CN103424991B - A kind of silicon wafer linear exchange device and method - Google Patents
A kind of silicon wafer linear exchange device and method Download PDFInfo
- Publication number
- CN103424991B CN103424991B CN201210153116.XA CN201210153116A CN103424991B CN 103424991 B CN103424991 B CN 103424991B CN 201210153116 A CN201210153116 A CN 201210153116A CN 103424991 B CN103424991 B CN 103424991B
- Authority
- CN
- China
- Prior art keywords
- mechanical arm
- exchange device
- silicon wafer
- linear exchange
- slide block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention relates to lithographic equipment field, particularly relate to a kind of silicon wafer linear exchange device and method, for transmitting material between worktable and external device (ED), comprising guide rail; Be arranged at the first slide block on described guide rail, the second slide block, first, second slide block described can do staggered to-and-fro movement along described guide rail; First mechanical arm, described first mechanical arm connects described first slide block by mechanical arm adaptor; And second mechanical arm, described second mechanical arm connects described second slide block, and described first mechanical arm, the second mechanical arm are in two different plane of movement be parallel to each other.The present invention adopts and keeps away barrier design, make the move in plane that first, second mechanical arm described is parallel to each other at two, realize two groups of mechanical arms to split, when the first mechanical arm and worktable join silicon chip, second mechanical arm carries out silicon chip handing-over with mechanical arm simultaneously, after above handing-over completes, and two groups of mechanical arm counter motions simultaneously, carry out next handing-over, reduce the motion is devolved on time of half.
Description
Technical field
The present invention relates to lithographic equipment field, particularly relate to a kind of silicon wafer linear exchange device and method.
Background technology
Silicon chip transmission system is applied in numerous semiconductor equipments such as lithographic equipment, as the material interface that these equipment are external, carry out the pre-service of material, it must be reliable and efficiently, and certain material transferring precision can be provided, just refer to that material can keep certain precision to send worktable to the attitude of specifying by silicon chip transmission system, the time that silicon chip reference marker found by worktable under alignment system can be greatly reduced like this, more very be be transmitted upper slice after, alignment system need not pass through working table movement passing marker, directly just can capture of labels, substantially increase the work efficiency of this kind equipment, improve productive rate, cost-saving.
Generally speaking can built-in prealignment equipment during transmission system design, the bias of silicon chip and deflection are corrected, but this repeatable accuracy is difficult to keep after material is transmitted to worktable, there are two key factors, first worktable is in the shock frame of machine, and transmission system is in outside shock frame usually, the drift of vibroshock makes worktable and transmission system with certain frequency relative motion, it two is that silicon chip after prealignment is normally responsible for transmitting to worktable by mechanical arm, general mechanical arm is all use commercial robot, but precision is very low, generally 100um can only be reached, so just make the silicon chip after prealignment by robotic transfer to worktable after introduce a larger deviations.
For the former generally by arrange secondary prealignment device by worktable join time dynamic compensation, but for the latter design single-degree-of-freedom can two-way simultaneous motion mechanical arm (i.e. silicon wafer linear exchange device) solve.
At present, silicon wafer linear exchange device many employings unit mechanical arm successively completes film releasing step by step and gets the action of sheet, or adopt double mechanical arms to have interlocked film releasing and get the action of sheet, action simultaneously can not be reached, work efficiency is lower, and some adopts the photo-etching machine silicon chip switch of cross guide rail can reach the action simultaneously of two mechanical arms, but it is excessive to take up room, the drive unit needed is also comparatively large, and the precision of device is also lower.
Therefore, how to provide a kind of and can improve work efficiency that silicon wafer linear exchanges and the high silicon wafer linear exchange device of precision and the method technical matters that to be this area staff urgently to be resolved hurrily.
Summary of the invention
The object of the present invention is to provide a kind of silicon wafer linear exchange device and method, to solve existing silicon wafer linear exchange device inefficiency, problem that precision is low.
For solving the problems of the technologies described above, the invention provides a kind of silicon wafer linear exchange device, for transmitting material between worktable and external device (ED), it is characterized in that, comprising guide rail; Be arranged at the first slide block on described guide rail, the second slide block, first, second slide block described can do staggered to-and-fro movement along described guide rail; First mechanical arm, described first mechanical arm connects described first slide block by mechanical arm adaptor; And second mechanical arm, described second mechanical arm connects described second slide block, and described first mechanical arm, the second mechanical arm are in two different plane of movement be parallel to each other.
Preferably, first, second slide block described is respectively equipped with driving mechanism, described driving mechanism is linear electric motors.
Preferably, described silicon wafer linear exchange device also comprises one for the particulate matter that prevents first, second mechanical arm described from producing in the motion process sealing unit to external diffusion.
Preferably, described sealing unit comprises sealing unit pedestal, and described sealing unit pedestal is provided with two bar-shaped troughs along first, second manipulator motion direction described, and first, second mechanical arm described is arranged in described bar-shaped trough and moves along bar-shaped trough; Magnetic seal inhales bar, is installed on described sealing unit pedestal towards described guide rail side; Two pieces of sealing guide blocks, connect described first mechanical arm, the second mechanical arm respectively, and are close to described magnetic seal suction bar, and described sealing guide block is provided with groove, and described first mechanical arm, the second mechanical arm are provided with the through hole with described fit depressions; Diaphragm seal, inhales on bar from the groove of described sealing guide block with passing in the through hole corresponding mechanical arm and be adsorbed in described magnetic seal; Described first mechanical arm, the second mechanical arm drive described sealing guide block to inhale between bar and described diaphragm seal at described magnetic seal and move, and keep the diaphragm seal of described sealing guide block both sides to be adsorbed in described magnetic seal suction bar all the time.
Preferably, described diaphragm seal is the sheet metal of thickness 0.1mm ~ 0.3mm.
Preferably, also sealing polyurethane pad is provided with between described diaphragm seal and described sealing guide block.
Preferably, described sealing unit also comprises lower seal plate, and described lower seal plate is connected to described sealing unit pedestal, is positioned under described guide rail.
Preferably, described silicon wafer linear exchange device also comprises RZ to regulon, described RZ comprises register pin, pedestal, two groups of passing screws to regulon, described register pin by the agent localization of described linear exchange device on described pedestal, described pedestal is located at by described passing screw, and the main body that one end supports described linear exchange device makes it around the central axis of described register pin.
Preferably, described silicon wafer linear exchange device also comprises RX, RY, Z-direction adjust structure, and described RX, RY, Z-direction adjust structure are made up of three groups of threaded adjustment structures.
Preferably, first, second mechanical arm described adopts the design of sheet fork, and is respectively equipped with the ceramic sucker a pair with vacuum suction chamber.
Preferably, the inside cabling of described silicon wafer linear exchange device adopts drag chain structure.
Present invention also offers a kind of silicon wafer linear switching method, adopt silicon wafer linear exchange device as above, workflow is as follows:
The first step first mechanical arm, the second mechanical arm are all at " unloading piece " station;
Second step first manipulator motion, to " getting sheet " station, gets sheet from external device (ED);
3rd step first mechanical arm returns " unloading piece " station, waits for worktable upper slice, and the second manipulator motion, to " work " station, gets sheet from worktable;
4th step second mechanical arm returns " unloading piece " station, waits for that exterior mechanical hand gets sheet from it, the first manipulator motion to " work " station, to worktable bottom sheet;
5th step first mechanical arm returns " unloading piece " station, and exterior mechanical hand gets sheet from the second mechanical arm.
The present invention adopts and keeps away barrier design, make first, second mechanical arm described two different plane motions be parallel to each other, realize two groups of mechanical arms to split, while the first mechanical arm and worktable join silicon chip, second mechanical arm carries out silicon chip handing-over with mechanical arm simultaneously, after above handing-over completes, and two groups of mechanical arm counter motions simultaneously, carry out next handing-over, reduce the motion is devolved on time of half.
Accompanying drawing explanation
Fig. 1 is the schematic perspective view of the silicon wafer linear exchange device of one embodiment of the invention;
Fig. 2 is the structural representation of the silicon wafer linear exchange device of one embodiment of the invention;
Fig. 3 is the cross-sectional schematic of Fig. 2;
Fig. 4 is the sealing unit structural representation of the silicon wafer linear exchange device of one embodiment of the invention;
Fig. 5 is the stereographic map of the sealing unit structure of the silicon wafer linear exchange device of one embodiment of the invention;
Fig. 6 is the structural upright schematic diagram of the regulon structure of the silicon wafer linear exchange device of one embodiment of the invention;
Fig. 7 is the structural drawing of upper and lower mechanical arm of the silicon wafer linear exchange device of one embodiment of the invention;
Fig. 8 is the silicon wafer linear exchange device station layout of one embodiment of the invention.
In figure: 101-guide rail, 102-first slide block, 103-second slide block, 104-first mechanical arm, 104a-mechanical arm adaptor, the mechanical arm pieces fork of 104b-first, 105-second mechanical arm, the mechanical arm pieces fork of 105b-second, 106-worktable, 107-drag chain structure, 108-sealing unit, 108a-sealing unit pedestal, 108b-seals guide block, 108c-magnetic seal inhales bar, 108d-diaphragm seal, 108e-lower seal plate, 109-RZ is to regulon, 109a-register pin, 109b-pedestal, 109c-passes screw, 109d-threaded adjustment structure, 111-8 cun of substrate, 112-12 cun of substrate, 120-" work " station, 121-" unloading piece " station, 122-" gets sheet " station.
Embodiment
For enabling above-mentioned purpose of the present invention, feature and advantage become apparent more, are described in detail the specific embodiment of the present invention below in conjunction with accompanying drawing.
Silicon wafer linear exchange device provided by the invention, for transmitting material between worktable and external device (ED), its structure as depicted in figs. 1 and 2, comprises guide rail 101, and particularly, described guide rail 101 is single wide cut line slideway; Be arranged at the first slide block 102, second slide block 103 on described guide rail 101, first, second slide block 102,103 described can do staggered to-and-fro movement along described guide rail 101; First mechanical arm 104, described first mechanical arm 104 connects described first slide block 102 by mechanical arm adaptor 104a; And second mechanical arm 105, described second mechanical arm 105 connects described second slide block 103, and described first mechanical arm 104, second mechanical arm 105 is in two different plane of movement be parallel to each other.Particularly, worktable 106 is for receiving external device (ED), here external device (ED) refers to the silicon chip that transmission system is transmitted, and described silicon chip is moved to exposure region carry out lithography operations, described first mechanical arm 104, second mechanical arm 105 does rectilinear motion respectively in two different planes be parallel to each other along described guide rail 101 direction (being Y-direction in the present embodiment), particularly, described first, second slide block 102, driving mechanism is respectively equipped with on 103, described driving mechanism is linear electric motors, single wide cut line slideway is adopted to lead, measured by its precision of grating pair, precision in 800mm stroke can reach 2 μm.Please refer to Fig. 3, described mechanical arm adaptor 104a connects described first mechanical arm 104, described first mechanical arm 104 is suspended on described second mechanical arm 105, make described first, second mechanical arm 104, 105 are formed up and down, left right-alternative arrangement form, thus the mechanical organ compact in design in described silicon wafer linear exchange device can be made, can utilize and allly utilize space, in the space of 90mm*70mm, layout two groups of moving cells, namely described first, second slide block 102, 103, described first, second slide block 102, 103 adopt consistent structure, back-to-back layout, thus size can be saved to the full extent, and realize the non-interference of motion, can simultaneously relative motion, complete fluctuating plate simultaneously, namely while the first mechanical arm 104 joins silicon chip with worktable 106, second mechanical arm 105 carries out silicon chip handing-over with mechanical arm simultaneously, after having joined, two groups of mechanical arms 104, 105 counter motions simultaneously, join next time, thus reduce the motion is devolved on time of half, effectively increase work efficiency.In addition, the design of single-degree-of-freedom can make the loss of accuracy after prealignment minimum.
Preferably, as depicted in figs. 1 and 2, described silicon wafer linear exchange device also comprises one for the particulate matter that prevents first, second mechanical arm 104,105 described from producing in the motion process sealing unit 108 to external diffusion, please refer to Fig. 4 and Fig. 5, described sealing unit 108 comprises sealing unit pedestal 108a, described sealing unit pedestal 108a is provided with two bar-shaped trough (not shown)s along first, second mechanical arm 104,105 direction of motion described, and first, second mechanical arm 104,105 described is arranged in described bar-shaped trough and moves along bar-shaped trough; Magnetic seal inhales bar 108c, is installed on described sealing unit pedestal 108a towards described guide rail 101 side; Two pieces of sealing guide block 108b, connect described first mechanical arm 104, second mechanical arm 105 respectively, and being close to described magnetic seal suction bar 108c, described sealing guide block 108b is provided with groove, and described first mechanical arm 104, second mechanical arm 105 is provided with the through hole with described fit depressions; Diaphragm seal 108d, inhales on bar 108c from the groove of described sealing guide block 108b with passing in the through hole corresponding mechanical arm and be adsorbed in described magnetic seal; Described first mechanical arm 104, second mechanical arm 105 drives described sealing guide block 108b to inhale between bar 108c and described diaphragm seal 108d at described magnetic seal and moves, and keeps the diaphragm seal 108d of described sealing guide block 108b both sides to be adsorbed in described magnetic seal suction bar 108c all the time.Preferably, described diaphragm seal 108d is the sheet metal of thickness 0.1mm ~ 0.3mm, and the best is 0.2mm.Like this, described diaphragm seal 108d adopts metal material that described diaphragm seal 108d is adsorbed by described magnetic seal suction bar 108c, thickness can not blocked up can not be excessively thin, to ensure certain flexural deformation to occur to be close to the surface that described magnetic seal inhales bar 108c after described diaphragm seal 108d passes from described groove and through hole, sealing effectiveness and serviceable life can not be affected because of excessively thin again.Preferably, surface of contact and the sealing unit pedestal 108a place plane of described two pieces of sealing guide block 108b and diaphragm seal 108d are angled, and this angle is less than 90 degree.In addition, also sealing polyurethane pad is provided with between described diaphragm seal 108d and described sealing guide block 108b, described diaphragm seal 108d is made to rub little when quickly passing through described through hole, and substantially do not produce pollution, prevent fricative contamination particle from leaking, and do not affect kinematic accuracy and the speed of first, second mechanical arm 104,105 described, preferably, described sealing unit 108 also comprises lower seal plate 108e, described lower seal plate 108e is connected to described sealing unit pedestal 108a, is positioned under described guide rail 101.Described sealing unit 108 is built in described silicon wafer linear exchange device, does not show its structure in appearance.
Preferably, as depicted in figs. 1 and 2, described silicon wafer linear exchange device also comprises RZ to regulon 109, particularly, please refer to Fig. 6, described RZ comprises register pin 109a, pedestal 109b, two groups of passing screw 109c to regulon 109, described register pin 109a by the agent localization of described linear exchange device on described pedestal 109b, described passing screw 109c is located at described pedestal 109b, the main body that one end supports described linear exchange device makes it around the central axis of described register pin 109a, thus carries out RZ to adjustment.Preferably, described silicon wafer linear exchange device also comprises RX, RY, Z-direction adjust structure, and described RX, RY, Z-direction adjust structure are made up of three groups of threaded adjustment structure 109d.Described RX, RY, Z-direction adjust structure carry out the adjustment of 3 degree of freedom to first, second mechanical arm 104,105 described, silicon chip center is realized to be placed into any desired position thus, adopt above-mentioned RZ to regulon 109 and RX, RY, Z-direction adjust structure, adapt to the inherent variability that described worktable 106 is possible, anchor point last for silicon chip can be placed on the arbitrfary point of claimed range by free position.
Preferably, please refer to Fig. 1, Fig. 3 and Fig. 7, first, second mechanical arm 104,105 described adopts the design of sheet fork, namely first, second mechanical arm 104,105 described is respectively equipped with first, second mechanical arm pieces fork 104b, 105b, and be respectively equipped with the ceramic sucker a pair with vacuum suction chamber, described first, second mechanical arm pieces fork 104b, 105b can carry the silicon chip of two kinds of specifications of 12 cun of substrates 112 and 8 cun of substrates 111, described ceramic sucker is also carried out Design of Compatibility based on this application, to meet the Production requirement of the silicon chip of two kinds of different sizes.
Preferably; as depicted in figs. 1 and 2; the inside cabling of described silicon wafer linear exchange device adopts drag chain structure 107; preferably, adopt the described drag chain structure 107 that toilet is special, the friction between each mechanical part can be reduced; protection and traction are play a part to built-in mechanical part; and drag chain often saves and can open, and is easy for installation and maintenance, the impact reached cable rubs drops to minimum object.
Present invention also offers a kind of silicon wafer linear switching method, adopt silicon wafer linear exchange device as above, as shown in Figure 8, in figure, 120 are depicted as " work " station to its station layout, and 121 are depicted as " unloading piece " station, and 122 are depicted as " getting sheet " station.
Workflow is as follows:
The first step first mechanical arm, the second mechanical arm are all at " unloading piece " station;
Second step first manipulator motion, to " getting sheet " station, gets sheet from external device (ED);
3rd step first mechanical arm returns " unloading piece " station, waits for worktable upper slice, and the second manipulator motion, to " work " station, gets sheet from worktable;
4th step second mechanical arm returns " unloading piece " station, waits for that exterior mechanical hand gets sheet from it, the first manipulator motion to " work " station, to worktable bottom sheet;
5th step first mechanical arm returns " unloading piece " station, and exterior mechanical hand gets sheet from the second mechanical arm.
An action cycle completes, and waits for the next work period.
In sum, silicon wafer linear exchange device of the present invention and method adopt keeps away barrier design, by first, second mechanical arm 104, stagger in interval between 105, first mechanical arm 104 is suspended on the second mechanical arm 105 by mechanical arm adaptor 104a, realize first, second mechanical arm 104, 105 split, while the first mechanical arm 104 joins silicon chip with worktable, second mechanical arm 105 carries out silicon chip handing-over with mechanical arm simultaneously, after more than having joined, first, second mechanical arm 104, 105 counter motions simultaneously, carry out next handing-over, reduce the motion is devolved on time of half, improve work efficiency.
Obviously, those skilled in the art can carry out various change and modification to the present invention and not depart from the spirit and scope of the present invention.Like this, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.
Claims (12)
1. a silicon wafer linear exchange device, for transmitting material between worktable and external device (ED), is characterized in that, comprising
Guide rail;
Be arranged at the first slide block on described guide rail, the second slide block, first, second slide block described can do staggered to-and-fro movement along described guide rail;
First mechanical arm, described first mechanical arm connects described first slide block by mechanical arm adaptor; And
Second mechanical arm, described second mechanical arm connects described second slide block, and described first mechanical arm, the second mechanical arm are in two different plane of movement be parallel to each other.
2. silicon wafer linear exchange device as claimed in claim 1, it is characterized in that, first, second slide block described is respectively equipped with driving mechanism, and described driving mechanism is linear electric motors.
3. silicon wafer linear exchange device as claimed in claim 1, is characterized in that, described silicon wafer linear exchange device also comprises one for the particulate matter that prevents first, second mechanical arm described from producing in the motion process sealing unit to external diffusion.
4. silicon wafer linear exchange device as claimed in claim 3, it is characterized in that, described sealing unit comprises
Sealing unit pedestal, described sealing unit pedestal is provided with two bar-shaped troughs along first, second manipulator motion direction described, and first, second mechanical arm described is arranged in described bar-shaped trough and moves along bar-shaped trough;
Magnetic seal inhales bar, is installed on described sealing unit pedestal towards described guide rail side;
Two pieces of sealing guide blocks, connect described first mechanical arm, the second mechanical arm respectively, and are close to described magnetic seal suction bar, and described sealing guide block is provided with groove, and described first mechanical arm, the second mechanical arm are provided with the through hole with described fit depressions;
Diaphragm seal, inhales on bar from the groove of described sealing guide block with passing in the through hole corresponding mechanical arm and be adsorbed in described magnetic seal;
Described first mechanical arm, the second mechanical arm drive described sealing guide block to inhale between bar and described diaphragm seal at described magnetic seal and move, and keep the diaphragm seal of described sealing guide block both sides to be adsorbed in described magnetic seal suction bar all the time.
5. silicon wafer linear exchange device as claimed in claim 4, it is characterized in that, described diaphragm seal is the sheet metal of thickness 0.1mm ~ 0.3mm.
6. silicon wafer linear exchange device as claimed in claim 4, is characterized in that, be also provided with sealing polyurethane pad between described diaphragm seal and described sealing guide block.
7. silicon wafer linear exchange device as claimed in claim 4, it is characterized in that, described sealing unit also comprises lower seal plate, and described lower seal plate is connected to described sealing unit pedestal, is positioned under described guide rail.
8. silicon wafer linear exchange device as claimed in claim 1, it is characterized in that, described silicon wafer linear exchange device also comprises RZ to regulon, described RZ comprises register pin, pedestal, two groups of passing screws to regulon, described register pin by the agent localization of described linear exchange device on described pedestal, described pedestal is located at by described passing screw, and the main body that one end supports described linear exchange device makes it around the central axis of described register pin.
9. silicon wafer linear exchange device as claimed in claim 1, it is characterized in that, described silicon wafer linear exchange device also comprises RX, RY, Z-direction adjust structure, and described RX, RY, Z-direction adjust structure are made up of three groups of threaded adjustment structures.
10. silicon wafer linear exchange device as claimed in claim 1, is characterized in that, first, second mechanical arm described adopts the design of sheet fork, and is respectively equipped with the ceramic sucker a pair with vacuum suction chamber.
11. silicon wafer linear exchange device as claimed in claim 1, is characterized in that, the inside cabling of described silicon wafer linear exchange device adopts drag chain structure.
12. 1 kinds of silicon wafer linear switching methods, is characterized in that, adopt as the silicon wafer linear exchange device in claim 1 ~ 11 as described in any one, workflow is as follows:
The first step first mechanical arm, the second mechanical arm are all at " unloading piece " station;
Second step first manipulator motion, to " getting sheet " station, gets sheet from external device (ED);
3rd step first mechanical arm returns " unloading piece " station, waits for worktable upper slice, and the second manipulator motion, to " work " station, gets sheet from worktable;
4th step second mechanical arm returns " unloading piece " station, waits for that exterior mechanical hand gets sheet from it, the first manipulator motion to " work " station, to worktable bottom sheet;
5th step first mechanical arm returns " unloading piece " station, and exterior mechanical hand gets sheet from the second mechanical arm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210153116.XA CN103424991B (en) | 2012-05-15 | 2012-05-15 | A kind of silicon wafer linear exchange device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210153116.XA CN103424991B (en) | 2012-05-15 | 2012-05-15 | A kind of silicon wafer linear exchange device and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103424991A CN103424991A (en) | 2013-12-04 |
| CN103424991B true CN103424991B (en) | 2015-09-30 |
Family
ID=49649935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210153116.XA Active CN103424991B (en) | 2012-05-15 | 2012-05-15 | A kind of silicon wafer linear exchange device and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103424991B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016152721A1 (en) * | 2015-03-25 | 2016-09-29 | 株式会社日立国際電気 | Substrate processing device and semiconductor device manufacturing method |
| CN106292194B (en) * | 2015-05-24 | 2018-03-30 | 上海微电子装备（集团）股份有限公司 | Silicon chip transmission system |
| CN107877927B (en) * | 2017-11-06 | 2024-03-12 | 终结号（深圳）科技有限公司 | Automatic feeding method of box packing machine |
| CN109216250B (en) * | 2018-10-19 | 2024-05-17 | 清华大学 | Wafer transmission mechanism |
| CN111383971A (en) * | 2018-12-29 | 2020-07-07 | 江苏鲁汶仪器有限公司 | Vacuum conveying piece device |
| CN109677928A (en) * | 2019-01-11 | 2019-04-26 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Robot device |
| CN112799283B (en) * | 2019-10-28 | 2022-04-15 | 上海微电子装备（集团）股份有限公司 | Substrate temperature stabilizing device and method and photoetching system |
| CN112053984B (en) * | 2020-09-28 | 2022-06-28 | 中国科学院光电技术研究所 | Automatic many sizes silicon chip transmission device of handing-over |
| CN114888983A (en) * | 2022-05-31 | 2022-08-12 | 杭州中为光电技术有限公司 | Automatic chamfering and cleaning integrated equipment for silicon wafers |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101226878A (en) * | 2007-01-15 | 2008-07-23 | 大日本网目版制造株式会社 | Substrate processing apparatus and substrate processing method |
| EP2298959A1 (en) * | 2008-06-06 | 2011-03-23 | Ulvac, Inc. | Film formation apparatus |
-
2012
- 2012-05-15 CN CN201210153116.XA patent/CN103424991B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101226878A (en) * | 2007-01-15 | 2008-07-23 | 大日本网目版制造株式会社 | Substrate processing apparatus and substrate processing method |
| EP2298959A1 (en) * | 2008-06-06 | 2011-03-23 | Ulvac, Inc. | Film formation apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103424991A (en) | 2013-12-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103424991B (en) | A kind of silicon wafer linear exchange device and method | |
| CN101844359B (en) | Multijoint robot | |
| CN106449510B (en) | Wafer transmission device | |
| TWI644768B (en) | Silicon transfer system | |
| CN103771113A (en) | Material conveying device | |
| CN109719385A (en) | A kind of circulation transferring jig for battery core ultrasonic bonding | |
| CN109904096A (en) | A kind of semiconductor load all-in-one machine | |
| CN104057438B (en) | Panel is carried and uses three arm robots | |
| CN110053069A (en) | A kind of multi-function robot suction cup carrier | |
| CN105552005A (en) | Back bonding lamination device for chip | |
| CN210379004U (en) | Double-power automatic wafer carrying mechanism | |
| CN110310911A (en) | Semiconductor equipment, wafer transfer mechanism and operational method | |
| TW200508140A (en) | Method and apparatus for vertical transfer of semiconductor substrates between cleaning modules | |
| CN209834996U (en) | Novel rotary suction nozzle material taking mechanism | |
| CN105151776A (en) | Mechanical arm | |
| CN206344162U (en) | A kind of manipulator and evaporation coating device | |
| CN108190517A (en) | Flat-type workpiece aligns transmission device and method | |
| CN111604929A (en) | Carrying clamping jaw | |
| CN102183738A (en) | Electric energy meter moving device capable of moving among work plates with different specifications | |
| CN201685264U (en) | Silicon chip manipulator | |
| CN218226091U (en) | Chemical mechanical planarization equipment | |
| CN207748540U (en) | Flat-type workpiece aligns transmission device | |
| CN202910867U (en) | Robot palm for sheet glass | |
| CN208945715U (en) | Automatic alignment mechanism under line | |
| CN206475175U (en) | Floating clamp and the robot with it |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 201203 Pudong New Area East Road, No. 1525, Shanghai Co-patentee after: Shanghai Micro And High Precision Mechine Engineering Co., Ltd. Patentee after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 Pudong New Area East Road, No. 1525, Shanghai Co-patentee before: Shanghai Micro And High Precision Mechine Engineering Co., Ltd. Patentee before: Shanghai Micro Electronics Equipment Co., Ltd. |
|
| CP01 | Change in the name or title of a patent holder |