CN103342335B - A kind of inflation of miniature CPT atomic clock vapour of an alkali metal chamber and plugging system and method - Google Patents
A kind of inflation of miniature CPT atomic clock vapour of an alkali metal chamber and plugging system and method Download PDFInfo
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- CN103342335B CN103342335B CN201310250469.6A CN201310250469A CN103342335B CN 103342335 B CN103342335 B CN 103342335B CN 201310250469 A CN201310250469 A CN 201310250469A CN 103342335 B CN103342335 B CN 103342335B
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Abstract
The present invention relates to a kind of inflation of miniature CPT atomic clock vapour of an alkali metal chamber and method for blocking and system thereof, mainly comprise the parts such as buffer gas gas bomb, vapour of an alkali metal gas bomb, vacuum chamber, MEMS disk plummer, vavuum pump and laser plugging device.Vapour of an alkali metal chamber MEMS disk preparation method for utilize dry etching or wet etching to produce vapour of an alkali metal chamber and air channel on silicon on silicon chip, glass material utilize the method such as mechanical punching or laser boring produce air-filled pore on glass, or on glass material, utilize wet etching to produce on glass inflate microchannel, finally carry out anode linkage and make the vapour of an alkali metal chamber obtaining wafer-level mini-sized CPT atomic clock.Use CO
2the optical window of laser beam transparent vacuum chamber is to melting shutoff glass air-filled pore or the inflation microchannel one by one of the vapour of an alkali metal cavity chip on MEMS disk.The invention enables the making in miniature CPT atom vapour of an alkali metal chamber have simple to operate, not easily introduce impurity, be convenient to the advantages such as batch making.
Description
Technical field
The present invention relates to miniature CPT atomic clock field, be specifically related to the inflation in miniature CPT atomic clock vapour of an alkali metal chamber and method for blocking and system.
Background technology
Atomic clock is the most accurate current timing tool, all important role in astronomy, Aero-Space, satellite navigation location, punctual time service and physics etc.But limit further expanding of its range of application due to its huge volume and fancy price, the microminiaturization of atomic clock will expand its range of application greatly, far-reaching influence will be produced to the field such as communication, electronics, Aeronautics and Astronautics, national defence, and atomic clock is installed in various measuring instrument measurement also will be made more accurately reliable.Conventional atom clock causes volume to be difficult to reduce further due to the existence of microwave cavity, coherent population trapping (the CPT found for 1976, Coherent Population Trapping) principle brings hope to the microminiaturization of atomic clock, owing to no longer becoming the main object of atomic clock microminiaturization in CPT atomic clock system containing microwave cavity, CPT atomic clock is also principle, uniquely can realize microminiaturized atomic clock at present.
The core component of chip-scale atomic clock is just to provide the vapour of an alkali metal chamber of hunting of frequency benchmark, and producing the vapour of an alkali metal chamber that volume is little, reliability is high is the key realizing the work of chip-scale atomic clock.At present, the preparation method that atomic clock vapour of an alkali metal chamber is main has glass blowing method, in-situ chemical reaction method, parafilm wrap method, light decomposition method etc.Wherein glass blowing method is the main preparation method in conventional atom clock vapour of an alkali metal chamber, and volume is very large and be difficult to produce the vapour of an alkali metal chamber that volume reduces further, and thus unfavorable microminiaturization and mass with realizing vapor chamber makes.The preparation method mainly in-situ reaction in current chip atomic clock vapour of an alkali metal chamber.
The existing method utilizing in-situ reaction legal system to do atomic clock vapour of an alkali metal chamber mainly utilizes chemical reaction to generate alkali metal legal system and does vapour of an alkali metal chamber now, this method is the mixture utilizing the compound that good seal has mixed up in proportion inside vapor chamber, then required alkali metal is generated by heating, basic process is as shown in accompanying drawing 6a-6d, first by twin polishing silicon chip 61 after photoetching, a square through hole is produced with KOH corrosion or deep reaction ion etching, then itself and Pyrex7740 sheet glass 62 bonding are obtained semi-finished product, RbCl salt 65 is added to containing BaN
6be in the aqueous solution of 15%, form colourless liquid 64, then with micro pipette 63, liquid is dripped in half-finished areola, semi-finished product are put in the bonder of band having heaters, at UHV(ultrahigh vacuum) carry out bonding under environment, in bonding process, RbCl and BaN
6due to heating, react and generate BaCl
2with required Rb element 66, total reaction is as follows:
Extract generated N again
2, counter fill required buffer gas after complete bonding, thus make obtain seal vapour of an alkali metal chamber.This method has following several shortcoming:
(1) because alkali metal simple substance has very active chemical property, very easily oxidized, in this way need high vacuum environment or anaerobic environment, this antianode bonder has high requirement.
(2) disadvantage being obtained by reacting alkali metal by chemistry in cavity is containing the impurity such as barium, chloride inside vapor chamber, the existence of impurity can stop light path thus affect signal strength signal intensity, the collision of alkali metal atom and impurity simultaneously may affect the energy level of alkali metal atom, thus causes frequency drift.
(3) this kind of method is high to operation requirements, needs to operate in glove box, needs to draw compound solution with micro pipette, and drops in very little cavity, and operation easier is very large.
(4) because each chip must be hand-manipulated, so can only singlely make, not easily mass making etc. is carried out.
Parafilm wrap method and light decomposition method are the manufacture crafts that laboratory stage proposes.Parafilm wrap method to be first wrapped among paraffin by alkali metal atom by MEMS technology to form wax bag, then by wet etching and anode linkage technique, to produce one side be glass one side is the Si chamber of SiN rete, wax bag is sticked to below SiN rete, irradiate with laser light glass and make the decomposition of SiN rete, the thawing of the wax portion of wrapping, laser has shone directly on alkali metal atom thus evaporation enters in Si chamber, the another side in Si chamber close by the paraffin that do not melt, form the alkali metal atom chamber of a sealing.The method exists that complex manufacturing technology, paraffin sealing are poor, the not easily shortcoming such as mass making; Light decomposition method is on two-sided precise polished silicon chip, first etch the Si hole array penetrated, and carries out anode linkage and forms semi-finished product, then on semi-finished product, deposit cesium azide (CsN
3) film, under ultra-high vacuum environment, carry out second bonding, make CsN finally by Ultraviolet radiation
3be decomposed into caesium (Cs) simple substance and nitrogen (N
2), scribing obtains the vapour of an alkali metal chamber of good seal.The technique of light decomposition method is all wafer level technique, be very easy to realize mass and make, but the method exists the deposition CsN needing exploitation special
3the equipment of film, and buffer gas can only be nitrogen and nitrogen pressure is generally higher, thus the CPT live width of the chip-scale atomic clock that this vapour of an alkali metal chamber is made is broadening, single buffer gas also makes the frequency stability of chip atomic clock be deteriorated.
Summary of the invention
The present invention is directed to environmental requirement in the preparation method of current atom clock vapour of an alkali metal chamber high, introduce impurity thus cause the problems such as frequency drift, complicated operation, not easily mass making, propose a kind of inflation of miniature CPT atomic clock vapour of an alkali metal chamber and method for blocking and system, the making in atomic clock vapour of an alkali metal chamber can be made to overcome the problems referred to above.
In order to achieve the above object, the present invention adopts following technical scheme: a kind of inflation of miniature CPT atomic clock vapour of an alkali metal chamber and plugging system, and this system comprises the primary heater be positioned on workbench;
Be positioned over the vacuum chamber on described primary heater;
Be provided with above described vacuum chamber for the optical window through laser beam;
Described vacuum chamber one end is provided with the first valve, and the other end of described first valve is communicated with the buffer gas gas bomb being provided with the 3rd valve, the vapour of an alkali metal gas bomb being provided with the second valve and the first vacuum meter successively by stainless steel pipes; Secondary heater is provided with below described vapour of an alkali metal gas bomb;
The described vacuum chamber other end is provided with the 4th valve, and the other end of described 4th valve is communicated with vavuum pump and the second vacuum meter successively by stainless steel pipes;
In described vacuum chamber, be provided with below optical window comprise stationary fixture thermally isolated for placing vapour of an alkali metal chamber MEMS disk; Described vapour of an alkali metal chamber MEMS disk comprises some vapour of an alkali metal cavity chips.
The present invention also provides a kind of and realizes the miniature inflation in CPT atomic clock vapour of an alkali metal chamber and the method for shutoff, and the method comprises the following steps:
First vacuum chamber is opened, put into vapour of an alkali metal chamber MEMS disk, and by stationary fixture, MEMS disk position is fixed, second, third valve described is closed condition, open described first, the 4th valve, and the primary heater opened below vacuum chamber and vavuum pump, be first pumped into low vacuum with fore pump, then by the higher vacuum of rear class pump degree of being evacuated; Basically identical and when reaching desirable value until the numerical value of two vacuum meters display, close vavuum pump, the heating tape of opening the secondary heater below vapour of an alkali metal gas bomb and being enclosed within stainless steel pipes, open second, third valve described more simultaneously, vapour of an alkali metal and buffer gas are arrived in the vapour of an alkali metal chamber MEMS disk of vacuum chamber, maintain a period of time until buffer gas and vapour of an alkali metal are fully filled in several vapour of an alkali metal cavity chips in the MEMS disk of vapour of an alkali metal chamber; Then all valves are closed, start to irradiate described vapour of an alkali metal cavity chip respectively with CO2 laser beam, it is made melting sealedly to realize shutoff, after shutoff terminates, open described first, the 4th valve, open primary heater and vavuum pump, in vacuum chamber and vapour of an alkali metal chamber MEMS disk surfaces residual alkali steam is extracted totally, thus obtains the vapour of an alkali metal chamber of miniature CPT atomic clock level Hermetic Package.
As can be seen from the above technical solutions, the present invention can make the making in atomic clock vapour of an alkali metal chamber compared with existing preparation method, has the following advantages:
(1) not easily introduce impurity in atomic clock vapour of an alkali metal chamber and cause frequency drift.Owing to not needing to obtain alkali metal by the method for reaction in vapor chamber, at the alkali metal simple substance steam that vapour of an alkali metal storage device vapour of an alkali metal is out very pure, thus in vapor chamber, not easily introduce impurity, there will not be the frequency drift phenomenon caused due to impurity and buffer gas consumption.
(2) requirement of the method to operation is relatively low, and only need the switch of the instruction operated valve according to flowmeter and vacuum meter, computerized control CO
2the melting shutoff process of laser instrument, does not need in little cavity, to drip the highly difficult operation of the aqueous solution etc. of compound with micro pipette in glove box, does not need to develop complicated special equipment simultaneously yet.
(3) the method can carry out mass making, can reduce cost of manufacture greatly, also has very high reliability simultaneously.
Accompanying drawing explanation
Fig. 1 is the inflation of the present invention's miniature CPT atomic clock vapour of an alkali metal chamber and plugging system schematic diagram.
The miniature CPT atomic clock vapour of an alkali metal cavity chip cell schematics of Fig. 2 a-2b to be filling channel of the present invention be two-layer bonding structure of air-filled pore.
The miniature CPT atomic clock vapour of an alkali metal cavity chip cell schematics of the two-layer bonding structure of Fig. 3 a-3b to be filling channel of the present invention be inflation microchannel.
The miniature CPT atomic clock vapour of an alkali metal cavity chip cell schematics of Fig. 4 a-4b to be filling channel of the present invention be three layers of bonding structure of air-filled pore.
The miniature CPT atomic clock vapour of an alkali metal cavity chip cell schematics of three layers of bonding structure of Fig. 5 a-5b to be filling channel of the present invention be inflation microchannel.
Fig. 6 a-6d is the atomic clock vapour of an alkali metal chamber preparation method schematic diagram based on in-situ reaction in prior art.
Number in the figure:
1 buffer gas gas bomb 2 vapour of an alkali metal gas bomb
5 first, second vacuum meters of stainless steel pipes 6
7 optical window 8 vacuum chambers
9 stationary fixture 10 vapour of an alkali metal chamber MEMS disks
11 thermally isolated 12 workbench
13 vavuum pump 14 CO
2laser beam
31 secondary heater 32 primary heaters
41 the 3rd valve 42 second valves
43 first valve 44 the 4th valves
26 silicon oxide layer 21 air channels
22 vapour of an alkali metal chamber 23 air-filled pores
24 inflation laser irradiation area, microchannel 25 marks
61 twin polishing silicon chip 62 Pyrex 7740 sheet glass
63 micro pipette 64 RbCl and BaN
6the aqueous solution
65 alkali metals 66 react the BaCl generated
2deng impurity
Detailed description of the invention
Below in conjunction with accompanying drawing, by specific embodiment, certain applications of the present invention are described, set forth substantive distinguishing features of the present invention and progress significantly further, but the present invention are only limitted to absolutely not the description of embodiment.
Refer to shown in Fig. 1, a kind of inflation of miniature CPT atomic clock vapour of an alkali metal chamber and plugging system, this system comprises the primary heater 32 be arranged on workbench 12; Be positioned over the vacuum chamber 8 on described primary heater 32; Be provided with for through CO above described vacuum chamber 8
2the optical window 7 of laser beam 14; Described vacuum chamber 8 one end is provided with the first valve 43, and the other end of described first valve 43 is communicated with the buffer gas gas bomb 1 being provided with the 3rd valve 41, the vapour of an alkali metal gas bomb 2 being provided with the second valve 42 and the first vacuum meter 6 successively by stainless steel pipes 5; Secondary heater 31 is provided with below described vapour of an alkali metal gas bomb 2; Described vacuum chamber 8 other end is provided with the 4th valve 44, and the other end of described 4th valve 44 is communicated with vavuum pump 13 and the second vacuum meter 6 successively by stainless steel pipes; In described vacuum chamber 8, be provided with below optical window 7 comprise stationary fixture 9 thermally isolated 11 for placing vapour of an alkali metal chamber MEMS disk 10; Described vapour of an alkali metal chamber MEMS disk 10 comprises some vapour of an alkali metal cavity chips.
The material of described optical window 7 adopts zinc selenide material.Described primary heater 32 is provided with Temperature numerical display module.Described vavuum pump 13 comprises fore pump and the rear class pump with this fore pump cascade.On described stainless steel pipes, surface cover has heating tape.
The present invention also provides a kind of and realizes the miniature inflation in CPT atomic clock vapour of an alkali metal chamber and the method for shutoff, the method comprises the following steps: first open vacuum chamber 8, put into vapour of an alkali metal chamber MEMS disk 10, and by stationary fixture, MEMS disk position is fixed, second, third valve described is closed condition, open described first, the 4th valve, and the primary heater 32 opened below vacuum chamber 8 and vavuum pump 13, first be pumped into low vacuum with fore pump, then by the higher vacuum of rear class pump degree of being evacuated; The numerical value shown until two vacuum meters 6 is basically identical and when reaching desirable value, close vavuum pump 13, the heating tape of opening the secondary heater 31 below vapour of an alkali metal gas bomb 2 and being enclosed within stainless steel pipes, open second, third valve described more simultaneously, vapour of an alkali metal and buffer gas are arrived in the vapour of an alkali metal chamber MEMS disk 10 of vacuum chamber, maintain a period of time until buffer gas and vapour of an alkali metal are fully filled in several vapour of an alkali metal cavity chips in the MEMS disk of vapour of an alkali metal chamber; Then close all valves, start to use CO
2laser beam 14 irradiates described vapour of an alkali metal cavity chip respectively, it is made melting sealedly to realize shutoff, after shutoff terminates, open described first, the 4th valve, open primary heater 31 and vavuum pump 13, in vacuum chamber and vapour of an alkali metal chamber MEMS disk surfaces residual alkali steam is extracted totally, thus obtains the vapour of an alkali metal chamber of miniature CPT atomic clock level Hermetic Package.
Embodiment 1
As shown in accompanying drawing 2a-2b, wherein 2a is the top view of 2b.Atomic clock vapour of an alkali metal chamber adopts the two-layer anode linkage structure of Si-Glass, lower floor is silicon chip, adopt the two-sided precise polished silicon chip of common N-type <100>, upper strata is sheet glass, adopt Pyrex7740 glass, inflation and shutoff passage are air-filled pore 23 on glass.First on semiconductor silicon material, utilize wet etching to produce on silicon vapour of an alkali metal chamber 22 on air channel 21 and silicon, then air-filled pore 23 on the glass utilizing the method such as mechanical punching or laser boring to produce vapour of an alkali metal on glass material, air channel makes silicon corresponding immediately below air-filled pore the SiO of thin layer
2layer 26, finally carries out Si-Glass anode linkage, makes the vapour of an alkali metal chamber obtaining the miniature CPT atomic clock waiting to inflate and seal.
Then the disk in miniature CPT atomic clock vapour of an alkali metal chamber is put into inflation and plugging system, inflation and plugging system are as shown in Figure 1, mainly comprise buffer gas gas bomb 1, vapour of an alkali metal gas bomb 2, vacuum chamber 8, vapour of an alkali metal chamber MEMS disk 10, the parts such as vavuum pump 13 and laser plugging device 14, vapour of an alkali metal gas bomb 2 is placed on heater 31, buffer gas gas bomb 1, vapour of an alkali metal gas bomb 2 connects valve 41 respectively, 42 control its switch, vacuum chamber upper end is optical window 7, two ends connect valve 43 respectively by stainless steel pipes 5, 44 and vacuum meter 6, and vacuum chamber 8 is placed on the heater 32 with Temperature numerical display, vavuum pump 13 part adopts two-level concatenation mode, fore pump is slightly taken out, be pumped into black vacuum, and then by the higher vacuum of rear class pump degree of being evacuated, each several part is linked together by stainless steel pipes 5, on stainless steel pipes 5, surface cover has heating tape, that laser plugging device adopts is CO
2laser beam 14.
First inflation and shutoff process for open vacuum chamber 8, put into vapour of an alkali metal chamber MEMS disk 10, and by stationary fixture 9, MEMS disk position is fixed in thermally isolated 11, close gas bomb valve 41, 42, open vacuum chamber valve 43, 44, and open the heater 32 of vacuum chamber, open vavuum pump 13, first be pumped into low vacuum with fore pump, again by the vacuum that rear class pump degree of being evacuated is higher, and the assorted gas removed in MEMS disk, basically identical and when reaching desirable value until the numerical value of two vacuum meters display, close vavuum pump 13, the heater 31 opening vapour of an alkali metal gas bomb and the heating tape be enclosed within stainless steel pipes, open the valve 41 of two gas bombs more simultaneously, 42, buffer gas and vapour of an alkali metal are arrived in the vapour of an alkali metal chamber MEMS disk of vacuum chamber 8, maintain a period of time, buffer gas and vapour of an alkali metal is made fully to be filled into little chip unit in MEMS disk, then all valves are closed, start to use CO
2laser beam 14 irradiates the glass pipe of the medium and small chip unit of MEMS disk, makes it melting sealed, then by computer accurately control CO
2the position of laser beam 14, lf shutoff is realized one by one to the little chip on disk, after shutoff terminates, open vacuum chamber valve 43,44, open primary heater 31, open vavuum pump 13, interior for vacuum chamber 8 and MEMS disk surfaces residual alkali steam are extracted totally, thus obtains the vapour of an alkali metal chamber of miniature CPT atomic clock air-tight packaging.
Embodiment 2
The disk in miniature CPT atomic clock vapour of an alkali metal chamber put into inflation and plugging system consistent with embodiment 1, difference is, in the present embodiment, atomic clock vapour of an alkali metal chamber adopts the two-layer anode linkage structure of Si-Glass, lower floor is silicon chip, adopt the two-sided precise polished silicon chip of common N-type <100>, upper strata is sheet glass, adopt Pyrex 7740 glass, inflation and shutoff passage are micro-filling channel 24 on glass, as shown in accompanying drawing 3a-3b, wherein 3a is the top view of 3b.First on semiconductor silicon material, utilize wet etching to produce on silicon vapour of an alkali metal chamber 22 on air channel 21 and silicon, then utilize on glass material the method such as mechanical punching or laser boring glass corresponding directly over air channel on silicon is produced vapour of an alkali metal glass on air-filled pore 23, glass material utilizes wet etching produce on glass and inflate microchannel 24, silicon corresponding below inflation microchannel makes the SiO of thin layer
2layer 26, finally carries out Si-Glass anode linkage, makes the vapour of an alkali metal chamber obtaining the miniature CPT atomic clock waiting to inflate and seal.Carry out inflation and shutoff process afterwards, the vapour of an alkali metal cavity chip preparation method in the present embodiment forms embodiment 2 with the inflation mentioned in embodiment 1 together with plugging system, inflation method for blocking.
Embodiment 3
The disk in miniature CPT atomic clock vapour of an alkali metal chamber put into inflation and plugging system consistent with embodiment 1, difference is, in the present embodiment, atomic clock vapour of an alkali metal chamber adopts Glass-Si-Glass tri-layers of anode linkage structure, intermediate layer is silicon chip, adopt the two-sided precise polished silicon chip of N-type <100>, upper and lower layer is sheet glass, adopt Pyrex 7740 glass, inflation and shutoff passage are air-filled pore 23 on glass, as shown in accompanying drawing 4a-4b, wherein 4a is the top view of 4b.First on semiconductor silicon material, utilize wet etching to produce air channel 21 and vapour of an alkali metal chamber 22 on the through silicon of corrosion on silicon, then glass is carried out anode linkage with silicon chip back side, then air-filled pore 23 on the glass utilizing the method such as mechanical punching or laser boring to produce vapour of an alkali metal on glass material, air channel makes silicon corresponding immediately below air-filled pore the SiO of thin layer
2layer 26, finally carries out front anode linkage by punching glass with Si-Glass bonding pad before, makes the vapour of an alkali metal chamber obtaining the miniature CPT atomic clock waiting to inflate and seal.Carry out inflation and shutoff process afterwards, the vapour of an alkali metal cavity chip preparation method in the present embodiment forms embodiment 3 with the inflation mentioned in embodiment 1 together with plugging system, inflation method for blocking.
Embodiment 4
The disk in miniature CPT atomic clock vapour of an alkali metal chamber put into inflation and plugging system consistent with embodiment 1, difference is, in the present embodiment, atomic clock vapour of an alkali metal chamber adopts Glass-Si-Glass tri-layers of anode linkage structure, intermediate layer is silicon chip, adopt the two-sided precise polished silicon chip of N-type <100>, upper and lower layer is sheet glass, adopt Pyrex 7740 glass, inflation and shutoff passage are micro-filling channel 24 on glass, as shown in accompanying drawing 5a-5b, wherein 5a is the top view of 5b.First on semiconductor silicon material, utilize wet etching to produce on silicon vapour of an alkali metal chamber 22 on air channel 21 and silicon, then glass is carried out anode linkage with silicon chip back side, then air-filled pore 23 on the glass utilizing the method such as mechanical punching or laser boring to produce vapour of an alkali metal on glass material on glass, glass material utilizes wet etching produce on glass and inflate microchannel 24, silicon corresponding immediately below filling channel 24 makes the SiO of thin layer
2layer 26, finally carries out front anode linkage by punching glass with Si-Glass bonding pad before, makes the vapour of an alkali metal chamber obtaining the miniature CPT atomic clock waiting to inflate and seal.Carry out inflation and shutoff process afterwards, the vapour of an alkali metal cavity chip preparation method in the present embodiment forms embodiment 4 with the inflation mentioned in embodiment 1 together with plugging system, inflation method for blocking.
As can be seen from the above technical solutions, the present invention can make the making in atomic clock vapour of an alkali metal chamber compared with existing preparation method, has the following advantages:
(4) not easily introduce impurity in atomic clock vapour of an alkali metal chamber and cause frequency drift.Owing to not needing to obtain alkali metal by the method for reaction in vapor chamber, at the alkali metal simple substance steam that vapour of an alkali metal storage device vapour of an alkali metal is out very pure, thus in vapor chamber, not easily introduce impurity, there will not be the frequency drift phenomenon caused due to buffer gas consumption.
(5) requirement of the method to operation is relatively low, and only need the switch of the instruction operated valve according to flowmeter and vacuum meter, computerized control CO
2the melting shutoff process of laser instrument, does not need in little cavity, to drip the highly difficult operation of the aqueous solution etc. of compound with micro pipette in glove box, does not need to develop complicated special equipment simultaneously yet.
(6) the method can carry out mass making, can reduce cost of manufacture greatly, also has very high reliability simultaneously.
The inflation in vapour of an alkali metal chamber proposed by the invention and method for blocking and system are applicable to the mass manufacture of miniature CPT atomic clock, but are not limited in this.The fields such as miniature atomic magnetometer of the present invention, miniature atomic gyroscope also have wide practical use.
The mass that the present invention may be used for miniature atomic magnetometer makes.The high-sensitivity miniature atom magnetometer of mm size magnitude utilizing the vapour of an alkali metal chamber being filled with vapour of an alkali metal and buffer gas to make have highly sensitive, size is little, the advantage such as low in energy consumption.CPT atom magnetometer is based on full photoresonance, and its magnetic probe does not need radio-frequency coil, the size of magnetic probe can be made very little thus improve spatial resolution in conjunction with MEMS manufacture craft; According to the relation of CPT signal center frequency and magnetic field intensity, can be used for differentiating the faint change in magnetic field.Scully etc. once foretold, utilized the magnetometer of this principle, and the limit resolution capability of its magnetic-field measurement can reach 0.1fT level; Simultaneously because CPT magnetometer does not exist the problem that radio-frequency coil produces additional field noise, the measurement of external magnetic field can be made more accurate.
The mass that the present invention may be used for miniature atomic gyroscope makes.Utilize the miniature atomic gyroscope that vapour of an alkali metal chamber makes, utilize the Sagnac effect in similar optical gyroscope, in atomic interferometer loop, atom experiences Coriolis acceleration, utilize the relation rotating phase shift and the rotary speed caused to extract the speed of rotation, its precision and resolution ratio are all improved largely relative to current gyro, are follow-on high accuracy gyroscopes.Make miniature atomic gyroscope based on the present invention and have that precision is high, volume is little, low in energy consumption, the low all advantages of cost, have a good application prospect.
The above-mentioned description to embodiment can understand and apply the invention for ease of those skilled in the art.Person skilled in the art obviously easily can make various amendment to these embodiments, and General Principle described herein is applied in other embodiments and need not through performing creative labour.Therefore, the invention is not restricted to embodiment here, those skilled in the art are according to announcement of the present invention, and the improvement made for the present invention and amendment all should within protection scope of the present invention.
Claims (5)
1. realize the miniature inflation in CPT atomic clock vapour of an alkali metal chamber and a method for shutoff, the method comprises the following steps:
First vacuum chamber is opened, put into vapour of an alkali metal chamber MEMS disk, and by stationary fixture, MEMS disk position is fixed, second, third valve is closed condition, open the first, the 4th valve, and the primary heater opened below vacuum chamber and vavuum pump, be first pumped into low vacuum with fore pump, then by the higher vacuum of rear class pump degree of being evacuated; Basically identical and when reaching desirable value until the numerical value of two vacuum meters display, close vavuum pump, the heating tape of opening the secondary heater below vapour of an alkali metal gas bomb and being enclosed within stainless steel pipes, open second, third valve described more simultaneously, vapour of an alkali metal and buffer gas are arrived in the vapour of an alkali metal chamber MEMS disk of vacuum chamber, maintain a period of time until buffer gas and vapour of an alkali metal are fully filled in several vapour of an alkali metal cavity chips in the MEMS disk of vapour of an alkali metal chamber; Then close all valves, start to use CO
2laser beam irradiates described vapour of an alkali metal cavity chip respectively, it is made melting sealedly to realize shutoff, after shutoff terminates, open described first, the 4th valve, open primary heater and vavuum pump, in vacuum chamber and vapour of an alkali metal chamber MEMS disk surfaces residual alkali steam is extracted totally, thus obtains the vapour of an alkali metal chamber of miniature CPT atomic clock level Hermetic Package.
2. the inflation in miniature CPT atomic clock vapour of an alkali metal chamber according to claim 1 and method for blocking, it is characterized in that: described vapour of an alkali metal chamber MEMS disk adopts bonding method to obtain, first on semiconductor silicon material, utilize dry etching or wet etching to produce air channel and vapour of an alkali metal chamber, then on glass material, utilize mechanical punching or laser boring method to produce air-filled pore, finally carry out the MEMS disk that anode linkage obtains waiting to inflate and seal vapour of an alkali metal chamber.
3. the inflation in miniature CPT atomic clock vapour of an alkali metal chamber according to claim 1 and method for blocking, it is characterized in that: described vapour of an alkali metal chamber MEMS disk adopts bonding method to obtain, first on semiconductor silicon material, utilize dry etching or wet etching to produce air channel and vapour of an alkali metal chamber, then on glass material, utilize mechanical punching or laser boring method to produce air-filled pore and on glass material, utilize wet etching to produce on glass and inflate microchannel, finally carry out the MEMS disk that anode linkage obtains waiting to inflate and seal vapour of an alkali metal chamber.
4. the inflation in miniature CPT atomic clock vapour of an alkali metal chamber according to claim 1 and method for blocking, it is characterized in that: described vapour of an alkali metal chamber MEMS disk adopts bonding method to obtain, first on semiconductor silicon material, utilize wet etching to produce air channel and the through vapour of an alkali metal chamber of corrosion, then a sheet glass and silicon chip back side are carried out anode linkage, form bonding pad, then on another sheet glass, air-filled pore is made, finally the sheet glass and described bonding pad that are manufactured with air-filled pore are carried out front anode linkage, make the vapour of an alkali metal chamber obtaining the miniature CPT atomic clock waiting to inflate and seal.
5. the inflation in miniature CPT atomic clock vapour of an alkali metal chamber according to claim 1 and method for blocking, it is characterized in that: described vapour of an alkali metal chamber MEMS disk adopts bonding method to obtain, first on semiconductor silicon material, utilize wet etching to produce air channel and vapour of an alkali metal chamber, then a sheet glass and silicon chip back side are carried out anode linkage, form bonding pad, then air-filled pore is made at another sheet glass, the sheet glass being manufactured with air-filled pore produces inflation microchannel with wet etching, finally the sheet glass and described bonding pad that are manufactured with air-filled pore and inflation microchannel are carried out front anode linkage, make the vapour of an alkali metal chamber obtaining the miniature CPT atomic clock waiting to inflate and seal.
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| CN103864007B (en) * | 2014-02-27 | 2016-03-30 | 中国电子科技集团公司第五十五研究所 | The high purity alkali metal fill method that chip-scale atomic clock absorbs bubble is realized at sheet |
| CN104609364B (en) * | 2015-01-28 | 2016-05-11 | 中国科学院上海光学精密机械研究所 | Preparation method and the system of high accuracy mixed buffer gas alkali metal atom steam bubble |
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