CN103327753A - Manufacturing method for metal semi-hole circuit board - Google Patents
Manufacturing method for metal semi-hole circuit board Download PDFInfo
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- CN103327753A CN103327753A CN2013101882230A CN201310188223A CN103327753A CN 103327753 A CN103327753 A CN 103327753A CN 2013101882230 A CN2013101882230 A CN 2013101882230A CN 201310188223 A CN201310188223 A CN 201310188223A CN 103327753 A CN103327753 A CN 103327753A
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- half hole
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Abstract
The invention discloses a manufacturing method for a metal semi-hole circuit board. According to the manufacturing method, after an outer layer graph of the circuit board is manufactured, graph electrolytic tinning treatment is carried out, tinning is carried out on the circuit graph and a drill hole needing to be protected, then a semi-hole is milled in the position of the drill hole, burr flashes are formed in the position of the hole opening after the semi-hole is milled, and then the etching treatment is carried out. As the circuit graph and the drill hole are protected by tinning, the burr flashes in the position of the hole opening are not tinned and can be etched off while the whole circuit graph and the drill hole are not influenced. Compared with the prior art, the manufacturing method is simple in process, avoids the problems of unsecured welding legs and cold solder joints occurring when follow-up welding is carried out on the circuit board, effectively solves the problem of production scrap, and lowers the maintenance cost and the scrap cost caused by the problem of the burr flashes.
Description
Technical field:
The invention belongs to the printed wiring board manufacture technology field, what be specifically related to is a kind of manufacture method of metal half hole wiring board.
Background technology:
Make in the industry at wiring board, usually have product that the design of metallized semi-pore is arranged at edges of boards, when this type of design is made according to traditional gong plate technique, have the remaining problem of burr.When the gong metallized semi-pore, because the gong cutter enters in the hole of metallized semi-pore entrance side, the state that copper sheet is in do not stress and support, this side opening wall copper sheet will be with the rotation of gong cutter, and the place forms the burr peak in the aperture.
Along with the development of electronic product, the client requires more and more diversifiedly to the edges of boards metallized semi-pore, and simultaneously the quality of edges of boards metallized semi-pore directly affects client's installation and use.How to control the product quality behind the edges of boards semi-metal hole forming, avoid place, metallized semi-pore aperture the defective of burr peak to occur, be a difficult problem in the mechanical processing process always.And the wiring board that the burr peak appears in metallized semi-pore aperture place is when carrying out follow-up welding, is easy to occur the not firm problem with rosin joint of leg, and serious meeting causes bridge joint short circuit between the pin, causes serious loss.
Summary of the invention:
For this reason, the object of the present invention is to provide a kind of manufacture method of metal half hole wiring board, locate the burr peak to occur because of the metallized semi-pore aperture to solve at present, and the leg that causes wiring board to occur when carrying out follow-up welding is not firm and the problem of rosin joint.
For achieving the above object, the present invention is mainly by the following technical solutions:
A kind of manufacture method of metal half hole wiring board comprises step:
A, circuit base plate is holed;
B, the circuit base plate after the boring is carried out electroless copper plating and electric plating of whole board process;
Then c, making outer graphics carry out graphic plating, and make on described boring and the whole circuit complete zinc-plated;
D, gong half hole is carried out in described boring process;
E, the wiring board behind gong half hole is carried out etching, the zone beyond zinc-plated on the wiring board is all etched away;
F, the etching rear board is moved back tin process;
G, the wiring board that moves back behind the tin is carried out welding resistance, moulding and detection.
Preferably, boring comprises brill via, half through hole, blind via hole and buries through hole to circuit base plate among the step a.
Preferably, can make behind the electroless copper plating among the step b and form the copper layer in the boring, make copper layer and the thickening of plate face copper layer in the boring after processing through electric plating of whole board.
Preferably, among the step c wiring board is carried out graphic plating, zinc-plated on the boring that needs protection and keep, pad and outer graphics circuit.
Preferably, in the steps d: described boring is carried out after gong half hole processes, correspondingly produced the burr peak in orifice edge.
Preferably, the wiring board behind gong half hole is carried out etching, and the burr peak that orifice edge is produced etches away.
The manufacture method of metal half hole wiring board of the present invention; carrying out graphic plating tin after the wiring board outer graphics completes processes; the line pattern and the boring that need protection is upper zinc-plated; then in bore position gong half hole, form the burr peak at the place, aperture behind gong half hole, then carry out etch processes; because line pattern and boring have zinc-plated protection; and that the burr peak at aperture place does not have is zinc-plated, therefore the burr peak at place, aperture can be etched away, and does not affect whole line pattern and boring.Compared with prior art, technique of the present invention is simple, can effectively reduce the manufacturing scrap problem, and the problem of the not firm and rosin joint of the leg of having avoided wiring board to occur when carrying out follow-up welding has reduced repairing and the scrap cost of problem wiring board.
Embodiment:
For setting forth thought of the present invention and purpose, the present invention is described further below in conjunction with specific embodiment.
The present invention is to provide a kind of manufacture method of metal half hole wiring board, it mainly adjusts to the technique in gong metal half hole after the graphic plating, carry out before the etching, thereby efficiently solve the burr peak problem that the aperture occurs behind gong half hole, both guarantee the quality of product, do not increased again the manufacture craft of product.
Wherein the present invention mainly adopts following steps:
A, circuit base plate is holed;
Wherein said boring comprises via, half through hole, blind via hole and buries through hole, and via refers on the multilayer circuit board the between layers hole of conductive interconnection purposes; The conducting function that half through hole then remains with foramen primum is welded and fixed with half hole again; Blind via hole then is to pass to the plate face and the hole of conducting not; Bury through hole and then refer to be positioned at sheet material hole inner and that do not connect with the plate face.
B, the circuit base plate after the boring is carried out electroless copper plating and electric plating of whole board process;
Wherein can make behind the electroless copper plating and form the copper layer in the boring, make copper layer and the thickening of plate face copper layer in the boring after processing through electric plating of whole board.
Then c, making outer graphics carry out graphic plating, and make on described boring and the whole circuit complete zinc-plated;
Wiring board is carried out graphic plating, zinc-plated on the boring that needs protection and keep, pad and outer graphics circuit.
D, gong half hole is carried out in described boring process;
Described boring is carried out after gong half hole processes, correspondingly produced the burr peak in orifice edge.
E, the wiring board behind gong half hole is carried out etching, the zone beyond zinc-plated on the wiring board is all etched away;
Wiring board behind gong half hole is carried out etching, and the burr peak that orifice edge is produced etches away.
F, the etching rear board is moved back tin process;
G, the wiring board that moves back behind the tin is carried out welding resistance, moulding and detection.
The present invention changes gong half orifice flow journey after graphic plating; carry out before the etching; then carrying out graphic plating makes on whole boring, pad and the figure circuit and all forms complete tin coating; carry out again afterwards etching; because tin coating forms protection to boring, pad and figure circuit during etching; and the burr burr is owing to exposing outside tin coating; therefore the burr burr is not protected by tin coating when etching; be easy to etchedly in the etching process, and namely can obtain perfect sunken metal half hole after moving back tin.
More than be that manufacture method to a kind of metal half hole wiring board provided by the present invention is described in detail, used specific case herein structural principle of the present invention and execution mode are set forth, above embodiment just is used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (6)
1. the manufacture method of metal half a hole wiring board is characterized in that comprising step:
A, circuit base plate is holed;
B, the circuit base plate after the boring is carried out electroless copper plating and electric plating of whole board process;
Then c, making outer graphics carry out graphic plating, and make on described boring and the whole circuit complete zinc-plated;
D, gong half hole is carried out in described boring process;
E, the wiring board behind gong half hole is carried out etching, the zone beyond zinc-plated on the wiring board is all etched away;
F, the etching rear board is moved back tin process;
G, the wiring board that moves back behind the tin is carried out welding resistance, moulding and detection.
2. the manufacture method of metal half hole wiring board according to claim 1, it is characterized in that among the step a circuit holed substantially comprises and bores via, half through hole, blind via hole and bury through hole.
3. the manufacture method of metal half hole wiring board according to claim 1 is characterized in that can making behind the electroless copper plating among the step b forming the copper layer in the boring, makes copper layer and the thickening of plate face copper layer in the boring after processing through electric plating of whole board.
4. the manufacture method of metal half hole wiring board according to claim 1 is characterized in that among the step c wiring board being carried out graphic plating, and is zinc-plated on the boring that needs protection and keep, pad and outer graphics circuit.
5. the manufacture method of metal half hole wiring board according to claim 1 is characterized in that in the steps d described boring is carried out after gong half hole processes, and correspondingly produces the burr peak in orifice edge.
6. the manufacture method of metal half hole wiring board according to claim 5 is characterized in that:
Wiring board behind gong half hole is carried out etching, and the burr peak that orifice edge is produced etches away.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310188223.0A CN103327753B (en) | 2013-05-20 | 2013-05-20 | A kind of preparation method of metal half hole wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310188223.0A CN103327753B (en) | 2013-05-20 | 2013-05-20 | A kind of preparation method of metal half hole wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103327753A true CN103327753A (en) | 2013-09-25 |
| CN103327753B CN103327753B (en) | 2016-05-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310188223.0A Expired - Fee Related CN103327753B (en) | 2013-05-20 | 2013-05-20 | A kind of preparation method of metal half hole wiring board |
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| CN (1) | CN103327753B (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104968151A (en) * | 2015-07-03 | 2015-10-07 | 景旺电子科技(龙川)有限公司 | Manufacturing method of carved copper substrate |
| CN106231817A (en) * | 2016-07-27 | 2016-12-14 | 江苏博敏电子有限公司 | A kind of manufacture method of HDI plate |
| CN106304639A (en) * | 2016-08-26 | 2017-01-04 | 广东冠锋科技股份有限公司 | A kind of method that high frequency Teflon circuit board removes edges of boards burr |
| CN107660078A (en) * | 2017-10-30 | 2018-02-02 | 惠州市和信达线路板有限公司 | Printed circuit board edges of boards semi-metal manufacture craft and its drilling equipment |
| CN108112173A (en) * | 2017-12-22 | 2018-06-01 | 姜鹏 | A kind of half-pore plate burr burr improves technological process |
| CN110121239A (en) * | 2019-04-10 | 2019-08-13 | 江门崇达电路技术有限公司 | A kind of production method of mechanical blind hole half bore |
| CN110248475A (en) * | 2019-06-10 | 2019-09-17 | 江门崇达电路技术有限公司 | A method of removal PCB metallized semi-pore burr |
| CN110312380A (en) * | 2019-06-05 | 2019-10-08 | 湖南好易佳电路板有限公司 | A kind of production production method of side metal side multilayer insulation isolation circuit plate |
| CN110602878A (en) * | 2019-08-15 | 2019-12-20 | 鹤山市中富兴业电路有限公司 | Direct forming method for metallized semi-hole |
| CN111698843A (en) * | 2020-05-27 | 2020-09-22 | 西安金百泽电路科技有限公司 | Reworking method for milled slot plate with etched leakage half-edge hole |
| CN114269070A (en) * | 2021-12-03 | 2022-04-01 | 珠海帝和智能电子科技有限公司 | Production process of gold-electroplated PCB with half holes |
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| US20070199735A1 (en) * | 2006-02-24 | 2007-08-30 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board having inner via hole and manufacturing method thereof |
| CN102143660A (en) * | 2010-01-28 | 2011-08-03 | 竞陆电子(昆山)有限公司 | Half-hole machining process for printed circuit board |
| CN102378500A (en) * | 2010-08-11 | 2012-03-14 | 成都航天通信设备有限责任公司 | Method for removing burrs of half-edge hole |
| CN102427667A (en) * | 2011-11-09 | 2012-04-25 | 金悦通电子（翁源）有限公司 | Machining process of half-pore plate |
| CN102438411A (en) * | 2011-09-30 | 2012-05-02 | 景旺电子（深圳）有限公司 | Manufacturing method of metallized semi-hole |
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2013
- 2013-05-20 CN CN201310188223.0A patent/CN103327753B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070199735A1 (en) * | 2006-02-24 | 2007-08-30 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board having inner via hole and manufacturing method thereof |
| CN102143660A (en) * | 2010-01-28 | 2011-08-03 | 竞陆电子(昆山)有限公司 | Half-hole machining process for printed circuit board |
| CN102378500A (en) * | 2010-08-11 | 2012-03-14 | 成都航天通信设备有限责任公司 | Method for removing burrs of half-edge hole |
| CN102438411A (en) * | 2011-09-30 | 2012-05-02 | 景旺电子（深圳）有限公司 | Manufacturing method of metallized semi-hole |
| CN102427667A (en) * | 2011-11-09 | 2012-04-25 | 金悦通电子（翁源）有限公司 | Machining process of half-pore plate |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104968151A (en) * | 2015-07-03 | 2015-10-07 | 景旺电子科技(龙川)有限公司 | Manufacturing method of carved copper substrate |
| CN104968151B (en) * | 2015-07-03 | 2017-12-15 | 景旺电子科技(龙川)有限公司 | A kind of preparation method for carving cup copper base |
| CN106231817A (en) * | 2016-07-27 | 2016-12-14 | 江苏博敏电子有限公司 | A kind of manufacture method of HDI plate |
| CN106304639A (en) * | 2016-08-26 | 2017-01-04 | 广东冠锋科技股份有限公司 | A kind of method that high frequency Teflon circuit board removes edges of boards burr |
| CN106304639B (en) * | 2016-08-26 | 2018-12-07 | 广东冠锋科技股份有限公司 | A kind of method that high frequency Teflon circuit board removes edges of boards burr |
| CN107660078A (en) * | 2017-10-30 | 2018-02-02 | 惠州市和信达线路板有限公司 | Printed circuit board edges of boards semi-metal manufacture craft and its drilling equipment |
| CN107660078B (en) * | 2017-10-30 | 2023-10-31 | 惠州市和信达线路板有限公司 | Semi-metallization manufacturing process for printed circuit board edge and drilling device thereof |
| CN108112173A (en) * | 2017-12-22 | 2018-06-01 | 姜鹏 | A kind of half-pore plate burr burr improves technological process |
| CN110121239B (en) * | 2019-04-10 | 2021-06-04 | 江门崇达电路技术有限公司 | Manufacturing method of mechanical blind hole and half hole |
| CN110121239A (en) * | 2019-04-10 | 2019-08-13 | 江门崇达电路技术有限公司 | A kind of production method of mechanical blind hole half bore |
| CN110312380A (en) * | 2019-06-05 | 2019-10-08 | 湖南好易佳电路板有限公司 | A kind of production production method of side metal side multilayer insulation isolation circuit plate |
| CN110248475A (en) * | 2019-06-10 | 2019-09-17 | 江门崇达电路技术有限公司 | A method of removal PCB metallized semi-pore burr |
| CN110602878A (en) * | 2019-08-15 | 2019-12-20 | 鹤山市中富兴业电路有限公司 | Direct forming method for metallized semi-hole |
| CN111698843A (en) * | 2020-05-27 | 2020-09-22 | 西安金百泽电路科技有限公司 | Reworking method for milled slot plate with etched leakage half-edge hole |
| CN114269070A (en) * | 2021-12-03 | 2022-04-01 | 珠海帝和智能电子科技有限公司 | Production process of gold-electroplated PCB with half holes |
| CN114269070B (en) * | 2021-12-03 | 2023-10-13 | 珠海帝和智能电子科技有限公司 | Production process of electroplated gold PCB with half holes |
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| CN103327753B (en) | 2016-05-04 |
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