CN103313505B - The manufacture method of the conductor track structure on non-conductive loading material - Google Patents
The manufacture method of the conductor track structure on non-conductive loading material Download PDFInfo
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- CN103313505B CN103313505B CN201210064513.XA CN201210064513A CN103313505B CN 103313505 B CN103313505 B CN 103313505B CN 201210064513 A CN201210064513 A CN 201210064513A CN 103313505 B CN103313505 B CN 103313505B
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- conductor track
- track structure
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Abstract
The invention discloses the manufacture method of the conductor track structure on a kind of non-conductive loading material, wherein, conductor track structure is made up of non-conductive loading material chemistry and/or electrical way metallization top layer and the follow-up metal layer applying on top layer, wherein metal surface is divided into some continuous or discrete different blocks by laser emission, and its block comprises conductor track structure and the required part of non-conductor track structure. Conductor track structure and the required part of non-conductor track structure be by selectively protection or active activation of carbonium or negative ion, follow-up under acidity or alkaline etching liquid effect non-conductor track structure part metals layer lose gradually and being connected of non-conductive loading material. The manufacture that conductor track structure is simple and reliable, top layer, conductor rail region metal still keeps being connected with the reliable of non-conductive loading material.
Description
Technical field
The present invention relates to the manufacture method of the conductor track structure on a kind of non-conductive loading material.
Background technology
Germany Patent document DE4210400C1 discloses by the film that is coated to the heavy metallic salt mixture in matrix and has heated the method for carrying out Direct precipitation copper by means of local laser. The method is having following shortcoming aspect thermal activation chemistry: the fineness of the line construction that obtained is limited. In addition, coated film is conducting film, therefore before metallization, needs to expend loaded down with trivial details developing technique. This patent documentation both unexposed also do not describe in detail the non-conductive metal complex of using and irradiate to destroy heavy metal complex with precipitating metal nucleus with ultraviolet laser.
US Patent No. 4574095 discloses a kind of method, and it stands the steam of palladium-complex compound by a matrix and irradiates with structuring by window 249nm excimer laser in vacuum chamber. Owing to carrying out palladium deposition by vapor phase in vacuum chamber, this method cost is very expensive, to such an extent as to is uneconomic at custom circuit plate and the use of circuit carrier field, is not suitable for a large amount of products of producing fast.
A kind of method is disclosed in Chinese patent CN1518850A, wherein nonconducting metallic compound is by highly heat-staple, stable and undissolved inorganic oxide formation in moisture acidity or alkalinous metal electrolyte, these oxides have the simple metal oxide of spinel structure or similar spinelle. Metal oxide is by the required member of rapid shaping. Utilize the loading material surface of electromagnetic radiation conductor track structure region, non conducting metallized compound and the fracture of metal nucleus are separated out thus, metallizing layer on follow-up metal nucleus.
Summary of the invention
The manufacture method that the object of the invention is to provide the conductor track structure on a kind of simple and reliable non-conductive loading material, wherein can adopt modern high temperature plastics, glass, carbon fiber, the even nonconducting metal material of surface passivation.
The present invention relates to the production method of the lametta line structure on non-conductive carrier material; wherein conducting metal or metal mixture are attached on non-conductive loading material; adhesion metal is divided into zones of different with laser; load electron ion protection in the region of metal guide rail; or load electron ion activation at nonmetal guide rail area; promote thus the effect with etching liquid; make the metal disengaging of non-conductor track region and adhering to of non-conductive loading material, and then simple and reliable manufacture conductor rail.
Patent DE4210400C1, in patent US4574095 and patent CN1518850A, in disclosed method, all relate to a non conducting metallized compound, and the material that adds this metallic compound is more special, the more general high temperature plastics costliness of price, increases end article cost. And this non-conductive metallic compound is nonessential material in the present invention, in the present invention, non-conductive loading material can be modern high temperature plastics, for example polyethylene, polystyrene, Merlon, poly-third fine-butadiene-styrene copolymer closes
Thing, polyethylene terephthalic acid (TPA) fat, poly terephthalic acid fourth two fat, polymeric liquid crystal copolymer, poly-thiamines, nylon, copolymerized methanal, polypropylene etc. and various mixing or derivative plastics or be that glass, carbon fiber etc. mix or derivative material are even non-conductive surface-treated metal compound or non-conductive metallic compound own. Non-conductive loading material is by penetrating, and casting is closed the techniques such as shaping and made structural body. The method material is selected more, can be suitable according to cost according to different product, in the principle multiple material such as performance is suitable, select. and reduce manufacturing cost.
Non-conducting material body, by electrolysis or chemistry or splash mode adhesion metal layer, in necessary situation, can increase and be easy to the pre-treating technology that metal level adheres to. Utilize more ripe metal attach process of modern times, adhesive force of metal layer is reliable, and the simple cost of processing procedure is controlled.
In the inventive method, non-conducting material body is divided into zones of different through laser emission by metal surface after by electrolysis or chemistry or splash mode adhesion metal layer, and wherein some continuous or discontinuous regions are the required part of conductor rail. Metal track is peeled off and being connected of non-conducting material body by acidity or akaline liquid etching with exterior domain.
In etching process, pass through to nonmetal guide rail area Metal loading electron ion (positive/negative), at electron ion effect lower metal layer and acidity or akaline liquid generation etching stripping reaction. Can not there is not any reaction with etching solution and retain in metal guide rail regional metal because not loading electron ion.
In the present invention, also comprise and allow another etching solution and loading electron ion (positive/negative) metal guide rail regional metal that electrochemical reaction does not occur, disappear with erosion liquid generation etching stripping reaction and do not load electro-ionic nonmetal guide rail area metal.
The present invention compares in patent DE4210400C1, patent US4574095 and patent CN1518850A the open method of introducing, and has material range of choice wide, without adding additional metal compound, and electromagnetic radiation cycle end, the feature such as cost is low.
Brief description of the drawings
Fig. 1 is embodiment of the present invention plastic body schematic diagram;
Fig. 2 is the schematic diagram that plastic body of the present invention carries out metalized and coating processing;
Fig. 3 is the schematic diagram that laser of the present invention is cut apart metal level;
Fig. 4 is the present invention's etching schematic diagram of switching on;
Fig. 5 is final products schematic diagram of the present invention.
Detailed description of the invention
In order to make the object, technical solutions and advantages of the present invention clearer, describe the present invention below in conjunction with the drawings and specific embodiments.
Shown in please refer to the drawing 1-4, the manufacture method of non-conducting material conductor track structure of the present invention comprises the steps:
(1) in a plastic injection molding machine, select previous materials polyethylene, polystyrene, Merlon, poly-third fine-butadiene-styrene copolymer compound, polyethylene terephthalic acid (TPA) fat, poly terephthalic acid fourth two fat, polymeric liquid crystal copolymer, one in poly-thiamines, nylon, copolymerized methanal, polypropylene etc. and various mixing or derivative plastics, selects Merlon ejection formation plastic body 10 in this embodiment.
(2) above-mentioned plastic body 10 is carried out to metalized, deposition forms a metal film layer 11, wherein above-mentioned metalized is to utilize wherein a kind of processing mode of low temperature sputter or POP, make metal be deposited on above-mentioned plastic body 10, the presedimentary processing of metal is no longer done one by one and is described.
(3) in this step, adopt laser to cut apart metal film layer 11, metal film layer 11 is divided into some discontinuous regions 12,13.
(4) metal film layer of nonmetal guide rail area 11 loading currents are put into etching solution and etching solution generation etching stripping reaction, final plastic body 10 surfaces only retain the metal film layer 11 at place, metal guide rail region.
(5) plastic body 10 is cleaned and do corresponding post processing, complete end article 14.
Conductor track structure on non-conductive loading material of the present invention, comprise non-conductive loading material chemistry and/or electrical way metallization top layer metal surface and the follow-up metal layer applying on top layer, wherein metal surface is divided into different blocks by laser emission mode, and its block comprises conductor track structure and the required part of non-conductor track structure. The metal of conductor track structure and non-conductor track structure region is by carbonium or selectively protection or active activation of negative ion; follow-up under acidity or alkaline etching liquid effect non-conductor track structure part metals top layer lose gradually and being connected of non-conductive loading material, non-conductive loading material has high stability in moisture acidity or alkaline etching liquid. Conductor track structure metal blocks keeps the reliable connection with non-conductive loading material.
By means of laser emission, metal surface is divided into continuous or discrete some regions by this radiation.
Electron ion (positive/negative ion) effect of the granting etching of the different metal regioselectivity after cutting apart, the non-metal surface that needs region of etching.
Electron ion (positive/negative ion) effect of the granting protection of the different metal surface regioselectivity after cutting apart, reserve part forms conductor track structure.
By laser emission or utilize appropriate mask technology that metal surface is divided into continuous or discrete several regions simultaneously.
By digital control lower pilot point laser focusing bundle, metal surface is divided into continuous or discrete several regions.
Non-conductive loading material be can top layer can adhesion metal non-conducting material, can not contain the organic metal chelating compound body that comprises spinelle.
Non-conductive loading material can be thermoplastic, hard plastic material, glass and derivative thereof.
Non-conductive loading material is magnesium after surface treatment or aluminium alloy and taking magnesium or aluminium as other alloy bodies of main component or mixed structure or the interstitital texture of carbon fiber and other the derivative materials taking carbon fiber as main body or aforementioned any materials.
Conductor rail is single circuit structure or some conductor circuit structures that is distributed in zones of different.
Conductor track structure on non-conductive loading material of the present invention, formed by non-conductive loading material chemistry and/or electrical way metal surface and the follow-up metal layer applying on top layer, wherein metal surface is divided into some continuous or discrete different blocks by laser emission, and its block comprises conductor track structure and the required part of non-conductor track structure. Conductor track structure and the required part of non-conductor track structure are by carbonium or selectively protection or active activation of negative ion; follow-up under acidity or alkaline etching liquid effect non-conductor track structure part metals top layer lose gradually and being connected of non-conductive loading material; non-conductive loading material has high stability in moisture acidity or alkaline etching liquid, conductor track structure regional metal top layer and still reliable connection of non-conductive loading material. The present invention is characterised in that to realize metal multizone by a kind of fast and reliable partitioning scheme continuous or discontinuously cut apart and isolate. Feature of the present invention also comprises conductive ion protection or activator metal top layer with selected acidity or alkaline etching liquid generation or chemistry or electrolysis do not occur, and partially metallised top layer finally remains as the required part of metallic conductor rail. The manufacture that conductor track structure is simple and reliable, therefore the metallization of non-conductive loading material is adhered to reliably processing procedure and significant change is occurred.
In sum, these are only preferred embodiment of the present invention, should not limit the scope of the invention with this, i.e. every simple equivalence of doing according to the claims in the present invention book and description of the invention content changes and modifies, and all should still remain within the scope of the patent.
Claims (17)
1. a manufacture method for the conductor track structure on non-conductive loading material, it comprises the steps:
(1) in a plastic injection molding machine, select polyethylene, polystyrene, Merlon, poly-third fine-butadiene-styreneCo-polymer, polyethylene terephthalic acid (TPA) fat, poly terephthalic acid fourth two fat, polymeric liquid crystal copolymer, poly-thiamines, nylon,A kind of ejection formation plastic body in copolymerized methanal, polypropylene and various mixing or derivative plastics;
(2) above-mentioned plastic body is carried out to metalized, deposition forms a metal film layer, wherein above-mentioned metalized profitWith wherein a kind of processing mode of low temperature sputter or POP, make metal be deposited on plastic body;
(3) adopt and have mask or cut apart above-mentioned metal film layer without the laser emission of mask, metal film layer is divided into some non-Continuum;
(4) metal film layer of conductor track structure and non-conductor track structure region is by carbonium or negative ionSelectively protection or active activation, put into etching solution by the metal film layer loading current of non-conductor track structure regionIn disappear with etching solution generation etching stripping reaction, final plastic body surface only retains the required metal of conductor track structureThin layer; And
(5) plastic body is cleaned and done corresponding post processing, complete end article.
2. the manufacture method of the conductor track structure on non-conductive loading material according to claim 1, is characterized in that:Described conductor track structure comprises non-conductive loading material chemistry and/or the metallized metal surface of electrical way and follow-up at goldBelong to the metal layer applying on top layer, described metal surface is divided into different blocks by laser emission mode.
3. the manufacture method of the conductor track structure on non-conductive loading material according to claim 2, is characterized in that:Described metal surface is divided into continuous or discontinuous some regions by laser emission.
4. according to the manufacture method of the conductor track structure on the non-conductive loading material described in claim 2 or 3, its feature existsIn: the electron ion of granting of the different metal regioselectivity after cutting apart is carbonium or negative ion effect etching, etchingThe non-metal surface that needs region.
5. according to the manufacture method of the conductor track structure on the non-conductive loading material described in claim 2 or 3, its feature existsIn: the electron ion of granting of the different metal surface regioselectivity after cutting apart is that carbonium or negative ion effect are protectedProtect, reserve part forms conductor track structure.
6. the manufacture method of the conductor track structure on non-conductive loading material according to claim 2, is characterized in that:Described metal surface is by laser emission and utilize appropriate mask technical point to be slit into continuous or discrete several regions.
7. the manufacture method of the conductor track structure on non-conductive loading material according to claim 2, is characterized in that:Described metal surface is divided into continuous or discrete several regions by digital control lower pilot point laser focusing bundle.
8. the manufacture method of the conductor track structure on non-conductive loading material according to claim 1, is characterized in that:Described non-conductive loading material is the organic metal chelating compound body that does not contain spinelle.
9. the manufacture method of the conductor track structure on non-conductive loading material as claimed in claim 1, is characterized in that: instituteState the non-conducting material that non-conductive loading material is top layer adhesion metal.
10. the manufacture method of the conductor track structure on non-conductive loading material according to claim 1, its feature existsIn: described non-conductive loading material is thermoplastic.
The manufacture method of the conductor track structure on 11. non-conductive loading materials as claimed in claim 1, is characterized in that:Described non-conductive loading material is hard plastic material.
The manufacture method of the conductor track structure on 12. non-conductive loading materials according to claim 1, its feature existsIn: described non-conductive loading material is glass and derivative thereof.
The manufacture method of the conductor track structure on 13. non-conductive loading materials according to claim 1, its feature existsIn: the magnesium after described non-conductive loading material is surface treatment or aluminium alloy and other alloys taking magnesium or aluminium as main component thereofBody.
The manufacture method of the conductor track structure on 14. non-conductive loading materials according to claim 1, its feature existsIn: described non-conductive loading material is carbon fiber and other the derivative materials taking carbon fiber as main body thereof.
The manufacture method of the conductor track structure on 15. non-conductive loading materials according to claim 1, its feature existsIn: composite material or interstitital texture that described non-conductive loading material is any materials in claim 8 ~ 14.
The manufacture method of the conductor track structure on 16. non-conductive loading materials according to claim 1, its feature existsIn: described conductor rail is single circuit structure.
The manufacture method of the conductor track structure on 17. non-conductive loading materials according to claim 1, its feature existsIn: described conductor rail is some conductor circuit structures that are distributed in zones of different.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210064513.XA CN103313505B (en) | 2012-03-13 | 2012-03-13 | The manufacture method of the conductor track structure on non-conductive loading material |
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| CN201210064513.XA CN103313505B (en) | 2012-03-13 | 2012-03-13 | The manufacture method of the conductor track structure on non-conductive loading material |
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| CN103313505B true CN103313505B (en) | 2016-05-25 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4574095A (en) * | 1984-11-19 | 1986-03-04 | International Business Machines Corporation | Selective deposition of copper |
| CN1103233A (en) * | 1993-08-26 | 1995-05-31 | 松下电工株式会社 | Method for manufacturing printed circuit board |
| CN1326435C (en) * | 2001-07-05 | 2007-07-11 | Lpkf激光和电子股份公司 | Conductor track structures and method for production thereof |
| CN202652684U (en) * | 2012-03-13 | 2013-01-02 | 昆山联滔电子有限公司 | Conductor track structure on non-conductive load bearing material |
-
2012
- 2012-03-13 CN CN201210064513.XA patent/CN103313505B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4574095A (en) * | 1984-11-19 | 1986-03-04 | International Business Machines Corporation | Selective deposition of copper |
| CN1103233A (en) * | 1993-08-26 | 1995-05-31 | 松下电工株式会社 | Method for manufacturing printed circuit board |
| CN1326435C (en) * | 2001-07-05 | 2007-07-11 | Lpkf激光和电子股份公司 | Conductor track structures and method for production thereof |
| CN202652684U (en) * | 2012-03-13 | 2013-01-02 | 昆山联滔电子有限公司 | Conductor track structure on non-conductive load bearing material |
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| CN103313505A (en) | 2013-09-18 |
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