CN103325808B - Display unit and manufacture method thereof - Google Patents
Display unit and manufacture method thereof Download PDFInfo
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- CN103325808B CN103325808B CN201210072583.XA CN201210072583A CN103325808B CN 103325808 B CN103325808 B CN 103325808B CN 201210072583 A CN201210072583 A CN 201210072583A CN 103325808 B CN103325808 B CN 103325808B
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- display unit
- led panel
- organic led
- thin film
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The open a kind of display unit of the present invention and manufacture method thereof. Display unit comprises a framework, an organic LED panel, a translucent element and a glue material. Organic LED panel is arranged in framework. Translucent element is arranged on organic LED panel. Glue material is filled between organic LED panel and translucent element, and is filled between organic LED panel and framework.
Description
Technical field
The present invention relates to a kind of display unit and manufacture method thereof, and particularly relate to a kind of organic LED display device and manufacture method thereof.
Background technology
Along with the development of display science and technology, various display unit is constantly weeded out the old and bring forth the new. Wherein Organic Light Emitting Diode has that self-luminosity, volume are little, chroma advantages of higher so that Organic Light Emitting Diode is described as the star of the tomorrow of display science and technology.
In the process of development Organic Light Emitting Diode, researchist finds that there is the destruction that OLED is quite easily subject to moisture or oxygen, and significantly subtracts the life-span damaging Organic Light Emitting Diode. Researchist adopts various design to increase water preventing ability and the oxygen barrier of Organic Light Emitting Diode, but the manufacture craft speed of the Organic Light Emitting Diode that slows down. Therefore, Organic Light Emitting Diode front is just before the bottleneck of a technical development.
Summary of the invention
It is an object of the invention to provide a kind of display unit and manufacture method thereof, it utilizes the design that glue material inserts between organic LED panel and framework so that display unit can reach high water resistance, high oxygen barrier, and the fireballing advantage of manufacture craft.
For reaching above-mentioned purpose, according to an aspect of the present invention, it is proposed to a kind of display unit. Display unit comprises a framework, an organic LED panel, a translucent element and a glue material. Organic LED panel is arranged in framework. Translucent element is arranged on organic LED panel. Glue material is filled between organic LED panel and translucent element, and is filled between organic LED panel and framework.
According to a further aspect in the invention, it is proposed to the manufacture method of a kind of display unit. The manufacture method of display unit comprises the following steps. One organic LED panel is provided. It is coated with a glue material on organic LED panel. Organic LED panel is set in a framework. One translucent element is set on glue material. Pressing translucent element and organic LED panel, so that glue material is filled between organic LED panel and translucent element, and be filled between organic LED panel and framework.
For the foregoing of the present invention can be become apparent, special embodiment below, and coordinate appended accompanying drawing, it is described in detail below:
Accompanying drawing explanation
Fig. 1 is the schematic diagram of display unit of the present invention;
Fig. 2��Fig. 9 is the schema of the manufacture method of display unit of the present invention.
Main element nomenclature
100: display unit
110: framework
120: organic LED panel
120a: upper surface
120b: surface, side
121: thin film transistor base plate
122: photodiode
123: protective layer
124: frame glue
125: colored filter substrate
126: packing material
130: translucent element
140: glue material
D1: highly
D2: sum total thickness
L1, L2: UV-light
Embodiment
Hereinafter proposing various embodiment to be described in detail, it adopts the design that glue material inserts between organic LED panel and framework so that display unit can reach high water resistance, high oxygen barrier, and the fireballing advantage of manufacture craft. But, embodiment only in order to illustrate as example, can't limit the present invention for protection scope. In addition, the accompanying drawing in embodiment omits part element, with the technology feature of clear display the present invention.
Please refer to Fig. 1, it illustrates the schematic diagram of display unit 100. Display unit 100 comprises framework 110, organic LED panel 120, translucent element 130 and a glue material 140. Framework 110 is in order to carry and protects the inner member of display unit 100, such as, be a chase. Organic LED panel 120 is such as active or passive type. Organic LED panel 120 is arranged in framework 110. Translucent element 130 is such as a panel or a blooming piece, wherein above-mentioned panel such as a contact panel or 2D/3D switching panel, above-mentioned blooming piece is a polaroid, a phase delay chip, a lenticular lenses (barrier) or a lens pillar sheet (lenticularlens) such as. Translucent element 130 is arranged on organic LED panel 120, and wherein translucent element 130 can be arranged in framework 110 with organic LED panel 120 simultaneously, it is possible to translucent element 130 is partly or entirely exposed to outside framework 110. Glue material 140 is filled between organic LED panel 120 and translucent element 130, in order to bond organic LED panel 120 and translucent element 130. In addition, glue material 140 is more filled between organic LED panel 120 and framework 110.
Wherein organic LED panel 120 is easily subject to the destruction of moisture or oxygen and subtracts and damage the life-span. The glue material 140 of the present embodiment is not only filled between organic LED panel 120 and translucent element 130 to bind translucent element 130 and organic LED panel 120; more it is filled between organic LED panel 120 and framework 110 so that the upper surface 120a of organic LED panel 120 and surface, side 120b can both be subject to further protection.
Glue material 140 is filled between Organic Light Emitting Diode 120 and framework 110, on the one hand, it has bonded organic LED panel 120 with framework 110 so that organic LED panel 120 can be fixedly arranged in framework 110, avoids causing organic LED panel 120 to move in framework and clash into framework 110 and impaired because display unit 100 is rocked. On the other hand, it covers the encapsulation region, side of organic LED panel 120. Cause the life-span to subtract damage owing to the aqueous vapor in air and oxygen are easily invaded in organic LED panel 120 by the encapsulation region, side of organic LED panel 120, therefore glue material 140 cover the encapsulation region, side of organic LED panel 120 can the intrusion of aqueous vapor and oxygen in more effective blocks air.
In the present embodiment, in order to allow surface, the side 120b of organic LED panel 120 be subject to enough protections, the filling ratio of glue material 140 between organic LED panel 120 and framework 110 is at least greater than 50%, such as, be greater than 70% or be greater than 90%. Planner can design according to the selection of glue material 140 material and considering of manufacture craft speed.
With regard to the manufacture method of display unit 100, please refer to Fig. 2��Fig. 9, it illustrates the schema of the manufacture method of display unit 100. First, as shown in Fig. 2��Fig. 5, it is provided that organic LED panel 120 (being illustrated in Fig. 5). In the step that organic LED panel 120 is provided, first as shown in Figure 2, it is provided that a thin film transistor base plate 121. Thin film transistor base plate 121 is in order to provide one drive circuit.
Then, as shown in Figure 2, several Organic Light Emitting Diodes 122 are set on thin film transistor base plate 121. This little Organic Light Emitting Diode 122 can be white light or colour (being such as red, green, blue). In the present embodiment, this little photodiode 122 is white light. This little Organic Light Emitting Diode 122 can be arrayed, to form the pixel of arranged one by one.
Then, as shown in Figure 2, covering this little Organic Light Emitting Diode 122 with a protective layer 123, destroying to avoid follow-up manufacture craft has photodiode 122.
Then, as shown in Figure 3, one frame glue 124 is set in thin film transistor base plate 121 around. The height D1 of frame glue 124 is greater than the sum total thickness D2 of Organic Light Emitting Diode 122 and protective layer 123.
Then, as shown in Figure 3, under the environment vacuumized, to drip, a packing material 126 is arranged on thin film transistor base plate 121 by manufacture craft (onedropfilling, ODF). Generally speaking, Organic Light Emitting Diode 122 has the uneven situation of height, arranges the situation that protective layer 123 thereon also has height uneven. Packing material 126 can be covered with in the protective layer 123 of height injustice to adopt manufacture craft of dripping to guarantee.
Then, as shown in Figure 4, under the environment vacuumized, a colored filter substrate 125 is set on frame glue 124. In other embodiments, when Organic Light Emitting Diode 122 is colored, it is possible to change in this step and a transparent protection substrate (not illustrating) is set on frame glue 124.
Then; as shown in Figure 5; under the environment vacuumized; along with the combination of colored filter substrate 125 with frame glue 124; packing material 126 spreads on protective layer 123; until packing material 126 is filled between colored filter substrate 125, frame glue 124 and thin film transistor base plate 121 completely, and residue between colored filter substrate 125, frame glue 124 and thin film transistor base plate 121 without any moisture content or oxygen.
, as shown in Figure 5, then with a UV-light L1 (or a thermal source) curing filler material 126 and frame glue 124. So far, namely complete organic LED panel 120. Now, Organic Light Emitting Diode 122 has been subject to protective layer 123 and the complete protection of packing material 126.
In one embodiment, it is possible to frame glue 124 is only set to assemble colored filter substrate 125 and thin film transistor base plate 121, and does not adopt the packing material 126 of manufacture craft of dripping (ODF).
In one embodiment, also optics glued membrane (opticallyclearadhesivefilm can be used, OCAfilm) (do not illustrate) and directly fit on Organic Light Emitting Diode 122, and do not adopt the packing material 126 of manufacture craft of dripping (ODF).
The enforcement mode only arranging frame glue 124 can leave space between colored filter substrate 125 and thin film transistor base plate 121, and makes moisture or oxygen easily infiltrate this space. Further, for guaranteeing water preventing ability and the oxygen barrier of frame glue 124, it is necessary to additionally use laser (not illustrating) to add strong cured one by one to each frame glue, and increase manufacturing cost and the manufacture craft speed that slows down.
Adopt the enforcement mode of optics glued membrane (OCAfilm) still can there is minim gap between the Organic Light Emitting Diode 122 of height injustice, and make moisture or oxygen easily infiltrate this minim gap.
Under comparing, the drip enforcement mode of packing material 126 of manufacture craft (ODF) of employing can avoid moisture or oxygen to residue between colored filter substrate 125, frame glue 124 and thin film transistor base plate 121, to extend the life-span of Organic Light Emitting Diode 122 and to guarantee the optical appearance of Organic Light Emitting Diode 122. Further, adopt the enforcement mode of the packing material 126 of manufacture craft (ODF) of dripping that UV-light L1 (or thermal source) can be used to do to solidify by entire surface so that manufacturing cost is able to cheap and manufacture craft speed is quick.
After providing organic LED panel 120 in above-mentioned various mode, then enter the step of Fig. 6 and Fig. 7.
In Fig. 6 and Fig. 7, glue coating material 140 is on organic LED panel 120. This glue material 140 is such as optical cement fat (OCR). In figure 6, it is possible to first on average be coated with some regions, then by this little glue material 140 brush open and be covered with on organic LED panel 120. In the figure 7, it is possible to glue material 140 is coated with directly doing whole property.
In this step, owing to the upper surface 120a of organic LED panel 120 is quite smooth, therefore glue material 140 can not coated on organic LED panel 120 with gap.
In this step, penetration by water rate (watervaportransmissionrate, WVTR) of glue material 140 is less than (g/m 20 grams/every square metre-every day2-day), to guarantee the high water resistance of glue material 140. Oxygen penetration coefficient (oxygentransmissionrate, OTR) of glue material 140 is less than 1 �� 10-3Milliliter/every square metre-every day (cc/m2-day), to guarantee the high oxygen barrier of glue material 140. The optics penetration coefficient of glue material 140 is greater than 90%, to guarantee the high light transmittance of glue material 140.
Then, as shown in Figure 8, organic LED panel 120 is set in framework 110.
Then, as shown in Figure 8, translucent element 130 is set on glue material 140.
Then, as shown in Figure 8, pressing translucent element 130 and organic LED panel 120, so that glue material 140 is filled between organic LED panel 120 and translucent element 130, and glue material 140 is overflowed and is filled between organic LED panel 120 and framework 110 through capillarity.
In the step of pressing, it is possible to control reducing pressure under the environment bled (being such as 50��1Pa), to help glue material 140 to infiltrate between organic LED panel 120 and framework 110.
, as shown in Figure 9, then glue material 140 is solidified with a UV-light L2 (or a thermal source). So far, namely complete display unit 100.
As mentioned above; Organic Light Emitting Diode 122 is at least subject to the protection of four layers: the first layer is the protection of protective layer 123; the second layer is the protection of packaged material 126; third layer is the protection of glue material 140; 4th layer is the protection of framework 110 so that Organic Light Emitting Diode 122 can avoid the destruction of moisture and oxygen effectively.
In sum, although disclosing the present invention in conjunction with above embodiment, however itself and be not used to limit the present invention. It is familiar with this skill patient in the technical field of the invention, without departing from the spirit and scope of the present invention, can be used for a variety of modifications and variations. Therefore, protection scope of the present invention should with being as the criterion that the claim enclosed defines.
Claims (20)
1. a display unit, comprising:
Framework;
Organic LED panel, is arranged in this framework;
Translucent element, is arranged on this organic LED panel, and is arranged in this framework; And
Glue material, is filled between this organic LED panel and this translucent element and not higher than the sidewall of this framework, and is filled between this organic LED panel and this framework.
2. display unit as claimed in claim 1, wherein penetration by water rate (watervaportransmissionrate, WVTR) of this glue material is less than (g/m 20 grams/every square metre-every day2-day)��
3. display unit as claimed in claim 1, wherein oxygen penetration coefficient (oxygentransmissionrate, OTR) of this glue material is less than 1 �� 10-3Milliliter/every square metre-every day (cc/m2-day)��
4. display unit as claimed in claim 1, wherein the optics penetration coefficient of this glue material is greater than 90%.
5. display unit as claimed in claim 1, wherein this translucent element is a panel.
6. display unit as claimed in claim 1, wherein this translucent element is a blooming piece.
7. display unit as claimed in claim 1, wherein the filling ratio of this glue material between this organic LED panel and this framework is greater than 90%.
8. display unit as claimed in claim 1, wherein this glue material is ultraviolet photocureable material or thermofixation material.
9. display unit as claimed in claim 1, wherein this organic LED panel comprises:
Thin film transistor base plate;
Multiple Organic Light Emitting Diode, is arranged on this thin film transistor base plate, and those Organic Light Emitting Diodes are white light;
Protective layer, covers those Organic Light Emitting Diodes;
Frame glue, is arranged at around this thin film transistor base plate;
Colored filter substrate, is arranged on this frame glue; And
Packing material, is arranged between this colored filter substrate, this frame glue and this thin film transistor base plate.
10. display unit as claimed in claim 1, wherein this organic LED panel comprises:
Thin film transistor base plate;
Multiple Organic Light Emitting Diode, is arranged on this thin film transistor base plate, and those Organic Light Emitting Diodes are colored;
Protective layer, covers those Organic Light Emitting Diodes;
Frame glue, is arranged at around this thin film transistor base plate;
Protection substrate, is arranged on this frame glue; And
Packing material, is arranged between this protection substrate, this frame glue and this thin film transistor base plate.
The manufacture method of 11. 1 kinds of display unit, comprising:
One organic LED panel is provided;
It is coated with a glue material on this organic LED panel;
This organic LED panel is set in a framework;
Arranging a translucent element on this glue material, wherein this translucent element is arranged in this framework; And
This translucent element of pressing and this organic LED panel, so that this glue material is filled between this organic LED panel and this translucent element and not higher than the sidewall of this framework, and be filled between this organic LED panel and this framework.
The manufacture method of 12. display unit as claimed in claim 11, wherein the step of this translucent element of pressing and this organic LED panel be make this glue material be filled between this organic LED panel and this translucent element and part this glue material overflow to be filled between this organic LED panel and this framework between this organic LED panel and this translucent element.
The manufacture method of 13. display unit as claimed in claim 11, wherein in the step of this glue material of coating, penetration by water rate (watervaportransmissionrate, WVTR) of this glue material is less than (g/m 20 grams/every square metre-every day2-day)��
The manufacture method of 14. display unit as claimed in claim 11, wherein in the step of this glue material of coating, oxygen penetration coefficient (oxygentransmissionrate, OTR) of this glue material is less than 1 �� 10-3Milliliter/every square metre-every day (cc/m2-day)��
The manufacture method of 15. display unit as claimed in claim 11, wherein in the step of this glue material of coating, the optics penetration coefficient of this glue material is greater than 90%.
The manufacture method of 16. display unit as claimed in claim 11, wherein in the step providing this translucent element, this translucent element is a panel or a blooming piece.
The manufacture method of 17. display unit as claimed in claim 11, wherein in the step of this translucent element of pressing and this organic LED panel, the filling ratio of this glue material between this organic LED panel and this framework is greater than 90%.
The manufacture method of 18. display unit as claimed in claim 11, also comprises:
This glue material is solidified with a UV-light or a thermal source.
The manufacture method of 19. display unit as claimed in claim 11, wherein provides the step of this OLED panel to comprise:
One thin film transistor base plate is provided;
Arranging multiple Organic Light Emitting Diode on this thin film transistor base plate, those Organic Light Emitting Diodes are white light;
Those Organic Light Emitting Diodes are covered with a protective layer;
One frame glue is set around this thin film transistor base plate;
To drip, a packing material is arranged on this thin film transistor base plate by manufacture craft (onedropfilling, ODF); And
One colored filter substrate is set on this frame glue, so that this packing material is arranged between this colored filter substrate, this frame glue and this thin film transistor base plate.
The manufacture method of 20. display unit as claimed in claim 11, wherein provides the step of this OLED panel to comprise:
One thin film transistor base plate is provided;
Arranging multiple Organic Light Emitting Diode on this thin film transistor base plate, those Organic Light Emitting Diodes are colored;
Those Organic Light Emitting Diodes are covered with a protective layer;
One frame glue is set around this thin film transistor base plate;
To drip, a packing material is arranged on this thin film transistor base plate by manufacture craft (onedropfilling, ODF); And
One protection substrate is set on this frame glue, so that this packing material is arranged between this protection substrate, this frame glue and this thin film transistor base plate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210072583.XA CN103325808B (en) | 2012-03-19 | 2012-03-19 | Display unit and manufacture method thereof |
| CN201610284142.4A CN105845709B (en) | 2012-03-19 | 2012-03-19 | Display device and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210072583.XA CN103325808B (en) | 2012-03-19 | 2012-03-19 | Display unit and manufacture method thereof |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610284142.4A Division CN105845709B (en) | 2012-03-19 | 2012-03-19 | Display device and its manufacturing method |
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| Publication Number | Publication Date |
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| CN103325808A CN103325808A (en) | 2013-09-25 |
| CN103325808B true CN103325808B (en) | 2016-06-08 |
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| CN201610284142.4A Active CN105845709B (en) | 2012-03-19 | 2012-03-19 | Display device and its manufacturing method |
| CN201210072583.XA Active CN103325808B (en) | 2012-03-19 | 2012-03-19 | Display unit and manufacture method thereof |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI505009B (en) * | 2013-09-16 | 2015-10-21 | E Ink Holdings Inc | Manufacturing method for display module |
| CN103730067A (en) * | 2013-11-22 | 2014-04-16 | 上海和辉光电有限公司 | AMOLED module structure and assembly method thereof |
| JP6383548B2 (en) * | 2014-03-10 | 2018-08-29 | 株式会社小糸製作所 | Lamp |
| CN104241332A (en) * | 2014-09-30 | 2014-12-24 | 深圳市华星光电技术有限公司 | White-light OLED (organic light-emitting diode) display and packaging method thereof |
| CN108538763B (en) * | 2018-04-24 | 2020-05-15 | 京东方科技集团股份有限公司 | Heating assembly, packaging device and packaging method |
| CN109860424A (en) * | 2019-02-26 | 2019-06-07 | 固安翌光科技有限公司 | A kind of flexible OLED screen body with outer protection structure |
| CN110048018B (en) * | 2019-04-02 | 2020-06-16 | 深圳市华星光电半导体显示技术有限公司 | Display packaging structure and manufacturing method thereof |
| CN111584745A (en) * | 2020-05-13 | 2020-08-25 | 深圳市华星光电半导体显示技术有限公司 | Display panel and method for manufacturing the same |
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| JP4401657B2 (en) * | 2003-01-10 | 2010-01-20 | 株式会社半導体エネルギー研究所 | Method for manufacturing light emitting device |
| JP4270137B2 (en) * | 2005-02-14 | 2009-05-27 | ソニー株式会社 | Display device |
| CN2864996Y (en) * | 2005-12-07 | 2007-01-31 | 陕西科技大学 | White organic electroluminescent display |
| FR2904508B1 (en) * | 2006-07-28 | 2014-08-22 | Saint Gobain | ENCAPSULATED ELECTROLUMINESCENT DEVICE |
| KR20100110968A (en) * | 2009-04-06 | 2010-10-14 | (주)케이제이 프리테크 | Flexible backlight unit and its manufacturing method |
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| KR101720722B1 (en) * | 2010-04-05 | 2017-04-03 | 삼성디스플레이 주식회사 | Display device |
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| CN1992371A (en) * | 2005-12-30 | 2007-07-04 | 三星Sdi株式会社 | Organic light emiting device and method of manufacturing the same |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN103325808A (en) | 2013-09-25 |
| CN105845709A (en) | 2016-08-10 |
| CN105845709B (en) | 2019-06-04 |
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