CN103311195A - Heat radiation structure - Google Patents
Heat radiation structure Download PDFInfo
- Publication number
- CN103311195A CN103311195A CN2012100689570A CN201210068957A CN103311195A CN 103311195 A CN103311195 A CN 103311195A CN 2012100689570 A CN2012100689570 A CN 2012100689570A CN 201210068957 A CN201210068957 A CN 201210068957A CN 103311195 A CN103311195 A CN 103311195A
- Authority
- CN
- China
- Prior art keywords
- material layer
- interface material
- heater members
- thermal interface
- radiator structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention discloses a heat radiation structure, which comprises a heating device, a heat radiation fin and a heat interface material layer, wherein the heat radiation fin is arranged on the heating device, and the heat interface material layer is arranged between the heating device and the heat radiation fin. The heat radiation structure is characterized in that the heat interface material layer is obtained through dispersing carbon nanometer tubes or carbon nanometer capsules into latex polymer substrates.
Description
Technical field
The present invention relates to a kind of radiator structure, particularly a kind of radiator structure that has the thermal interface material layer of high thermal conductivity and structure function concurrently and use this thermal interface material (thermal interface material, TIM) layer.
Background technology
Along with the micro of semiconductor integrated device, the heat dissipation problem that affects semiconductor integrated device operation usefulness also comes into one's own gradually.Traditional radiator structure is at heater members one radiating fin to be set, and is provided with a thermal interface material layer between heater members and radiating fin.
Above-mentioned thermal interfacial material series of strata are scattered in pottery or the metal oxide powder of high thermal conductivity coefficient in the polymeric matrix, when temperature raises, the thermal interface material layer is by the solid-state semisolid of softening into, and the out-of-flatness surface between heater members and the radiating fin filled up, the heat that heater members is produced can be conducted by efficient.
Yet, above-mentionedly being scattered in polymeric matrix as main thermal interface material layer take pottery or metal oxide powder, its heat-conductive characteristic is still not enough.Therefore, still need to have concurrently at present the thermal interface material of high thermal conductivity and structure function, to solve semi-conductor industry for the demand of heat radiation.
Summary of the invention
The invention provides a kind of radiator structure that has the thermal interface material layer of high thermal conductivity and structure function concurrently and use this thermal interface material layer.
The invention provides a kind of radiator structure, comprise a heater members; One radiating fin is arranged on this heater members; And a thermal interface material layer, be arranged between this heater members and this radiating fin, it is characterized in that: these thermal interfacial material series of strata are with carbon nanotube or how a rice carbon ball is scattered in the emulsion polymer matrix.Since carbon nanotube or how the rice molecular structure of carbon ball own have good chemical affinity and associativity with emulsion polymer, therefore when both mix, easily be combined into one, reunite and the problem of disperseing inequality and do not have.
For the above-mentioned purpose of the present invention, feature and advantage can be become apparent, better embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.Yet following better embodiment and graphic only for reference and explanation usefulness are not to the present invention's limitr in addition.
Description of drawings
The radiator structure schematic diagram of Fig. 1 for illustrating according to most preferred embodiment of the present invention.
Wherein, description of reference numerals is as follows:
1 radiator structure, 10 heater members
12 thermal interface material layer 12a carbon nanotube or rice carbon ball how
12b emulsion polymer matrix 14 radiating elements
100 printed substrates
Embodiment
The invention provides a kind of radiator structure that has the thermal interface material layer of high thermal conductivity and structure function concurrently and use this thermal interface material layer.Fig. 1 illustration one embodiment of the present invention, wherein, radiator structure 1 can comprise a heater members 10, for example, semiconductor integrated device, be arranged on the printed substrate (printed circuit board) 100, one radiating element 14, radiating fin for example, be arranged on the heater members 10, and a thermal interface material layer 12, be arranged between heater members 10 and the radiating element 14, it is characterized in that: thermal interface material layer 12 is with carbon nanotube or how rice carbon ball 12a is scattered in emulsion polymer (letax polymer) matrix 12b, has excellent heat conductivity and toughness.
Since carbon nanotube or how molecular structure and the emulsion polymer of rice carbon ball 12a itself have good chemical affinity and associativity, therefore when both mix, easily be combined into one, and do not have the problem of reuniting with the dispersion inequality.According to the preferred embodiment of the present invention, thermal interface material layer 12 is solid-state in room temperature, can utilize to paste or mode of printing is formed on heater members 10 surfaces.Carbon nanotube or how a rice carbon ball be commercial desirable material, usually be applied to conductive film and field of display.In addition, also can be with carbon nanotube or how a rice carbon ball is mixed participates in PUR, thermoplastic macromolecule material or paraffin series (paraffin wax) macromolecular material.
Thermal interface material layer 12 directly contacts with heater members 10 surfaces, and directly contacts with radiating element 14 surfaces.When the temperature of heater members 10 raises, thermal interface material layer 12 is softening and be the semisolid of tool flowability, because carbon nanotube the or how size of rice carbon ball 12a is small, can fill up out-of-flatness place or the micropore hole on heater members 10 and radiating element 14 surfaces, reduce and hinder heat conducting air gap, therefore thermal interface material layer 12 can provide effective heat dissipation path, and promotes heat conduction efficiency.This kind radiator structure is particularly suitable for being used in three-dimensional storehouse encapsulation (3D stacked package) high power capacity memory modules.The above is the preferred embodiments of the present invention only, is not limited to the present invention, and for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any modification of doing, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.Within the spirit and principles in the present invention all, any modification of doing, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (6)
1. a radiator structure is characterized in that, comprises:
One heater members;
One radiating fin is arranged on this heater members; And
One thermal interface material layer is arranged between this heater members and this radiating fin, and this thermal interface material layer comprises an emulsion polymer matrix and is scattered in carbon nanotube or rice carbon ball how in this emulsion polymer matrix.
2. radiator structure according to claim 1, it is characterized in that: this heater members is arranged on the printed substrate.
3. radiator structure according to claim 1, it is characterized in that: this heater members comprises the semiconductor integrated device.
4. radiator structure according to claim 3 is characterized in that: this semiconductor integrated device comprises a three-dimensional storehouse encapsulation high power capacity memory modules.
5. radiator structure according to claim 1 is characterized in that: this thermal interface material layer directly contacts with the surface of this heater members.
6. radiator structure according to claim 1 is characterized in that: this thermal interface material layer directly contacts with the surface of this radiating fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100689570A CN103311195A (en) | 2012-03-15 | 2012-03-15 | Heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100689570A CN103311195A (en) | 2012-03-15 | 2012-03-15 | Heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103311195A true CN103311195A (en) | 2013-09-18 |
Family
ID=49136253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100689570A Pending CN103311195A (en) | 2012-03-15 | 2012-03-15 | Heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103311195A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1517426A (en) * | 2003-01-18 | 2004-08-04 | 鸿富锦精密工业（深圳）有限公司 | Thermal interface material |
| CN1703776A (en) * | 2002-10-11 | 2005-11-30 | 宋简民 | Carbonaceous composite heat spreader and associated methods |
| CN1834190A (en) * | 2005-03-19 | 2006-09-20 | 清华大学 | Thermal dielectric surface material and prepn. process |
| CN101095219A (en) * | 2004-11-04 | 2007-12-26 | 皇家飞利浦电子股份有限公司 | Carbon nanotube-based filler for integrated circuits |
-
2012
- 2012-03-15 CN CN2012100689570A patent/CN103311195A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1703776A (en) * | 2002-10-11 | 2005-11-30 | 宋简民 | Carbonaceous composite heat spreader and associated methods |
| CN1517426A (en) * | 2003-01-18 | 2004-08-04 | 鸿富锦精密工业（深圳）有限公司 | Thermal interface material |
| CN101095219A (en) * | 2004-11-04 | 2007-12-26 | 皇家飞利浦电子股份有限公司 | Carbon nanotube-based filler for integrated circuits |
| CN1834190A (en) * | 2005-03-19 | 2006-09-20 | 清华大学 | Thermal dielectric surface material and prepn. process |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Bahru et al. | A review of thermal interface material fabrication method toward enhancing heat dissipation | |
| JP6440715B2 (en) | Metal encapsulant with excellent heat dissipation, manufacturing method thereof, and flexible electronic element encapsulated with metal encapsulant | |
| CN105531837B (en) | Thermal conductivity adhesive sheet, its manufacturing method and the electronic device using the thermal conductivity adhesive sheet | |
| CN105482435B (en) | Three-dimensional drape shape graphene radiating slurry, its preparation method and application | |
| US10736237B2 (en) | Heat sink, preparation method therefor, and communications device | |
| CN205194687U (en) | A heat conduction silica gel sheet for cell -phone | |
| TW201237084A (en) | Electrically insulating and thermally conductive composition and electronic device | |
| US10945331B2 (en) | Mobile display device | |
| JP2008519455A (en) | Integrated circuit chip device | |
| CN103772992A (en) | Thermal conductive composite material and preparation method thereof | |
| Ge et al. | Low Melting-Point Alloy–Boron Nitride Nanosheet Composites for Thermal Management | |
| CN107396592A (en) | Terminal device and its radiator structure | |
| CN107325377B (en) | High-efficient graphite alkene nano modification heat sink material and preparation method thereof | |
| CN1982404A (en) | Thermal-interface material and its production | |
| CN104994682B (en) | A kind of PCB with heat dissipation performance and apply its mobile terminal | |
| CN103378022B (en) | Fin and manufacture method thereof | |
| CN105990274B (en) | A kind of heat conducting film and preparation method thereof | |
| JP4749631B2 (en) | Heat dissipation member | |
| WO2014166238A1 (en) | Mobile terminal and heat dissipation method of liquid metal of same | |
| CN103311195A (en) | Heat radiation structure | |
| JP2021038366A (en) | Thermally conductive silicone composition and thermally conductive silicone material | |
| US20220240418A1 (en) | Thermal conductive structure and electronic device | |
| CN101338181A (en) | Thermal interfacial material doped by diamond granules and method for preparing same | |
| CN106808767A (en) | Moistureproof Graphene composite radiating film | |
| CN108353516A (en) | The radiator and communication terminal of a kind of heat conduction bonding agent, communication terminal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130918 |