CN103313505A - Conductor track structure on non-conductive bearing material and manufacturing method of conductor track structure - Google Patents
Conductor track structure on non-conductive bearing material and manufacturing method of conductor track structure Download PDFInfo
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- CN103313505A CN103313505A CN201210064513XA CN201210064513A CN103313505A CN 103313505 A CN103313505 A CN 103313505A CN 201210064513X A CN201210064513X A CN 201210064513XA CN 201210064513 A CN201210064513 A CN 201210064513A CN 103313505 A CN103313505 A CN 103313505A
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- track structure
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Abstract
The invention discloses a conductor track structure on a non-conductive bearing material and a manufacturing method of the conductor track structure, wherein the conductor track structure is composed of a non-conductive bearing material metal surface layer metalized in a chemical and/or electrical mode and a metallization layer coated subsequently on the surface layer. The metal surface layer is divided into several continuous or discontinuous different blocks through a laser radiation; the blocks comprise parts needed by the conductor track structure and a nonconductor track structure; the parts needed by the conductor track structure and the nonconductor track structure are selectively protected or activity-activated through positively-charged ions or negatively-charged ions; and subsequently, under the effect of an acidic or alkaline etching solution, the metal layer of the nonconductor track structure part gradually loses connection with the non-conductive bearing material. The conductor track structure is manufactured simply and reliably; besides, the surface layer metal of the conductor track area is still in a reliable connection with the non-conductive bearing material.
Description
Technical field
The present invention relates to the production method of the lametta line structure on the non-conductive carrier material.
Background technology
Germany Patent document DE4210400C1 discloses by the film that is coated to the heavy metallic salt mixture on the matrix and has heated the method for coming Direct precipitation copper by means of local laser.The method is having following shortcoming aspect the thermal activation chemistry: namely the fineness of resulting line construction is limited.In addition, coated film is conducting film, therefore needs to expend loaded down with trivial details developing technique before metallization.This patent documentation both unexposed also describe in detail the non-conductive metal complex of using and shine to destroy heavy metal complex with the precipitating metal nucleus with ultraviolet laser.
US Patent No. 4574095 discloses a kind of method, and it stands the steam of palladium-complex compound with a matrix and shines with structuring with the 249nm excimer laser by a window in vacuum chamber.Because carry out palladium deposition by vapor phase in vacuum chamber, this method cost is very expensive, be uneconomic to such an extent as to use in custom circuit plate and circuit carrier field, be not suitable for a large amount of products of producing fast.
A kind of method is disclosed among the Chinese patent CN 1518850A, wherein nonconducting metallic compound is by highly heat-staple, stable and undissolved inorganic oxide consists of in moisture acidity or alkalinous metal electrolyte, and these oxides have the simple metal oxide of spinel structure or similar spinelle.Metal oxide is by the required member of rapid shaping.Utilize the loading material surface of electromagnetic radiation conductor rail region, metallizing layer on the follow-up metal nucleus is separated out in the fracture of non conducting metallized compound and metal nucleus thus.
Summary of the invention
The object of the invention is to provides simple and reliable and the conductor track structure on the non-conductive loading material cheaply at non-conductive circuit carrier, and this structure becomes unnecessary property to non-conductive circuit carrier without the metallic compound that specific (special) requirements and interpolation contain nucleus.The present invention also aims in addition provide the manufacture method of the conductor rail on a kind of simple and reliable non-conductive loading material, wherein can adopt modern high temperature plastics, glass, carbon fiber, even the nonconducting metal material of surface passivation.
The present invention relates to the production method of the lametta line structure on the non-conductive carrier material; wherein conducting metal or metal mixture are attached on the non-conductive loading material; with laser adhesion metal is divided into zones of different; load the electron ion protection in the zone of metal guide rail; or in the activation of nonmetal guide rail area loading electron ion; promote thus and the effect of etching liquid, make adhering to of the disengaging of non-conductor orbital region metal and non-conductive loading material.And then simple and reliable manufacturing conductor rail.
Patent DE4210400C1, all relate to a non conducting metallized compound in the disclosed method among the patent US 4574095 patent CN 1518850A, and the material that adds this metallic compound is more special, and the more general high temperature plastics of price is expensive, increases the end article cost.And this non conducting metallized compound is nonessential material in the present invention, non-conductive loading material can be modern high temperature plastics among the present invention, for example polyethylene, polystyrene, Merlon, poly-third fine-butadiene-styrene copolymer compound, polyethylene terephthalic acid (TPA) fat, poly terephthalic acid fourth two fat, polymeric liquid crystal copolymer, poly-thiamines, nylon, copolymerized methanal, polypropylene etc. reach various mixing or derivative plastics or are that glass, carbon fiber etc. mix or derivative materials, even are that non-conductive surfaces is processed metallic compound or non conducting metallized compound itself.Non-conductive loading material is by penetrating, and the technique making structural body such as shaping are closed in casting.It is more that the method material is selected, can be suitable according to cost according to different product, select in the principle multiple material such as performance is suitable. and reduce manufacturing cost.
The electrically non-conductive material body is by electrolysis or chemistry or splash mode adhesion metal layer, in the necessary situation, can increase and is easy to the pre-treating technology that metal level adheres to.Utilize more ripe metal attach process of modern times, adhesive force of metal layer is reliable, and the simple cost of processing procedure is controlled.
The electrically non-conductive material body is divided into zones of different through laser emission with metal surface after by electrolysis or chemistry or splash mode adhesion metal layer in the inventive method, wherein some continuously or discontinuity zone be the required part of metallic conductor rail.Metal track is peeled off and being connected of electrically non-conductive material body by acidity or akaline liquid etching with exterior domain.
In the etching process by to nonmetal guide rail area Metal loading electron ion (just/negative), at electron ion effect lower metal layer and acidity or akaline liquid generation etching stripping reaction.Any reaction can not occur with etching solution and keeps because loading electron ion in the metal guide rail regional metal.
Also comprise among the present invention allowing another etching solution and loading electron ion (just/negative) metal guide rail regional metal electrochemical reaction does not occur, do not disappear with erosion liquid generation etching stripping reaction and load electro-ionic nonmetal guide rail area metal.
The characteristics such as the present invention compares the open method of introducing among patent DE4210400C1, the patent US 4574095 patent CN 1518850A, has the material range of choice wide, need not to add the additional metal compound, and the electromagnetic radiation cycle holds, and cost is low.
Description of drawings
Fig. 1 is embodiment of the invention plastic body schematic diagram;
Fig. 2 is the schematic diagram that plastic body of the present invention carries out metalized and coating processing;
Fig. 3 is the schematic diagram that laser of the present invention is cut apart metal level;
Fig. 4 is the present invention's etching schematic diagram of switching on.
Embodiment
In order to make the purpose, technical solutions and advantages of the present invention clearer, describe the present invention below in conjunction with the drawings and specific embodiments.
Shown in please refer to the drawing 1-4, the manufacture method of non-conducting material conductor track structure of the present invention comprises the steps:
(1) in a plastic injection molding machine, select previous materials polyethylene, polystyrene, Merlon, poly-third fine-butadiene-styrene copolymer compound, polyethylene terephthalic acid (TPA) fat, poly terephthalic acid fourth two fat, polymeric liquid crystal copolymer, a kind of in poly-thiamines, nylon, copolymerized methanal, polypropylene etc. and various mixing or the derivative plastics selects Merlon ejection formation plastic body 10 among this embodiment.
(2) above-mentioned plastic body is carried out metalized, deposition forms a metal film layer 11, wherein above-mentioned metalized is to utilize wherein a kind of processing mode of low temperature sputter or POP, makes metal deposition in above-mentioned plastic body 10, and the metal deposition pre-treatment is no longer done one by one and described.
(3) adopt laser to cut apart metal level in this step, the metal film layer 11 that front processing procedure is deposited is divided into some discontinuous regional 12,13.
(4) nonmetal guide rail area metal (being discontinuous regional 13) loading current is put into etching solution and reacted with etching solution, final plastic material surface only keeps metal guide rail zone 12.
(5) only keep the plastic body cleaning in metal guide rail zone 12 and do corresponding reprocessing final, finish end article 14.
Conductor track structure on the non-conductive loading material of the present invention, comprise non-conductive loading material chemistry and/or electrical way metallization top layer and the follow-up metal layer that applies on the top layer, wherein metal surface is divided into different blocks by the laser emission mode, and its block comprises conductor track structure and the required part of non-conductor track structure.Conductor track structure and the required part of non-conductor track structure are by carbonium or selectively protection or active activation of negative ion; follow-up under acidity or alkaline etching liquid effect non-conductor track structure part metals layer lose gradually and being connected of non-conductive loading material, non-conductive loading material has high stability in moisture acidity or alkaline etching liquid.The conductor track structure metal blocks keeps the reliable connection with non-conductive loading material.
By means of laser emission, this radiation is divided into continuous or discontinuous some zones with metal surface.
Different metal regioselectivity after cutting apart grant electron ion (just/anion) effect etching, the non-metallization top layer that needs the zone of etching.
Different metallization rim surface zona field selectivity after cutting apart grant electron ion (just/anion) effect protection, reserve part consists of the metal guide rail structure.
By laser emission or utilize simultaneously the appropriate mask technology that metal is divided into continuous or discrete several zones.
By digital control lower pilot point laser focusing bundle metal surface is divided into continuous or discrete several zones.
But but non-conductive loading material is the electrically non-conductive material of top layer adhesion metal, can not contain the organic metal chelating compound body that comprises spinelle.
Non-conductive loading material can be thermoplastic, hard plastic material, glass and derivative thereof.
Non-conductive loading material is magnesium after the surface treatment or aluminium alloy and take magnesium or aluminium as other alloy bodies of main component or mixed structure or the interstitital texture of carbon fiber and other the derivative materials take carbon fiber as main body or aforementioned any materials.
Conductor rail is single circuit structure or some conductor circuit structures that is distributed in zones of different.
Conductor track structure on the non-conductive loading material of the present invention, consisted of by non-conductive loading material chemistry and/or electrical way metallization top layer and the follow-up metal layer that applies on the top layer, wherein metal surface is divided into some continuous or discrete different blocks by laser emission, and its block comprises conductor track structure and the required part of non-conductor track structure.Conductor track structure and the required part of non-conductor track structure are by carbonium or selectively protection or active activation of negative ion; follow-up under acidity or alkaline etching liquid effect non-conductor track structure part metals layer lose gradually and being connected of non-conductive loading material; non-conductive loading material has high stability in moisture acidity or alkaline etching liquid, and conductor track structure regional metal top layer and non-conductive loading material be reliable connection still.The present invention is characterised in that the partitioning scheme by a kind of fast and reliable realizes that the metal multizone is continuous or discontinuously cut apart and isolate.Feature of the present invention also comprises conductive ion protection or activator metal layer with selected acidity or alkaline etching liquid generation or chemistry or electrolysis do not occur, and partially metallised top layer finally remains as the required part of metallic conductor structure.Therefore the manufacturing that conductor track structure is simple and reliable, the metallization of non-conductive loading material are adhered to reliably processing procedure and significant change are occured.
In sum, it below only is preferred embodiment of the present invention, should not limit the scope of the invention with this, i.e. every simple equivalence of doing according to claims of the present invention and description of the invention content changes and modifies, and all should still belong in the scope that patent of the present invention contains.
Claims (17)
1. the conductor track structure on the non-conductive loading material; comprise non-conductive loading material chemistry and/or the metallized metal surface of electrical way and the follow-up metal layer that applies at metal surface; wherein metal surface is divided into different blocks by the laser emission mode; its block comprises conductor track structure and the required part of non-conductor track structure; conductor track structure and the required part of non-conductor track structure are by carbonium or selectively protection or active activation of negative ion; non-conductor track structure part metals layer loses and being connected of non-conductive loading material gradually under acidity or alkaline etching liquid effect, and the conductor track structure metal blocks still keeps being connected with the reliable of non-conductive loading material.
2. conductor track structure as claimed in claim 1 is characterized in that, metal surface is divided into continuous or discontinuous some zones by laser emission.
3. conductor track structure as claimed in claim 1 or 2 is characterized in that, the electron ion of granting of the different metal regioselectivity after cutting apart is electron ion plus or minus electron ion effect etching, the non-metallization top layer that needs the zone of etching.
4. conductor track structure as claimed in claim 1 or 2 is characterized in that, the electron ion of granting of the different metallization rim surface zona field selectivity after cutting apart is electron ion plus or minus electron ion effect protection, and reserve part consists of the metal guide rail structure.
5. conductor track structure as claimed in claim 1 is characterized in that, metal surface is by laser emission and utilize the appropriate mask technical point to be slit into continuous or discrete several zones.
6. conductor track structure as claimed in claim 1 is characterized in that, metal surface is divided into continuous or discrete several zones by digital control lower pilot point laser focusing bundle.
7. conductor track structure as claimed in claim 1 is characterized in that, non-conductive loading material is not for can containing the organic metal chelating compound body of spinelle.
8. conductor track structure as claimed in claim 1 is characterized in that, but non-conductive loading material is the electrically non-conductive material of top layer adhesion metal.
9. conductor track structure as claimed in claim 1 is characterized in that, non-conductive loading material is thermoplastic.
10. conductor track structure as claimed in claim 1 is characterized in that, non-conductive loading material is the hard plastic material.
11. conductor track structure as claimed in claim 1 is characterized in that, non-conductive loading material is glass and derivative thereof.
12. institute's conductor track structure is characterized in that as claimed in claim 1, non-conductive loading material is magnesium after the surface treatment or aluminium alloy and other alloy bodies take magnesium or aluminium as main component thereof.
13. the one or more institute conductor track structure as in claim 1 and its follow-up claim is characterized in that non-conductive loading material is carbon fiber and other the derivative materials take carbon fiber as main body thereof.
14. conductor track structure as claimed in claim 1 is characterized in that, non-conductive loading material is composite material or the interstitital texture of any materials in the claim 7 ~ 13.
15. conductor track structure as claimed in claim 1 is characterized in that, conductor rail is the single circuit structure.
16. conductor track structure as claimed in claim 1 is characterized in that, conductor rail is some conductor circuit structures that are distributed in zones of different.
17. the manufacture method of the conductor track structure on the non-conductive loading material comprises the steps:
(1) in a plastic injection molding machine, select polyethylene, polystyrene, Merlon, poly-third fine-butadiene-styrene copolymer compound, polyethylene terephthalic acid (TPA) fat, poly terephthalic acid fourth two fat, polymeric liquid crystal copolymer, a kind of ejection formation plastic body in poly-thiamines, nylon, copolymerized methanal, polypropylene etc. and various mixing or the derivative plastics;
(2) above-mentioned plastic body is carried out metalized, deposition forms a metal film layer, and wherein above-mentioned metalized is utilized wherein a kind of processing mode of low temperature sputter or POP, makes metal deposition in plastic body;
(3) employing has mask or cuts apart metal level without the laser emission of mask, and the metal film layer that front processing procedure is deposited is divided into some discontinuous zones;
(4) nonmetal guide rail area metal (being discontinuous zone) is loaded or not loading current put into etching solution and react with etching solution, final plastic material surface only keeps the metal guide rail zone;
(5) only keep the plastic body cleaning in metal guide rail zone and do corresponding reprocessing final, finish end article.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210064513.XA CN103313505B (en) | 2012-03-13 | 2012-03-13 | The manufacture method of the conductor track structure on non-conductive loading material |
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| CN201210064513.XA CN103313505B (en) | 2012-03-13 | 2012-03-13 | The manufacture method of the conductor track structure on non-conductive loading material |
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| CN103313505A true CN103313505A (en) | 2013-09-18 |
| CN103313505B CN103313505B (en) | 2016-05-25 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4574095A (en) * | 1984-11-19 | 1986-03-04 | International Business Machines Corporation | Selective deposition of copper |
| CN1103233A (en) * | 1993-08-26 | 1995-05-31 | 松下电工株式会社 | Method for manufacturing printed circuit board |
| CN1326435C (en) * | 2001-07-05 | 2007-07-11 | Lpkf激光和电子股份公司 | Conductor track structures and method for production thereof |
| CN202652684U (en) * | 2012-03-13 | 2013-01-02 | 昆山联滔电子有限公司 | Conductor track structure on non-conductive load bearing material |
-
2012
- 2012-03-13 CN CN201210064513.XA patent/CN103313505B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4574095A (en) * | 1984-11-19 | 1986-03-04 | International Business Machines Corporation | Selective deposition of copper |
| CN1103233A (en) * | 1993-08-26 | 1995-05-31 | 松下电工株式会社 | Method for manufacturing printed circuit board |
| CN1326435C (en) * | 2001-07-05 | 2007-07-11 | Lpkf激光和电子股份公司 | Conductor track structures and method for production thereof |
| CN202652684U (en) * | 2012-03-13 | 2013-01-02 | 昆山联滔电子有限公司 | Conductor track structure on non-conductive load bearing material |
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| CN103313505B (en) | 2016-05-25 |
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