CN103456458A - Multilayer type inductor - Google Patents
Multilayer type inductor Download PDFInfo
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- CN103456458A CN103456458A CN2012103552442A CN201210355244A CN103456458A CN 103456458 A CN103456458 A CN 103456458A CN 2012103552442 A CN2012103552442 A CN 2012103552442A CN 201210355244 A CN201210355244 A CN 201210355244A CN 103456458 A CN103456458 A CN 103456458A
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- 239000004020 conductor Substances 0.000 claims abstract description 55
- 239000011241 protective layer Substances 0.000 claims abstract description 24
- 239000010410 layer Substances 0.000 claims description 15
- 239000011148 porous material Substances 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 5
- 238000007639 printing Methods 0.000 description 10
- 239000000758 substrate Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- 229910000859 α-Fe Inorganic materials 0.000 description 7
- 238000010276 construction Methods 0.000 description 6
- 238000003475 lamination Methods 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910007565 Zn—Cu Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- SGGPVBOWEPPPEH-UHFFFAOYSA-N [K].[Zr] Chemical compound [K].[Zr] SGGPVBOWEPPPEH-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
- H01F2017/002—Details of via holes for interconnecting the layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
Abstract
The invention provides a multilayer type inductor, comprising a multilayer body which is pressed by a plurality of plates having inner conductor patterns, a protective layer which is formed as the top face and bottom face of the multilayer body. After the length-direction inductor is cut, the cross section of the multilayer body cut out from the width-thickness direction will meet the demand of 0.1<=Tc/Bc<=1.5 when the thickness of the protective layer formed as the top face of the multilayer body and the thickness of the protective layer formed as the bottom face of the multilayer body is Bc.
Description
The cross reference of related application
The application requires the priority at the korean patent application No.10-2012-0058728 of Korea S Department of Intellectual Property submission on May 31st, 2012, and its disclosure is incorporated into to this by quoting as proof.
Technical field
The present invention relates to a kind of multilayer type inductor (multi-layer type inductor).
Background technology
Inductor (multilayer chiop electronic component) is to be used in jointly form electronic circuit with resistor and capacitor and abate the noise or form the representative passive device in the part of LC resonant circuit.
According to its structure, such inductor can be divided into winding type inductor and multilayer type inductor, the winding type inductor by by coil winding or printing (print) on FERRITE CORE and then on its two ends, form electrode and manufacture, multilayer type inductor is manufactured by a plurality of magnetospheres or the insulating barrier that internal electrode are printed on magnetosphere or insulating barrier and then lamination has the internal electrode be printed thereon.
Simultaneously, it is recently popular and have as mentioned above sandwich construction that multilayer type inductor is tending towards, and is pressed with a plurality of magnetospheres or the insulating barrier with formation internal electrode thereon in this sandwich construction middle level.Internal electrode is linked in sequence by the pore electrod (via electrode) of crossing on being formed on every layer, and usually forms loop construction, thereby realizes the desired characteristic such as target inductance or impedance.
For the characteristic such as inductance or impedance that realizes that multilayer type inductor is desired, internal electrode and outer electrode should be electrically connected to each other.Whether such connection is stable is a key factor that determines the performance of multilayer type inductor.
But, owing to usually pursuing the multilayer type inductor of small light and thin, even if in the situation that multilayer type inductor is manufactured according to design, so the connection between internal electrode and outer electrode may be insecure, this may cause lamination, connection failure etc.
Namely, the size of product is dwindled manyly, and the performance degradation of product must be more severe, and especially, quality will be inevitably deteriorated.Index by quality as the performance that means product, be commonly called the Q characteristic.
[prior art document]
(patent documentation 1) Japanese Patent Laid is openly announced No.2006-148027.
Summary of the invention
An aspect of of the present present invention provides a kind of multilayer type inductor with gratifying Q characteristic.
According to an aspect of the present invention, provide a kind of multilayer type inductor, having comprised: the multilayer main body is pressed with in this multilayer main body middle level a plurality of plates that comprise the inner conductor pattern; And protective layer; as the end face of multilayer main body and bottom surface and form; wherein; after being cut in the central portion of length direction; in the cross section of the multilayer main body intercepted on width-thickness direction; when the thickness that the thickness of the protective layer formed when the end face as the multilayer main body is Tc and the protective layer that forms as the bottom surface of multilayer main body is Bc, meet 0.1≤Tc/Bc≤1.5.
In the cross section of multilayer main body, can meet 0.3≤Tc/Bc≤1.3.
In the cross section of multilayer main body, when the width that the width between the inner conductor pattern on being formed on identical layer is We and multilayer main body is Wt, meet 0.2≤We/Wt≤0.7.
In the cross section of multilayer main body, can meet 0.3≤We/Wt≤0.6.
In the cross section of multilayer main body, when the thickness of inner conductor pattern is thickness between inner conductor pattern of Te and another adjacent inner conductive pattern while being Ts, can meet 0.5≤Ts/Te≤2.0.
In the cross section of multilayer main body, can meet 0.7≤Ts/Te≤1.8.
The inner conductor pattern be formed on a plurality of plates can be connected to each other to form single coil, and can on laminating direction, by crossing pore electrod, be electrically connected to each other.
According to a further aspect in the invention, provide a kind of multilayer type inductor, having comprised: the multilayer main body is pressed with in this multilayer main body middle level a plurality of plates that comprise the inner conductor pattern; And protective layer; as the end face of multilayer main body and bottom surface and form; wherein; after being cut in the central portion of length direction; in the cross section of the multilayer main body intercepted on width-thickness direction; the width that width between the inner conductor pattern be formed on identical layer is We and multilayer main body is Wt, meets 0.2≤We/Wt≤0.7.
In the cross section of multilayer main body, can meet 0.3≤We/Wt≤0.6.
In the cross section of multilayer main body, when the thickness of inner conductor pattern is thickness between inner conductor pattern of Te and another adjacent inner conductive pattern while being Ts, can meet 0.5≤Ts/Te≤2.0.
In the cross section of multilayer main body, can meet 0.7≤Ts/Te≤1.8.
The inner conductor pattern be formed on a plurality of plates can be connected to each other to form single coil, and can on laminating direction, by crossing pore electrod, be electrically connected to each other.
According to a further aspect in the invention, provide a kind of multilayer type inductor, having comprised: the multilayer main body is pressed with in this multilayer main body middle level a plurality of plates that comprise the inner conductor pattern, and protective layer, as the end face of multilayer main body and bottom surface and form, wherein, after being cut in the central portion of length direction, in the cross section of the multilayer main body intercepted on width-thickness direction, the thickness of the protective layer formed when the end face as the multilayer main body is Tc, as the bottom surface of multilayer main body and the thickness of the protective layer formed is Bc, the width be formed between the inner conductor pattern on identical layer is We, the width of multilayer main body is Wt, the thickness of inner conductor pattern is Te, and when the thickness between an inner conductor pattern and another adjacent inner conductive pattern is Ts, meet 0.1≤Tc/Bc≤1.5, 0.2≤We/Wt≤0.7, and 0.5≤Ts/Te≤2.0.
The accompanying drawing explanation
From the detailed description of carrying out below in conjunction with accompanying drawing, above and other of the present invention aspect, feature and other advantages will become more obvious, wherein:
Fig. 1 is the perspective view according to the multilayer type inductor of one embodiment of the invention;
Fig. 2 is the decomposition diagram according to the multilayer type inductor of one embodiment of the invention;
Fig. 3 is the cross-sectional view along the intercepting of the line A-A' in Fig. 1.
Embodiment
Hereinafter, with reference to accompanying drawing, exemplary embodiment of the present invention is described.But the present invention can be presented as different forms and should not be understood to be limited to the embodiment that stated herein.On the contrary, provide these embodiment so that the disclosure will be comprehensively complete, and fully pass on concept of the present invention to those skilled in the art.In the accompanying drawings, for clarity, the shape and size of possible amplifier element, identical reference number in the text will be for meaning same or similar element.
Fig. 1 is the perspective view according to the multilayer type inductor of one embodiment of the invention; Fig. 2 is the decomposition diagram according to the multilayer type inductor of one embodiment of the invention.
Define hexahedral direction in order to clearly state embodiments of the invention, the L in Fig. 1, W and T mean respectively length, width and thickness direction.
With reference to Fig. 1 and 2, according to the multilayer type inductor of one embodiment of the invention, can comprise multilayer main body 15 and outer electrode 20.
Multilayer main body 15 can be manufactured by following steps: inner conductor pattern 40 is printed on magnetic printing circuit substrate (magnetic green sheet) 60, lamination is formed with the magnetic printing circuit substrate 60 of inner conductor pattern 40 on it, and sintering magnetic printing circuit substrate 60.
In this article, will be formed at identical reference number explanation the inner conductor pattern 40 on a plurality of plate 15a ~ 15j.
Multilayer main body 15(wherein lamination has the sandwich construction of a plurality of plates of ceramic layer, magnetosphere, non-magnetosphere or insulating barrier) can there is rectangular shape or shape similarly, and comprising inner conductor pattern 40.
When plate 15a ~ 15j is comprised of magnetisable material, can use ferrite.Although the magnetic characteristic that ferrite can be required according to electronic component is suitably selected, high resistivity and relatively low-loss ferrite are preferred.
More specifically, plate 15a ~ 15j can be used the Ni-Zn-Cu based ferrite and use the megohmite insulant that dielectric constant is about 5 to about 100.
And, when plate 15a ~ 15j is comprised of non magnetic megohmite insulant, therefore can use the ceramic material that comprises zirconium silicate, potassium zirconium, zirconium etc.
And, when ceramic layer that multilayer type inductor 100 is configured to be formed by magnetisable material or namagnetic substance, according to material, select, can reduce the difference of linear expansion coefficient.
Simultaneously, the plate 15a ~ 15j that forms main body 15 can comprise the plate 15a that do not form inner conductor pattern 40 on it and 15j, with and on be formed with the plate 15b ~ 15i of inner conductor pattern 40.Plate 15b ~ 15i can comprise the first plate 15b of being arranged in extreme higher position, be arranged on the second plate 15i in extreme lower position and be arranged on the first plate 15b and the second plate 15i between at least one or a plurality of inner panel 15c ~ 15h.
In this article, can not limit uniformly inner panel 15c ~ 15h, but can revise in every way according to the expectation size of inductance to be achieved and impedance.
In addition, baffle 15a and 15j can be laminated to the top of the first plate 15b and the second plate 15i below.According to one embodiment of the invention, baffle 15a and 15j can be used as the protective layer of the inside for protecting multilayer type inductor 100.
In this article, the material of limiting protecting plate 15a and 15j particularly not, the material that baffle 15a and 15j can be identical by the material of the plate 15b ~ 15i with being formed with inner conductor pattern 40 on it forms.
It is upper and at the interior formation coil of main body 15 formed by laminated sheet 15a～15j that inner conductor pattern 40 can be formed on a plurality of plate 15b ~ 15i.
That is, be formed on inner conductor pattern 40 on plate 15a～15j and can pass through pore electrod 150 and be electrically connected to and form single coil, thereby realize inductance and impedance.
In this, inner conductor pattern 40 can be formed by conductor material, and therefore can use at least one in Ag, Pt, Pd, Cu, Au and Ni or its alloy.
More specifically, be formed on plate 15b ~ 15i(and be formed with inner conductor pattern 40 on it) in be arranged at the first plate 15b in extreme higher position and the inner conductor pattern 40 that is arranged on the second plate 15i in extreme lower position can be electrically connected to the outer electrode 20 on the outer surface that is formed on main body 15.For this reason, can provide connecting electrode.
That is, connecting electrode can be included in the inner conductor pattern 40 be formed on the first plate 15b and the second plate 15i and can extend along the edge of main body 15.
In this article, outer electrode 120 can be used main body 15 is immersed in to the formation such as method in conductive paste, print process, sedimentation, sputtering method.
In this, conductive paste can comprise silver (Ag), silver-colored palladium (Ag-Pd), nickel (Ni) or copper (Cu).
And, also can form nickel (Ni) coating and tin (Sn) coating on the surface of outer electrode 20.
Fig. 3 is the cross-sectional view along the intercepting of the line A-A' in Fig. 1.
With reference to figure 3; after being cut in central portion in the longitudinal direction; in the cross section of the multilayer main body 15 intercepted on its width-thickness direction; when the thickness that the thickness of the protective layer formed when the end face as multilayer main body 15 is Tc and the protective layer that forms as the bottom surface of multilayer main body 15 is Bc, can meet 0.1≤Tc/Bc≤1.5.
In the situation that Tc/Bc is lower than 0.1, internal electrode may expose.In the situation that Tc/Bc exceed 1.5, Q characteristic may be deteriorated.
After being cut in central portion in the longitudinal direction, in the cross section of the multilayer main body 15 intercepted on its width-thickness direction, when the width that the width between the inner conductor pattern 40 on being formed on identical layer is We and multilayer main body 15 is Wt, can meet 0.2≤We/Wt≤0.7.
In the situation that We/Wt is lower than 0.2, the space between internal electrode is less, and therefore short circuit may occur.In the situation that We/Wt exceeds 0.7, internal electrode may expose.
After being cut in central portion in the longitudinal direction, in the cross section of the multilayer main body 15 intercepted on its width-thickness direction, when the thickness of inner conductor pattern 40 is thickness between Te and an inner conductor pattern 40 and another adjacent inner conductive pattern while being Ts, can meet 0.5≤Ts/Te≤2.0.
In the situation that Ts/Te is lower than 0.5, the space between internal electrode is less, and therefore occurs that the possibility of short circuit is higher than 90%.In the situation that Ts/Te exceed 2.0, Q characteristic may be deteriorated.
Following multilayer type inductor and the comparative example of manufacturing according to one embodiment of the invention.
Preparation is applied to carrier film by the slurry that will comprise Ni-Zn-Cu based ferrite powder and makes its dry a plurality of magnetic printing circuit substrates of manufacturing.
Then, form conductive pattern by using silk screen (screen) that silver (Ag) conductive paste is applied to the magnetic printing circuit substrate.Afterwards, by around conductive pattern, the ferrite slurry being applied to the magnetic printing circuit substrate, form the single multilayer carrier with magnetic printing circuit substrate, so that the multilayer carrier is formed on the layer identical with conductive pattern.
When lamination repeatedly is formed with the multilayer carrier of conductive pattern on it, conductive pattern is electrically connected to have coil pattern on laminating direction.Upper conductor pattern and lower conductor pattern in this, on the magnetic printing circuit substrate, formed pore electrod, so that can be electrically connected to each other by the magnetic printing circuit substrate be arranged on therebetween.
By the multilayer carrier in the scope of 10 layers to 20 layers with upper protective layer together with the lower protective layer lamination, and at 85 ° of C at 1000kgf/cm
2pressure condition under this sandwich construction is waited to static pressure (isostatically press).The chip sandwich construction that waits static pressure to complete is cut into to one single chip.Keep 40 hours at the temperature of 230 ° of C in air atmosphere by the chip by cutting, carry out binding agent and remove on the chip of cutting.
Then, at the temperature lower than 950 ° of C, the chip cut is carried out to sintering in air atmosphere.Afterwards, form outer electrode by being applied to for the cream of outer electrode main body, sintering, plating etc.
Below table 1 show the thickness T c of the protective layer formed for the end face as the multilayer main body and the thickness B c of the protective layer that forms as the bottom surface of multilayer main body between ratio in the comparison between originality example of the present invention and comparative example aspect the Q characteristic.The Q characteristic is measured under 100MHz, 500MHz, 1000MHz and 2000MHz.
[table 1]
*comparative example
According to table 1, internal electrode in sample 1 100% exposes, and the Q deterioration in characteristics of sample 17 is more than 50%, and compares with sample 17, and the Q characteristic of sample 2 to 16 is satisfactory.
But, with sample 1 to 14, to compare, the Q deterioration in characteristics of sample 15 is less than 10%, and the Q deterioration in characteristics of sample 16 is less than 30%.
Therefore, as Tc/Bc, between 0.1 and 1.5, the Q characteristic is satisfactory, and, in sample 2 and 3, the Q characteristic is satisfactory, and the amount that simultaneously internal electrode exposes is less than respectively 50% and be less than 20%, and therefore, the situation of Tc/Bc between 0.3 and 1.3 is most preferred.
Following table 2 shows for the ratio between the width W t of the width W e between the inner conductor pattern 40 be formed on identical layer and multilayer main body 15 in the comparison between originality example of the present invention and comparative example aspect the Q characteristic.The Q characteristic is measured under 100MHz, 500MHz, 1000MHz and 2000MHz.
[table 2]
*comparative example
According to table 2, the Q characteristic of sample 2 to 7 is satisfactory, and the Q characteristic of sample 1 is very low.And, in sample 8, internal electrode exposes.
Therefore, when We/Wt is between 0.2 and 0.7, can obtain the multilayer type inductor with gratifying Q characteristic.
But, in sample 2, the distance between inner conductor pattern 40 is shorter, this may cause short circuit phenomenon, and, in sample 7, inner conductor pattern 40 is arranged on the side of multilayer main body 15 and probably and exposes, so the situation of We/Wt between 0.3 and 0.6 is most preferred.
Following table 3 shows for the ratio between the thickness T s between the thickness T e of inner conductor pattern 40 and an inner conductor pattern and another adjacent inner conductive pattern in the comparison between originality example of the present invention and comparative example aspect the Q characteristic.The Q characteristic is measured under 100MHz, 500MHz, 1000MHz and 2000MHz.
[table 3]
*comparative example
According to table 3, with sample 1, with 18, to compare, the Q characteristic of sample 2 to 17 is satisfactory.That is,, when Ts/Te is between 0.5 and 2.0, can obtain the multilayer type inductor with gratifying Q characteristic.
In sample 1, the distance between inner conductor pattern 40 is shorter, and therefore occurs that the possibility of short circuit is higher than 90%.In sample 2 and 3, the possibility of short circuit is lower than the possibility in sample 1, but the short circuit phenomenon between inner conductor pattern 40 may occur.And, with sample 4 to 15, compare, in sample 16 and 17, the Q characteristic may be deteriorated.Therefore, between 0.7 and 1.8, can obtain high performance multilayer type inductor as Ts/Te.
As mentioned above, according to one embodiment of the invention, can provide the multilayer type inductor with gratifying Q characteristic.
Although illustrate and illustrated the present invention in conjunction with the embodiments, it is evident that for a person skilled in the art, not deviating under the prerequisite of the spirit and scope of the present invention as defined by the appended claims, can modify and change.
Claims (13)
1. a multilayer type inductor comprises:
The multilayer main body, be pressed with in described multilayer main body middle level a plurality of plates that comprise the inner conductor pattern; And
Protective layer, as the end face of described multilayer main body and bottom surface and form,
Wherein, after being cut in the longitudinal direction; in the cross section of the described multilayer main body intercepted on the width-thickness direction of described multilayer main body; when the thickness that the thickness of the described protective layer formed when the described end face as described multilayer main body is Tc and the described protective layer that forms as the described bottom surface of described multilayer main body is Bc, meet 0.1≤Tc/Bc≤1.5.
2. multilayer type inductor according to claim 1, wherein, in the described cross section of described multilayer main body, meet 0.3≤Tc/Bc≤1.3.
3. multilayer type inductor according to claim 1 and 2, wherein, in the described cross section of described multilayer main body, when the width that the width between the described inner conductor pattern on being formed on identical layer is We and described multilayer main body is Wt, meet 0.2≤We/Wt≤0.7.
4. multilayer type inductor according to claim 3, wherein, in the described cross section of described multilayer main body, meet 0.3≤We/Wt≤0.6.
5. multilayer type inductor according to claim 1 and 2, wherein, in the described cross section of described multilayer main body, when the thickness of described inner conductor pattern is thickness between Te and an inner conductor pattern and another adjacent inner conductive pattern while being Ts, meet 0.5≤2.0.
6. multilayer type inductor according to claim 5, wherein, in the described cross section of described multilayer main body, meet 0.7≤Ts/Te≤1.8.
7. multilayer type inductor according to claim 1, wherein, the described inner conductor pattern be formed on described a plurality of plate is connected to each other to form single coil, and passes through pore electrod and be electrically connected on laminating direction.
8. a multilayer type inductor comprises:
The multilayer main body, be pressed with in described multilayer main body middle level a plurality of plates that comprise the inner conductor pattern; And
Protective layer, as the end face of described multilayer main body and bottom surface and form,
Wherein, after being cut in the longitudinal direction, in the cross section of the described multilayer main body intercepted on the width-thickness direction of described multilayer main body, when the width that the width between the described inner conductor pattern on being formed on identical layer is We and described multilayer main body is Wt, meet 0.2≤We/Wt≤0.7.
9. multilayer type inductor according to claim 8, wherein, in the described cross section of described multilayer main body, meet 0.3≤We/Wt≤0.6.
10. multilayer type inductor according to claim 8 or claim 9, wherein, in the described cross section of described multilayer main body, when the thickness of described inner conductor pattern is thickness between Te and an inner conductor pattern and another adjacent inner conductive pattern while being Ts, meet 0.5≤Ts/Te≤2.0.
11. multilayer type inductor according to claim 10, wherein, in the described cross section of described multilayer main body, meet 0.7≤Ts/Te≤1.8.
12. multilayer type inductor according to claim 8, wherein, the described inner conductor pattern be formed on described a plurality of plate is connected to each other to form single coil, and passes through pore electrod and be electrically connected on laminating direction.
13. a multilayer type inductor comprises:
The multilayer main body, be pressed with in described multilayer main body middle level a plurality of plates that comprise the inner conductor pattern; And
Protective layer, as the end face of described multilayer main body and bottom surface and form,
Wherein, after being cut in the longitudinal direction, in the cross section of the described multilayer main body intercepted on the width-thickness direction of described multilayer main body, the thickness of the described protective layer formed when the described end face as described multilayer main body is Tc, as the described bottom surface of described multilayer main body and the thickness of the described protective layer formed is Bc, the width be formed between the described inner conductor pattern on identical layer is We, the width of described multilayer main body is Wt, the thickness of described inner conductor pattern is Te, and when the thickness between an inner conductor pattern and another adjacent inner conductive pattern is Ts, meet 0.1≤Tc/Bc≤1.5, 0.2≤We/Wt≤0.7, and 0.5≤Ts/Te≤2.0.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020120058728A KR20130134868A (en) | 2012-05-31 | 2012-05-31 | Multilayer type inductor |
| KR10-2012-0058728 | 2012-05-31 |
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| CN103456458A true CN103456458A (en) | 2013-12-18 |
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| CN2012103552442A Pending CN103456458A (en) | 2012-05-31 | 2012-09-21 | Multilayer type inductor |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104282426A (en) * | 2013-07-09 | 2015-01-14 | 三星电机株式会社 | Multilayer inductor |
| CN106716566A (en) * | 2014-09-11 | 2017-05-24 | 摩达伊诺琴股份有限公司 | Power inductor and method for manufacturing same |
| CN110534287A (en) * | 2018-05-25 | 2019-12-03 | 三星电机株式会社 | Inductor |
| US10541075B2 (en) | 2014-08-07 | 2020-01-21 | Moda-Innochips Co., Ltd. | Power inductor |
-
2012
- 2012-05-31 KR KR1020120058728A patent/KR20130134868A/en not_active Application Discontinuation
- 2012-09-21 CN CN2012103552442A patent/CN103456458A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104282426A (en) * | 2013-07-09 | 2015-01-14 | 三星电机株式会社 | Multilayer inductor |
| US10541075B2 (en) | 2014-08-07 | 2020-01-21 | Moda-Innochips Co., Ltd. | Power inductor |
| US10541076B2 (en) | 2014-08-07 | 2020-01-21 | Moda-Innochips Co., Ltd. | Power inductor |
| CN106716566A (en) * | 2014-09-11 | 2017-05-24 | 摩达伊诺琴股份有限公司 | Power inductor and method for manufacturing same |
| US10308786B2 (en) | 2014-09-11 | 2019-06-04 | Moda-Innochips Co., Ltd. | Power inductor and method for manufacturing the same |
| US10508189B2 (en) | 2014-09-11 | 2019-12-17 | Moda-Innochips Co., Ltd. | Power inductor |
| CN110534287A (en) * | 2018-05-25 | 2019-12-03 | 三星电机株式会社 | Inductor |
| CN110534287B (en) * | 2018-05-25 | 2021-12-03 | 三星电机株式会社 | Inductor |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20130134868A (en) | 2013-12-10 |
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Application publication date: 20131218 |