CN103296153B - Led芯片封装方法 - Google Patents
Led芯片封装方法 Download PDFInfo
- Publication number
- CN103296153B CN103296153B CN201210170642.7A CN201210170642A CN103296153B CN 103296153 B CN103296153 B CN 103296153B CN 201210170642 A CN201210170642 A CN 201210170642A CN 103296153 B CN103296153 B CN 103296153B
- Authority
- CN
- China
- Prior art keywords
- led chip
- pole
- circuit board
- board substrate
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000012856 packing Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 239000003292 glue Substances 0.000 claims abstract description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 10
- 238000003466 welding Methods 0.000 claims abstract description 8
- 230000005496 eutectics Effects 0.000 claims abstract description 4
- 239000000853 adhesive Substances 0.000 claims abstract description 3
- 230000001070 adhesive effect Effects 0.000 claims abstract description 3
- 230000004888 barrier function Effects 0.000 claims description 17
- 238000000465 moulding Methods 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
Landscapes
- Led Device Packages (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210170642.7A CN103296153B (zh) | 2012-05-28 | 2012-05-28 | Led芯片封装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210170642.7A CN103296153B (zh) | 2012-05-28 | 2012-05-28 | Led芯片封装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103296153A CN103296153A (zh) | 2013-09-11 |
CN103296153B true CN103296153B (zh) | 2016-06-22 |
Family
ID=49096738
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210170642.7A Expired - Fee Related CN103296153B (zh) | 2012-05-28 | 2012-05-28 | Led芯片封装方法 |
Country Status (1)
Country | Link |
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CN (1) | CN103296153B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105355729B (zh) * | 2015-12-02 | 2018-06-22 | 佛山市国星半导体技术有限公司 | Led芯片及其制作方法 |
CN105830944B (zh) * | 2016-05-27 | 2022-10-04 | 上海睿通机器人自动化股份有限公司 | 一种圆形耳标自动组装机 |
CN110289234B (zh) * | 2019-07-04 | 2021-08-17 | 京东方科技集团股份有限公司 | 用于发光单元的巨量转移方法,阵列基板以及显示装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6303873B1 (en) * | 1995-10-31 | 2001-10-16 | Ibiden Co., Ltd. | Electronic part module and process for manufacturing the same |
CN1574261A (zh) * | 2003-05-27 | 2005-02-02 | 精工爱普生株式会社 | 电子部件的安装方法、电子部件的安装结构、电子部件模块和电子设备 |
CN101840972A (zh) * | 2009-03-19 | 2010-09-22 | 先进开发光电股份有限公司 | 倒装芯片式半导体光电元件的结构及其制造方法 |
-
2012
- 2012-05-28 CN CN201210170642.7A patent/CN103296153B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6303873B1 (en) * | 1995-10-31 | 2001-10-16 | Ibiden Co., Ltd. | Electronic part module and process for manufacturing the same |
CN1574261A (zh) * | 2003-05-27 | 2005-02-02 | 精工爱普生株式会社 | 电子部件的安装方法、电子部件的安装结构、电子部件模块和电子设备 |
CN101840972A (zh) * | 2009-03-19 | 2010-09-22 | 先进开发光电股份有限公司 | 倒装芯片式半导体光电元件的结构及其制造方法 |
Also Published As
Publication number | Publication date |
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CN103296153A (zh) | 2013-09-11 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160705 Address after: 214200 the south side of Wen Zhuang Road, Yixing Economic Development Zone, Jiangsu, Wuxi Patentee after: Fu Huagui Patentee after: EZ Robot Corp. Address before: 214200 the south side of Wen Zhuang Road, Yixing Economic Development Zone, Jiangsu, Wuxi Patentee before: Fu Huagui |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170726 Address after: Songjiang District Wen Xiang Road 201600 Shanghai City No. 218 B area 1 floor room 119 Patentee after: Shanghai EZ Robot Automation Co., Ltd. Address before: 214200 the south side of Wen Zhuang Road, Yixing Economic Development Zone, Jiangsu, Wuxi Co-patentee before: Shanghai EZ Robot Automation Co., Ltd. Patentee before: Fu Huagui |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160622 Termination date: 20200528 |