CN103379945A - Flip edge shadow frame - Google Patents

Flip edge shadow frame Download PDF

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Publication number
CN103379945A
CN103379945A CN2013800004491A CN201380000449A CN103379945A CN 103379945 A CN103379945 A CN 103379945A CN 2013800004491 A CN2013800004491 A CN 2013800004491A CN 201380000449 A CN201380000449 A CN 201380000449A CN 103379945 A CN103379945 A CN 103379945A
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Prior art keywords
shadow frame
lip
substrate
main body
edge
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Granted
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CN2013800004491A
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Chinese (zh)
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CN103379945B (en
Inventor
Q·王
崔寿永
R·L·蒂纳
J·M·怀特
古田学
朴范洙
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Applied Materials Inc
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Applied Materials Inc
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Priority claimed from US13/569,064 external-priority patent/US10676817B2/en
Priority claimed from US13/789,188 external-priority patent/US20140251216A1/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN103379945A publication Critical patent/CN103379945A/en
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C23C16/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

Device for processing a substrate are described herein. An apparatus for controlling deposition on a substrate can include a chamber comprising a shadow frame support, a substrate support comprising a substrate supporting surface, a shadow frame with a shadow frame body including a first support surface, a second support surface opposite the first surface, and a detachable lip connected with the shadow frame body. The detachable lip can include a support connection, a first lip surface facing the substrate, a second lip surface opposite the first lip surface, a first edge positioned over the first support surface, and a second edge opposite the first edge to contact the substrate.

Description

The flanging type shadow frame
Background of invention
Prior art
Modern semiconductor devices need to form feature, for example dielectric film of Organic Light Emitting Diode (OLED), transistor and low-k by a plurality of layers that deposit and remove conduction, semiconductive and dielectric material from glass substrate.The glass substrate treatment technology comprises plasma enhanced chemical vapor deposition (PECVD), physical vapour deposition (PVD) (PVD), etching etc.Because the needed relatively low treatment temperature of deposit film and can be by the good film quality that uses Cement Composite Treated by Plasma to bring, Cement Composite Treated by Plasma is widely used in the production of flat-panel devices.
In general, Cement Composite Treated by Plasma comprises the supporting member (be commonly referred to pedestal or heater) of substrate setting (position) in being configured in vacuum chamber is upper and is being adjacent to the upper surface place formation plasma of exposure of substrates.Plasma is introduced in the chamber by one or more are processed gas, and with the electric field excited gas, forms so that gas is dissociated into charged and neutral particle.Plasma adjustable inductance formula and/or condenser type ground or by producing with microwave energy, inductance type for example is the radio-frequency coil that uses inductance, condenser type for example is to use parallel plate electrode.
During processing, the edge of glass substrate and the back side and chamber interior assembly must be protected, in order to avoid deposition.Typically, deposition mas equipment (deposition masking device) or shadow frame (shadow frame) are in the substrate placed around, arrive edge and the back side of substrate to avoid processing gas or plasma, and during processing, substrate is remained on the supporting member.Shadow frame can be arranged in the treatment chamber of supporting member top, so when supporting member moved to a higher processing position, shadow frame was lifted and the contact substrate marginal portion.Therefore, around the shadow frame covered substrate upper surface several millimeters, thus avoid having on the substrate deposition at edge and the back side.
In the situation of the advantage of considering the use shadow frame, present shadow frame is designed with some shortcomings.Shadow frame of the prior art typically comprises can have an angular clamping device.Such wedge angle may the scratch substrate when contact substrate (for example, substrate being loaded and unloading from treatment chamber) or is made substrate breakage.And during processing, substrate and shadow frame experience expand and shrink, and cause mechanical stress to produce between the two, and usually cause the damage of substrate.Therefore, the shadow frame of standard can have the gap, so that shadow frame is separated with substrate.
When the shadow frame damaged substrate, electric arc may occur.Electric arc can cause the damage of other assembly of pedestal, substrate or chamber.Therefore, need in the art a kind ofly to avoid the broken of substrate and/or break and the device of electric arc during avoiding simultaneously processing.
Technical field
Embodiments of the invention relate to a kind of shadow frame for the treatment of chamber haply.
Summary of the invention
The present invention relates to a kind of shadow frame for the treatment of chamber (for example, PECVD chamber) haply.In one embodiment, disclosed a kind of device for the deposition on the control substrate.This device can comprise chamber, substrate support and shadow frame, and chamber comprises the shadow frame support member, and substrate support comprises substrate, and shadow frame comprises shadow frame main body, detachable lip (lip) and support connecting piece.
The shadow frame main body can have the first supporting surface and the second supporting surface, and the first supporting surface is in the face of substrate, and the second supporting surface is with respect to the first supporting surface.Detachable lip can be connected with the shadow frame main body and be arranged on the second supporting surface in fixable mode.Detachable lip can have the first lip surface, the second lip surface, the first edge and the second edge, the first lip surface is in the face of substrate support, the second lip surface is with respect to the first lip surface, the first edge is arranged on the first supporting surface top, and the second edge is with respect to the first edge.Support connecting piece can be coupled to the shadow frame main body detachable lip.
In another embodiment, a kind of device for the deposition on the control substrate can comprise chamber, substrate support and shadow frame, chamber comprises the shadow frame support member, substrate support comprises substrate, shadow frame comprises shadow frame main body and detachable lip, and shadow frame can be parked on the substrate.
The shadow frame main body can comprise the first supporting surface, the second supporting surface, the first supporting surface is in the face of substrate, wherein first surface is parked on the shadow frame support member, the second supporting surface is with respect to first surface, the second supporting surface comprises recess, and recess has recess lower surface and recess shoulder (recess ledge).Detachable lip can be connected with the shadow frame main body and be arranged in fixable mode in the recess of the second supporting surface.Detachable lip can comprise the first lip surface, the second lip surface, the first edge and the second edge, the first lip surface is in the face of substrate, wherein a part is connected with the recess lower surface, the second lip surface is with respect to the first lip surface, the first edge is arranged to be connected with the recess shoulder, and the second edge is with respect to the first edge.
Description of drawings
In order at length to understand the above-mentioned feature of the present invention, can make for the of the present invention of above simplified summary more being described in detail with reference to embodiment, some embodiment describe in the accompanying drawings.Yet, should be noted that accompanying drawing only depicts exemplary embodiments of the present invention, and therefore be not considered to the restriction to scope of the present invention, because the present invention can allow other equivalent embodiment.
Fig. 1 is the generalized section for the treatment of chamber.
Fig. 2 A is the schematic diagram of shadow frame, and shadow frame has the detachable lip that is coupled to the shadow frame body surfaces.
Fig. 2 B is the generalized section of the shadow frame described of Fig. 2 A.
Fig. 3 A-3D is the generalized section that illustrates the various embodiment of shadow frame.
Fig. 4 is the schematic top plan view that illustrates the detachable lip that covers the gap between the adjacent shadow frame piece.
In order to help to understand, in possible situation, indicate the similar elements that shares in the accompanying drawing with identical Reference numeral.Can expect that disclosed element may advantageously be used among other embodiment in one embodiment, and not especially citation.
The specific embodiment
Embodiments of the invention relate to a kind of shadow frame for the treatment of chamber haply.In one or more embodiment of following narration, shadow frame is formed by integral type shadow frame main body or multi-block shadow frame main body, and integral type shadow frame main body or multi-block shadow frame main body are connected with the detachable lip of integral type or the detachable lip of multi-block.The design of shadow frame can be by being controlled at shadow frame during the high power operation and " gap " or the distance between the substrate, perhaps control typically cause electric arc processing (for example, deposition processes based on silicon nitride or silica) " gap " or distance between the shadow frame in and the substrate allow electric arc control.Lacking in the situation of lip, electric arc may occur between the adjacent shadow frame piece on the contrary.In addition, lacking in the situation of lip, electric arc may occur between shadow frame and other chamber piece on the contrary.
Not being subject in the theoretical situation, believe that electric arc is the partly cause that causes substrate crushing or break.Importantly, shadow frame is done some with substrate and is contacted, with the deposition below shadow frame during avoiding processing.Yet the weight of the shadow frame of prior art can cause chip or the slight crack in the substrate.Therefore chip in the substrate or slight crack cause the tendency of electric arc generation so that a plurality of parts of pedestal are exposed to plasma.By the embodiment of narration here, shadow frame is supported in lip-deep weight and reduces, and shadow frame is controlled with contacting of substrate, so that the fragmentation of substrate or break minimizes.So the embodiment of narration can control the deposition on the substrate here, avoids simultaneously the electric arc that causes because breaking.
Moreover because narrow edge lip and related to less the covering of substrate, shadow frame has improved the uniformity of non-crystalline silicon.The even arrangement of electrically insulating material also helps the deposition uniformity of non-crystalline silicon.Below will cooperate accompanying drawing and embodiments of the invention will be carried out clearer narration.
Fig. 1 is that treatment chamber 10 has shadow frame according to the generalized section of the exemplary process chamber 10 of an embodiment.An example that can be adjusted and be indebted to treatment chamber of the present invention is the PECVD treatment chamber, can obtain from the US business of the subsidiary triumphant scientific ﹠ technical corporation of industry (AKT America, Inc.) of the Applied Materials that is positioned at the Santa Clara city.Can expect that other plasma process chamber (comprising the plasma process chamber from other manufacturer) is also applicable to implementing the present invention.
Treatment chamber 10 comprises cavity 12 and is configured in backboard 14 on the cavity 12.Cavity 12 has treatment region 16.The size of the associated component of cavity 12 and treatment chamber 10 is not restricted, and normally pro rata greater than the size of substrate 28 to be processed.Can process any suitable substrate size.The example of the substrate size that is fit to comprises the substrate with about 5500 square centimeters or larger surface area, for example about 25000 square centimeters or larger, for instance, about 50000 square centimeters or larger.In one embodiment, can process the substrate with about 90000 square centimeters or larger surface area.
Gas distribution plate 18 can be mounted to backboard 14, and the coboundary in definition process district 16.A plurality of perforates 20 are formed in the gas distribution plate 18, send from these perforates to allow processing gas.Gas source 40 can be with gas delivery to the plenum chamber (plenum) that is formed between gas distribution plate 18 and the backboard 14, with allocation process gas fifty-fifty, thereby by gas distribution plate 18 delivery process gas equably.Power supply 42 can be electrically coupled to gas distribution plate 18, forms plasma with the processing gas by the perforate 20 of flowing through.Power supply 42 can be the power supply for any type of PECVD chamber, for example radio-frequency power supply.Shadow frame 22 is depicted as and is configured on the substrate support 32.Shadow frame 22 comprises shadow frame main body 24, and wherein detachable lip 26 appends to shadow frame main body 24.
Cavity 12 also comprises shadow frame support member 44, and shadow frame support member 44 forms around substrate support 32 annularly.When substrate support 32 was positioned at lower position, shadow frame 22 was supported by shadow frame support member 44.
Substrate support 32 is also referred to as pedestal or heater, is configured in the treatment chamber 10 and by motor 33 to activate.In higher processing position, so that substrate 28 is configured in the substrate support 32 on the substrate 34 of substrate support 32, support the shadow frame main body 24 of shadow frame 22, and the lower boundary in definition process district 16, so so that substrate 28 be arranged in the treatment region 16.When shadow frame main body 24 is parked on the substrate 34, detachable lip 26 extend substrate 28 a part the top and contact with this part.
Substrate 28 enters and shifts out treatment chamber 10 by the opening 36 that is formed in the cavity 12, and opening 36 is optionally sealed by slit valve mechanism (not shown).Lift pin 38 can be slidably configuration and passes substrate support 32, and applicable to the upper end that substrate is remained on substrate support 32.Lift pin 38 can be by using motor 33 to reduce substrate support 32 activatable.
Fig. 2 A is the schematic diagram according to the shadow frame 200 of an embodiment, and shadow frame 200 is so that detachable lip 202 is coupled to shadow frame main body 204.Shadow frame main body 204 can be comprised of a plurality of shadow frame main body block 203A, 203B.Although be illustrated as in the accompanying drawings multi-blocked structure, shadow frame main body 204 can be the have the cooperation substrate single block of shape of (being rectangle) in the situation of flat glass substrate.In addition, shadow frame 200 can be required to be any size or shape according to the user, for example is for one 5500 square centimeters substrate and the shadow frame that designs.
Shadow frame main body 204 can be connected with detachable lip 202 with fixable mode.Detachable lip 202 can be comprised of a plurality of detachable lip piece 205A, 205B, yet, detachable lip 202 can be understood and single block can be comprised.Shadow frame main body block 203A, 203B can be attached to detachable lip piece 205A, 205B respectively. Detachable lip piece 205A, 205B can overlap shadow frame main body block 203A, 203B, thus allow detachable lip piece 205A, 205B and be connected more than shadow frame main body block 203A, a 203B.
Be formed between shadow frame main body block 203A, the 203B and the gap between detachable lip piece 205A, the 205B can be sealed by one or more gap cover 206A and 206B.Gap cover 206A and 206B can use one or more support connecting pieces to be connected to shadow frame main body 204, support connecting piece are depicted as support connecting piece 208A and 208B here.Here the support connecting piece of narration is preferred embodiment.The support connecting piece that other embodiment can be connected with other assembly that is connected to shadow frame, with other assembly of shadow frame or other assembly by shadow frame connects.The support connecting piece that is used for this embodiment can be door bolt or screw or other retention mechanism.
Importantly, notice that the gap cover 206A of the equipment of depicting coverage gap here as and 206B are an embodiment.Other gap cover can be integrated among shadow frame main body block 203A, 203B or detachable lip piece 205A, the 205B, for example be formed at the overhang among the shadow frame main body block 203A, this overhang cooperates to be inserted in the groove that is formed among the second shadow frame main body block 203B.Also can infer the combination of above-described embodiment.
Fig. 2 B describes the generalized section according to the shadow frame 200 of an embodiment, and shadow frame 200 is so that detachable lip 202 is coupled to shadow frame main body 204.Shadow frame main body 204 can have the first supporting surface 210, the second supporting surface 212, inward flange 214A and 214B, outward flange 216 and lower limb 218.
The first supporting surface 210 can be faced substrate, and in fact is parked on the substrate during processing.When shadow frame 200 was not supported by substrate support, lower limb 218 was parked on the shadow frame support member.An example of shadow frame support member is the shoulder (ledge) that extends from chamber wall.
The second supporting surface 212 can arrange with respect to the first supporting surface 210.In the embodiment shown in Fig. 2 B, surface 210 is parallel in fact with 212.Yet, can understand surface 210,212 and can be arranged to cooperate the shadow frame demand.The second supporting surface 212 can have the structure that is formed in the surface, and for example perforate 213, and perforate 213 can be used for holding in order to detachable lip 202 is connected to the retention mechanism of shadow frame main body 204.
The thickness of shadow frame main body 204 is guaranteed contacting and too many stress can be applied to substrate or shadow frame main body 204 between detachable lip 202 and the substrate.Consider the position of detachable lip 202 when being attached at shadow frame main body 204, distance between the first supporting surface 210 on the shadow frame main body 204 and the second supporting surface 212 (namely, the length of inward flange 214A) should be not blocked up and so that detachable lip is arranged to not contact substrate, in one embodiment, this distance equals in fact the thickness of substrate to be processed.In certain embodiments, the distance between the first supporting surface 210 and the second supporting surface 212 between about 6 millimeters and about 15 millimeters, about 10 millimeters distance for example.In the embodiment shown in Fig. 2 B, shadow frame main body 204 is depicted as has " L " shape, be parked on the substrate to make shadow frame main body 204, simultaneously all side rings around substrate and substrate support the two.
Inward flange 214A and 214B can be configured to provide respectively shadow frame main body 204 from substrate with from the appropriate intervals between the substrate support.Do not wishing to be subject in the theoretical situation, believe the damage that substrate is caused by shadow frame main body 204 can improve between pedestal and the shadow frame main body 204 compared to and other assembly between the possibility of electric arc generation.Yet, if shadow frame main body 204 from substrate excessively away from, the deposition may betide on the substrate below the shadow frame.
Outward flange 216 and lower limb 218.Outward flange 216 and lower limb can be smooth in fact surface, the flat surfaces that intersects with an angle of 90 degrees such as Fig. 2 B be depicted as.Other embodiment can comprise different shapes or angle, to meet the technical staff for the needs of shadow frame support member.Shadow frame main body 204 more can be made of metal (for example, aluminium), anodised aluminium or pottery.
Detachable lip 202 can comprise pottery usually.In detachable lip, come the possibility of warpage with aluminium strip.In one embodiment, detachable lip 202 is thin than shadow frame main body 204.In certain embodiments, detachable lip can be between about 2 millimeters to about 10 millimeters thick, for example about 3 millimeters to about 5 millimeters thick.In one embodiment, detachable lip 202 is comprised of pottery and about 3 millimeters thick.
In the embodiment shown in Fig. 2 B, detachable lip 202 extends beyond shadow frame main body 204, but and the part at covered substrate edge.Detachable lip 202 is extensible to exceed shadow frame main body 204 between about 25 millimeters and about 40 millimeters.
Detachable lip 202 can comprise a single block.Detachable lip 202 can have the first lip surface 222, the second lip surface 224, the first edge 226 and the second edge 228.Support connecting piece 229 can be in order to be coupled to shadow frame main body 204 with detachable lip 202.
The first lip surface 222 is arranged to faces substrate during processing, and contacts with the second supporting surface 212.In addition, when shadow frame 200 is arranged on the substrate support, at least a portion of the first lip surface 222 can with substrate contacts.The first lip surface 222 can be smooth in fact surface.Other embodiment can comprise superficial makings or further feature, to reduce the part of the first lip surface 222 contact substrates.
The second lip surface 224 is with respect to the first lip surface 222.The second lip surface 224 can be and is parallel in fact the first lip surface 222.Other embodiment comprises with the second lip surface 224 that has an angle to form with respect to the first lip surface 222, to produce an angle.In one embodiment, the first lip surface 222 and the second lip surface 224 can form the angle from about 3 degree to about 7 degree, for example angle of about 5 degree.
The first edge 226 connects first and second lip surface 222,224.Although in Fig. 2 B, depict as flat, but the first edge 226 can be and allows the first edge 226 to cooperate securely the various shapes that are installed in the groove, and for example cooperation is installed in bending in the recess shoulder (not shown) of bending or V-arrangement or the first edge of V-arrangement securely.
The second edge 228 is with respect to the first edge 226.The second edge 228 connects first and second lip surface 222,224.Although in Fig. 2 B, depict flat surfaces as, the second edge 228 can be provide with substrate between the safer various shapes that contact or reduce contact point, circular-arc (rounded) or be asymptotic (tapered) second edge of taper for example.
Support connecting piece 229 can be connected to shadow frame main body 204 securely with detachable lip 202.Support connecting piece 229 can be connected a point of meeting at detachable lip 202 and be connected with the shadow frame main body, for example be near 226 places, the first edge.In addition, support connecting piece 229 can be fixing connector, for example is door bolt, groove or screw.In the embodiment shown in Fig. 2 B, support connecting piece 229 is depicted screw as.
Support connecting piece 229 can comprise for example material of aluminium, anodised aluminium, pottery or other material.Be used in a support connecting piece 229 among the embodiment and can comprise the material identical with shadow frame main body 204 or detachable lip 202.The embodiment of other support connecting piece 229 can comprise that slidably groove, door bolt, clasp maybe can be firmly held in detachable lip 202 and shadow frame main body 204 other fixing fitting together.
Importantly, notice that the shadow frame of narration need to not be comprised of a plurality of shadow frame main body block and detachable lip piece here.Detachable lip and shadow frame main body can be respectively single all-in-one-piece structure.The combination of any foregoing can be in order to form the embodiment according to shadow frame of the present invention.For instance, an all-in-one-piece shadow frame master can be connected to a plurality of detachable lip piece that comprises a shadow frame part.
Be not subject in the theoretical situation, believing the use by the detachable lip of one or more designs in the design of narration here, permission is being had better deposition profile at the edge.Because disorderly air-flow, the gradually inclination in the shadow frame direction has been found in the design of prior art, causes thus the uneven gauge of the sedimentary deposit of substrate surface top.Here the embodiment of narration forms more uniform deposition profile.Be accompanied by more uniform deposition profile, equipment can form to get more close substrate edges, so brings more equipment on the substrate, and the less waste of substrate space during processing.
Fig. 3 A-3D is the generalized section that illustrates the various embodiment of the shadow frame of using detachable lip design.Below the part of embodiment of narration can be used alone or in combination, reaching and the contacting of substrate surface, and during processing damaged substrate not.
Fig. 3 A describes shadow frame 300, and shadow frame 300 has and is the asymptotic detachable lip 302 of taper.Shadow frame 300 can have detachable lip 302, and detachable lip 302 has and is taper asymptotic edge 304A and 304B.Be the asymptotic edge 304A of taper and 304B and can form the lower profile of deposit film.Although the detachable lip 302 among this embodiment is depicted as and has two and be the asymptotic edge of taper, does not need two edges to be the taper asymptotic expression.Detachable lip 302 can be securely connected to the upper surface of shadow frame main body 306.Detachable lip 302 can use support connecting piece to connect, and support connecting piece is depicted as screw 308 here.Support connecting piece can be selected so that this support connecting piece can be removed easily.
The part (be called as lip) of the shadow frame of prior art above shadow frame extends substrate has relatively high critical thickness.This is because if lip damages during processing, and then must replace whole shadow frame, thereby brings the expensive of undesired downtime and replacement.Removable connector can allow the reliable setting on substrate when being connected to shadow frame main body 306 of detachable lip 302.In addition, in situation about damaging, detachable lip 302 can be removed easily and be replaced.
Fig. 3 B describes shadow frame 310, and shadow frame 310 has the recess 316 that supports detachable lip 312.In this embodiment, along with detachable lip 312 stretches out from shadow frame main body 314, detachable lip 312 is kept similar in fact width.As discussed previously, what detachable lip 312 can be very is thin, for example between about 1 millimeter and about 3 millimeters, to produce gratifying film profile.Detachable lip 312 can be securely connected to the upper surface of shadow frame main body 314.Detachable lip 312 can connect with removable means, for example screw or clip.Some embodiment can use permanent or semi-permanent connector, for example welding.
Detachable lip 312 can have smooth edge 318A and 318B.Smooth edge 318A can be similar in fact the recess shoulder 319 of recess 316.Smooth edge 318B can be extended out in substrate (not shown) top.Be formed on the recess 316 on shadow frame main body 314 surfaces, so embodiment is disclosed, the extra support of detachable lip 312 can be provided and avoid detachable lip 312 belows the additional measures that flows the two.And the surface area by reducing the detachable lip 312 that plasma can contact can reduce the damage of detachable lip 312 during normal operating.In the embodiment shown in Fig. 3 B, align the in fact surface of shadow frame main body 314 the tops of the upper surface of detachable lip 312.
Fig. 3 C describes the shadow frame 320 according to another embodiment, and shadow frame 320 has the recess 323 that supports detachable lip 322.In this embodiment, along with detachable lip 322 stretches out from shadow frame main body 324, detachable lip 322 is kept similar in fact width.As discussed previously, what detachable lip 322 can be very is thin, to produce gratifying film profile.Detachable lip 322 can be securely connected to the upper surface of shadow frame main body 324.Detachable lip 322 can connect with removable means, for example screw or clip.
Detachable lip 322 can have detachable hp body 329 and smooth edge 326.Smooth edge 326 can be similar in fact the recess shoulder 327 of recess 323.And smooth edge 326 can abut against securely recess shoulder 327 and park, and abuts against rotatablely move (the pivoting movement) of the part that shadow frame main body 324 parks to avoid detachable lip 322.Detachable lip 322 also can have circular-arc edge 328.Circular-arc edge 328 can be completely, and circular shape also can be configured to share a bisector with detachable hp body 329.Other embodiment comprises and only is the circular-arc edge 328 of partial arc that for example only having the surface in the face of substrate is circular-arc circular-arc edge 328.In one embodiment, circular-arc edge is for partially or completely circular-arc, and wherein bisector is offset towards the substrate (not shown).
Fig. 3 D describes the shadow frame 330 according to another embodiment, and shadow frame 330 has the recess 336 that supports detachable lip 332.In this embodiment, along with detachable lip 332 stretches out to form angled edge 335 from shadow frame main body 324, the width of detachable lip 332 reduces.Angled edge 335 can be the various angles based on user's demand, and for example the substrate-side from detachable lip 332 measures, the angle of 2 degree that form between the first lip surface and the second lip surface.Detachable lip 332 can be securely connected to the upper surface of shadow frame main body 334.Other embodiment can have the angled edge 335 of 1 degree or less angle, farther to allow detachable lip 332 to extend above substrate, simultaneously detachable lip 332 is kept the height of upper surface that is same as or is lower than the recess 336 of shadow frame main body 334.
Detachable lip 332 can have smooth edge 333.Smooth edge 333 can be similar in fact the recess shoulder 337 of recess 336.And smooth edge 333 can abut against securely recess shoulder 337 and park, and abuts against rotatablely moving of part that shadow frame main body 334 parks to avoid detachable lip 332.Detachable lip 332 also can have a plurality of support connecting pieces, depicts two screw 338A and 338B here as.
Although the embodiment of narration describes haply straight main body of one of detachable lip here, other embodiment can have by two-dimensional silhouette it seems bending main body or form various shapes.For instance, detachable lip can extend with a curvature from the shadow frame main body, with contact substrate.Other embodiment can have one or more bends in detachable lip, start from the first edge that allows detachable lip to be higher than substrate surface.Detachable lip then will have one or more bends in detachable lip, with the Second Edge marginal zone to the contacting of substrate.
Fig. 4 is the schematic top plan view that illustrates the detachable lip that covers the gap between the adjacent shadow frame piece.Shadow frame 400 can have shadow frame main body 402, shadow frame main body 402 has one or more shadow frame main body block 403A, 403B, shadow frame main body block 403A, 403B can be different length and shape, so that shadow frame main body 402 meets the size and dimension of being made the substrate in boundary line by shadow frame main body 402.
Detachable lip 404 can comprise a plurality of detachable lip piece 405A and 405B, and detachable lip piece 405A, 405B can have the size that extends beyond shadow frame main body block 403A, 403B.Thus, detachable lip piece 405A, 405B can keep together shadow frame main body block 403A, 403B when being attached securely, and reduce the gap width between piece and the piece.
Detachable lip 404 can cooperate inserts in the recess 406.Recess 406 can be comprised of a plurality of recesses, and these a plurality of recesses for example are that those are formed at the recess among shadow frame main body block 403A and the 403B.As shadow frame main body block 403A, 403B and detachable lip piece 405A, when 405B is combined, the gap of some sizes may have an independent existence between detachable lip piece 405A, 405B and have an independent existence between shadow frame main body block 403A, 403B.One or more gap cover 410 can be in order to cover the gap between these piece spares.Although a gap cover 410 only is shown in this embodiment, can infer a gap cover can be corresponding to each gap that is formed on by detachable lip piece 405A, 405B and shadow frame main body block 403A, 403B in the shadow frame 400.
Gap cover 410 can be fixed to shadow frame main body block 403A, the 403B with corresponding tie point 408A and 408C, depicts tie point 408A and 408C as perforate here.Tie point 408A and 408C can form and pass shadow frame main body block 403B and gap cover 410, therefrom pass through with the support connecting piece that allows screw for example or door bolt.Tie point 408B and 408D can form and pass detachable lip piece 405A, 405B and shadow frame main body block 403A, 403B, to connect detachable lip piece 405A, 405B and shadow frame main body block 403A, 403B.The tie point 408A-408D of the member of the top (being illustrated as shadow frame main body block 403A, 403B, detachable lip piece 405A, 405B or gap cover 410 among the embodiment here), can have shape edge in the slope, be recessed in the piece spare of the top to allow support connecting piece.
Here the embodiment of narration relates to a kind of shadow frame for the treatment of chamber haply.This shadow frame is comprised of the solid memder of the detachable lip that supports solid memder or a plurality of members or the shadow frame main body of a plurality of members.Detachable lip can comprise various shapes, but and the light material of operating weight.The embodiment of the detachable lip of multi-block or multi-block shadow frame main body comprises gap cover, to seal the gap between piece and the piece.Detachable lip can contact substrate and do not make substrate produce slight crack or break, thereby allows shadow frame to be used for that the high-energy plasma gymnastics is done and occur without electric arc, and the good profile of the deposit film on the substrate is provided simultaneously.In addition, the detachable lip of shadow frame can be replaced easily, exchanges with lower cost and higher frequency with the detachable lip that allows to damage.
Although above relate to embodiments of the invention, in the situation that does not deviate from base region of the present invention, can obtain other and embodiment further of the present invention, and scope of the present invention defined by accompanying claim.

Claims (15)

1. device that is used for the deposition on the control substrate, described device comprises:
Chamber, described chamber comprises the shadow frame support member;
Substrate support, described substrate support comprises substrate;
Shadow frame, described shadow frame comprises:
The shadow frame main body, described shadow frame main body has the first supporting surface and the second supporting surface, and described the first supporting surface is in the face of described substrate, and described the second supporting surface is with respect to described the first supporting surface; And
Detachable lip, described detachable lip is connected with described shadow frame main body and is arranged on described the second supporting surface in fixable mode, described detachable lip has the first lip surface, the second lip surface, the first edge and the second edge, described the first lip surface is in the face of described substrate support, described the second lip surface is with respect to described the first lip surface, described the first edge is arranged on described the first supporting surface top, and described the second edge is with respect to described the first edge; And
Support connecting piece, described support connecting piece is coupled to described detachable lip with described shadow frame main body.
2. device as claimed in claim 1, wherein said detachable lip comprises the material of the combination that is selected from pottery, aluminium or described pottery and described aluminium.
3. device as claimed in claim 1, wherein said shadow frame main body comprises two or the more shadow frame main body block that is coupled in together.
4. device as claimed in claim 3, wherein said detachable lip comprises two or the more detachable lip piece that is coupled in together.
5. device as claimed in claim 4, further comprise one or more gap cover, wherein said one or more gap cover seal gap between described two or the more detachable lip piece and the gap between described two or the more shadow frame main body block.
6. device as claimed in claim 1, wherein said detachable lip has the thickness between about 2 millimeters and about 5 millimeters.
7. device as claimed in claim 1, wherein said the second edge is circular-arc.
8. device that is used for the deposition on the control substrate, described device comprises:
Chamber, described chamber comprises the shadow frame support member;
Substrate support, described substrate support comprises substrate;
Shadow frame, described shadow frame comprises:
The shadow frame main body, described shadow frame main body has:
The first supporting surface, described the first supporting surface is in the face of described substrate;
The second supporting surface, described the second supporting surface are with respect to described first surface, and described the second supporting surface has recess, and described recess has:
The recess lower surface; And
The recess shoulder; And
Detachable lip, described detachable lip are connected with described shadow frame main body and are arranged in fixable mode in the described recess of described the second supporting surface, and described detachable lip has:
The first lip surface, described the first lip surface is in the face of described substrate, and the part of wherein said the first lip surface is connected with described recess lower surface;
The second lip surface, described the second lip surface is with respect to described the first lip surface;
The first edge, described the first edge are arranged to be connected with described recess shoulder; And
The second edge, described the second edge is with respect to described the first edge.
9. device as claimed in claim 8, wherein said the first edge and described the second edge are that taper is asymptotic.
10. device as claimed in claim 8, wherein said the second edge has the width less than described the first edge.
11. device as claimed in claim 8, wherein said shadow frame main body comprise the material that is selected from the group that the combination by pottery, aluminium, anodised aluminium and described pottery, described aluminium and described anodised aluminium forms.
12. device as claimed in claim 8, wherein said shadow frame main body comprise two or more shadow frame main body block.
13. device as claimed in claim 12, wherein said detachable lip comprise two or more detachable lip piece.
14. device as claimed in claim 13 further comprises one or more gap cover, wherein said one or more gap cover seal gap between the described detachable lip surface and the gap between the described shadow frame body surfaces.
15. device as claimed in claim 8, wherein said detachable lip have the thickness between about 2 millimeters and about 5 millimeters.
CN201380000449.1A 2012-04-05 2013-03-19 Flip edge shadow frame Active CN103379945B (en)

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US201261620955P 2012-04-05 2012-04-05
US61/620,955 2012-04-05
US13/569,064 US10676817B2 (en) 2012-04-05 2012-08-07 Flip edge shadow frame
US13/569,064 2012-08-07
US13/789,188 2013-03-07
US13/789,188 US20140251216A1 (en) 2013-03-07 2013-03-07 Flip edge shadow frame
PCT/US2013/032990 WO2013151786A1 (en) 2012-04-05 2013-03-19 Flip edge shadow frame

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TWI576458B (en) 2017-04-01
KR101547483B1 (en) 2015-08-26
KR20140034126A (en) 2014-03-19
JP2014528155A (en) 2014-10-23
JP5956564B2 (en) 2016-07-27
WO2013151786A1 (en) 2013-10-10
TW201348491A (en) 2013-12-01

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