CN103328607B - 发光装置用荧光体、其制造方法及使用了该荧光体的发光装置 - Google Patents
发光装置用荧光体、其制造方法及使用了该荧光体的发光装置 Download PDFInfo
- Publication number
- CN103328607B CN103328607B CN201280005892.3A CN201280005892A CN103328607B CN 103328607 B CN103328607 B CN 103328607B CN 201280005892 A CN201280005892 A CN 201280005892A CN 103328607 B CN103328607 B CN 103328607B
- Authority
- CN
- China
- Prior art keywords
- fluor
- light
- briliancy
- emitting device
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000002245 particle Substances 0.000 claims abstract description 61
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 49
- 239000000839 emulsion Substances 0.000 claims abstract description 46
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000012756 surface treatment agent Substances 0.000 claims abstract description 20
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 72
- 239000011572 manganese Substances 0.000 claims description 32
- 229910052693 Europium Inorganic materials 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 25
- 239000011248 coating agent Substances 0.000 claims description 20
- 238000000576 coating method Methods 0.000 claims description 20
- 239000006185 dispersion Substances 0.000 claims description 20
- 239000007788 liquid Substances 0.000 claims description 20
- 239000000203 mixture Substances 0.000 claims description 19
- 229910052748 manganese Inorganic materials 0.000 claims description 18
- 229910052915 alkaline earth metal silicate Inorganic materials 0.000 claims description 13
- 230000008569 process Effects 0.000 claims description 13
- OGPBJKLSAFTDLK-UHFFFAOYSA-N europium atom Chemical compound [Eu] OGPBJKLSAFTDLK-UHFFFAOYSA-N 0.000 claims description 9
- 238000002156 mixing Methods 0.000 claims description 8
- 238000002347 injection Methods 0.000 claims description 7
- 239000007924 injection Substances 0.000 claims description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 6
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052708 sodium Inorganic materials 0.000 claims description 6
- 239000011734 sodium Substances 0.000 claims description 6
- 229910004283 SiO 4 Inorganic materials 0.000 claims description 4
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 3
- -1 3-glycidoxypropyl group Chemical group 0.000 claims description 3
- VLWUKSRKUMIQAX-UHFFFAOYSA-N diethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[SiH](OCC)CCCOCC1CO1 VLWUKSRKUMIQAX-UHFFFAOYSA-N 0.000 claims description 3
- NFCHYERDRQUCGJ-UHFFFAOYSA-N dimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[SiH](OC)CCCOCC1CO1 NFCHYERDRQUCGJ-UHFFFAOYSA-N 0.000 claims description 3
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000007864 aqueous solution Substances 0.000 claims description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims 2
- 229920001577 copolymer Polymers 0.000 claims 2
- 238000001035 drying Methods 0.000 claims 1
- 239000005083 Zinc sulfide Substances 0.000 abstract description 7
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 abstract description 2
- UPIZSELIQBYSMU-UHFFFAOYSA-N lanthanum;sulfur monoxide Chemical compound [La].S=O UPIZSELIQBYSMU-UHFFFAOYSA-N 0.000 abstract 1
- 238000012423 maintenance Methods 0.000 abstract 1
- 229910052984 zinc sulfide Inorganic materials 0.000 abstract 1
- 239000000843 powder Substances 0.000 description 34
- 238000012360 testing method Methods 0.000 description 23
- 239000012298 atmosphere Substances 0.000 description 19
- CXZYAHIVDQSGMI-UHFFFAOYSA-M [O-2].[OH-].O.[F].S.[La+3] Chemical compound [O-2].[OH-].O.[F].S.[La+3] CXZYAHIVDQSGMI-UHFFFAOYSA-M 0.000 description 18
- 239000011159 matrix material Substances 0.000 description 18
- 230000004913 activation Effects 0.000 description 17
- 239000012190 activator Substances 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 15
- 239000010949 copper Substances 0.000 description 15
- YDUSRVDVRPPCFI-UHFFFAOYSA-N [F].[Zn] Chemical compound [F].[Zn] YDUSRVDVRPPCFI-UHFFFAOYSA-N 0.000 description 14
- 239000002994 raw material Substances 0.000 description 14
- HDUUOYUEXLTPQS-UHFFFAOYSA-N [F].[S-2].[Zn+2] Chemical compound [F].[S-2].[Zn+2] HDUUOYUEXLTPQS-UHFFFAOYSA-N 0.000 description 12
- 229910052782 aluminium Inorganic materials 0.000 description 12
- 238000006073 displacement reaction Methods 0.000 description 12
- 239000011777 magnesium Substances 0.000 description 12
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 12
- 229910052712 strontium Inorganic materials 0.000 description 11
- 229910052772 Samarium Inorganic materials 0.000 description 10
- 238000004381 surface treatment Methods 0.000 description 10
- 239000011701 zinc Substances 0.000 description 10
- 229910052788 barium Inorganic materials 0.000 description 9
- 230000008859 change Effects 0.000 description 9
- 230000009467 reduction Effects 0.000 description 9
- 229910052749 magnesium Inorganic materials 0.000 description 8
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 7
- 238000009826 distribution Methods 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 230000003081 coactivator Effects 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 229910052688 Gadolinium Inorganic materials 0.000 description 5
- 238000012216 screening Methods 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 229910052727 yttrium Inorganic materials 0.000 description 5
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 4
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 4
- 150000001342 alkaline earth metals Chemical class 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 230000005284 excitation Effects 0.000 description 4
- 238000001228 spectrum Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- LVGYADDQLWOBGC-UHFFFAOYSA-M [O-2].[OH-].O.S.[La+3] Chemical compound [O-2].[OH-].O.S.[La+3] LVGYADDQLWOBGC-UHFFFAOYSA-M 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 239000011259 mixed solution Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000010298 pulverizing process Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- XTEGARKTQYYJKE-UHFFFAOYSA-M Chlorate Chemical compound [O-]Cl(=O)=O XTEGARKTQYYJKE-UHFFFAOYSA-M 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 235000019270 ammonium chloride Nutrition 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 2
- BDAGIHXWWSANSR-NJFSPNSNSA-N hydroxyformaldehyde Chemical compound O[14CH]=O BDAGIHXWWSANSR-NJFSPNSNSA-N 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- 238000009877 rendering Methods 0.000 description 2
- KZUNJOHGWZRPMI-UHFFFAOYSA-N samarium atom Chemical compound [Sm] KZUNJOHGWZRPMI-UHFFFAOYSA-N 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 229910000018 strontium carbonate Inorganic materials 0.000 description 2
- IATRAKWUXMZMIY-UHFFFAOYSA-N strontium oxide Chemical compound [O-2].[Sr+2] IATRAKWUXMZMIY-UHFFFAOYSA-N 0.000 description 2
- 230000002087 whitening effect Effects 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- WINBENDMTZYOIQ-UHFFFAOYSA-M F[Ag].[Zn] Chemical compound F[Ag].[Zn] WINBENDMTZYOIQ-UHFFFAOYSA-M 0.000 description 1
- QXQVDANUNXECKG-UHFFFAOYSA-N OP(O)(Cl)=O.OP(O)(Cl)=O.OP(O)(Cl)=O.P.P Chemical compound OP(O)(Cl)=O.OP(O)(Cl)=O.OP(O)(Cl)=O.P.P QXQVDANUNXECKG-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910003564 SiAlON Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 239000008186 active pharmaceutical agent Substances 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- AYJRCSIUFZENHW-DEQYMQKBSA-L barium(2+);oxomethanediolate Chemical compound [Ba+2].[O-][14C]([O-])=O AYJRCSIUFZENHW-DEQYMQKBSA-L 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000011284 combination treatment Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- SULCVUWEGVSCPF-UHFFFAOYSA-L europium(2+);carbonate Chemical compound [Eu+2].[O-]C([O-])=O SULCVUWEGVSCPF-UHFFFAOYSA-L 0.000 description 1
- AEBZCFFCDTZXHP-UHFFFAOYSA-N europium(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Eu+3].[Eu+3] AEBZCFFCDTZXHP-UHFFFAOYSA-N 0.000 description 1
- WSVPPALNMDLGQB-UHFFFAOYSA-N europium;oxalic acid Chemical compound [Eu].OC(=O)C(O)=O WSVPPALNMDLGQB-UHFFFAOYSA-N 0.000 description 1
- 238000000695 excitation spectrum Methods 0.000 description 1
- UIWYJDYFSGRHKR-UHFFFAOYSA-N gadolinium atom Chemical compound [Gd] UIWYJDYFSGRHKR-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 150000002500 ions Chemical group 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 229960001708 magnesium carbonate Drugs 0.000 description 1
- 235000014380 magnesium carbonate Nutrition 0.000 description 1
- HDJUVFZHZGPHCQ-UHFFFAOYSA-L manganese(2+);oxalate;dihydrate Chemical compound O.O.[Mn+2].[O-]C(=O)C([O-])=O HDJUVFZHZGPHCQ-UHFFFAOYSA-L 0.000 description 1
- XMWCXZJXESXBBY-UHFFFAOYSA-L manganese(ii) carbonate Chemical compound [Mn+2].[O-]C([O-])=O XMWCXZJXESXBBY-UHFFFAOYSA-L 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229960001866 silicon dioxide Drugs 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- QSQXISIULMTHLV-UHFFFAOYSA-N strontium;dioxido(oxo)silane Chemical class [Sr+2].[O-][Si]([O-])=O QSQXISIULMTHLV-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/56—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/59—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing silicon
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/64—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing aluminium
- C09K11/641—Chalcogenides
- C09K11/642—Chalcogenides with zinc or cadmium
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77342—Silicates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7783—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals one of which being europium
- C09K11/7784—Chalcogenides
- C09K11/7787—Oxides
- C09K11/7789—Oxysulfides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
- H05B33/145—Arrangements of the electroluminescent material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (6)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011-057880 | 2011-03-16 | ||
JP2011057880 | 2011-03-16 | ||
PCT/JP2012/001653 WO2012124302A1 (ja) | 2011-03-16 | 2012-03-09 | 発光装置用蛍光体とその製造方法、及びそれを用いた発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103328607A CN103328607A (zh) | 2013-09-25 |
CN103328607B true CN103328607B (zh) | 2015-05-20 |
Family
ID=46830394
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201280005892.3A Active CN103328607B (zh) | 2011-03-16 | 2012-03-09 | 发光装置用荧光体、其制造方法及使用了该荧光体的发光装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9231150B2 (zh) |
JP (1) | JP5813096B2 (zh) |
KR (1) | KR101528413B1 (zh) |
CN (1) | CN103328607B (zh) |
WO (1) | WO2012124302A1 (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102899020B (zh) * | 2012-10-25 | 2014-07-23 | 江苏博睿光电有限公司 | 包膜led用硅酸盐荧光粉及其包膜方法 |
WO2015046004A1 (ja) * | 2013-09-25 | 2015-04-02 | 信越化学工業株式会社 | 赤外蛍光体 |
WO2015072766A1 (ko) * | 2013-11-13 | 2015-05-21 | 엘지이노텍(주) | 청녹색 형광체, 이를 포함하는 발광 소자 패키지 및 조명 장치 |
JP2017082058A (ja) * | 2015-10-26 | 2017-05-18 | 国立大学法人豊橋技術科学大学 | 蛍光体材料およびその製造方法 |
CN107142102A (zh) * | 2017-06-15 | 2017-09-08 | 华南理工大学 | 一种Mn4+掺杂氟化物红色荧光粉材料的表面改性方法 |
EP3576168B1 (en) * | 2018-05-31 | 2023-05-31 | Nichia Corporation | Light emitting device |
JP2021048354A (ja) | 2019-09-20 | 2021-03-25 | 日亜化学工業株式会社 | 発光装置 |
EP4030163A1 (en) * | 2021-01-19 | 2022-07-20 | Atlas Material Testing Technology GmbH | A fluorescent material as a radiation source in an apparatus for artificial weathering |
WO2023102366A1 (en) * | 2021-12-01 | 2023-06-08 | Lumileds Llc | Phosphor layer with improved high-temperature reliability for phosphor converted leds |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005286351A (ja) * | 2005-06-06 | 2005-10-13 | Toshiba Corp | 発光装置の製造方法 |
JP2007161748A (ja) * | 2005-12-09 | 2007-06-28 | Kagawa Univ | 蛍光体微粒子とその製造方法及びそれらを用いた蛍光体被膜 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2753042B2 (ja) * | 1989-05-23 | 1998-05-18 | 株式会社東芝 | 蛍光体およびその処理方法 |
JPH10298544A (ja) * | 1997-04-24 | 1998-11-10 | Toshiba Corp | 電場発光蛍光体およびその製造方法 |
US6576156B1 (en) * | 1999-08-25 | 2003-06-10 | The United States Of America As Represented By The Secretary Of The Navy | Phosphors with nanoscale grain sizes and methods for preparing the same |
DE10036940A1 (de) | 2000-07-28 | 2002-02-07 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Lumineszenz-Konversions-LED |
JP4316127B2 (ja) * | 2000-09-05 | 2009-08-19 | 化成オプトニクス株式会社 | 蛍光体ペースト組成物の製造方法及び真空紫外線励起発光素子 |
JP3954304B2 (ja) * | 2000-12-20 | 2007-08-08 | 株式会社東芝 | 発光装置 |
JP2002188085A (ja) * | 2000-12-20 | 2002-07-05 | Catalysts & Chem Ind Co Ltd | 蛍光体および蛍光体膜形成用塗布液 |
JP4662649B2 (ja) | 2001-04-06 | 2011-03-30 | 北興化学工業株式会社 | 新規なホスフィン化合物 |
JP2005187628A (ja) * | 2003-12-25 | 2005-07-14 | Mitsubishi Chemicals Corp | 顔料付蛍光体及びその製造方法 |
TWI403570B (zh) * | 2005-08-10 | 2013-08-01 | Mitsubishi Chem Corp | 螢光體與其製造方法,含螢光體組成物,發光裝置及其用途 |
US20080173886A1 (en) * | 2006-05-11 | 2008-07-24 | Evident Technologies, Inc. | Solid state lighting devices comprising quantum dots |
JP2008096545A (ja) * | 2006-10-10 | 2008-04-24 | Ricoh Co Ltd | 転写定着装置及び画像形成装置 |
KR100841171B1 (ko) | 2006-10-28 | 2008-06-24 | 삼성전기주식회사 | 형광체의 유동특성 제어방법, 형광체 및 형광체 페이스트 |
WO2008096545A1 (ja) * | 2007-02-09 | 2008-08-14 | Kabushiki Kaisha Toshiba | 白色発光ランプとそれを用いた照明装置 |
JP5330263B2 (ja) | 2007-12-07 | 2013-10-30 | 株式会社東芝 | 蛍光体およびそれを用いたled発光装置 |
KR100898288B1 (ko) | 2008-01-09 | 2009-05-18 | 삼성에스디아이 주식회사 | 백색 형광체, 이를 이용하는 발광 장치, 및 이 발광 장치를백 라이트 유닛으로 사용하는 액정 표시 장치 |
EP2415848A4 (en) | 2009-03-31 | 2013-08-14 | Mitsubishi Chem Corp | PHOSPHORUS, PHOSPHORUS PROCESSING METHOD, PHOSPHORUS COMPOSITION, LIGHT-EMITTING DEVICE, LIGHTING DEVICE AND IMAGE DISPLAY DEVICE |
-
2012
- 2012-03-09 JP JP2013504558A patent/JP5813096B2/ja active Active
- 2012-03-09 WO PCT/JP2012/001653 patent/WO2012124302A1/ja active Application Filing
- 2012-03-09 CN CN201280005892.3A patent/CN103328607B/zh active Active
- 2012-03-09 KR KR1020137017474A patent/KR101528413B1/ko active IP Right Grant
-
2013
- 2013-09-13 US US14/026,635 patent/US9231150B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005286351A (ja) * | 2005-06-06 | 2005-10-13 | Toshiba Corp | 発光装置の製造方法 |
JP2007161748A (ja) * | 2005-12-09 | 2007-06-28 | Kagawa Univ | 蛍光体微粒子とその製造方法及びそれらを用いた蛍光体被膜 |
Also Published As
Publication number | Publication date |
---|---|
KR20130091356A (ko) | 2013-08-16 |
WO2012124302A1 (ja) | 2012-09-20 |
KR101528413B1 (ko) | 2015-06-11 |
US9231150B2 (en) | 2016-01-05 |
JPWO2012124302A1 (ja) | 2014-07-17 |
US20140008690A1 (en) | 2014-01-09 |
CN103328607A (zh) | 2013-09-25 |
JP5813096B2 (ja) | 2015-11-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103328607B (zh) | 发光装置用荧光体、其制造方法及使用了该荧光体的发光装置 | |
JP6625582B2 (ja) | 発光ダイオード用途に使用するための赤色線放出蛍光体 | |
CN101646747B (zh) | 用于led应用的红光荧光体 | |
JP4976857B2 (ja) | 放射線源および蛍光材料を有する照明システム | |
US7857994B2 (en) | Green emitting phosphors and blends thereof | |
CN101878280B (zh) | 荧光体及使用其的发光装置以及荧光体的制造方法 | |
US20060022582A1 (en) | White LEDs with tunable CRI | |
WO2007062137A1 (en) | White lamps with enhanced color contrast | |
CN101180381A (zh) | 用于基于led的照明的红色磷光体 | |
JPWO2009037848A1 (ja) | 照明用白色発光ランプとそれを用いた照明器具 | |
JP2008007644A (ja) | 赤色発光蛍光体及び発光装置 | |
CN101151348A (zh) | 用于具有改善的色彩品质的发光应用的氧氮化物磷光体 | |
WO2012033122A1 (ja) | 青色発光蛍光体及び該青色発光蛍光体を用いた発光装置 | |
CN101443433A (zh) | 包括辐射源和发光材料的照明*** | |
JP4965840B2 (ja) | 白色発光型ledランプの製造方法およびそれを用いたバックライトの製造方法並びに液晶表示装置の製造方法 | |
JP2009081288A (ja) | 照明用白色発光ランプの製造方法 | |
CN102471684A (zh) | 荧光体 | |
CN102399554B (zh) | 氮化物红色发光材料、包括其的发光件以及发光器件 | |
TWI731048B (zh) | 氧溴化物磷光體及其用途 | |
JP5912895B2 (ja) | 蛍光体とその製造方法、及びそれを用いた発光装置 | |
JP4886221B2 (ja) | 発光装置の製造方法 | |
CN102010715B (zh) | 用于暖白光led的荧光粉 | |
JP2005200659A (ja) | 表示装置用蛍光体の製造方法と表示装置の製造方法 | |
WO2014156201A1 (ja) | 蛍光体及びその製造方法並びにそれを用いた発光装置 | |
JP2004269834A (ja) | 赤色発光蛍光体及びこれを用いた発光素子 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210630 Address after: Kanagawa Prefecture, Japan Patentee after: TOSHIBA MATERIALS Co.,Ltd. Address before: Tokyo, Japan Patentee before: Toshiba Corp. Patentee before: TOSHIBA MATERIALS Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220124 Address after: Gyeonggi Do, South Korea Patentee after: Seoul Semiconductor Co.,Ltd. Address before: Kanagawa Patentee before: TOSHIBA MATERIALS Co.,Ltd. |