CN103456649A - 半导体封装方法 - Google Patents
半导体封装方法 Download PDFInfo
- Publication number
- CN103456649A CN103456649A CN2013103829623A CN201310382962A CN103456649A CN 103456649 A CN103456649 A CN 103456649A CN 2013103829623 A CN2013103829623 A CN 2013103829623A CN 201310382962 A CN201310382962 A CN 201310382962A CN 103456649 A CN103456649 A CN 103456649A
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- substrate
- conductive adhesive
- packaging semiconductor
- coated
- heating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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- Wire Bonding (AREA)
Abstract
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Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2013103829623A CN103456649A (zh) | 2013-08-28 | 2013-08-28 | 半导体封装方法 |
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CN2013103829623A CN103456649A (zh) | 2013-08-28 | 2013-08-28 | 半导体封装方法 |
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CN103456649A true CN103456649A (zh) | 2013-12-18 |
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CN2013103829623A Pending CN103456649A (zh) | 2013-08-28 | 2013-08-28 | 半导体封装方法 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105428263A (zh) * | 2015-12-16 | 2016-03-23 | 南通富士通微电子股份有限公司 | 半导体封装方法 |
CN108733243A (zh) * | 2017-04-17 | 2018-11-02 | 蓝思科技(长沙)有限公司 | 一种基于纳米银薄膜的触摸屏的制作方法 |
CN111370318A (zh) * | 2018-12-25 | 2020-07-03 | 东莞新科技术研究开发有限公司 | 一种半导体消除内应力的方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201163615Y (zh) * | 2008-01-08 | 2008-12-10 | 印能科技有限公司 | 半导体封装加工的除泡烤箱装置 |
CN101477979A (zh) * | 2008-01-03 | 2009-07-08 | 三星电子株式会社 | 多芯片封装体 |
CN101533786A (zh) * | 2008-03-11 | 2009-09-16 | 印能科技有限公司 | 半导体封装的芯片粘着胶层气泡排除方法 |
KR20100090561A (ko) * | 2009-02-06 | 2010-08-16 | 이지스코 주식회사 | 이종 물질 간 접합구조를 갖는 정전척 및 그 제조방법 |
CN102903646A (zh) * | 2011-07-25 | 2013-01-30 | 上海祯显电子科技有限公司 | 一种芯片的焊接方法 |
CN103050465A (zh) * | 2012-12-12 | 2013-04-17 | 华天科技(西安)有限公司 | 一种带有铜柱的晶圆减薄的单芯片封装件及其制作工艺 |
-
2013
- 2013-08-28 CN CN2013103829623A patent/CN103456649A/zh active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101477979A (zh) * | 2008-01-03 | 2009-07-08 | 三星电子株式会社 | 多芯片封装体 |
CN201163615Y (zh) * | 2008-01-08 | 2008-12-10 | 印能科技有限公司 | 半导体封装加工的除泡烤箱装置 |
CN101533786A (zh) * | 2008-03-11 | 2009-09-16 | 印能科技有限公司 | 半导体封装的芯片粘着胶层气泡排除方法 |
KR20100090561A (ko) * | 2009-02-06 | 2010-08-16 | 이지스코 주식회사 | 이종 물질 간 접합구조를 갖는 정전척 및 그 제조방법 |
CN102903646A (zh) * | 2011-07-25 | 2013-01-30 | 上海祯显电子科技有限公司 | 一种芯片的焊接方法 |
CN103050465A (zh) * | 2012-12-12 | 2013-04-17 | 华天科技(西安)有限公司 | 一种带有铜柱的晶圆减薄的单芯片封装件及其制作工艺 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105428263A (zh) * | 2015-12-16 | 2016-03-23 | 南通富士通微电子股份有限公司 | 半导体封装方法 |
CN108733243A (zh) * | 2017-04-17 | 2018-11-02 | 蓝思科技(长沙)有限公司 | 一种基于纳米银薄膜的触摸屏的制作方法 |
CN111370318A (zh) * | 2018-12-25 | 2020-07-03 | 东莞新科技术研究开发有限公司 | 一种半导体消除内应力的方法 |
CN111370318B (zh) * | 2018-12-25 | 2024-04-09 | 东莞新科技术研究开发有限公司 | 一种半导体消除内应力的方法 |
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PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information |
Inventor after: Zhang Weihong Inventor after: Shen Haijun Inventor after: Zhou Feng Inventor after: Zhang Weihong, Shen Haijun, Zhou Feng, Yan Xiaolong Inventor before: Zhang Tonglong Inventor before: Shen Haijun Inventor before: Zhang Weihong Inventor before: Hong Shengping Inventor before: Zhou Feng Inventor before: Yan Xiaolong Inventor before: Zhang Tonglong, Shen Haijun, Zhang Weihong, Hong Shengping, Zhou Feng, Yan Xiaolong, Lu Hailun |
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Application publication date: 20131218 |