CN103459453B - Anisotropic conductive film - Google Patents

Anisotropic conductive film Download PDF

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Publication number
CN103459453B
CN103459453B CN201280018363.7A CN201280018363A CN103459453B CN 103459453 B CN103459453 B CN 103459453B CN 201280018363 A CN201280018363 A CN 201280018363A CN 103459453 B CN103459453 B CN 103459453B
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CN
China
Prior art keywords
epoxy resin
anisotropic conductive
conductive film
electronic unit
type epoxy
Prior art date
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Expired - Fee Related
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CN201280018363.7A
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Chinese (zh)
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CN103459453A (en
Inventor
出口真吾
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Dexerials Corp
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Dexerials Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
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    • C09J9/02—Electrically-conducting adhesives
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    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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Abstract

In the thermosetting epoxy resin composition comprising epoxy resin, hardener for epoxy resin and film formation resin dispersed electro-conductive particle anisotropic conductive film in, as its epoxy resin, use the epoxy resin containing β-alkyl glycidyl type epoxy resin and glycidyl ether type epoxy resin with the ratio of mass ratio 9:1 ~ 2:8.As β-alkyl glycidyl type epoxy resin, be preferably Resorcinol two (Beta-methyl glycidyl) ether, as glycidyl ether type epoxy resin, be preferably oxyalkylene modifying glycidyl ether type epoxy.

Description

Anisotropic conductive film
Technical field
The present invention relates to the anisotropic conductive film being dispersed with conductive particle in thermosetting epoxy resin composition.
Background technology
When IC chip is connected to circuit board, widely use with material cost lower, general glycidyl ether type epoxy resin is as the anisotropic conductive film (ACF) of primary curing composition, but for this anisotropic conductive film, require that connection reliability is well natural, the performance degradation of IC chip is caused from preventing Yin Re, the viewpoint reducing anisotropic conductive link cost is set out, require low-temperature fast-curing property, and then from the IC chip of costliness, the viewpoint of effective utilization of circuit board is set out, also require display good recoverability (リ ペ ア) and the cost of material is low.
In addition, general glycidyl ether type epoxy resin is can expect connection reliability to a certain degree and the lower epoxy resin of material cost among epoxide resin material, but reactivity is fully not talkative, therefore its solidification value is had to be set as more than about 170 DEG C, it is sufficient for being difficult to low-temperature fast-curing property, and cross-linking density is too high, therefore there is the problem that can not show abundant recoverability.
Therefore, as solving the discussion of these problems, attempted using as solidifying agent the positively charged ion system solidifying agent (patent documentation 1) can expecting curing reaction rapidly compared with existing common negatively charged ion system solidifying agent; Use reactive higher alicyclic epoxy resin to replace glycidyl ether type epoxy resin (patent documentation 2).
Prior art document
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2009-275102 publication
Patent documentation 2: Japanese Unexamined Patent Publication 2007-238751 publication.
Summary of the invention
The problem that invention will solve
But, when using positively charged ion system solidifying agent, the improvement of low-temperature fast-curing property can be realized, but still there is the insufficient problem of recoverability.In addition, compared with glycidyl ether type epoxy resin, when the basis using positively charged ion system solidifying agent uses alicyclic epoxy resin, low-temperature fast-curing property is enhanced further, but material cost is high, in addition, there is recoverability still problem that is insufficient, that reduce as the storage stability of anisotropic conductive film.And then, owing to having more hydrophobicity compared with glycidyl ether type epoxy resin, therefore exist and the tendency that the maturation process under hot and humid condition (エ ー ジ Application グ process) reduces afterwards, connection reliability also decreases is being carried out to the bonding force of adherend.
The present invention will solve above prior art problem and carry out, its object is to provide following anisotropic conductive film, it does not use alicyclic epoxy resin in the anisotropic conductive film of epoxy matrix material using positively charged ion system solidifying agent, even if use the general glycidyl ether type epoxy resin or derivatives thereof that material cost is lower, low-temperature fast-curing property and recoverability are also all excellent, so connection reliability and storage stability also excellent.
The technique means of dealing with problems
The present inventor etc. attempted for containing positively charged ion system solidifying agent as the thermosetting epoxy resin composition of solidifying agent in the anisotropic conductive film of dispersed electro-conductive particle, especially in order to improve its low-temperature fast-curing property, as the epoxy resin forming thermosetting epoxy resin composition, except general glycidyl ether type epoxy resin, the β position also combinationally using oxirane ring have can by sterically hindered hinder the β-alkyl glycidyl type epoxy resin of the alkyl of the anionoid polymerization of epoxy resin time, found that different from the situation of anionoid polymerization system, cationoid polymerisation system improves low-temperature fast-curing property unexpectedly, more surprisingly, recoverability also improves, connection reliability and storage stability are also excellent, thus complete the present invention.
That is, the invention provides anisotropic conductive film, its be comprising epoxy resin, as the positively charged ion system solidifying agent of hardener for epoxy resin and the thermosetting epoxy resin composition of film formation resin in be dispersed with the anisotropic conductive film of conductive particle,
This epoxy resin contains β-alkyl glycidyl type epoxy resin and glycidyl ether type epoxy resin with the ratio of mass ratio 9:1 ~ 2:8.
In addition, the invention provides manufacture method, it is utilize anisotropic conductive film that the terminal of the first electronic unit and the terminal of the second electronic unit have been carried out the manufacture method of the connection structural bodies that anisotropic conductive is connected, and this manufacture method possesses following operation:
Interim operation of pasting aforementioned anisotropic conductive film of the present invention on the terminal of the first electronic unit;
Second electronic unit carries out in the mode that its terminal is relative with the respective terminal of the first electronic unit the operation temporarily arranged by the anisotropic conductive film of carrying out interim stickup; And
Second electronic unit limit is pressed to the first electronic unit with adding heat welding machine heating edge, by the operation that the terminal of the first electronic unit is connected with the terminal anisotropic conductive of the second electronic unit.
In addition, the invention provides connection structural bodies, it utilizes aforementioned anisotropic conductive film of the present invention that the terminal of the terminal of the first electronic unit and the second electronic unit is carried out anisotropic conductive to be formed by connecting.
Invention effect
Use in the anisotropic conductive film of the epoxy matrix material of the present invention of positively charged ion system solidifying agent, as become conductive particle dispersion medium, the epoxy resin that forms thermosetting epoxy resin composition, combinationally use β-alkyl glycidyl type epoxy resin and glycidyl ether type epoxy resin with specified proportion.β-alkyl glycidyl type epoxy resin is owing to having the tertiary carbon can thought and can make positively charged ion kind stabilization, result can improve the low-temperature fast-curing property of anisotropic conductive film, but also recoverability, connection reliability and storage stability can be improved simultaneously, described tertiary carbon by accept be derived from the positively charged ion kind of positively charged ion system polymerization starter attack, oxirane ring open loop is formed.
Accompanying drawing explanation
Fig. 1 is manufacturing process's explanatory view of connection structural bodies.
Fig. 2 is manufacturing process's explanatory view of the connection structural bodies of then Fig. 1.
Fig. 3 is manufacturing process's explanatory view of the connection structural bodies of then Fig. 2.
Fig. 4 is the summary section of connection structural bodies.
Embodiment
The present invention is the anisotropic conductive film being dispersed with conductive particle in the thermosetting epoxy resin composition comprising epoxy resin, hardener for epoxy resin and film formation resin.
The thermosetting epoxy resin composition forming anisotropic conductive film of the present invention becomes the dispersion medium of conductive particle, form film as a whole, play bounding force before curing for adherend, play bonding force after hardening, as mentioned above, it contains epoxy resin, hardener for epoxy resin and film formation resin.
In the present invention, the epoxy resin contained by thermosetting epoxy resin composition is heat curable component, containing β-alkyl glycidyl type epoxy resin and glycidyl ether type epoxy resin.Thus, anisotropic conductive film, with do not use Beta-methyl glycidyl type epoxy resin and compared with the anisotropic conductive film using the thermosetting epoxy resin composition be made up of general glycidyl ether type epoxy resin, low-temperature fast-curing property can not only be improved, can also recoverability be improved, and then good connection reliability and storage stability can be realized.
β-alkyl glycidyl type epoxy resin refers to the compound represented with following general formula (1).
In formula (1), Y is the alkyl such as methyl, ethyl, propyl group, sec.-propyl, butyl, isobutyl-, amyl group, hexyl, cyclohexyl, wherein, from the view point of acquisition easiness, is preferably methyl.X is-O-,-NH-or-OCO-base.Wherein, from the view point of synthesis easiness ,-O-is preferably.In addition, n is the number of more than 2.R is aromatic series, aliphatics or ester ring type polyol compound residue; Aromatic series, aliphatics or ester ring type polyamine compound residue; Or aromatic series, aliphatics or ester ring type polycarboxylate compound residue.Wherein, from the view point of acquisition easiness, be preferably aromatic series, aliphatics or ester ring type polyol compound residue, be particularly preferably aromatic polyol compounds residues.Herein, the compound of formula (1) makes β-alkyl epoxy chloropropane and polyol compound, polyamine compounds or polycarboxylate compound dehydrochlorination reaction occur and prepare, because dehydrochlorination reaction carries out gradually, in therefore β-alkyl glycidyl type epoxy resin, comprise monomer type, prepolymer type (condenses).The preferred example of the compound of this prepolymer type is shown in formula (2).Herein, m is the number of 1 ~ 20.
As this aromatic series, aliphatics or ester ring type polyol compound, Resorcinol, 4,4' dihydroxy diphenyl, dihydroxyphenyl propane, Bisphenol F, 1,6-hexylene glycol, BDO, hexanaphthene-1,3-glycol etc. can be listed.As aromatic series, aliphatics or ester ring type polyamine compounds, O-Phenylene Diamine, mphenylenediamine, Ursol D, 1,6-hexanediamine, Putriscine, hexanaphthene-1,3-diamines etc. can be listed.As aromatic series, aliphatics or ester ring type polycarboxylate compound, phthalic acid, m-phthalic acid, terephthalic acid, hexanodioic acid, succsinic acid etc. can be listed.
As the preferred concrete example of the β-alkyl glycidyl type epoxy resin of formula (1), Resorcinol two (β-alkyl glycidyl base) ether, bisphenol A-type two (β-alkyl glycidyl base) ether, bisphenol-f type two (β-alkyl glycidyl base) ether etc. can be listed.Wherein, from the view point of the low-temperature fast-curing property can improving anisotropic conductive film, be preferably Resorcinol two (β-alkyl glycidyl base) ether, be particularly preferably Resorcinol two (Beta-methyl glycidyl) ether.It should be noted that, this Resorcinol two (Beta-methyl glycidyl) ether can be monomer type, also can be prepolymer type.
On the other hand, as the glycidyl ether type epoxy resin combinationally used with β-alkyl glycidyl type epoxy resin, there is not the substituent epoxy resin such as alkyl in glycidyl, preferably can use general glycidyl ether type epoxy resin, especially preferably use oxyalkylene modification (being preferably the oxyalkylene modification of more than 2 moles) glycidyl ether type epoxy resin.As this glycidyl ether type epoxy resin, bisphenol A-type diglycidyl ether and prepolymer (condenses), bisphenol-f type diglycidyl ether and prepolymer (condenses), novolac type diglycidyl ether etc. can be listed.Wherein, from the view point of good bonding strength can be given to anisotropic conductive film, oxyethane or epoxy pronane modification bisphenol A-type diglycidyl ether preferably can be used.
Epoxy resin contained by thermosetting epoxy resin composition contains above-mentioned β-alkyl glycidyl type epoxy resin and glycidyl ether type epoxy resin with mass ratio 9:1 ~ 2:8, the preferably ratio of 8:2 ~ 4:6.With this quality than when the content of β-alkyl glycidyl type epoxy resin is many compared with scope, when tailing off on the contrary, there is the tendency that its recoverability is difficult to improve in the tendency that the connection reliability that there is anisotropic conductive film reduces.
In the present invention, as the epoxy resin contained by thermosetting epoxy resin composition, can combinationally using other epoxy resin except β-alkyl glycidyl type epoxy resin and glycidyl ether type epoxy resin in the scope not damaging effect of the present invention, such as 3, the alicyclic epoxy resins such as 4-epoxycyclohexyl-methyl-3,4-epoxycyclohexane carboxylate.
Form in the thermosetting epoxy resin composition of anisotropic conductive film of the present invention, as hardener for epoxy resin, use known to improvement low-temperature fast-curing property effective positively charged ion system solidifying agent.As this positively charged ion system solidifying agent, known solidifying agent can be used, aryl diazonium salts system solidifying agent, aryl salt system solidifying agent, arylsulfonium salts system solidifying agent, propadiene-ionic complex (ア レ Application-イ オ Application Wrong body) such as can be used to be the chelating system solidifying agent etc. of solidifying agent, metal (such as, aluminium, titanium, zinc, tin etc.) and acetylacetic ester or diones.Especially, the reactivity under low temperature is excellent, validity period (Port ッ ト ラ イ Off) is long, preferably uses arylsulfonium salts system solidifying agent.
As the arylsulfonium salts system solidifying agent that can compatibly use in the present invention, the solidifying agent of structure shown in following formula (3) ~ (6) can be exemplified.
In formula (3), R afor hydrogen atom, COCH 3base or COOCH 3base, R band R cbe respectively hydrogen atom, halogen atom or C 1~ C 4alkyl, R dfor hydrogen atom, CH 3base, OCH 3base or halogen atom, R efor C 1~ C 4alkyl, X is SbF 6, AsF 6, PF 6or BF 4.
In formula (4), R ffor hydrogen atom, ethanoyl, methoxycarbonyl, methyl, epoxy group(ing) carbonyl, tert-butoxycarbonyl, benzoyl, phenyloxycarbonyl, benzyloxycarbonyl, 9-fluorenylmethoxycarbonyl groups or to methoxy-benzyl carbonyl, R gand R hbe respectively hydrogen atom, halogen atom or C 1~ C 4alkyl, R iand R jbe respectively hydrogen atom, methyl, methoxyl group or halogen atom, X is SbF 6, AsF 6, PF 6or BF 4.
In formula (5), R kfor oxyethyl group, phenyl, phenoxy group, benzyloxy, chloromethyl, dichloromethyl, trichloromethyl or trifluoromethyl, R land R mbe respectively hydrogen atom, halogen atom or C 1~ C 4alkyl, R nfor hydrogen atom, methyl, methoxyl group or halogen atom, R ofor C 1~ C 4alkyl, X is SbF 6, AsF 6, PF 6or BF 4.
In formula (6), R pfor hydrogen atom, ethanoyl, methoxycarbonyl, methyl, epoxy group(ing) carbonyl, tert-butoxycarbonyl, benzoyl, phenyloxycarbonyl, benzyloxycarbonyl, 9-fluorenylmethoxycarbonyl groups or to methoxy-benzyl carbonyl, R qand R rbe respectively hydrogen atom, halogen atom or C 1~ C 4alkyl, R sand R tbe respectively methyl or ethyl, X is SbF 6, AsF 6, PF 6or BF 4.
As the concrete example of the commercially available positively charged ion system solidifying agent that can use in the present invention, include, for example out aryl diazonium salts [such as, PP-33((strain) ADEKA system)], aryl salt, arylsulfonium salts [such as, FC-509, FC-540(3M Inc.), UVE1014(G.E. Inc.), UVI-6974, UVI-6970, UVI-6990, UVI-6950(ユ ニ オ ン カ ー バ イ De Inc.), SP-170, SP-150, CP-66, CP-77 etc. (ADEKA Inc.)], SI-60L, SI-80L, SI-100L, SI-110L(tri-new chemical industry Co., Ltd. system), propadiene-ionic complex [such as, CG-24-61(BASF Inc.)].
When the consumption of the positively charged ion system solidifying agent in thermosetting epoxy resin composition is very few, exists and produce the bad tendency of solidification, and time too much, there is the tendency of storage stability reduction.In addition, by using with this scope, the cured article that thermotolerance, the transparency, weathering resistance etc. are good can be obtained, being therefore preferably 1 ~ 30 mass parts relative to epoxy resin 100 mass parts, being more preferably 1 ~ 10 mass parts.
As the film formation resin of the thermosetting epoxy resin composition containing formation anisotropic conductive film of the present invention, the thermoplastic resin of the film formation resin that can be applicable to known anisotropic conductive film preferably can be used.As this film formation resin, preferably with the resin of the epoxy resin compatibility of thermosetting epoxy resin composition, such as can use phenoxy resin, vibrin, urethane resin, polyamide resin, polyimide resin, polyolefin resin etc., the two or more of them can be combinationally used.Among these, from viewpoints such as material cost, film-forming properties, processibility, connection reliability, preferably can use phenoxy resin.
Form the compounding amount of the film formation resin in the thermosetting epoxy resin composition of anisotropic conductive film of the present invention very few time, there is the tendency that film formative reduces, and time too much, there is the tendency of mobility reduction, therefore relative to epoxy resin 100 mass parts, be preferably 40 ~ 200 mass parts, be more preferably 50 ~ 150 mass parts.
As the conductive particle forming anisotropic conductive film of the present invention, the conductive particle used in known anisotropic conductive film can be adopted.Include, for example out the metallic particles such as nickel, cobalt, silver, copper, gold, palladium, coating metal resin particle etc., the two or more of them can be combinationally used.Their particle shape and particle diameter suitably can determine according to the environment for use of anisotropic conductive film, application target etc.
About the compounding ratio of this conductive particle relative to thermosetting epoxy resin composition, when conductive particle is very few, there is the tendency being difficult to carry out stable anisotropic conductive connection, and time too much, the in-plane of film easily produces the conducting of conductive particle, therefore relative to thermosetting epoxy resin composition (total of the epoxy resin namely except conductive particle, hardener for epoxy resin and film formation resin) 100 mass parts, be preferably 0.1 ~ 50 mass parts, be more preferably 0.1 ~ 30 mass parts.
Form in the thermosetting epoxy resin composition of anisotropic conductive film of the present invention, the additives such as solvent, known silane coupling agent, tinting material, fire retardant, weighting agent, polybutadiene particles equal stress negative catalyst can also be contained as required.
Anisotropic conductive film of the present invention can by conventionally mixing thermosetting epoxy resin composition and conductive particle and other additives and prepare anisotropic conductive film formation composition equably, and with the known film such as rolling process, casting method, said composition is made film, thus manufacture, described thermosetting epoxy resin composition comprises: contain the epoxy resin of β-alkyl glycidyl type epoxy resin and glycidyl ether type epoxy resin, hardener for epoxy resin and film formation resin with the ratio of mass ratio 9:1 ~ 2:8.It should be noted that, also the composition except conductive particle can be mixed in advance equably and prepare thermosetting epoxy resin composition, conventionally dispersed electro-conductive particle equably in said composition, thus preparation anisotropic conductive film formation composition.
Such operation and the thickness of the anisotropic conductive film obtained suitably can determine according to the use form etc. of anisotropic conductive film.
Anisotropic conductive film of the present invention preferably can be suitable for when manufacturing the connection structural bodies be connected with the terminal anisotropic conductive of the one side being formed at the second electronic unit by the terminal of the one side being formed at the first electronic unit.Below for possess operation (a) ~ (c), the manufacture method that uses the connection structural bodies of anisotropic conductive film of the present invention, operation break-down is described.
< operation (a) >
As shown in Figure 1, interim stickup anisotropic conductive film 20 of the present invention on the terminal 11 of the first electronic unit 10.Interim stickup uses the heat welding machine 40(that adds described later with reference to Fig. 3), anisotropic conductive film 20 can be heated to by limit can not thermofixation but show the pressing of fusible temperature limit and carry out.Conductive particle 21 is dispersed with in anisotropic conductive film 20.
As the first electronic unit 10, glass circuit board, rigidity circuit board, flexible circuit board etc. can be listed.As terminal 11, the terminal conventionally formed by composite oxides such as the metals such as copper, nickel, aluminium, gold or indium-titanium oxides at the one side of the first electronic unit 10 can be listed.In addition, the thickness of terminal 11, wire distribution distance suitably can determine according to the application target etc. of the first electronic unit 10.
< operation (b) >
Then, as shown in Figure 2, the second electronic unit 30 arranges in the mode that its terminal 31 is relative with the respective terminal 11 of the first electronic unit 10 by the anisotropic conductive film 20 of carrying out interim stickup temporarily.Be set using the heat welding machine 40(that adds described later with reference to Fig. 3 temporarily), anisotropic conductive film 20 can be heated to by limit can not thermofixation but show the pressing of fusible temperature limit and carry out.When this is arranged temporarily, when the second electronic unit 30 or anisotropic conductive film 20 produce position skew, as required, such as anisotropic conductive film 20 can be softened the first electronic unit 10 side heating with hot plate, conventionally peel off the second electronic unit 30, the thermosetting epoxy resin composition acetone and other organic solvent of the remained on surface of the first electronic unit 10 or the second electronic unit 30 is removed.Good recoverability can be realized thus.
As the second electronic unit 30, semi-conductor chip, electrical condenser, LED chip, flexible circuit board etc. can be listed.As terminal 31, the electrode (such as projection) conventionally formed by metals such as copper, nickel, aluminium, gold, scolding tin at the one side of the second electronic unit 30 can be listed.In addition, the thickness of terminal 31, wire distribution distance suitably can determine according to the application target etc. of the second electronic unit 30.
< operation (c) >
Then, as shown in Figure 3, the second electronic unit 30 limit is pressed to the first electronic unit 10 with adding heat welding machine 40 heating edge.Thus, terminal 11 and the conductive particle clamped by terminal 31 21 crushed, realize conducting between the terminal 11 of the first electronic unit 10 and the terminal 31 of the second electronic unit 30.Thus, as shown in Figure 4, the connection structural bodies 100 utilizing anisotropic conductive film 20 terminal 11 of the first electronic unit 10 and the terminal 31 of the second electronic unit 30 to be carried out anisotropic conductive to be connected can be obtained.
It should be noted that, add heat welding machine 40 as what use in this operation (c), use when manufacturing semiconductor device known can be used in and add heat welding machine.In addition, as heating and pressurizing condition, suitably can determine according to the characteristic of the anisotropic conductive film that will use.
The concrete example of the connection structural bodies 100 obtained as so operating, can list semiconductor device, liquid crystal indicator, LED light device etc.This connection structural bodies 100 is also a mode of the present invention.It should be noted that, in connection structural bodies 100, anisotropic conductive film 20 is thermally cured.
Embodiment
Below, anisotropic conductive film of the present invention is illustrated by embodiment.
Embodiment 1 ~ 12, comparative example 1 ~ 7
< anisotropic conductive film be made >
Whipping appts is used thermoplastic resin (phenoxy resin), Beta-methyl glycidyl type epoxy resin A, glycidyl ether type epoxy resin B, silane coupling agent, positively charged ion system solidifying agent, stress negative catalyst (polybutadiene particles) and conductive particle to be mixed equably with the compounding ratio (mass parts benchmark) of table 1 and table 2, the mode that stripping film reaches 20 μm with dry thickness is coated with, in the drying machine of 70 DEG C, carry out drying, thus make anisotropic conductive film.
The evaluation > of < anisotropic conductive film
For the anisotropic conductive film obtained in embodiment 1 ~ 12, comparative example 1 ~ 7, such according to following explanation, contact resistance, bonding strength and the recoverability of the connection structural bodies (covering the anisotropic conductive linker of brilliant film (COF) base material and glass substrate) that test evaluation makes differential scanning calorimetric analysis (DSC) (Exotherm Onset Temperature, exothermic peak temperature, thermal discharge decrement), thermo-compressed condition changes and makes.Acquired results is shown in table 1 and table 2.
(differential scanning calorimetric analysis)
1）DSC
Use DSC device (DSC-60, Shimadzu Seisakusho Ltd.'s system) to carry out thermal analyses to anisotropic conductive film, measure Exotherm Onset Temperature (DEG C), exothermic peak temperature (DEG C).Practicality is considered low-temperature fast-curing property and keeping quality, wish that Exotherm Onset Temperature is 90 ~ 110 DEG C, in addition, wish that exothermic peak temperature is 100 ~ 130 DEG C.
2) DSC thermal discharge decrement
For manufacture just complete after or with 30 DEG C of placements 1 month, 2 months or the anisotropic conductive film of 3 months, DSC device (DSC-60, Shimadzu Seisakusho Ltd.'s system) is used to carry out thermal analyses, measure total thermal discharge (j/g), calculate with 30 DEG C of total thermal discharges placing the anisotropic conductive film of 1 month, 2 months or 3 months relative to the decrement (%) of total thermal discharge manufacturing the anisotropic conductive film after just terminating.In practicality, the decrement of hope after 1 month (%) is less than 35%.
(contact resistance mensuration)
As evaluation base material, prepare to cover brilliant film (COF) base material (being formed with the base material of Cu8 μm of thick-Sn plating electrode wires of 50 μm of spacing at 38 μm of thick polyimide film surface) and be formed with the glass substrate of the solid electrode (ベ タ Electricity Very) formed by indium tin composite oxides (ITO).
Then, use tool width (ツ ー Le width) be the press-connection machine of 1.5mm, at the prescribed position of ITO solid glass substrate, by the anisotropic conductive film cutting into 1.5mm across cushioning material be the cushioning material that 150 μm of thick teflon (registered trademark) are made, with 70 DEG C, this condition of 1MPa, 1sec pastes temporarily.
Then, use identical press-connection machine carried out in interim anisotropic conductive film of pasting with 80 DEG C, this condition of 0.5MPa, 0.5sec arranges COF base material temporarily.
And then, after confirming that not producing position between COF base material and glass substrate offsets, use identical press-connection machine to carry out main crimping with the condition (150 DEG C, 160 DEG C or 170 DEG C, 4MPa, 5 seconds) shown in table 1 or table 2, made connection structural bodies.
Gained connection structural bodies is placed 500 hours under 85 DEG C of environment with 85%RH.Then for just placing the connection structural bodies after 500 hours, digital multimeter (Yokogawa Electric Corporation's system) is used to measure contact resistance value.In addition, to place under being similarly determined at the environment of 85 DEG C and 85%RH after 500 hours so with 30 DEG C preserve 1 month, preserve 2 months or preserve the contact resistance value of the connection structural bodies after 3 months.Practicality is expected measured value is 2 below Ω.
(determining bonding strength)
Make the connection structural bodies identical with the connection structural bodies made when measuring contact resistance value, place 500 hours under 85 DEG C of environment with 85%RH.Then, use tensile testing machine (AND Inc.) to be peeled off to 90 ° of directions with draw speed 50mm/sec by the COF base material of connection structural bodies, the stripping strength measured now is used as bonding strength.Practicality is wished for more than 6N/cm.
(recoverability test)
As evaluation base material, prepare to cover brilliant film (COF) base material (being formed with the base material of Cu8 μm of thick-Sn plating electrode wires of 50 μm of spacing at 38 μm of thick polyimide film surface) and be formed with the glass substrate of the solid electrode formed by indium tin composite oxides (ITO).
Then, use the press-connection machine that tool width is 1.5mm, at the prescribed position of ITO solid glass substrate, by the anisotropic conductive film cutting into 1.5mm across cushioning material be the cushioning material that 150 μm of thick teflon (registered trademark) are made, with 70 DEG C, this condition of 1MPa, 1sec pastes temporarily.
Then, use identical press-connection machine carried out in interim anisotropic conductive film of pasting with 80 DEG C, this condition of 0.5MPa, 0.5sec arranges COF base material temporarily and obtains duplexer.
The duplexer this being provided with temporarily COF base material is with its glass substrate side mounting after 30 seconds on the hot plate of heating temperatures to 100 DEG C, COF base material is peeled from glass substrate, by the swab stick wiping being impregnated with acetone of the thermosetting epoxy resin composition of anisotropic conductive film remaining on COF base material or glass baseplate, counted by the wiping number of times all wiping to resin combination.In practicality, hope is less than 30 times.
It should be noted that, the material used in table 1 and table 2 is as follows.
* 1 phenoxy resin (JER-4210, Mitsubishi Chemical Ind)
* 2 products that the dihydroxyphenyl propane of 1 mole and the β methyl epoxy chloropropane of 2 moles are reacted
* 3 products that the Resorcinol of 1 mole and the β methyl epoxy chloropropane of 2 moles are reacted
* 4jER-828, Mitsubishi Chemical Ind
* 5EP-4100S, ADEKA company
* 6 median sizes are the polybutadiene particles (RKB, レ ジ Na ス changes into company) of 0.5 μm
* 7KBM-403, Shin-Etsu Chemial Co., Ltd
* 8 arylsulfonium salts system solidifying agent (SI-60, three new chemical industry Co., Ltd.)+3% stablizer (p-hydroxybenzene dimethyl sulfonium methylsulfuric acid ester)
* 9 arylsulfonium salts system solidifying agent (SI-60, three new chemical industry Co., Ltd.)+5% stablizer (p-hydroxybenzene dimethyl sulfonium methylsulfuric acid ester)
* 10 arylsulfonium salts system solidifying agent (SI-60, three new chemical industry Co., Ltd.)+8% stablizer (p-hydroxybenzene dimethyl sulfonium methylsulfuric acid ester)
* 11 arylsulfonium salts system solidifying agent (SI-80, three new chemical industry Co., Ltd.)+3% stablizer (p-hydroxybenzene dimethyl sulfonium methylsulfuric acid ester)
* 12 Block ラ イ ト GNR, Nippon Chemical Ind
* 13CEL2021P, ダ イ セ Le company.
[table 1]
[table 2]
As shown in Table 1, in the anisotropic conductive film of embodiment 1 ~ 12, as epoxy resin, common glycidyl ether type epoxy resin and β-alkyl glycidyl type epoxy resin is contained with the ratio of mass ratio 9:1 ~ 2:8, therefore the Exotherm Onset Temperature of DSC, exothermic peak temperature are no problem, and low-temperature fast-curing property improves, and recoverability, connection reliability and storage stability also improve simultaneously.
On the other hand, in the anisotropic conductive film of the comparative example 1 of table 2, as epoxy resin, do not use β-alkyl glycidyl type epoxy resin, only used common glycidyl ether type epoxy resin, therefore 150 DEG C of-4MPa-5 seconds, this is compared with the initial contact resistance under the thermo-compressed condition of low temperature and bonding strength existing problems.In addition, the bonding strength under 160 DEG C of-4MPa-5 these thermo-compressed conditions second and recoverability also have problems.
In addition, the anisotropic conductive film of comparative example 2 does not use β-alkyl glycidyl type epoxy resin, compared with comparative example 1, as epoxy resin, the half oxyalkylene modifying glycidyl ether type epoxy of common glycidyl ether type epoxy resin is replaced, result, owing to only only used the material of glycidyl ether type epoxy resin, therefore at 150 DEG C of-4MPa-5, this has problems compared with the initial contact resistance under the thermo-compressed condition of low temperature and bonding strength second in the same manner as comparative example 1, in addition, under 160 DEG C of-4MPa-5 these thermo-compressed conditions second, recoverability also has problems.
In the anisotropic conductive film of comparative example 3, as epoxy resin, although combinationally used β-alkyl glycidyl type epoxy resin and glycidyl ether type epoxy resin, but mass ratio is the ratio of 1:9, therefore 150 DEG C of-4MPa-5 seconds, this is compared with the initial contact resistance under the thermo-compressed condition of low temperature and bonding strength existing problems.In addition, under 160 DEG C of-4MPa-5 these thermo-compressed conditions second, bonding strength and recoverability also have problems.
In the anisotropic conductive film of comparative example 4, as epoxy resin, only used β-alkyl glycidyl type epoxy resin, therefore at 150 DEG C of-4MPa-5, this does not have problems compared with the recoverability under the thermo-compressed condition of low temperature second, but initial contact resistance and bonding strength existing problems, in addition, under 160 DEG C of-4MPa-5 these thermo-compressed conditions second, bonding strength also has problems.
Compared with comparative example 2, in the anisotropic conductive film of comparative example 5, as epoxy resin, each part alicyclic epoxy resin of common glycidyl ether type epoxy resin and oxyalkylene modifying glycidyl ether type epoxy is replaced, do not use β-alkyl glycidyl type epoxy resin, therefore the reacting initial temperature of DSC is low, and in addition, 150 DEG C and 160 DEG C of-4MPa-5 seconds, this is compared with the recoverability existing problems under the thermo-compressed condition of low temperature and middle temperature.
Compared with comparative example 2, consistent dose in the positively charged ion system solidifying agent of the anisotropic conductive film of comparative example 6 and 7 is increased to 5% and 8% respectively from 3%, as epoxy resin, β-alkyl glycidyl type epoxy resin is not used in the same manner as comparative example 2, and employ common glycidyl ether type epoxy resin and oxyalkylene modifying glycidyl ether type epoxy, the recoverability existing problems therefore under 170 DEG C of-4MPa-5 these thermo-compressed conditions second.
utilizability in industry
Use in the anisotropic conductive film of the epoxy matrix material of the present invention of positively charged ion system solidifying agent, as the epoxy resin of formation thermosetting epoxy resin composition of dispersion medium becoming conductive particle, β-alkyl glycidyl type epoxy resin and glycidyl ether type epoxy resin are combinationally used with specified proportion, therefore low-temperature fast-curing property, recoverability, connection reliability and storage stability can improve simultaneously.Therefore, for manufacture semiconductor device, LED matrix etc. be useful.
The explanation of symbol
10 first electronic units
11,31 terminals
20 anisotropic conductive film
21 conductive particles
30 second electronic units
40 add heat welding machine
100 connection structural bodies

Claims (6)

1. anisotropic conductive film, its be comprising epoxy resin, as the positively charged ion system solidifying agent of hardener for epoxy resin and the thermosetting epoxy resin composition of film formation resin in be dispersed with the anisotropic conductive film of conductive particle,
This epoxy resin contains β-alkyl glycidyl type epoxy resin and glycidyl ether type epoxy resin with the ratio of mass ratio 9:1 ~ 2:8.
2. anisotropic conductive film according to claim 1, wherein, this epoxy resin contains β-alkyl glycidyl type epoxy resin and glycidyl ether type epoxy resin with the ratio of mass ratio 8:2 ~ 4:6.
3. anisotropic conductive film according to claim 1, wherein, this glycidyl ether type epoxy resin is oxyalkylene modifying glycidyl ether type epoxy.
4. the anisotropic conductive film according to any one of claim 1 ~ 3, wherein, positively charged ion system solidifying agent is arylsulfonium salts system solidifying agent.
5. manufacture method, it is utilize anisotropic conductive film that the terminal of the first electronic unit and the terminal of the second electronic unit have been carried out the manufacture method of the connection structural bodies that anisotropic conductive is connected, and this manufacture method possesses following operation:
The terminal of the first electronic unit is pasted the operation of the anisotropic conductive film according to any one of claim 1 ~ 4 temporarily;
Second electronic unit carries out in the mode that its terminal is relative with the respective terminal of the first electronic unit the operation temporarily arranged by the anisotropic conductive film of carrying out interim stickup; And
Second electronic unit limit is pressed to the first electronic unit with adding heat welding machine heating edge, by the operation that the terminal of the first electronic unit is connected with the terminal anisotropic conductive of the second electronic unit.
6. connection structural bodies, it utilizes the anisotropic conductive film according to any one of claim 1 ~ 4 that the terminal of the terminal of the first electronic unit and the second electronic unit is carried out anisotropic conductive to be formed by connecting.
CN201280018363.7A 2011-04-14 2012-04-02 Anisotropic conductive film Expired - Fee Related CN103459453B (en)

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