二极管芯片62进行封固。投光透镜66与发光二极管61相向地配置。投光透镜66设置在发光二极管61和反射镜23之间的检测光A的光路上。
设置有光电二极管51，来作为用于接受返回光B的受光部。光电二极管51包括：基材53；光电二极管芯片52，其安装在基材53的主表面上，用于接受返回光B；透光性树脂层54，在基材53的主表面上对光电二极管芯片52进行封固。受光透镜56与光电二极管51相向地配置。受光透镜56设置在光电二极管51和反射镜23之间的返回光B的光路上。
在作为两眼式的回归反射型光电传感器的光电传感器10中，通过设置在壳体31内的隔壁27，将发光二极管61以及投光透镜66、光电二极管51以及受光透镜56设置在不同的空间内。
反射镜23相对于受光透镜56设置在与光电二极管51相反的一侧。反射镜23相对于投光透镜66设置在与发光二极管61相反的一侧。反射镜23具有用于反射检测光A以及返回光B的反射面23p。
发光二极管61所发出的检测光A在投光透镜66中转换成平行光，并从壳体31向盖罩21前进。检测光A通过反射镜23将其前进方向改变90°，并通过保护罩25向外部发射。向外部发射的检测光A被回归反射板14(参照图1)反射而成为返回光B。通过保护罩25入射至盖罩21内的返回光B通过反射镜23将其前进方向改变90°。返回光B在受光透镜56中转换成汇聚光并入射至光电二极管51中。
图6是将图2中的光电传感器的传感器头部局部放大的剖视图。在图中，将壳体31、中间壳体41以及盖罩21的截面以它们之间的接合部为中心表示。
参照图4至图6，将壳体31、中间壳体41以及盖罩21相互组装在一起，从而构成本实施方式的树脂壳体20。
壳体31具有接合面31c。接合面31c面向中间壳体41而形成。从正面观察时，接合面31c形成为环绕成环状的形状。接合面31c形成为，在相同平面内环绕成环状的形状。接合面31c在与投光透镜66和反射镜23之间的检测光A的前进方向以及受光透镜56和反射镜23之间的返回光B的前进方向垂直的平面内，形成为环绕成环状的形状。接合面31c形成为，组合两个曲线部和两个直线部的环绕形状。
中间壳体41形成为薄壁的环状。中间壳体41形成为，与接合面31c的环绕形状相对应的环状。中间壳体41具有端面41a以及端面41b。端面41a面向盖罩21。端面41b配置于端面41a的里侧，并面向壳体31。
盖罩21相对于中间壳体41配置于与壳体31相反的一侧。盖罩21立设在中间壳体41的端面41a上。在从盖罩21的侧边观察传感器头部12的外观的情况下，盖罩21形成为比中间壳体41以及壳体31还缩径的形状。
盖罩21具有侧部21a以及顶部21b来作为盖罩21的构成部位。侧部21a以从中间壳体41立起的方式设置。侧部21a向远离中间壳体41的端面41a的方向延伸成筒状。侧部21a沿着投光透镜66和反射镜23之间的检测光A的前进方向以及受光透镜56和反射镜23之间的返回光B的前进方向延伸成筒状。开口部26形成在侧部21a上。
顶部21b设置在从中间壳体41立起的侧部21a的前端。顶部21b以堵塞从端面41a延伸成筒状的侧部21a的开口端的方式设置。侧部21a和顶部21b在隔着中间壳体41与壳体31的接合面31c相对的位置相交叉。侧部21a和顶部21b在以接合面31c为基准比反射镜23更远的位置相交叉。侧部21a和顶部21b在以接合面31c为基准比保护罩25更远的位置相交叉。
盖罩21具有接合面21c。接合面21c面向中间壳体41。接合面21c与中间壳体41的端面41a相对。接合面21c经由中间壳体41与壳体31的接合面31c相对。
中间壳体41以使端面41b与接合面31c重合的方式组装在壳体31上。中间壳体41通过形成中间壳体41以及壳体31的树脂彼此的熔敷来与接合面31c接合。而且，中间壳体41以使端面41a与接合面21c重合的方式组装在盖罩21上。中间壳体41通过形成中间壳体41以及盖罩21的树脂彼此的熔敷来与接合面21c接合。
在本实施方式的树脂壳体20中，就以接合面31c为基准的情况下的侧部21a和顶部21b相交叉的高度(图5以及图6中的高度H)而言，在与接合面31c相对的任一位置上都相同。即，侧部21a和顶部21b相交叉的高度H在接合面31c的周缘的任一位置上都相同。
在本实施方式中，顶部21b具有与投光透镜66和反射镜23之间的检测光A的前进方向以及受光透镜56和反射镜23之间的返回光B的前进方向垂直的平板形状。顶部21b具有与接合面31c平行的平板形状。顶部21b具有平板形状，并在其周缘以高度H与侧部21a相交叉。
反射镜23以其反射面23p沿着相对于接合面31c倾斜的方向延伸的方式容置于盖罩21中。反射镜23以相对于平板形状的顶部21b倾斜的姿势被支撑。在反射镜23和顶部21b之间形成有空的空间28，该空的空间28在图3中成为大致三角形的截面。从反射面23p一侧观察时，空的空间28形成在反射镜23的里侧的位置。
此外，在本实施方式中，对于盖罩21具有平坦的顶部21b的情况进行了说明，但是本发明并不限定于这样的结构。只要侧部21a和顶部21b相交叉的高度H在顶部21b的周缘上恒定即可，例如顶部21b可以形成为，整体上向侧部21a的轴向以半球状突出的形状，也可以在顶部21b的中央部设置有凹部或凸部。
在图5中，假设了与接合面31c平行的平面120。在用该平面120剖切盖罩21的情况下，侧部21a具有与接合面31c的环绕形状相同或者相似的截面形状130。侧部21a从接合面31c的正上方附近的端面41a向与接合面31c垂直的方向立起，并且在侧部21a的前端与顶部21b相交叉。
盖罩21具有倒角部22。倒角部22设置在侧部21a和顶部21b相交叉的位置上。倒角部22以将侧部21a和顶部21b所成的角部加工成弯曲面形状的方式设置。优选倒角部22的大小为R1.0(mm)以上。
图7是示出在盖罩上设置的倒角部的变形例的剖视图。在图7中，示出了盖罩21的与图6中的双点划线VII所包围的范围相对应的截面形状。
参照图7，在本变形例中，倒角部22以将侧部21a和顶部21b所成的角部以斜面状切掉的方式设置。优选倒角部22的大小为C1.0(mm)以上。
对于上面说明的本发明的实施方式的树脂壳体20以及光电传感器10的结构，进行总结。
本实施方式的作为树脂部件的树脂壳体20具有接合面31c，具有：作为第一构件的壳体31，其由树脂形成；作为中间构件的中间壳体41，其通过熔敷与接合面31c相接合，并由能够透射激光的树脂形成；作为第二构件的盖罩21，其相对于中间壳体41配置于与壳体31相反的一侧，且立设在中间壳体41上，并由树脂形成。盖罩21具有：从中间壳体41立起的侧部21a；顶部21b，其在隔着中间壳体41与接合面31c相对的位置与侧部21a相交叉。以接合面31c为基准时的侧部21a和顶部21b相交叉的高度H，在与接合面31c相对的任一位置都相同。
本实施方式的树脂壳体20是照射激光来使位于作为透射性树脂构件的中间壳体41的背后的作为吸收性树脂构件的壳体31熔化而成形的树脂部件。作为在激光的光路上的构件的盖罩21是不能透射激光的非无色透明体的树脂构件。盖罩21具有防溶解结构，以便在接受激光时，将盖罩21的温度维持在小于非无色透明体的熔化温度的温度上。
本实施方式的光电传感器10除了上述的壳体31、中间壳体41以及盖罩21之外，还具有：作为发出光的投光部的发光二极管61；作为接受光的受光部的光电二极管51；作为镜的反射镜23，将发光二极管61所发出的光朝向检测对象物反射，并将从发光二极管61朝向检测对象物发出的光朝向光电二极管51反射。壳体31用于容置发光二极管61以及光电二极管51。盖罩21用于容置反射镜23，并经由中间壳体41固定在壳体31上。
接着，对将壳体31、中间壳体41以及盖罩21相互接合起来制造树脂壳体20的方法进行说明。图8至图10是示出图6中的树脂壳体的制造方法的工序的图。
参照图8，首先通过熔敷将中间壳体41接合在盖罩21上。
具体地，将中间壳体41组装在盖罩21上，使端面41a和接合面21c重合。使激光器头71定位在隔着中间壳体41与盖罩21的接合面21c相对的位置。一边从激光器头71朝向接合面21c照射激光72，一边使激光器头71移动来使激光72沿着接合面21c进行扫描。激光72透射中间壳体41而被盖罩21吸收，从而使接合面21c发热。由此，形成盖罩21以及中间壳体41的树脂熔化，从而使中间壳体41接合在接合面21c上。
接着，参照图9以及图10，通过熔敷将中间壳体41接合在壳体31上。
具体地，将在之前的工序与盖罩21接合的中间壳体41组装在盖罩21上，使端面41b与接合面31c重合。使激光器头71定位在隔着中间壳体41与壳体31的接合面31c相对的位置。
一边从激光器头71朝向接合面31c照射激光73，一边使激光器头71移动来使激光沿着接合面31c进行扫描。此时，使激光器头71以维持激光73的光轴102与接合面31c垂直的关系的方式移动。在本工序中，激光73越过盖罩21来向接合面31c照射，因此激光73的一部分在侧部21a和顶部21b相交叉的位置被盖罩21遮挡。激光73透射中间壳体41而被壳体31吸收，从而使接合面31c发热。由此，形成壳体31以及中间壳体41的树脂熔化，从而使中间壳体41接合在接合面31c上。
就在上述的工序中使用的激光的种类而言，考虑壳体31、中间壳体41以及盖罩21的材质、接合面积、生产性等来适当地进行选择。作为那样选择的激光，能够举出利用了半导体激光器或YAG激光器等的红外光激光。
图11是示出比较例的树脂壳体的制造方法的工序的立体图。图12是示出比较例的树脂壳体的另一制造方法的工序的立体图。在图11以及图12中示出了通过参照图9以及图10而说明的熔敷将壳体31接合在中间壳体41上的工序。
参照图11以及图12，本比较例的树脂壳体具有盖罩121来代替盖罩21。盖罩121具有侧部21a以及顶部21b来作为其构成部位。在盖罩121上设置有沿着反射镜23切开的切口部125。
在图11中所示的工序中，使激光器头71以维持激光73的光轴与接合面31c垂直的关系的方式移动。此时，当激光73的一部分被盖罩121遮挡时，担忧在激光73的焦点位置即接近接合面31c的切口部125发生树脂的熔化或燃烧。例如，在遮挡激光的位置上的激光的能量密度大于焦点位置上的激光的能量密度的1/3的情况下，那样的树脂的熔化和燃烧现象更显著。
另外，由于在盖罩121上设置有切口部125，在使激光沿着接合面31c进行扫描时，激光73被遮挡的高度发生变化，因此传递至接合面31c的激光73的能量也发生变化。因此，在本比较例中，为了使传递至接合面31c的激光73的能量均匀，需要对照射能量进行复杂的控制。
在图12中所示的工序中，为了避免激光73被盖罩121遮挡，使激光器头71以激光73的光轴倾斜地与接合面31c交差的方式移动。在该情况下，用于照射激光的设备成本增加，或者对激光器头71的移动控制变得复杂。
相对于此，参照图9以及图10，在本实施方式的树脂壳体20中，以接合面31c为基准的情况下的侧部21a和顶部21b相交叉的高度H，在与接合面31c相对的任一位置上都相同。根据这样的结构，从接合面31c到通过盖罩21遮挡激光73的位置为止的高度，在与接合面31c相对的任一位置上都相同。由此，在激光73的扫描路径上，充分确保从激光73的焦点位置(接合面31c)到通过盖罩21遮挡激光73的位置为止的距离，从而能够防止盖罩21熔化和燃烧的现象发生。
另外，在本实施方式的树脂壳体20中，在用与接合面31c平行的平面120剖切盖罩21的情况下，侧部21a具有与接合面31c的环绕形状相同或者相似的截面，因此盖罩21的外形形成为与激光73的扫描路径接近的形状。根据这样的结构，由于激光73的一部分被盖罩21遮挡，传递至接合面31c的激光73的能量产生损失，但是该损失量在接合面31c的所有位置都恒定。由此，不必进行激光的照射能量的复杂的控制，能够以均匀的品质将中间壳体41接合在接合面31c上。
而且，在本实施方式的树脂壳体20中，在盖罩21的侧部21a和顶部21b相交叉的位置上设置有倒角部22。根据这样的结构，能够更有效地抑制在盖罩21的侧部21a和顶部21b相交叉的位置上发生熔化和燃烧。
另外，在本实施方式的树脂壳体20的制造方法中，使激光器头71以维持激光73的光轴102与接合面31c垂直的关系的方式移动。由此，能够简单地构成用于照射激光的设备。例如若是将要实施利用激光的熔敷工序的多个树脂部件以熔敷面朝向一个方向的方式排列并使激光器头71在那上面平行移动的设备，则能够用同一设备连续地实施多种熔敷工序。
如上说明，根据本发明的实施方式的树脂壳体20、光电传感器10以及其制造方法，能够消除因激光的照射而在盖罩21的局部发生熔化和燃烧的担忧，因此能够高品质地加工树脂壳体20的外观。另外，抑制传递至接合面31c的激光的能量发生偏差的情况，因此能够通过简单的制造工序制造树脂壳体20。基于这些理由，能够将制造成本抑制得低廉的同时获得高品质的光电传感器10。
此外，在本实施方式中，对于将本发明应用于两眼式的回归反射型光电传感器的情况进行了说明，但是并不限定于此，也能够应用于利用一对具有投光部的投光器和具有受光部的受光器的透光型光电传感器中。在透光型光电传感器中，投光器和受光器相向配置，以便来自投光器的光进入受光器中。当测定对象物体在投光器和受光器之间遮挡光时，进入受光器的光的量减少，因此基于该受光量的减少来检测出测定对象物体的存在与否。
另外，本发明并不限定于光电传感器，而能够应用于通过利用激光的树脂接合方法来接合多个树脂构件而成的各种树脂部件上。作为优选的一例，本发明的树脂部件利用于电子部件的框体上。本发明的第一构件和第二构件可以不必是单独的构件，也可以是将第一构件和第二构件相结合的一个构件。
应当认为本次公开的实施方式是在所有方面都是例示而非限制。本发明的范围由权利要求书来表示，而不是上述的说明，包括在与权利要求书等同的意思和范围内的全部变更。
产业上的可利用性
本发明例如适用于光电传感器的树脂壳体中。

Claims (7)

1.一种光电传感器(10)，其特征在于，
具有：
第一构件(31)，其具有接合面(31c)，由吸收激光能量的吸收性树脂材料形成，
中间构件(41)，其通过熔敷接合在上述接合面(31c)上，由能够透射激光的树脂形成，
第二构件(21)，其相对于上述中间构件(41)配置在与上述第一构件(31)相反的一侧，并且立设在上述中间构件(41)上，由吸收激光能量的吸收性树脂材料形成，在从上述第二构件(21)观察上述光电传感器(10)的情况下，上述第二构件(21)形成为比上述中间构件(41)以及上述第一构件(31)还缩径的形状；
上述第二构件(21)具有：
侧部(21a)，其从上述中间构件(41)立起，
顶部(21b)，其在隔着上述中间构件(41)与上述接合面(31c)相对的位置上，与上述侧部(21a)相交叉；
以上述接合面(31c)为基准，上述侧部(21a)和上述顶部(21b)相交叉的高度在与上述接合面(31c)相对的任一位置上都相同。
2.根据权利要求1所述的光电传感器(10)，其特征在于，
上述第一构件(31)和上述中间构件(41)沿着环绕成环状的上述接合面(31c)相接合，
在用与上述接合面(31c)平行的平面切断上述第二构件(21)的情况下，上述侧部(21a)具有与上述接合面(31c)的环绕形状相同或者相似的截面。
3.根据权利要求1或2所述的光电传感器(10)，其特征在于，
在上述侧部(21a)和上述顶部(21b)相交叉的位置上设置有倒角(22)。
4.根据权利要求3所述的光电传感器(10)，其特征在于，
将上述侧部(21a)和上述顶部(21b)相交叉的位置切成斜面状或者弯曲面状，来形成上述倒角(22)。
5.根据权利要求1、2和4中任一项所述的光电传感器(10)，其特征在于，
还具有：
用于发出光的投光部(61)以及用于接受光的受光部(51)中的至少一个，
反射镜(23)，其使上述投光部(61)所发出的光反射到检测对象物或者使从上述投光部(61)朝向检测对象物发出的光反射到上述受光部(51)；
上述第一构件(31)是容置上述投光部(61)以及受光部(51)中的至少一个的主体壳体，
上述第二构件(21)是容置上述反射镜(23)并且隔着上述中间构件(41)固定在上述主体壳体上的罩体。
6.根据权利要求5所述的光电传感器(10)，其特征在于，
上述反射镜(23)具有用于反射光的反射面，该反射镜以上述反射面沿着相对于上述接合面(31c)倾斜的方向延伸的方式容置于上述罩体中。
7.一种光电传感器(10)的制造方法，用于制造权利要求1至4中任一项所述的光电传感器(10)，
该光电传感器(10)的制造方法的特征在于，
包括如下工序：
通过熔敷将上述中间构件(41)接合在上述第二构件(21)上；
使上述中间构件(41)与上述接合面(31c)重合，并且将激光器头定位在与上述接合面(31c)相对的位置；
一边使上述激光器头以及上述树脂部件以维持激光的光轴与上述接合面(31c)垂直的关系的方式相对移动，一边使激光越过上述第二构件(21)照射上述接合面(31c)。
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