CN103454769B - The method of optical system, exposure device and manufacture device - Google Patents
The method of optical system, exposure device and manufacture device Download PDFInfo
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- CN103454769B CN103454769B CN201310208070.1A CN201310208070A CN103454769B CN 103454769 B CN103454769 B CN 103454769B CN 201310208070 A CN201310208070 A CN 201310208070A CN 103454769 B CN103454769 B CN 103454769B
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- reflecting mirror
- mirror
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/24—Optical objectives specially designed for the purposes specified below for reproducing or copying at short object distances
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/18—Optical objectives specially designed for the purposes specified below with lenses having one or more non-spherical faces, e.g. for reducing geometrical aberration
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/24—Optical objectives specially designed for the purposes specified below for reproducing or copying at short object distances
- G02B13/26—Optical objectives specially designed for the purposes specified below for reproducing or copying at short object distances for reproducing with unit magnification
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B17/00—Systems with reflecting surfaces, with or without refracting elements
- G02B17/08—Catadioptric systems
- G02B17/0836—Catadioptric systems using more than three curved mirrors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2008—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the reflectors, diffusers, light or heat filtering means or anti-reflective means used
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Lenses (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Along the light path of optical system according to arranged in order the 1st optical element, the 2nd optical element, the 3rd optical element and the 4th optical element of the 1st optical element, the 2nd optical element, the 3rd optical element and the 4th optical element, between above-mentioned the 3rd optical element and above-mentioned the 4th optical element, form space, above-mentioned optical system possesses the member that the light path between above-mentioned the 1st optical element and above-mentioned the 2nd optical element is separated with above-mentioned space.
Description
Technical field
In the photoetching process that the present invention relates to use in the time manufacturing liquid crystal display cells, semiconductor elementOptical system, the exposure device using and use this exposure device to manufacture the method for device.
Background technology
In recent years, in the display unit such as personal computer, television set, using in a large number liquid crystalDisplay base plate. By use photoetching process, on glass substrate transparent membrane electrode pattern shapeBecome desirable shape and make liquid crystal display substrate. In order to carry out photoetching process, use projectionExposure device, this projection aligner irradiates and exposes to the sun on the mask of having described in advance desirable patternLight light, via projection optical system, projects to pattern on mask to have applied photoresistOn the substrates such as glass substrate, make base board to explosure. In the manufacture of liquid crystal display substrate, useBased on the projection aligner of mirror surface projection mode.
Use Fig. 4, illustrate at TOHKEMY 2006-78631 communique, TOHKEMY 2008-The projection aligner of No. 89832 disclosed existing mirror surface projection modes of communique. Illumination optical systemSystem 101 is forming from the polishing sending at the high-pressure mercury-vapor lamp of lamp optical system 101 inner mountingsDesirable shape, throws light on to the mask 102 of having described pattern. From lamp optical system101 light, to after mask 102 illuminations, incides the lens barrel 103 that accommodates projection optical systemIn. The light inciding in lens barrel 103 is reflected by plane mirror 131 and concave mirror 132,Near of the pupil of guiding projection optical system. In near of projection optical system pupil, be provided withConcave-convex lens 133 and convex reflecting mirror 134.
The light transmission concave-convex lens 133 having been reflected by plane mirror 131 and concave mirror 132Afterwards, reflected by convex reflecting mirror 134, again see through concave-convex lens 133. Again see through concavo-convexThe light of lens 133 is reflected by concave mirror 132 and plane mirror 131 again, arrives and is coated withApply the substrate 104 of emulsion. In the position of substrate 104, from the transmitted light of mask 102 andDiffraction light interferes, and the pattern of imaging mask 102 exposes to substrate 104. Mask 102And plate 104 is arranged at respectively not shown mask mounting table and substrate mounting table, by makingMask mounting table and substrate mounting table limit are synchronously scanned limit and are exposed, and can realize large pictureThe exposure of the substrate 104 of face.
In recent years, liquid crystal display substrate is large screen increasingly, in order to respond its requirement, exposure deviceExposure area also broaden. If exposure area increases, the light quantity of per unit area diminishes,Needed time of exposing is elongated, reduces as the productivity ratio of exposure device. Therefore, by usingThe many light sources as exposure use are output as the large-scale mercury vapor lamp of 10KW degree, seek to keep highThe increase of luminous intensity, inhibition time for exposure.
Because the quantity of large-scale mercury vapor lamp increases, the projection optics of the exposure device in exposure technologyThe inside of system produces very high thermic load. Specifically, at the light that forms projection optical systemIn member, absorb a part for exposure light, optics accumulation of heat, this heat is discharged into lens barrel againIn, thereby the temperature rise of optics and optics gas around. If opticsAnd the temperature rise of optics gas around, due to the convection current of gas, at opticsThe swing of near surface generation gas, there is the progress path of the light of the gas by swingingSkew (as swing). And then, temperature rise gas save bit by bit and be equipped with projection optical systemLens barrel in top, the gas of lens barrel inside becomes the shape along vertical direction with thermogradeState.
In the exposure device of the mirror surface projection mode shown in Fig. 4, becoming projection optical systemNear of the convex reflecting mirror 134 of pupil, light gathering degree is the highest, becomes high temperature. Thereby, concavo-convexSpace between mirror 133 and convex reflecting mirror 134 becomes high temperature, because space is not airtight construction,Therefore there is nearby the flowing of the gas of convection current upward from convex reflecting mirror 134, sometimes causeThe swing of picture etc. Imaging performance is due in the projection optical system producing in exposure technology like thisThe swing of the gas of the thermograde of gas, the near surface of optics and decline and be regarded as problem.
Summary of the invention
Thereby, the invention provides the other parts of a part of environmental gas that has reduced light path to light pathThe optical system of the impact bringing.
The 1st aspect of the present invention provides along light path according to plane mirror, concave mirror, recessedThe arranged in order of convex lens and convex reflecting mirror plane mirror, concave mirror, concavo-convexThe optical system of mirror and convex reflecting mirror, between above-mentioned concave-convex lens and above-mentioned convex reflecting mirrorBe formed with space, above-mentioned optical system possesses comprising above-mentioned plane mirror and above-mentioned concave reflectionThe space of the light path between mirror and be formed on above-mentioned concave-convex lens and above-mentioned convex reflecting mirror between skyBetween separate member.
The 2nd aspect of the present invention provides through projection optical system the pattern projection that is formed at maskTo substrate, and the exposure device that aforesaid substrate is exposed, above-mentioned projection optical system comprisesState the optical system of the 1st aspect.
The 3rd aspect of the present invention provides the method for manufacturing device, and said method comprises use the above-mentioned the 2ndThe exposure device of aspect is to base board to explosure; The above-mentioned substrate being exposed is developed; In processingState the substrate having developed and manufacture above-mentioned device.
Further feature of the present invention is passed through with reference to accompanying drawing, according to following exemplary embodimentExplanation and become clear and definite.
Brief description of the drawings
Fig. 1 is the skeleton diagram that represents exposure device of the present invention.
Fig. 2 is the details drawing that is illustrated near of convex reflecting mirror in Fig. 1.
Fig. 3 has observed near the figure of of convex reflecting mirror from concave mirror 32 sides in Fig. 1.
Fig. 4 is the skeleton diagram that represents existing exposure device.
Detailed description of the invention
[exposure device]
Below, use Fig. 1 that the embodiment of exposure device of the present invention is described. Mask 2 is carried outThe lamp optical system 1 of illumination comprises high-pressure mercury-vapor lamp, the oval shape mirror, whole as light source in insideThe opticses such as shape optical system, ND optical filter, light integrator, collector lens. Oval shape mirror handleThe light occurring from high-pressure mercury-vapor lamp is to specific direction optically focused. Shaping optical system handle is from oval shape mirrorLight distribution shaping become desirable shape. ND optical filter regulates luminous intensity. Light integrator makes to coverLight intensity distributions in 2 of moulds is even. Collector lens gathers the light that has passed through light integratorLight.
The exposure light penetrating from lamp optical system is illuminated in the mask of having described the pattern of answering transfer printing(also referred to as egative film) 2. The light that has seen through mask 2 arrives substrate (plate) via projection optical system 3On 4, the pattern transfer on mask 2, to plate 4, is then exposed to plate 4. At plate 4On apply in advance emulsion, by implement suitable processing before and after exposure, can on plate 4, makeMake desirable pattern.
In projection optical system 3, along the light path from mask 2 to plate 4, according to plane reflectionMirror (the 1st optical element) 31, concave mirror (the 2nd optical element) 32, concave-convex lens (3 optical elements) 33, the arranged in order plane reflection of convex reflecting mirror (the 4th optical element) 34Mirror (the 1st optical element) 31, concave mirror (the 2nd optical element) 32, concave-convex lens (3 optical elements) 33, convex reflecting mirror (the 4th optical element) 34. In the present embodiment, warpCross light that mask 2 incides projection optical system 3 by plane mirror 31 bendings, and anti-by concave surfacePenetrate after mirror 32 reflected, see through concave-convex lens 33, incide convex reflecting mirror 34. By convex surfaceAfter the light that speculum 34 reflects has seen through concave-convex lens 33 again, again by concave mirror 32,Plane mirror 31 reflects, and incides plate 4. Plane mirror 31, concave mirror 32, concavo-convexLens 33 and convex reflecting mirror 34 form along light path according to the 1st optical element, the 2nd opticsArranged in order the 1st optical element, the 2nd of element, the 3rd optical element and the 4th optical elementThe optical system of optical element, the 3rd optical element and the 4th optical element.
The projection optical system 3 of the exposure device of the mirror surface projection mode of introducing in the present embodimentIn, dispose concave-convex lens 33 at the upstream side of light path, dispose convex surface in the downstream of light path anti-Penetrate mirror 34. In the projection optical system 3 of the exposure device of mirror surface projection mode, in designConcave-convex lens 33 and convex reflecting mirror 34 are configured near of the pupil of projection optical system 3. ByNear light gathering degree convex reflecting mirror 34 is the highest, and therefore caloric value is also many. At concave-convex lens 33And between convex reflecting mirror 34, form space 39, to make owing to being irradiated to convex reflecting mirror 34The reflectance coating on surface and the heat that occurred by reflectance coating is difficult for being delivered to concave-convex lens 33. Concave-convex lens 33Fixed by lens barrel 35 with convex reflecting mirror 34, space 39 is by concave-convex lens 33, convex reflecting mirror34 and lens barrel 35 surround. Thereby, the space of being heated by the heat occurring in reflectance coating partGas in 39 can not slip out from space 39, makes at plane mirror 31 and concave mirror 32Between light path in there is not the swing of gas. Lens barrel 35 forms comprising plane mirror the (the 1stOptical element) 31 and concave mirror (the 2nd optical component) between space and the space of light path39 members that separate.
The material of lens barrel 35 is selected the outstanding material of thermal resistance, makes to be difficult for to transmit to outside heat. EveryConvex reflecting mirror 34 and with concave-convex lens 33 opposition sides (downstream of light path), join across spaceBe equipped with light absorption part member 36. Light-absorbing member 36 absorbs the not surface at convex reflecting mirror 34Reflection and see through the light of convex reflecting mirror 34. Make space between convex reflecting mirror 34 and light absorption structureBetween part 36, be the poor of coefficient of thermal expansion in order to absorb convex reflecting mirror 34 and light-absorbing member 36,Be difficult in addition transmit to convex reflecting mirror 34 heat being occurred by light-absorbing member 36.
Reflecting surface at convex reflecting mirror 34 has been manufactured reflectance coating for reverberation. This reflectance coatingThe Metal Phases such as material and aluminium are than dielectric preferably. The reason of selecting dielectric is because and metal filmCompare, the absorbance that the film of dielectric has irradiated the light time is little. Select in the material as reflectance coatingIn the situation of dielectric, compare with metal film, due to the light reflection surface at convex reflecting mirror 34Be not that reflection but the light quantity that sees through increase, the lens barrel 35 that is therefore fixed wtih convex reflecting mirror 34 hasMay generate heat. Its result, near temperature rise convex reflecting mirror 34, in projection optical system 3In inner light path, there is the swing of gas, the imaging performance of projection optical system 3 is declined.
Fig. 2 represents near the enlarged drawing of of convex reflecting mirror 34. In light-absorbing member 36, connectHave pipe arrangement 37 for cold-producing medium, this cold-producing medium comprises to the inside of light-absorbing member 36 and supplying with pipe arrangement 37Give the liquid supply portion of the controlled liquid of temperature (cold-producing medium) and the liquid from inside discharge liquidDischarge portion, in order to prevent the overheated of light-absorbing member 36, can make cold-producing medium along the arrow in Fig. 2Head towards flow. Cold-producing medium is brought to the outside of projection optical system 3 with pipe arrangement 37, use notIllustrated refrigerators etc., limit is that constant limit makes its circulation the temperature control of cold-producing medium. Both can makeCold-producing medium always circulates, also can be only in the temperature of light-absorbing member 36 situation higher than certain threshold valueUnder make refrigerant circulation. By pipe arrangement 37 for cold-producing medium is set, can be the temperature of light-absorbing member 36Degree rises and suppresses for Min., can suppress the gas in the light path of inside of projection optical system 3The swing of body. Light-absorbing member 36 uses material, for example aluminium with high thermoconductivity. In refrigerationAgent is for example the inert fluid of fluorine series with cold-producing medium mobile in pipe arrangement 37.
Then, use Fig. 3, record the space 39 between concave-convex lens 33 and convex reflecting mirror 34Cooling means. Fig. 3 is from concave mirror 32 side observation spaces 39 and lens barrel 35 and obtainProfile. If continue exposure, the space 39 between concave-convex lens 33 and convex reflecting mirror 34Temperature rise gradually. Its result,, there is kine bias, astigmatism in the interior generation Temperature Distribution in space 39Deng. In order to prevent kine bias, astigmatism etc., on lens barrel 35, be connected with pipe arrangement 38, can be viaPipe arrangement 38, transports temperature to the space 39 between concave-convex lens 33 and convex reflecting mirror 34 and is controlledThe gas such as air, nitrogen. Bring pipe arrangement 38 from the outside of projection optical system 3. By adjustingThe flow of throttle body, or regulate to the shape of the gas ejection ports of lens barrel 35 inside, can be effectiveGround carries out the temperature treatment in the space 39 between concave-convex lens 33 and convex reflecting mirror 34. In Fig. 3The space 39 of the schematically illustrated gas of arrow between concave-convex lens 33 and convex reflecting mirror 34Mobile situation effectively. In pipe arrangement 38, mobile gas is for example air, inert gas.
In addition, in the structure of the pipe arrangement 38 of Fig. 3, the gas to space 39 supply gas is suppliedThe portion of giving, be made as 1 from the quantity of the gas discharge section of space 39 Exhaust Gas, but be not limited to this numberAmount, also can be made as multiple the quantity of gas supply part, gas discharge section. In addition, gasFlow for horizontal direction, about this point, even the situation of the direction configuration in the horizontal directionLower certain certain effect that also can obtain.
[device making method]
Device (semiconductor devices, the liquid crystal display of one embodiment of the present invention then, are describedPart etc.) manufacture method. Here describe as an example of the manufacture method of semiconductor devices example.
Semiconductor devices by via on substrate, make integrated circuit front technique, make in front techniqueThe rear technique that IC chip on the substrate of middle making completes as product is manufactured. Front workSkill comprises that the aforesaid exposure device scan exposure of use has applied the technique of the substrate of emulsion, made baseThe technique that plate develops. Rear technique comprises assembly technology (cutting, welding), packaging technology (sealing).In addition, liquid crystal display device is by manufacturing via the technique that forms transparency electrode. Form transparent electricalOn the technique of the utmost point the has been included in evaporation glass substrate of nesa coating, apply emulsion technique, makeCarry out having applied the glass substrate of emulsion with aforesaid exposure device scan exposure technique, makeThe technique that glass substrate develops. According to the device making method of present embodiment, in the production of deviceAt least one party of rate and quality is more favourable than prior art.
Be associated the present invention has been described with illustrative embodiment, but be construed as the present inventionThe illustrative embodiment not being disclosed limits. Should be in the scope of the claim of following,Provide the most widely and explain, make to comprise whole variation and the equivalent thereof of structure and performance.
Claims (9)
1. an optical system, this optical system along light path according to plane mirror, concave mirror,The arranged in order of concave-convex lens and convex reflecting mirror plane mirror, concave mirror, concavo-convexLens and convex reflecting mirror,
Between above-mentioned concave-convex lens and above-mentioned convex reflecting mirror, be formed with space,
Above-mentioned optical system possesses comprising between above-mentioned plane mirror and above-mentioned concave mirrorThe space of light path be formed on that space between above-mentioned concave-convex lens and above-mentioned convex reflecting mirror separatesMember.
2. optical system according to claim 1, is characterized in that,
Above-mentioned member surround together with above-mentioned concave-convex lens and above-mentioned convex reflecting mirror be formed on above-mentionedSpace between concave-convex lens and above-mentioned convex reflecting mirror.
3. optical system according to claim 2, is characterized in that,
Above-mentioned optical system possesses gas supply part and gas discharge section, and this gas supply part is to being wrappedThe gas that the above-mentioned space supplying temperature that enclosed has been controlled, this gas discharge section is from besiegedAbove-mentioned gas is discharged in above-mentioned space.
4. optical system according to claim 1, is characterized in that,
Above-mentioned concave-convex lens is disposed at the upstream side of above-mentioned light path compared with above-mentioned convex reflecting mirror,
Above-mentioned optical system possesses absorption and sees through in the downstream of the above-mentioned convex reflecting mirror of above-mentioned light pathThe light-absorbing member of light of above-mentioned convex reflecting mirror.
5. optical system according to claim 4, is characterized in that,
Above-mentioned optical system possesses liquid supply portion and liquid discharge portion, and this liquid supply portion is to above-mentionedThe liquid that the internal feed temperature of light-absorbing member has been controlled, this liquid discharge portion inhales from above-mentioned lightReceive the inside of member and discharge aforesaid liquid.
6. optical system according to claim 1, is characterized in that,
Above-mentioned concave-convex lens and above-mentioned convex reflecting mirror are configured in pupil attached of above-mentioned optical systemClosely.
7. optical system according to claim 1, is characterized in that,
The reflecting surface of above-mentioned convex reflecting mirror is made up of the film of dielectric.
8. an exposure device, this exposure device is formed at the pattern of mask via projection optical system handleProject to substrate, and aforesaid substrate exposed,
Above-mentioned projection optical system comprises the optical system described in any one in claim 1 to 7.
9. a method of manufacturing device, comprises,
Right to use requires the exposure device described in 8, to base board to explosure;
The aforesaid substrate that has made to be exposed develops;
The aforesaid substrate that processing has been developed, manufactures above-mentioned device.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-127531 | 2012-06-04 | ||
| JP2012127531A JP6041541B2 (en) | 2012-06-04 | 2012-06-04 | Exposure apparatus and device manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103454769A CN103454769A (en) | 2013-12-18 |
| CN103454769B true CN103454769B (en) | 2016-05-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310208070.1A Active CN103454769B (en) | 2012-06-04 | 2013-05-30 | The method of optical system, exposure device and manufacture device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6041541B2 (en) |
| KR (1) | KR20130136390A (en) |
| CN (1) | CN103454769B (en) |
| TW (1) | TWI490540B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6463087B2 (en) * | 2014-11-14 | 2019-01-30 | キヤノン株式会社 | Exposure apparatus and article manufacturing method |
| JP6386896B2 (en) * | 2014-12-02 | 2018-09-05 | キヤノン株式会社 | Projection optical system, exposure apparatus, and device manufacturing method |
| JP6896404B2 (en) * | 2016-11-30 | 2021-06-30 | キヤノン株式会社 | Exposure equipment and manufacturing method of articles |
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| JP5595001B2 (en) * | 2009-10-06 | 2014-09-24 | キヤノン株式会社 | Projection optical system, exposure apparatus, and device manufacturing method |
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2012
- 2012-06-04 JP JP2012127531A patent/JP6041541B2/en active Active
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2013
- 2013-05-07 TW TW102116193A patent/TWI490540B/en active
- 2013-05-30 CN CN201310208070.1A patent/CN103454769B/en active Active
- 2013-05-31 KR KR1020130062198A patent/KR20130136390A/en active Search and Examination
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| US4690528A (en) * | 1983-10-05 | 1987-09-01 | Nippon Kogaku K. K. | Projection exposure apparatus |
| CN1618114A (en) * | 2002-06-28 | 2005-05-18 | 佳能株式会社 | Reflection mirror apparatus, exposure apparatus and device manufacturing method |
| CN1746775A (en) * | 2004-08-13 | 2006-03-15 | Asml荷兰有限公司 | Lithographic apparatus and device manufacturing method |
| TW200912562A (en) * | 2007-07-31 | 2009-03-16 | Canon Kk | Optical system, exposure device, and device manufacturing method |
| CN101625455A (en) * | 2008-07-09 | 2010-01-13 | 佳能株式会社 | Projection optical system, exposure device as well as method for producing the device |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI490540B (en) | 2015-07-01 |
| JP6041541B2 (en) | 2016-12-07 |
| KR20130136390A (en) | 2013-12-12 |
| CN103454769A (en) | 2013-12-18 |
| JP2013250541A (en) | 2013-12-12 |
| TW201350902A (en) | 2013-12-16 |
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