CN103415750A - Household system with multiple peltier systems - Google Patents

Household system with multiple peltier systems Download PDF

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Publication number
CN103415750A
CN103415750A CN2012800047083A CN201280004708A CN103415750A CN 103415750 A CN103415750 A CN 103415750A CN 2012800047083 A CN2012800047083 A CN 2012800047083A CN 201280004708 A CN201280004708 A CN 201280004708A CN 103415750 A CN103415750 A CN 103415750A
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CN
China
Prior art keywords
heat
semiconductor refrigeration
energy
refrigeration system
semiconductor
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Pending
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CN2012800047083A
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Chinese (zh)
Inventor
亚辛·阿拉法
默罕默德·阿米
内伦德兰·苏里亚尔
古斯塔夫·索德斯特龙
斯蒂芬·曼戈尔德
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ZOLIEX AB
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ZOLIEX AB
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Publication of CN103415750A publication Critical patent/CN103415750A/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
    • F24H1/00—Water heaters, e.g. boilers, continuous-flow heaters or water-storage heaters
    • F24H1/18—Water-storage heaters
    • F24H1/185—Water-storage heaters using electric energy supply
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
    • F24H7/00—Storage heaters, i.e. heaters in which the energy is stored as heat in masses for subsequent release
    • F24H7/02—Storage heaters, i.e. heaters in which the energy is stored as heat in masses for subsequent release the released heat being conveyed to a transfer fluid
    • F24H7/04—Storage heaters, i.e. heaters in which the energy is stored as heat in masses for subsequent release the released heat being conveyed to a transfer fluid with forced circulation of the transfer fluid
    • F24H7/0408—Storage heaters, i.e. heaters in which the energy is stored as heat in masses for subsequent release the released heat being conveyed to a transfer fluid with forced circulation of the transfer fluid using electrical energy supply
    • F24H7/0433—Storage heaters, i.e. heaters in which the energy is stored as heat in masses for subsequent release the released heat being conveyed to a transfer fluid with forced circulation of the transfer fluid using electrical energy supply the transfer medium being water
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C1/00—Stoves or ranges in which the fuel or energy supply is not restricted to solid fuel or to a type covered by a single one of the following groups F24C3/00 - F24C9/00; Stoves or ranges in which the type of fuel or energy supply is not specified
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D18/00—Small-scale combined heat and power [CHP] generation systems specially adapted for domestic heating, space heating or domestic hot-water supply
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D2101/00—Electric generators of small-scale CHP systems
    • F24D2101/60—Thermoelectric generators, e.g. Peltier or Seebeck elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D2103/00—Thermal aspects of small-scale CHP systems
    • F24D2103/10—Small-scale CHP systems characterised by their heat recovery units
    • F24D2103/17—Storage tanks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D2200/00—Heat sources or energy sources
    • F24D2200/16—Waste heat
    • F24D2200/24—Refrigeration
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F25B2321/0252—Removal of heat by liquids or two-phase fluids

Abstract

A household system (1), which includes a first cooling unit (10) that is configured to be connectable to a heat/energy reservoir (30) via a first peltier system (11), and a heating unit (20) that is configured to be connectable to the heat/energy reservoir (30) via a second peltier system (21), where the first peltier system (11) is configured for transferring heat/energy between the cooling unit (10) and the energy reservoir (30), and the second peltier system (21) is configured for transferring energy between the heat reservoir (30) and the heating unit (20).

Description

Domestic system with a plurality of semiconductor refrigeration systems
Technical field
The present invention relates generally to a kind of housed device, particularly transporting heat energy between the semiconductor refrigerating parts that family expenses equipment is used.
Background technology
Masses more and more pay close attention to raising and the energy security by the environmental change caused due to global warming, fossil fuel price; Regenerative resource is being played the part of important role in having addressed these problems producing local, the clean and inexhaustible energy.In different regenerative resources, as in wind-force, waterpower, wave, solar energy, biological energy source and other, become faster from the distributed power generation solar energy and wind turbine, wherein each is direct current (DC) in essence.The better compatibility of these direct current memory technologies such as battery and fuel cell causes the interest that nearest direct current is used.And family, office and operate in a lot of equipment in the industry of low pressure, direct current, transform from standard electric alternating current (AC) supply device is inner.The loss transformed to DC by simply removing AC, energy loss can be reduced.The combination of simpler distributed power generation and backup battery can be used and effectively directly supply DC equipment.Be generally used for the machinery exchanged between equipment under construction, comprise probe, controller and the low follow current of other equipment state needs.When power equipment start to use, in energy conversion, produced energy loss, when operation under low current mode, produced loss, when product disconnects and external power source has still produced loss during plug-in.The use of low-voltage DC provides crucial benefit, and low-tension current does not need balance, so disturbance do not conduct by system, so it has protected responsive equipment not to be subjected to other power quality problems affect.The benefit of low-voltage DC at other has comprised safety and accurate control.
The domestic system of latest developments comprises only moves galvanic family, and wherein to enter the entrance of family be the direct current from solar cell, wind power plant or other energy to electric power, and direct current is converted into alternating current.A problem in being applied in domestic system for example is how the household equipment that is normally operated in alternating current is provided, and for example refrigerator, stove, dish-washing machine, washing machine, to DC system.Simultaneously, replacing conventional cooling system, as refrigerator, is a lasting development.Conventional cooling system generally includes cold-producing medium, and human body and environment all are harmful to.Conventional cooling system comprises three foundations, i.e. evaporimeter, compressor and condenser.Evaporimeter is that compressed refrigerant expands, the part of boiling and evaporation.The energy is absorbed in the state variation from liquid to gas.Compressor is as refrigerated medium pump, and Compressed Gas is to change its state to liquid again.The heat absorbed in evaporimeter, and the heat produced in compression is discharged in environment or condenser on every side.
Relating to heating or possible technical field developed of cooling technology is the application of semiconductor refrigerating parts.In the detailed description part, have further and describe, in a word, it must use the semiconductor refrigerating parts, and it provides thermograde when receiving direct current, and direct current is provided when being subject to thermograde.The example of described embodiment provides in list of references [1], it has been described and has a kind ofly used the cooling refrigerator of semiconductor refrigerating parts, and in list of references [2], has described a kind of freeze/thaw device that uses the semiconductor refrigerating parts.
Be necessary to find possible solution, offer the housed device that is suitable for moving direct current and does not need rectifier.In addition, the variation when preventing supply of electric power, guarantee the consumption management of the possible energy, and effective equipment must be provided, in kitchen or housed device or near storage use the energy.
Summary of the invention
The invention discloses the solution of avoiding some the problems referred to above, and a kind of housed device of prodigiosin source efficiency is provided.
The invention discloses a kind of domestic system, it comprises, the first cooling unit, be characterised in that by the first semiconductor refrigeration system and can be connected to heat/energy storage device, and heating unit, be characterised in that by the second semiconductor refrigeration system and can be connected to heat/energy storage device, wherein the first semiconductor refrigeration system is between cooling unit and energy storage device, transmitting heat/energy, and the second semiconductor refrigeration system is for transmitting the energy between heat holder and heating unit.
Advantage disclosed by the invention comprises a kind of housed device of prodigiosin source efficiency.
The accompanying drawing explanation
The present invention, and goal of the invention and advantage, can say and obtain best understanding by reference to following specific embodiment and relevant drawings, wherein:
Figure 1 shows that the schematic diagram of semiconductor refrigerating parts;
Figure 2 shows that the block diagram of embodiment disclosed by the invention;
Figure 3 shows that according to the block diagram of disclosed embodiment part of the present invention disclosed by the invention;
Figure 4 shows that the block diagram according to another preferred embodiment disclosed by the invention;
Figure 5 shows that according to the block diagram of a preferred embodiment more disclosed by the invention;
Figure 6 shows that the block diagram according to another preferred embodiment disclosed by the invention;
Figure 7 shows that the schematic diagram according to the embodiment of domestic system disclosed by the invention.
The specific embodiment
All in accompanying drawing, identical Reference numeral is for same or corresponding parts.
Content disclosed by the invention provides a kind of domestic system or equipment of prodigiosin source efficiency, and wherein the energy is stored and at cooling unit, as refrigerator, and heating unit, between stove, by the semiconductor refrigerating parts swap.The known housed device that heats stove or cooling refrigerator with the semiconductor refrigerating parts has been arranged.But existing equipment can not provide temperature difference, 60 ℃ are being divided other operating temperature with synchronization refrigerator and stove as required.
The inventor has defined new scheme, and wherein two semiconductor refrigeration systems are applied in the combination of heat holder, and wherein at least one cooling unit and a heating unit can remain on minute other operating temperature.
In order to understand better disclosed content of the present invention, below describe in detail the semiconductor refrigerating parts.
The semiconductor refrigerating parts are a kind of equipment of paltie effect from a surface to another surperficial pumping heat that utilizes.It typically comprises two plates, and one is cold drawing, and another is hot plate.Plate is electrically connected to power supply.If there is voltage to be applied on the semiconductor refrigerating parts, heat is pumped into hot surface from cold surface, makes a plate cold, a plate heat.Himself can not produce heat or cold, but transmits heat to another plate from a plate.It also is called TEC (TEC), or electrothermal module (TEM).It is also important that, when the DC voltage polarity of using was changed, this phenomenon can be reversed, and it can cause that heat moves to opposite direction.Electrothermal module can be applied to the heating and cooling purpose; In addition, it is very applicable for the accurate temperature control assembly.If the temperature difference is implemented around module, it can produce voltage, so module can be used to generating.
Content illustration disclosed by the invention have a function of so-called semiconductor refrigerating parts.This paltie effect is a kind of pyroelectric phenomena, when direct current is connected by metal and semiconductor, and sets up thermograde in the both sides of parts, and in the time of as shown in Figure 1, it can occur.This effect can be used to the semiconductor refrigerating parts, provide direct current by applying thermograde.By to the semiconductor refrigerating parts, providing direct current, corresponding Seebeck effect causes the heat transmission between both sides.In essence, charge carrier, for example the side of heat energy to heat carried from a cold side of semiconductor refrigerating parts in electronics and hole.Therefore, likely use the semiconductor refrigerating parts that electric current both was provided, also from an object, transmit heat to another.By a side of heating semiconductor refrigerating parts, an opposite side will become colder, and vice versa.
With reference to figure 2, will be described according to a basic embodiment of the domestic system of content disclosed by the invention.System 1 comprises the first cooling unit 10, and it is connected to heat holder 30 by the first semiconductor refrigeration system 11.Heating unit 20 is connected to identical heat holder 30 by the second semiconductor refrigeration system 21.Therefore, the first semiconductor refrigeration system 11 between cooling unit 10 and heat holder 30 with the form transmitting energy of heat, similarly, the second semiconductor refrigeration system 21 between heat holder 30 and heating unit 20 with the form transmitting energy of heat.Semiconductor refrigeration system is preferably by DC system, and for example the 48V DC system provides power.
In another embodiment, cooling unit 10 is refrigerators, and heating unit 20 is stoves.According to other embodiment, heat holder 30 comprises hot water tank, water consumption unit 40, and for example dish-washing machine or washing machine can be connected up.Therefore, domestic system 1 has refrigerator 10, stove 20 and hot water tank 30.
Content disclosed by the invention has proposed a kind of refrigerator 10 and stove 20 assembled units 1 of novelty, mainly by dc source, is driven.When energising, electrothermal module (TEM) 11 produces the temperature difference by from a side, extracting heat to opposite side in its both sides.This concept is for refrigerator 10 work.The heat extracted from refrigerator 10 and the heat produced to TEM 11 due to power supply become the heat of the opposite side of TEM 11.This heat is collected and is supplied to by the pump circulation the cold side of the 2nd TEM 11 by water holder 30.This heat is used for increasing the temperature of the cold side of the 2nd TEM 11, arrives the 48V dc source by link block, makes the temperature of a side of the heat of module can reach easily 100 ℃.In order to store the heat of stove 20, be used by the paraffin that has the latent heat storage capacity at 100 ℃ of its states of change from the solid to liquid.The glassware for drinking water of hot water tank 30 has the temperature up to 60 ℃, and it can be used to dish-washing machine or washing machine, to reduce the energy resource consumption of dish-washing machine or washing machine.Extra little (cylinder) aluminum radiator 23 can be placed on the paraffin centre of stove so that boiling water to be provided.
According to specific embodiment, disclosure of the present invention relates to a kind of domestic system, has refrigerator 10 and stove 20, by two semiconductor refrigerating parts 11,21 or semiconductor refrigeration system, is connected with hot water tank 30.This system 1 comprises cooling unit (refrigerator) 10, is connected to hot water tank 30 by air/liquid semiconductor refrigeration system 11.Heating unit (stove) 20 also is connected to hot water tank 30 by liquid/solid semiconductor refrigeration system 21.This semiconductor refrigeration system is preferably the DC system by 48V.Each semiconductor refrigeration system can comprise a plurality of independently semiconductor refrigerating parts.
Semiconductor refrigeration system 11,21 or TEM operate in the mode similar to conventional cooling system.Along with electronics passes at the low energy layers of the P-type semiconductor parts high-energy layer to the N-type semiconductor element, show as evaporimeter, thermal energy at cold junction by Electron absorption.When electronics, move to the low energy layers of P-type semiconductor parts from the high-energy layer of N-type semiconductor element, show as condenser, thermal energy is discharged from hot junction.TEC is as heat pump, and there is no movable part, the solid condition apparatus of fluid or gas.The electric power that is provided for module provides energy to using mobile electron and passes system as compressor.
Electrothermal module can be compared with thermocouple, and it is by connecting two different metal lines, typical in copper or constantan, makes two contacts form and makes.Then, a contact remains on some specified temps, and another contact is connected to the object that needs measurement.When some points were opened, the voltage of generation was measured when loop.By considering a pair of fixed contact that applies electric flux, cause that a contact becomes cold, and another becomes hot with opposite form.Several thermocouples use between two plates of semiconductor refrigerating parts, they are connected.The semiconductor refrigerating parts are mainly made by semi-conducting material, comprise a plurality of PN contacts, and parallel electrical connection is connected with temperature successively.They are heavily doped special additive, and it can promote the electronics surplus or electronics lacks.Thermoelectric part and being connected electrically between two ceramic substrate is installed.The entire infrastructure that holds that substrate is used to machinery is integrated, and insulate between single parts and outside electrical connection of installing between surface.
The semiconductor refrigerating parts produce a large amount of heat, the heat that it consumes more than them usually at hot surface.Because TEC itself causes a large amount of electric currents, itself is because heat loss produces heat.The cooling means of the most frequently used semiconductor refrigerating module is air cooling.With the fin of cooling fan, be arranged on a side of the heat of semiconductor refrigerating module, with from main body, heat being passed away.Heat-conducting cream is used to effective transferring heat.In a side of heat, along with electronics moves to low energy layers (P type) from high-energy layer parts (N-type), heat is discharged on fin.Fin should be chosen to be the heat of a side that can guide all heat that come from the semiconductor refrigerating module.
The dissimilar semiconductor refrigerating module that is used to of cooling/heating systems, air/air for example, air/liquid, liquid/liquid, and liquid/solid cooling system.Air/air has the fan that is arranged on the module both sides.Around each fan propagation cold air arrives.The fan that is arranged on a cold side is propagated cold air, and the fan that is arranged on a side of heat is propagated hot-air.Air/liquid is used between refrigerator parts and tank parts.The fan that is connected to a cold side of semiconductor refrigerating module is propagated cold air, and the conduit working fluid of a side that is connected to the heat of semiconductor refrigerating parts is taken away from the heat of a side of the heat of module.The fan of air cooling system is powered by low dc voltage, and its power consumption is very little, as shown in Figure 3.The semiconductor refrigerating module is extracted the side of heat to the heat of module from a cold side of module, by pipeline, is circulated by pump for cooling water, is used for taking away the water of heat to water tank from a side of the heat of semiconductor refrigerating module.Cooling fan is propagated cooling-air in the refrigerator parts.
Another system had by the liquid-circulating of the pipeline of the both sides at electrothermal module can be used.Usually the high temperature electrothermal module is used liquid system to reach specified temp in a cold side, then by a side that keeps the poor heat in module of specified temp, obtains high temperature.Liquid-cooling system in a side of heat is generally used for taking away heat from a side of heat.
The disclosed content of Fig. 4 according to the present invention, the first semiconductor refrigeration system 11 is typically the air/liquid semiconductor refrigeration system, wherein, from the air of refrigerator 10, by fan, be transported to the cold side of semiconductor refrigeration system 11 or TEM, the water of a side direct contact heat water holder 30 of the heat of semiconductor refrigeration system 11.The second semiconductor refrigeration system 21 is typically the liquid/solid semiconductor refrigeration system, wherein a cold side of semiconductor refrigeration system 21 is born the water of hot water tank 30, and a side of heat directly contacts stove 20, for example furnace surface.In fact, hot water, from the first semiconductor refrigeration system 11, being recycled to the second semiconductor refrigeration system 21, before a side of the heat that again reenters the first semiconductor refrigeration system 11, passes hot water tank.
In the refrigerator of content disclosed by the invention-stove combined system 1, the electrothermal module of refrigerator side or semiconductor refrigeration system 11 operate refrigerator module and heating module simultaneously.In the refrigerator side, it is from refrigerator pumping heat it is cooling; Its simultaneously at a side heating water of heat in order to subsequently use.
The electrical efficiency of electrothermal module depends on a side of heat and the temperature difference of a cold side.Poor for low temperature, the maximum of the energy of pumping is high.
For heating unit or stove 20, high temperature is necessary.When refrigerator temperature is 0～5 ℃, can not uses single electrothermal module or semiconductor refrigeration system and obtain high temperature (>100 ℃).Therefore, in order to obtain high temperature, be necessary according to two step operations of content disclosed by the invention.The purpose of the module of stove side is to obtain high temperature, from the energy storage of this module the material of state variation.Paraffin is for storage power.
Each comprises the semiconductor refrigerating parts of a plurality of series connection two semiconductor refrigeration systems, the embodiment in Fig. 4 semiconductor refrigeration system 11,21 each comprise the semiconductor refrigerating parts of 4 12V series connection.Yet the semiconductor refrigerating parts of arbitrary number can be series connected to form two semiconductor refrigeration systems.
Each electrothermal module or semiconductor refrigeration system 11,21 comprise at least one semiconductor refrigerating parts, have the input voltage of the galvanic multiple of 12V.In the embodiment of Fig. 4, two semiconductor refrigeration systems 11,21 are respectively got up to form by 4 semiconductor refrigerating unit Series.Whole input voltages for system are 48V direct currents.The cooling system of the electrothermal module of refrigerator side is the air-liquid system.In refrigerator inside, be that air is cooling, fan is used to reduce the thermal resistance of the fin of refrigerator inside.Liquid-cooling system is used in a side of the heat of refrigerator.The temperature of refrigerator inside remains between 0 ℃ and 5 ℃, and the temperature of a side of the heat of module remains between general 50 to 60 ℃, and the maximum temperature difference of module is 60 ℃.In the stove side, temperature must be higher than 100 ℃.In order to increase the temperature of stove side, two step operations are used.Another electrothermal module with 4 semiconductor refrigerating parts that are connected in series is used for increasing the temperature to 120 ℃.The input voltage of module or 48V direct current.The cooling system that system is used is the liquid/solid system.Liquid-cooling system is used in a cold side of module, and opposite side normally is connected to the metallic plate of a side of the heat of semiconductor refrigerating parts.
According to preferred embodiment, with reference to figure 5, heating unit 20 adds thermal storage 22 in the middle of also comprising, for the form store heat with latent heat at heating unit 20.According to preferred embodiment, centre adds thermal storage 22 and comprises paraffin.Water tank, for example aluminium or similar, be used in the stove components interior, contains paraffin for storing the thermal energy with the form of latent heat.Fin is arranged on a side of the heat of semiconductor refrigerating module, for paraffin provides large surface area with Fast Heating.Radiator is arranged on paraffin inside, by tank parts, connects between water supply tap and dish-washing machine or washing machine water parts.The purpose of radiator is, if in dish-washing machine or washing machine if required, by from paraffin, absorbing heat, from the very hot water of supply in pre-heated water water tank.Small cylinder water tank 23 also can be installed in paraffin inside, so that boiling water to be provided.
The energy value that the latent heat representative discharges or absorbs in its state changes by chemical substance, it does not need to change its temperature and occurs, and this means phase transformation, for example thawing of ice, or the boiling of water.Latent heat storage device comprises phase-change material.The gas of comparing, used the solid-liquid phase-change material usually, and this is to be easy to manage because of these stages.Dissimilar phase-change material is used for store heat, for example organic phase change material, for example paraffin (C nH 2n+2) and aliphatic acid (CH 3(CH 2) 2nCOOH), inorganic phase-changing material, for example hydrated salt (M nH 2O).Paraffin can be used as phase-change material, and it is because have high specific heat capacity and relatively cheap and be of value to the store heat energy.
The solid-liquid phase-change material, paraffin for example, at specific its state of temperature change, and itself temperature of the increase do not shown at this point, state from solid-state to liquid absorbs a large amount of heat energy in changing at this for it, and the heat energy of storage depends on the specific heat capacity of volume and phase-change material.When the environment temperature reduction of liquid, when state changed to preceding state, the heat energy of storage was released.
Paraffin, in the phase transformation from solid-state to liquid, absorbs a certain amount of heat energy in relative stationary temperature.Opposite namely from liquid state to solid-state phase transition process, the latent heat before stored is released in stationary temperature almost.Paraffin shows crystal property due to high-purity and special component, and it has high thermmal storage ability; It is being chemically inertia, can store and release heat in stationary temperature almost.Performance is stable in the phase transformation circulation; Nontoxic, environmentally friendly, easy operating also has large fusion temperature scope.
By reference to the accompanying drawings 2 and 6, according to the preferred embodiment of the domestic system of content disclosed by the invention, will be described.This embodiment comprises, except aforementioned unit, the second cooling unit 50 is for being connected to described the first cooling unit 10 by the 3rd semiconductor refrigeration system 51.This second cooling unit 50 comprises household freezer 50, is connected to the first cooling unit 10, for example refrigerator by air/air semiconductor cooling system.Identical with the first and second semiconductor cooling systems 11,21, the 3rd semiconductor cooling system 51 can comprise a plurality of cooling parts of semiconductor that are connected in series.
Combination due to hot water tank and three semiconductor cooling system parts or semiconductor cooling system, likely provide a kind of efficient system.In addition, an independent system can provide household freezer for family, refrigerator, stove and hot water supply.Prior art semiconductor refrigerating parts are merely able in the temperature difference 50 degree, work in the scope of maximum 60 degree.Based on content disclosed by the invention, likely obtaining is at least respectively household freezer, refrigerator, and necessary-45 ℃ of hot water and stove, 5 ℃, 55 ℃, and 105 ℃ (maximum-60 ℃, 0 ℃, 60 ℃, 120 ℃).Although very detailed temperature and median are illustrated, close on or these detailed value around temperature be also can be obtainable.
Energy can be stored the cooling energy that arrives the household freezer of-45 ℃ as low, and can before starting the cooling parts of semiconductor, rise to slowly-18 ℃.Energy also can be stored in stove as latent heat.
With reference to Fig. 6, domestic system can be connected in direct current or AC network 100.This network 100 can comprise low pressure, and for example 48V direct current or high voltage direct current are supplied with network 100, or 230V alternating current network, or its combination.
In addition, it is effective with control apparatus, between independent semiconductor refrigerating parts, controlling current balance type.Therefore, according to preferred embodiment, this system, for connection control unit 200 and the temp probe in each unit 10,20,30,50, supplies with from direct current each unit that network 100 is distributed to domestic system 1 be used to controlling electric power.
Same, in case other equipment, as micro-wave oven, is connected to DC system, control apparatus can be used to the electric current of instantaneous trip to the semiconductor refrigerating parts, so that extra electric weight supplies to other equipment at short notice.In case micro-wave oven is connected to DC system, the electric power that supplies to the semiconductor refrigerating parts can be reduced or cut off fully within the time that the magnetron of micro-wave oven starts.Along with magnetron suspends, supply to the power recovery of semiconductor refrigerating parts.
Combination due to hot water tank and two semiconductor refrigerating parts or semiconductor refrigeration system, likely provide efficient system.In addition, a system can provide the hot water of refrigerator, stove and abundance to family.Semiconductor refrigerating parts of the prior art only just can work at the temperature difference 50 degree.Based on content disclosed by the invention, likely obtain refrigerator, hot water and stove are distinguished necessary 5,55 and 105 degrees centigrade.
According to preferred embodiment, domestic system 1 is used as a single combination housed device, has three parts, and one for refrigerator, and one for hot water tank, and another is for stove.In the situation that increased freezer unit, other parts are provided, as shown in Figure 7.
In a word, content disclosed by the invention provide a kind of for housed device under 48V direct current supply rather than under 230V AC power commonly used, move solution.Any direct current family, for example, have the family that produces galvanic solar panels, also can be for different housed devices under different burning voltages.The energy come from solar panels also can be stored in battery as dc source.This stored energy source of coming from battery can be than for moving different housed devices under different stable DC voltage at night.Loss to the conversion exchanged can move and reduce by housed device under dc source with direct current for the AC-to DC of housed device inside.Refrigerator and stove move alternating current usually.The present invention proposes a kind ofly for refrigerator and stove, to operate in low-voltage DC, rather than the solution under the 230V AC power.Two independently electrothermal module by between these two modules, manufacturing the temperature difference of at least 100 ℃, be used for cooling refrigerator, and by the thermmal storage of phase-change material in stove.The efficiency of electrothermal module is by storing the heat extracted from refrigerator, and the heat that produces from input power of TEM and increasing.By storing the heat extracted from refrigerator, the hot water of about 60 ℃ can be stored in the water tank be arranged between refrigerator and stove module.Hot water can be used in dish-washing machine or shower or washing machine or other need the equipment of hot water.The hot water come from water tank upgrades circulation for dish-washing machine at its hot water.Dish-washing machine can upgrade in circulation from water tank, taking out 10L hot water at its hot water.By using pump, hot water circuit can keep between stove and dish-washing machine water tank.If need very hot water, when the radiator that passes the water tank that is arranged on paraffin, as stove, the time, recirculated water is from extracting heat paraffin.
The model of the proposition of refrigerator and stove can be used to direct current family, with operation 48V dc source.These equipment are more effective due to the minimizing of the storage wasted energy and conversion loss.Most of power equipment has designed to be used low-voltage dc power supply.The new solution of refrigerator and stove can be set up direct current family with hope, and therefore, the use that society can benefit from galvanic regenerative resource increases.For the increase of the use of the dc source of each equipment, give technology from the use of the dc source of regenerative resource with hope, therefore it be of value to the environmental protection of All Around The World.
Although the embodiment of content disclosed by the invention sets forth with reference to the low-voltage DC supply network, it can also be implemented in the HVDC supply network, or or even conventional Alternating Current Power Supply network in implement.
Above-described embodiment can be understood easily as the example of elaboration of the present invention.It will be understood by those skilled in the art that different modifications, combination and change can make without breaking away from the present invention.Particularly, the different parts in different embodiment can be combined into scheme feasible on other technologies.Scope of the present invention, therefore, limited by dependent claims.
List of references
[1] GB935679, relate to the improvement of cooling device;
[2] US6038865, temperature control device.

Claims (17)

1. a domestic system (1), comprise
The first cooling unit (10);
Heat/energy holder (30), it is set to as storage power;
The first semiconductor refrigeration system (11);
Heating unit (20);
The second semiconductor refrigeration system (21);
Wherein said the first cooling unit (10) is set to be connected to described heat/energy holder (30) by described the first semiconductor refrigeration system (11), described heating unit (20) is set to be connected to heat/energy holder (30) by described the second semiconductor refrigeration system (21), wherein said the first semiconductor refrigeration system is set to transmit heat/energy between cooling unit and energy storage device, and described the second semiconductor refrigeration system is set to transmitting energy between heat holder and heating unit.
2. the system as claimed in claim 1, wherein said heat/energy holder (30) comprises (heat) water receptacle.
3. system as claimed in claim 2, wherein said the first semiconductor refrigeration system (11) is the air/liquid semiconductor refrigeration system, described the second semiconductor refrigeration system (21) is the liquid/solid semiconductor refrigeration system.
4. the system as claimed in claim 1, wherein said the first semiconductor refrigeration system (11) comprises the semiconductor refrigerating parts of a plurality of series connection.
5. the system as claimed in claim 1, wherein said the second semiconductor refrigeration system (21) comprises the semiconductor refrigerating parts of a plurality of series connection.
6. system as described as claim 4 or 5, wherein each described first and/or second semiconductor refrigeration system comprises the semiconductor refrigerating parts of at least four series connection.
7. heat holder (22) in the middle of system as claimed in claim 3, wherein said heating unit (20) also comprise, be used to storing the heat energy of heating unit.
8. system as claimed in claim 7, wherein said in the middle of the heat holder comprise paraffin.
9. the system as claimed in claim 1, wherein said the first cooling unit (10) comprises refrigerator, described heating unit (20) comprises stove.
10. as arbitrary described system in claim 2-9, wherein said system (1) also comprises water use sector (dish-washing machine, shower, washing machine) (40), and it is set to be connected to described (heat) water holder (30).
11. as arbitrary described system in claim 1-10, wherein said system also comprises the second cooling unit (50), it is set to be connected to described the first cooling unit (10) by the 3rd semiconductor refrigeration system (51).
12. system as claimed in claim 11, wherein said the second half cooling units (50) comprise freezer units.
13. system as claimed in claim 11, wherein said the 3rd semiconductor refrigeration system (51) comprises air/air semiconductor refrigerating parts.
14. as arbitrary described system in claim 1-13, wherein said system is supplied with network (100) for being connected to direct current.
15. it is that low pressure or high voltage direct current are supplied with network (100 that system as claimed in claim 11, wherein said direct current are supplied with network (100).
It is that the 48V direct current is supplied with network that 16. system as claimed in claim 11, wherein said direct current are supplied with network, or the 230V alternating current supply with network both one of.
17. as arbitrary described system in claim 1-16, wherein said system is connected to control module (200), from described direct current, supplies with each unit that network (100) is distributed to system (1) be used to controlling electric current.
CN2012800047083A 2011-02-18 2012-02-13 Household system with multiple peltier systems Pending CN103415750A (en)

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BR112013020990A2 (en) 2016-10-11
CL2013001971A1 (en) 2013-12-06
RU2013116889A (en) 2014-10-20
AU2012218168A1 (en) 2013-08-29
WO2012112107A1 (en) 2012-08-23

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