CN103345132B - A kind of outer film PIN follows closely the method for contraposition - Google Patents

A kind of outer film PIN follows closely the method for contraposition Download PDF

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Publication number
CN103345132B
CN103345132B CN201310255460.4A CN201310255460A CN103345132B CN 103345132 B CN103345132 B CN 103345132B CN 201310255460 A CN201310255460 A CN 201310255460A CN 103345132 B CN103345132 B CN 103345132B
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China
Prior art keywords
film
pin
press strip
contraposition
outer film
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Expired - Fee Related
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CN201310255460.4A
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Chinese (zh)
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CN103345132A (en
Inventor
李小王
刘德林
周刚
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HUIZHOU CHINA EAGLE ELECTRONIC TECHNOLOGY Co Ltd
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HUIZHOU CHINA EAGLE ELECTRONIC TECHNOLOGY Co Ltd
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Priority to CN201310255460.4A priority Critical patent/CN103345132B/en
Publication of CN103345132A publication Critical patent/CN103345132A/en
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Publication of CN103345132B publication Critical patent/CN103345132B/en
Expired - Fee Related legal-status Critical Current
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Abstract

A kind of outer film PIN follows closely the method for contraposition, the described outer film comprises first film (A) and second film (B), comprise step: on first film, make 4 PIN holes (E), some butterflies (C) and some target holes (D), outer film B makes the some butterflies that overlap (C) corresponding to first film (A) and target hole (D); Two outer films are carried out coincidence according to butterfly (C) and target hole (D) aim at; With a press strip (F) and the outer film while be fixed together, then double faced adhesive tape is removed; By first-class for 4 nail (E) on first film (A) PIN nail; Finally be placed into completing the two-layer film after integration on exposure machine table top.Outer film PIN of the present invention follows closely the method for contraposition, by increasing press strip, the outer film in the two sides of Graphic transitions circuit is integrated, then be directly fixed on exposure machine table top, rely on the PIN on one of them film to follow closely and product is positioned, operate comparatively simple.

Description

A kind of outer film PIN follows closely the method for contraposition
Technical field
The present invention relates to PCB Graphic transitions, particularly a kind of outer film PIN follows closely the method for contraposition.
Background technology
The mode of operation of manual alignment is generally adopted in PCB manufacturing ectomesoderm Graphic transitions operation, personnel needed for in-process are more and alignment method is relatively complicated, often expose once, all will re-start film aligning, add the fussy degree of operation, production efficiency is low.
Summary of the invention
For overcoming the shortcomings and deficiencies of above-mentioned prior art, the invention provides a kind of method that outer film PIN simple to operate follows closely contraposition.
The technical solution adopted in the present invention is:
Outer film PIN follows closely a method for contraposition, and the described outer film comprises first film (A) and second film (B), comprises the following steps:
(1) make on first film 4 PIN holes, some butterflies and some target holes, outer film B makes with the butterfly on outer film A and the corresponding some butterflies overlapped in target hole with target hole; Described butterfly be the circular film region that fan-shaped photic zone and shading region alternately occur.
(2) by two outer films according to butterfly and target hole carry out coincidences aligning after, be fixed together with double faced adhesive tape;
(3) with a press strip and the outer film while be fixed together, described press strip is bonded between the two outer layers film, is then removed by the double faced adhesive tape described in step (2);
(4) by first-class for the nail of 4 on first film PIN nail, then be fixed with one side glue;
(5) finally step (4) being completed the two-layer film after integration is placed on exposure machine table top, press strip and first film is bonded on exposure machine table top.
Preferably, described butterfly (C) and target hole (D) are all located at the position outside the form wire of the film.
Preferably, the thickness of described press strip (F) is consistent with production plate.
Preferred further, the width 20 ~ 25mm of described press strip (F), length is than the length of side 10 ~ 15mm of the place film, and press strip is placed from form wire 15 ~ 20mm.
It is 3.15-3.18mm that described PIN follows closely width, is highly 1.2-1.5mm.
Using more intensive for circuit in two outer films one as the first film A.
Outer film PIN of the present invention follows closely the method for contraposition, on the basis of original contraposition by hand, by increasing, be bonded at the press strip between the two outer layers film, the outer film in the two sides of Graphic transitions circuit integrated, is then directly fixed on exposure machine table top, PIN nail is relied on to position product, as long as product directly to be put PIN nail, just directly can expose, operate comparatively simple.Additionally by butterfly and aspect, some target holes two carry out film aligning, simple to operate, precision is high.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of first film of the present invention;
Fig. 2 is the schematic diagram of second film of the present invention;
Fig. 3 is the schematic diagram after the present invention first film and second film complete integration.
Embodiment
Understand technology contents of the present invention for convenience of those skilled in the art, below in conjunction with embodiment, the present invention is described in further detail.
Outer film PIN follows closely a method for contraposition, and the described outer film comprises the first film A and the second film B, and circuit is wherein than of comparatively dense as the first film A, and concrete operations comprise step:
(1) on first film, make 4 PIN hole E, some butterflies C and some target hole D, the second film B makes some butterflies the C that overlap corresponding to butterfly the C on outer film A and target hole D and target hole D; Described butterfly C and target hole D is all located at the position outside the form wire of the film.
(2), after two outer films being carried out coincidence aligning according to butterfly C and target hole D, be fixed together with double faced adhesive tape;
(3) with a press strip F and the outer film while be fixed together, described press strip is bonded between the two outer layers film, is then removed by the double faced adhesive tape described in step (2); The thickness of described press strip F is consistent with production plate.Width 20 ~ the 25mm of described press strip F, length is placed from form wire 15 ~ 20mm than the length of side 10 ~ 15mm of the place film, press strip F.
(4) by first-class for 4 nail E on the first film A PIN nail, then be fixed with one side glue; The boring aperture in PIN hole is generally 3.2mm, and finished product aperture is generally 3.1mm, and plating back aperture will diminish, so when selection PIN follows closely width, range set is 3.15-3.18mm; What the height (i.e. the thickness of the PIN head of a nail) of PIN nail was conventional is the thickness of 1.2-1.5mm, if blocked up words easily produce the thin bad phenomenon of ill-exposed line, gets over Bao Yuehao in the choice, but is not durable lower than the thickness of 1.2mm and very easily fractures.Best selection is 1.2mm, if PIN follows closely periphery when not having a circuit certainly, the thickness selecting 1.5mm is also manipulable.
(5) finally step (4) being completed the two-layer film after contraposition is placed on exposure machine table top, is bonded on exposure machine table top by press strip F and the first film A.First film A fixes, and the second film B can freely stir.
As long as product directly overlaps PIN nail by the present invention, then expose personnel and carry out catching up with gas to expose, whole operating process only needs a people to complete, and carries out manual alignment without the need to independent contraposition personnel, then exposes personnel and exposes.
Above-described embodiment is only wherein specific implementation of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these apparent replacement forms all belong to protection scope of the present invention.

Claims (3)

1. outer film PIN follows closely a method for contraposition, and the described outer film comprises first film (A) and second film (B), it is characterized in that, comprises the following steps:
(1) in upper making 4 the PIN holes (E) of first film (A), some butterflies (C) and some target holes (D), at second film (B) upper making some butterflies (C) corresponding with (C) of the butterfly on first film (A) and target hole (D) position and target hole (D); The circular film region that described butterfly (C) alternately occurs for fan-shaped photic zone and shading region;
(2), after first film (A) and second film (B) being carried out coincidence aligning according to butterfly (C) and target hole (D), with double faced adhesive tape, the two is fixed together;
(3) with a press strip (F) and the outer film while be fixed together, described press strip is bonded between first film (A) and second film (B), then removed by the double faced adhesive tape described in step (2), the thickness of described press strip (F) is consistent with production plate;
(4) by first-class for 4 PIN holes (E) on first film (A) PIN nail, then with one side glue by fixing for PIN nail;
(5) finally step (4) being completed the outer film after contraposition is placed on exposure machine table top, and be bonded on exposure machine table top by the PIN nail in the upper right corner on press strip (F) and first film (A) and the lower right corner, second film (B) can freely stir; Width 20 ~ the 25mm of described press strip (F), length is than the length of side 10 ~ 15mm of the place film, and press strip is placed from form wire 15 ~ 20mm place; Using more intensive for circuit in the outer film one as first film (A).
2. outer film PIN according to claim 1 follows closely the method for contraposition, and it is characterized in that, described butterfly (C) and target hole (D) are all located at the position outside the form wire of the film.
3. outer film PIN according to claim 1 follows closely the method for contraposition, it is characterized in that, it is 3.15 ~ 3.18mm that described PIN follows closely width, is highly 1.2 ~ 1.5mm.
CN201310255460.4A 2013-06-25 2013-06-25 A kind of outer film PIN follows closely the method for contraposition Expired - Fee Related CN103345132B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310255460.4A CN103345132B (en) 2013-06-25 2013-06-25 A kind of outer film PIN follows closely the method for contraposition

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Application Number Priority Date Filing Date Title
CN201310255460.4A CN103345132B (en) 2013-06-25 2013-06-25 A kind of outer film PIN follows closely the method for contraposition

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CN103345132B true CN103345132B (en) 2016-01-20

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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105182682A (en) * 2015-08-11 2015-12-23 深圳崇达多层线路板有限公司 Film structure
CN105611752A (en) * 2015-12-14 2016-05-25 谢兴龙 Manufacture method adopting inner layer pattern transfer exposure
CN105682383A (en) * 2016-03-31 2016-06-15 广州兴森快捷电路科技有限公司 Page-type film group manufacturing method
CN105792529A (en) * 2016-04-08 2016-07-20 梅州市中联精密电子有限公司 Loose-leaf type circuit board Pin nail counterpoint technology
CN107278020A (en) * 2017-06-30 2017-10-20 上达电子(深圳)股份有限公司 Circuit board and locating tool
CN107877108B (en) * 2017-12-05 2019-09-03 扬州华盟电子有限公司 A kind of heat dissipation metal mould group and preparation method thereof
CN108267941A (en) * 2018-02-05 2018-07-10 惠州联创宏科技有限公司 A kind of PCB circuits exposure method
CN109548299B (en) * 2018-11-21 2020-08-25 奥士康精密电路(惠州)有限公司 General film of semi-automatic and full-automatic exposure machine

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101772268A (en) * 2009-12-22 2010-07-07 深圳市集锦线路板科技有限公司 Technology for aligning circuit board by PIN nail
CN201919243U (en) * 2010-12-27 2011-08-03 深圳市翔宇电路有限公司 Alignment device for pegs
CN202189230U (en) * 2011-09-09 2012-04-11 惠州市星之光科技有限公司 Hinge contraposition exposure device
CN202615116U (en) * 2012-03-31 2012-12-19 骏亚(惠州)电子有限公司 Para-position exposure auxiliary mechanism
CN202815413U (en) * 2012-08-10 2013-03-20 东莞市五株电子科技有限公司 Device for exposure and alignment of dry films
CN103025069A (en) * 2012-11-21 2013-04-03 广东依顿电子科技股份有限公司 Method for improving outer pattern layer contraposition precision by virtue of exposure PIN pins

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101772268A (en) * 2009-12-22 2010-07-07 深圳市集锦线路板科技有限公司 Technology for aligning circuit board by PIN nail
CN201919243U (en) * 2010-12-27 2011-08-03 深圳市翔宇电路有限公司 Alignment device for pegs
CN202189230U (en) * 2011-09-09 2012-04-11 惠州市星之光科技有限公司 Hinge contraposition exposure device
CN202615116U (en) * 2012-03-31 2012-12-19 骏亚(惠州)电子有限公司 Para-position exposure auxiliary mechanism
CN202815413U (en) * 2012-08-10 2013-03-20 东莞市五株电子科技有限公司 Device for exposure and alignment of dry films
CN103025069A (en) * 2012-11-21 2013-04-03 广东依顿电子科技股份有限公司 Method for improving outer pattern layer contraposition precision by virtue of exposure PIN pins

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