CN103354699B - 多陶瓷层印刷线路板 - Google Patents
多陶瓷层印刷线路板 Download PDFInfo
- Publication number
- CN103354699B CN103354699B CN201310238637.XA CN201310238637A CN103354699B CN 103354699 B CN103354699 B CN 103354699B CN 201310238637 A CN201310238637 A CN 201310238637A CN 103354699 B CN103354699 B CN 103354699B
- Authority
- CN
- China
- Prior art keywords
- ceramic layer
- printed substrate
- ceramic
- layer
- layers printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Laminated Bodies (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310238637.XA CN103354699B (zh) | 2013-06-17 | 2013-06-17 | 多陶瓷层印刷线路板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310238637.XA CN103354699B (zh) | 2013-06-17 | 2013-06-17 | 多陶瓷层印刷线路板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103354699A CN103354699A (zh) | 2013-10-16 |
CN103354699B true CN103354699B (zh) | 2016-02-24 |
Family
ID=49310984
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310238637.XA Active CN103354699B (zh) | 2013-06-17 | 2013-06-17 | 多陶瓷层印刷线路板 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103354699B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106793471A (zh) * | 2017-01-20 | 2017-05-31 | 昆山福烨电子有限公司 | 一种陶瓷线路板 |
CN111424243B (zh) * | 2019-05-22 | 2021-03-23 | 北京师范大学 | 一种散热涂层的制备方法 |
TWI685627B (zh) * | 2019-07-05 | 2020-02-21 | 合信材料有限公司 | Led發光結構及led發光元件之料帶、led發光元件及led燈泡 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5853888A (en) * | 1997-04-25 | 1998-12-29 | The United States Of America As Represented By The Secretary Of The Navy | Surface modification of synthetic diamond for producing adherent thick and thin film metallizations for electronic packaging |
CN102569597A (zh) * | 2011-08-20 | 2012-07-11 | 中国科学院福建物质结构研究所 | 利用掺杂稀土元素的透明陶瓷为基座的led封装结构 |
CN202753512U (zh) * | 2012-07-11 | 2013-02-27 | 铜陵颐和泰新材料股份有限公司 | 一种铝基陶瓷复合结构覆铜板 |
CN203340407U (zh) * | 2013-06-17 | 2013-12-11 | 苏州晶品光电科技有限公司 | 多陶瓷层印刷线路板 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001220217A (ja) * | 2000-02-07 | 2001-08-14 | Tdk Corp | 複合基板およびこれを用いたel素子 |
-
2013
- 2013-06-17 CN CN201310238637.XA patent/CN103354699B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5853888A (en) * | 1997-04-25 | 1998-12-29 | The United States Of America As Represented By The Secretary Of The Navy | Surface modification of synthetic diamond for producing adherent thick and thin film metallizations for electronic packaging |
CN102569597A (zh) * | 2011-08-20 | 2012-07-11 | 中国科学院福建物质结构研究所 | 利用掺杂稀土元素的透明陶瓷为基座的led封装结构 |
CN202753512U (zh) * | 2012-07-11 | 2013-02-27 | 铜陵颐和泰新材料股份有限公司 | 一种铝基陶瓷复合结构覆铜板 |
CN203340407U (zh) * | 2013-06-17 | 2013-12-11 | 苏州晶品光电科技有限公司 | 多陶瓷层印刷线路板 |
Also Published As
Publication number | Publication date |
---|---|
CN103354699A (zh) | 2013-10-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102738377B (zh) | 超高导热金属基线路板及其制备方法、应用 | |
CN105777210B (zh) | 一种氮化铝陶瓷覆铜板及其制备方法 | |
CN103354699B (zh) | 多陶瓷层印刷线路板 | |
CN104733399A (zh) | 一种层状高导热绝缘基板及其制备方法 | |
CN102917534A (zh) | 基于dlc薄膜涂层的陶瓷基板 | |
CN103327735B (zh) | 高导热绝缘金属基印刷电路板 | |
CN103338588A (zh) | 高导热绝缘金属基印刷电路板 | |
CN102820418A (zh) | 一种半导体照明用绝缘导热膜层材料及其制备方法 | |
CN103346241B (zh) | 白色led灯的封装结构 | |
CN103325921B (zh) | 高导热荧光绝缘led封装结构 | |
CN203339213U (zh) | 高导热荧光绝缘led封装结构 | |
CN103354220B (zh) | 用于光学和电子器件的图案化结构基板 | |
CN203339214U (zh) | 多陶瓷层led封装结构 | |
CN202918581U (zh) | 一种基于dlc薄膜涂层的陶瓷基板 | |
CN103117335A (zh) | 具有电路的复合式金属陶瓷基板的制法及其结构 | |
CN103353065B (zh) | 同基板光引擎结构 | |
CN203340407U (zh) | 多陶瓷层印刷线路板 | |
CN103354221B (zh) | 用于光学和电子器件的多陶瓷层图案化结构基板 | |
CN103354698B (zh) | 用于光学和电子器件的图案化陶瓷层印刷线路基板 | |
CN203339224U (zh) | Smd led封装结构 | |
CN203340408U (zh) | 用于光学和电子器件的图案化陶瓷层印刷线路基板 | |
CN103354269B (zh) | 高可靠性smd led封装结构 | |
CN106365637A (zh) | 一种镀膜用C/h‑BN复合蒸发舟及其制造方法 | |
CN103354222B (zh) | 用于光学和电子器件的多层复合陶瓷层图案化结构基板 | |
CN103346242A (zh) | 基于玻璃基板的led器件及其制备方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: FenHu FenHu Avenue in Wujiang District of Suzhou City, Jiangsu province 215211 No. 558 No. two on the third floor of the building of scientific research innovation park (South) Patentee after: SUZHOU JINGPIN ADVANCED MATERIALS Co.,Ltd. Address before: FenHu FenHu Avenue in Wujiang District of Suzhou City, Jiangsu province 215211 No. 558 No. two on the third floor of the building of scientific research innovation park (South) Patentee before: SUZHOU JINGPIN OPTOELECTRONICS Inc. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230822 Address after: No. 15 Tianyuan Road, Tianhuangping Town, Anji County, Huzhou City, Zhejiang Province, 313000 (self declared) Patentee after: Zhejiang Yunyin Technology Co.,Ltd. Address before: 215,211 Floor 3, Scientific Research Building 2, Science Park, No. 558, Fenhu Avenue, Fenhu Town, Wujiang District, Suzhou, Jiangsu Province (South) Patentee before: SUZHOU JINGPIN ADVANCED MATERIALS Co.,Ltd. |