CN103426997B - LED support manufacturing process and packaging technology - Google Patents
LED support manufacturing process and packaging technology Download PDFInfo
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- CN103426997B CN103426997B CN201310300820.8A CN201310300820A CN103426997B CN 103426997 B CN103426997 B CN 103426997B CN 201310300820 A CN201310300820 A CN 201310300820A CN 103426997 B CN103426997 B CN 103426997B
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- led support
- material strip
- leg
- support unit
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Abstract
A kind of LED support manufacturing process and packaging technology, comprise the steps: that a. provides some conducting terminals, it is one edition that described some conducting terminals are connected by material strip, described conducting terminal comprises the leg that main part and main body extend, and the leg of described conducting terminal is connected with described material strip by a connecting portion; B. profiled insulation body form some LED support unit on described conducting terminal, the leg of described some LED support unit connects material strip by connecting portion and becomes justifying LED support, and described leg extends outside insulating body; C. LED chip is packaged in some LED support unit of justifying LED support; D. justifying LED support is carried out material strip excision, described connecting portion and material strip cut, each LED support unit is separated; LED support manufacturing process of the present invention and packaging technology effectively can improve product yield, reduce production difficulty.
Description
Technical field
The present invention relates to LED-backlit and illumination package application field, espespecially a kind of manufacturing process of LED support and packaging technology.
Background technology
Tradition LED support as shown in Figure 1, at least one pair of conducting terminal 85 described, the leg 82 extended out from conducting terminal 85 side, the material strip 84 be connected with described leg 82 and insulating body 81 integrated with described conducting terminal 85.Described material strip 84 is also extended with the feet 83 be connected with described insulating body 81 from the side, and it is one edition that described LED support unit is connected by feet 83, and described LED support unit can be separated with described feet 83.
For ease of the operation of client, the LED support manufactory aborning usual leg 82 by described LED support cuts off in advance with material strip 84, it is that a shipment is to LED factory that several LED support unit described are connected by described feet 83, and LED factory is after packaged, with tool move LED support unit make packaged after LED support unit separate.
Although as above flow process facilitates the effect of LED factory, but due to described feet 83 coordinate with described this 81 shaping mould that insulate in LED support manufacture process require higher, and easily produce gap between described feet 83 and described insulating body 81, cause plastic cement overflow problem, affect the yield of product encapsulation.
Summary of the invention
The object of the present invention is to provide a kind of structure, the LED support manufacturing process that can reduce producting process difficulty and the packaging technology that not easily produce plastic cement and overflow.
For this reason, the invention provides a kind of LED support manufacturing process and packaging technology, comprise the steps: that a. provides some conducting terminals, it is one edition that described some conducting terminals are connected by material strip, described conducting terminal comprises the leg that main part and main body extend, and the leg of described conducting terminal is connected with described material strip by a connecting portion; B. profiled insulation body form some LED support unit on described conducting terminal, the leg of described some LED support unit connects material strip by connecting portion and becomes justifying LED support, and described leg extends outside insulating body; C. LED chip is packaged in some LED support unit of justifying LED support; D. justifying LED support is carried out material strip excision, described connecting portion and material strip cut, each LED support unit is separated.
Relative to prior art, each LED support unit of LED support manufacturing process of the present invention and packaging technology is connected leg 11 and material strip 20 by connecting portion 12 and becomes justifying LED support, and shipment is to LED factory, LED factory carries out material strip 20 after packaging again and excises operation, and avoiding in prior art needs to arrange the described some LED support unit of feet and connect and easily produce the defects such as plastic cement spilling for justifying LED support.
Accompanying drawing explanation
Fig. 1 is existing LED support structure chart.
Fig. 2 is the stereogram of the conducting terminal of LED support manufacturing process of the present invention and packaging technology.
Fig. 3 be the conducting terminal of LED support manufacturing process of the present invention and packaging technology and insulating body shaping after stereogram.
Fig. 4 is the structure chart that the LED support unit of LED support manufacturing process of the present invention and packaging technology is combined into edition shape.
Fig. 5 is the schematic diagram after the LED support unit package of LED support manufacturing process of the present invention and packaging technology.
Fig. 6 is the structure chart after the LED support unit of LED support manufacturing process of the present invention and packaging technology excises material strip.
Embodiment
Refer to shown in Fig. 2 to Fig. 6, LED support manufacturing process of the present invention and packaging technology are carried out according to following steps:
A. providing several to connect is the conducting terminal 10 of an edition, it is one edition that described each conducting terminal 10 is connected by material strip 20 (one edition comprise tens or a hundreds of conducting terminal to).Described conducting terminal 10 is arranged in pairs, comprises the leg 11 that main part 13 and main body 13 extend; The leg 11 of described conducting terminal 10 is connected with described material strip 20 by connecting portion 12.
B. profiled insulation body 30 form some LED support unit on described conducting terminal 10, the leg 11 of described some LED support unit connects material strip 20 by connecting portion 12 and becomes justifying LED support, and described leg 11 extends outside insulating body 30.
C. LED chip is packaged in some LED support unit of justifying LED support, and forms encapsulation part 40.
D. justifying LED support is carried out material strip 20 to excise, described connecting portion 12 is cut with material strip 20, and each LED support unit is separated.
In the illustrated embodiment, each LED support unit is connected on material strip 20 by a pair leg 11 of both sides; But in specific implementation process, each LED support unit can also be connected to material strip 20 by a leg 11 can realize identical effect equally.
Compared to prior art, each LED support unit of LED support manufacturing process of the present invention and packaging technology is connected leg 11 and material strip 20 by connecting portion 12 and becomes justifying LED support, and shipment is to LED factory, LED factory carries out material strip 20 after packaging again and excises operation, and avoiding in prior art needs to arrange the described some LED support unit of feet and connect and easily produce the defects such as plastic cement spilling for justifying LED support.
Claims (1)
1. LED support manufacturing process and a packaging technology, is characterized in that: comprise the steps:
A. provide some conducting terminals, it is one edition that described some conducting terminals are connected by material strip, and described conducting terminal comprises the leg that main part and main body extend, and the leg of described conducting terminal is connected with described material strip by a connecting portion;
B. profiled insulation body form some LED support unit on described conducting terminal, the leg of described some LED support unit connects material strip by connecting portion and becomes justifying LED support, and described leg extends outside insulating body;
C. LED chip is packaged in some LED support unit of justifying LED support;
D. justifying LED support is carried out material strip excision, described connecting portion and material strip cut, each LED support unit is separated;
Described each LED support unit both sides are provided with at least one pair of leg, and described each LED support unit is connected to by one of them leg material strip becomes justifying LED support structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310300820.8A CN103426997B (en) | 2013-07-17 | 2013-07-17 | LED support manufacturing process and packaging technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310300820.8A CN103426997B (en) | 2013-07-17 | 2013-07-17 | LED support manufacturing process and packaging technology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103426997A CN103426997A (en) | 2013-12-04 |
| CN103426997B true CN103426997B (en) | 2015-12-09 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310300820.8A Active CN103426997B (en) | 2013-07-17 | 2013-07-17 | LED support manufacturing process and packaging technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103426997B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1797799A (en) * | 2004-12-30 | 2006-07-05 | 大铎精密工业股份有限公司 | Method for fabricating lead wire rack of light emitting diode |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201229954Y (en) * | 2008-06-18 | 2009-04-29 | 一诠精密工业股份有限公司 | LED support construction |
| CN201898149U (en) * | 2010-10-13 | 2011-07-13 | 复盛股份有限公司 | Light-emitting diode support structure |
| CN103000773A (en) * | 2011-09-13 | 2013-03-27 | 复盛精密工业股份有限公司 | Light emitting diode support structure and manufacturing method thereof |
| JP5505735B2 (en) * | 2011-09-22 | 2014-05-28 | 復盛精密工業股▲ふん▼有限公司 | Light-emitting diode support frame structure and manufacturing method thereof (2) |
| CN202917535U (en) * | 2012-10-19 | 2013-05-01 | 博罗承创精密工业有限公司 | LED bracket with multiple light emitting angles and terminal material belt thereof |
-
2013
- 2013-07-17 CN CN201310300820.8A patent/CN103426997B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1797799A (en) * | 2004-12-30 | 2006-07-05 | 大铎精密工业股份有限公司 | Method for fabricating lead wire rack of light emitting diode |
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| Publication number | Publication date |
|---|---|
| CN103426997A (en) | 2013-12-04 |
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Effective date of registration: 20180119 Address after: 523000 Industrial Development Zone of Songshan Lake in Dongguan, Guangdong Province, No. 4 factory building, No. 1 Industrial North Patentee after: Dongguan wisdom Photoelectric Technology Co., Ltd. Address before: 523808, No. 4, No. 1, industrial North Road, Songshan hi tech Industrial Development Zone, Guangdong, Dongguan Patentee before: Guangdong Changying Precision Technology Co., Ltd. |
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Effective date of registration: 20190802 Address after: 523000 First Floor of No.4 Factory Building of Industrial North Road, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Co-patentee after: Guangdong Changying Precision Technology Co., Ltd. Patentee after: Dongguan wisdom Photoelectric Technology Co., Ltd. Address before: 523000 First Floor of No.4 Factory Building of Industrial North Road, Dongguan Songshan Lake High-tech Industrial Development Zone, Guangdong Province Patentee before: Dongguan wisdom Photoelectric Technology Co., Ltd. |
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Effective date of registration: 20201113 Address after: 523808 First Floor, No. 4 Industrial North Road, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee after: DONGGUAN ZHIHAO PHOTOELECTRIC TECHNOLOGY Co.,Ltd. Address before: 523000 First Floor of No.4 Factory Building of Industrial North Road, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee before: DONGGUAN ZHIHAO PHOTOELECTRIC TECHNOLOGY Co.,Ltd. Patentee before: GUANGDONG EVERWIN PRECISION TECHNOLOGY Co.,Ltd. |
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