CN103289588A - Adhesive sheet - Google Patents
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- CN103289588A CN103289588A CN2013100661391A CN201310066139A CN103289588A CN 103289588 A CN103289588 A CN 103289588A CN 2013100661391 A CN2013100661391 A CN 2013100661391A CN 201310066139 A CN201310066139 A CN 201310066139A CN 103289588 A CN103289588 A CN 103289588A
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Abstract
The invention provides an adhesive sheet capable of keeping sufficient adhesive force and excellent processing properties such as paper through property and the like after an isolation film is peeled off. The adhesive sheet is provided with a matrix layer and an adhesive layer. A ball number of the adhesive layer in a roll adhesive test is smaller than 2; and an adhesive force to a silicone mirror wafer is higher than 0.3 N/20mm. By using the adhesive sheet, the adhesive sheet taking account of the sufficient adhesive force as the adhesive sheet and the processing properties such as the paper through property and the like after an isolation film is peeled off can be obtained.
Description
Technical field
The present invention relates to adhesive sheet.
Background technology
Semiconductor crystal wafer is made with the major diameter state, the grinding back side after the surface forms pattern, and the thickness of wafer is usually by about wear down to 100 ~ 600 μ m thus.Then, further cutting and separating (dicing) is the element small pieces, and is transferred to installation procedure.In the operation (back side grinding process) of grinded semiconductor wafer rear, use adhesive sheet for the pattern plane of protecting semiconductor crystal wafer.The adhesive sheet that is used for wafer processing requires can to keep wafer when technologies such as grinding wafer, cutting, prevent the bounding force of degree such as wafer breakage.As such adhesive sheet, the adhesive sheet (for example patent documentation 1) that a kind of base material that comprises polyethylene-based resin is provided with the binder layer that has been coated with acrylic adhesive has for example been proposed.
In the processing of semiconductor crystal wafer, use the band adhering device to carry out the attaching of self adhesive tape in order to boost productivity.In the band adhering device, the adhesive sheet of supplying with part output from band is stripped from barrier film, is attached at crystal column surface by attaching roller.Then, the adhesive sheet that will attach with cutting knife is cut into the wafer shape.To be cut into unwanted reeling to the band recoverer after the wafer shape, and from the new band of band supply unit output.Adhesive sheet is imported into the band adhering device before use.At this moment, the adhesive sheet that needs to have peeled off barrier film is by narrow roller gap, and logical paper is to being with recoverer.Yet, satisfy the so high adhesive sheet of bounding force of requirement that adds man-hour and be attached to roller easily and be difficult to logical paper.In addition, the high adhesive sheet of bounding force also can be attached to desk etc. sometimes and becomes and be difficult to recovery when batching the unwanted band in cutting back.Like this, for the high adhesive sheet of bounding force, the productivity of wafer reduces sometimes.
On the other hand, under the situation that the bounding force of adhesive sheet reduces, wafer adds to become in each technology in man-hour and is difficult to fully keep wafer.Therefore, for example under the situation about using as the boundary belt of wafer in the grinding process overleaf, sometimes the adhesive sheet that bounding force is low in grinding the grinding water intrusion, wafer breakage takes place.Like this, be difficult to take into account as the all-purpose bounding force of adhesive sheet and logical paper etc. and peel off processing behind the barrier film.
The prior art document
Patent documentation
Patent documentation 1: the international brochure that discloses No. 2007/116856
Summary of the invention
The problem that invention will solve
The present invention makes in order to solve above-mentioned existing issue, and its purpose is to provide a kind of adhesive sheet of having taken into account the processing (low viscosity) after sufficient adhesive and logical paper etc. are peeled off barrier film.
For the scheme of dealing with problems
The inventor etc. study repeatedly, found that these two of viscosity by making binder layer and bounding forces independently characteristic be respectively ball in the spin adhesive test and number be below 2, be more than the 0.3N/20mm to the bounding force of silicon mirror wafer, can address the above problem.
Adhesive sheet of the present invention possesses substrate layer and binder layer, and the ball of this binder layer in the spin adhesive test number is below 2, and is more than the 0.3N/20mm to the bounding force of silicon mirror wafer.
Preferred embodiment, above-mentioned binder layer comprises polyolefin-based resins.
Preferred embodiment, said polyolefins is that resin comprises amorphousness propylene-(1-butylene) multipolymer that uses metallocene catalyst polymerisation to form.
Preferred embodiment, said polyolefins is that also to comprise crystalline polypropylene be resin to resin.
Preferred embodiment, adhesive sheet of the present invention forms material and the coextrusion shaping of substrate layer formation material with binder layer and obtains.
Preferred embodiment, adhesive sheet of the present invention is used for semiconductor crystal wafer processing.
The effect of invention
According to the present invention, can provide a kind of excellent adhesive sheet of processing (low viscosity) that has after sufficient adhesive and logical paper etc. are peeled off barrier film.Because adhesive sheet of the present invention is peeled off the processing excellence behind the barrier film, therefore to band adhering device mounting strap the time, lead to paper easily.Therefore, can further improve the productivity of semiconductor crystal wafer.And then, owing to the sufficient adhesive that has as adhesive sheet, therefore can suitably be used for various purposes.Adhesive sheet of the present invention is suitable for the processing purposes of semiconductor crystal wafer especially.
Description of drawings
Fig. 1 is the diagrammatic cross-section of the adhesive sheet of the preferred embodiment of the present invention.
Description of reference numerals
10 substrate layers
20 binder layers
100 adhesive sheets
Embodiment
A. the one-piece construction of adhesive sheet
Fig. 1 is the diagrammatic cross-section of the adhesive sheet of the preferred embodiment of the present invention.Adhesive sheet 100 possesses substrate layer 10 and binder layer 20 successively.
Adhesive sheet of the present invention can also possess other suitable arbitrarily layers.As other layers, for example can list that a side opposite with binder layer at substrate layer possesses, can give adhesive sheet stable on heating upper layer.
The ball of the binder layer of adhesive sheet of the present invention in the spin adhesive test number is below 2.Number be below 2 by making the ball of binder layer in the spin adhesive test, logical paper etc. is peeled off the processing raising of the adhesive sheet behind the barrier film.Therefore, using the band adhering device to attach under the situation of operation, the productivity of easily logical paper, semiconductor crystal wafer can further improve during mounting strap.The ball of above-mentioned binder layer in the spin adhesive test number is preferably below 1, and more preferably 0(is that the spin of ball number 1 falls).In this specification sheets, spin viscosity is to utilize the tilting spin viscosity method according to JIS Z 0237, the value of measuring under 30 degree of pitch angle.
About adhesive sheet of the present invention, its binder layer is more than the 0.3N/20mm to the bounding force of silicon mirror wafer.As long as the bounding force of above-mentioned binder layer is more than the 0.3N/20mm, just have the sufficient adhesive as adhesive sheet, for example, when being used for the processing purposes of semiconductor crystal wafer, can keep wafer fully.Above-mentioned binder layer is preferably 0.3N/20mm ~ 3.0N/20mm to the bounding force of silicon mirror wafer, more preferably 0.4N/20mm ~ 2.5N/20mm, more preferably 0.4N/20mm ~ 2.0N/20mm.Need to prove that above-mentioned bounding force is to use semi-conductor minute surface wafer test board (silicon system), utilizes according to JIS Z 0237(2000) the value measured of method (laminating condition: 180 ° on reciprocal 1 time of 2kg roller, peeling rate: 300mm/min, peel angle).The ball that adhesive sheet of the present invention can be taken into account in above-mentioned spin adhesive test number is characteristic (that is low viscosity) and the desired sufficient adhesive of adhesive sheet such below 2.
The thickness of adhesive sheet of the present invention is preferably 90 μ m ~ 285 μ m, more preferably 105 μ m ~ 225 μ m, more preferably 120 μ m ~ 205 μ m.
The thickness of above-mentioned substrate layer is preferably 30 μ m ~ 185 μ m, more preferably 65 μ m ~ 175 μ m.
The thickness of above-mentioned binder layer is preferably 20 μ m ~ 100 μ m, more preferably 25 μ m ~ 65 μ m.
Adhesive sheet of the present invention can provide under the state by the barrier film protection.Adhesive sheet of the present invention can coil into tubular with the state by the barrier film protection.Barrier film has as the protecting materials of protection adhesive sheet until in the effect of reality use.As barrier film, for example can list plastics (for example, polyethylene terephthalate (PET), polyethylene, polypropylene) film, paper or the non-woven fabrics etc. that have carried out surface coated by strippers such as silicon series stripping agent, fluorine series stripping agent, long-chain aliphatic acrylate series stripping agents.
Adhesive sheet of the present invention for example under situation about not protecting with barrier film, also can carry out the back side to the outermost layer of a side opposite with binder layer and handle.The back side is handled and for example can be used strippers such as silicon series stripping agent, long-chain aliphatic acrylate series stripping agent to carry out.Self adhesive tape of the present invention is handled to become and is coiled into web-like easily by carrying out the back side.
B. binder layer
Above-mentioned binder layer is as long as ball in the spin adhesive test number is below 2 and to the bounding force of silicon mirror wafer to be more than the 0.3N/20mm.Above-mentioned binder layer can constitute by any suitable adhesive.For example can list the tackiness agent of thermoplastic resins such as comprising polyolefin-based resins, acrylic resin, phenylethylene resin series etc.This binder layer preferably comprises polyolefin-based resins.Particularly, can list ethylene copolymer, polyolefin modified polymkeric substance etc. such as Low Density Polyethylene, ultra-low density polyethylene, low crystalline polypropylene, amorphousness propylene-(1-butylene) multipolymer, ionomer resin, vinyl-vinyl acetate copolymer, ethene-(methyl) acrylic copolymer, ethene-(methyl) acrylate-copolymer-maleic anhydride, ethylene-methyl methacrylate glycidyl ester copolymer.This binder layer more preferably comprises amorphousness propylene-(1-butylene) multipolymer.By using such binder layer, the sufficient adhesive that can be maintained and peel off barrier film after the adhesive sheet of processing excellence.And then, as long as for such binder layer, just can make adhesive sheet by being shaped with the substrate layer coextrusion, can obtain adhesive sheet and not with an organic solvent with less process number.Need to prove that in this specification sheets, " amorphousness " refers to not have the character of fusing point clear and definite as xln.
Above-mentioned amorphousness propylene-(1-butylene) multipolymer preferably carries out polymerization by the use metallocene catalyst with propylene and 1-butylene, thereby obtains.More specifically, amorphousness propylene-(1-butylene) multipolymer for example can followingly obtain: use metallocene catalyst to make the polymerization process of propylene and 1-butylene polymerization, behind this polymerization process, carry out removal operation, the foreign matter of residual catalyst and remove postprocessing working procedures such as operation, obtain thus.Amorphousness propylene-(1-butylene) multipolymer is through such operation, obtains with shapes such as for example Powdered, particulate state.As metallocene catalyst, for example can list the even mixed catalyst of the metallocene that comprises metallocene compound and aikyiaiurnirsoxan beta, load has the metallocene loaded catalyst of metallocene compound etc. on microparticle support.
Amorphousness propylene-(1-butylene) multipolymer that uses metallocene catalyst polymerisation to form as described above demonstrates narrow molecular weight distribution.The molecular weight distribution (Mw/Mn) of above-mentioned amorphousness propylene-(1-butylene) multipolymer is preferably below 3, more preferably below 2, and more preferably 1.1 ~ 2, be preferably 1.2 ~ 1.9 especially.Because the low molecular weight compositions of amorphousness propylene-(1-butylene) multipolymer that molecular weight distribution is narrow is few, therefore if use such amorphousness propylene-(1-butylene) multipolymer, then can obtain to prevent from causing because of oozing out of low molecular weight compositions the adhesive sheet of the pollution of adherend.
In above-mentioned amorphousness propylene-(1-butylene) multipolymer, the ratio that contains that derives from the structural unit of propylene is preferably 80 moles of % ~ 99 mole %, more preferably 85 moles of % ~ 99 mole %, more preferably 90 moles of % ~ 99 mole %.
In above-mentioned amorphousness propylene-(1-butylene) multipolymer, the ratio that contains that derives from the structural unit of 1-butylene is preferably 1 mole of % ~ 15 mole %, more preferably 1 mole of % ~ 10 mole %.As long as be such scope, just can obtain the adhesive sheet of the balance excellence of toughness and flexibility.
Above-mentioned amorphousness propylene-(1-butylene) multipolymer can be segmented copolymer, also can be random copolymers.
The weight-average molecular weight (Mw) of above-mentioned amorphousness propylene-(1-butylene) multipolymer is preferably more than 200000, and more preferably 200000 ~ 500000, more preferably 200000 ~ 300000.As long as the weight-average molecular weight (Mw) of amorphousness propylene-(1-butylene) multipolymer is such scope, compare with general polystyrene thermoplastic resin, acrylic acid series thermoplastic resin (Mw is below 100000), can obtain the adhesive sheet that low molecular weight compositions is few, can prevent the pollution of adherend.In addition, can not have the poorly formed binder layer of processing when coextrusion is shaped, and can obtain suitable bounding force.
The melt flow rate (MFR) of above-mentioned amorphousness propylene-(1-butylene) multipolymer under 230 ℃, 2.16kgf is preferably 1g/10min ~ 50g/10min, more preferably 5g/10min ~ 30g/10min, more preferably 5g/10min ~ 20g/10min.As long as the melt flow rate (MFR) of amorphousness propylene-(1-butylene) multipolymer is in such scope, just can be shaped to form by coextrusion have bad, the uniform binder layer of thickness of processing.Melt flow rate (MFR) can be utilized according to the method for JISK7210 and measure.
Above-mentioned amorphousness propylene-(1-butylene) multipolymer can also further comprise the structural unit that derives from other monomers in the scope of not damaging effect of the present invention.As other monomers, for example can list alpha-olefins such as ethene, 1-amylene, 1-hexene, 1-octene, 1-decene, 4-methyl-1-pentene, 3-Methyl-1-pentene etc.
Preferably, above-mentioned binder layer does not comprise F in fact
-, Cl
-, Br
-, NO
2 -, NO
3 -, SO
4 2-, Li
+, Na
+, K
+, Mg
2+, Ca
2+, NH
4 +This is because can prevent this ionic soil adherend.The adhesive sheet that possesses such binder layer can not produce the broken string of circuit or short circuit etc. for example under the situation that is used for semiconductor crystal wafer processing usefulness.The binder layer that does not comprise above-mentioned ion for example can use metallocene catalyst to carry out solution polymerization as described above by amorphousness propylene-(1-butylene) multipolymer that this binder layer is comprised and obtain.Use in the solution polymerization of metallocene catalyst at this, amorphousness propylene-(1-butylene) multipolymer can use the poor solvent different with polymer solvent to repeat to separate out to separate (reprecipitation method) and purifying, therefore can not comprised the binder layer of above-mentioned ion.Need to prove, in this specification sheets, " do not comprise F in fact
-, Cl
-, Br
-, NO
2 -, NO
3 -, SO
4 2-, Li
+, Na
+, K
+, Mg
2+, Ca
2+, NH
4 +" refer to be lower than detectability in the ion chromatography (for example, using the ion chromatography of DIONEX K.K. manufacturing, trade(brand)name " DX-320 ", " DX350 ") in standard.Particularly, refer to the binder layer with respect to 1g, F
-, Cl
-, Br
-, NO
2 -, NO
3 -, SO
4 2-And K
+Be respectively below the 0.49 μ g Li
+And Na
+Be respectively below the 0.20 μ g Mg
2+And Ca
2+Be respectively below the 0.97 μ g NH4
+It is the following situation of 0.5 μ g.
The storage modulus of above-mentioned binder layer (G ') be preferably 0.5 * 10
6Pa～1.0 * 10
8Pa, more preferably 0.8 * 10
6Pa～3.0 * 10
7Pa.As long as (G ') is such scope the storage modulus of above-mentioned binder layer, the sufficient adhesive that just can be maintained and peel off barrier film after the adhesive sheet of processing excellence.In addition, the adhesive sheet that possesses such storage modulus is arranged the above-mentioned binder layer of (G ') is used for the semiconductor crystal wafer processing time spent, can help to realize the grinding accuracy of the excellence in the back side grinding of wafer.Need to prove, and the storage modulus among the present invention (G ') can measure by the dynamic viscoelastic spectrometry.
For the adhesive sheet of the processing excellence after keeping sufficient adhesive and peeling off barrier film is provided, it is resin that above-mentioned binder layer can also further comprise crystalline polypropylene.Crystalline polypropylene is containing ratio and can being set at suitable ratio arbitrarily according to desired bounding force and spin viscosity of resin.Crystalline polypropylene is that containing of resin is preferably proportional, be the gross weight of resin with respect to above-mentioned amorphousness propylene-(1-butylene) multipolymer and this crystalline polypropylene, be preferably 0 weight % ~ 50 weight %, more preferably 0 weight % ~ 40 weight %, more preferably 0 weight % ~ 30 weight %.
Above-mentioned crystalline polypropylene is that resin can be homopolymer polypropylene, also can be for by propylene and the multipolymer that can obtain with the monomer of copolymerization of propylene.As can with the monomer of copolymerization of propylene, for example can list alpha-olefins such as ethene, 1-amylene, 1-hexene, 1-octene, 1-decene, 4-methyl-1-pentene, 3-Methyl-1-pentene etc.
Above-mentioned crystalline polypropylene is that resin preferably obtains by the use metallocene catalyst polymerisation equally with above-mentioned amorphousness propylene-(1-butylene) multipolymer.As long as using the crystalline polypropylene so obtain is resin, just can prevent the pollution of the adherend that causes because of oozing out of low molecular weight compositions.
Above-mentioned crystalline polypropylene is that resin crystallinity is preferably more than 10%, more preferably more than 20%.Degree of crystallinity is representational to be to utilize differential scanning calorimetric analysis (DSC) or X-ray diffraction and try to achieve.
Above-mentioned binder layer can also further comprise other compositions in the scope of not damaging effect of the present invention.As these other compositions, for example can list antioxidant, UV light absorber, photostabilizer, heat-resisting stabilizing agent, static inhibitor etc.The kind of other compositions and consumption can suitably be selected according to purpose.
C. substrate layer
Above-mentioned substrate layer can form by any suitable resin.Be preferably and carry out the thermoplastic resin that coextrusion described later is shaped, for example can list polyethylene-based resin.As the concrete example of polyethylene-based resin, can list vinyl-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer (EEA), ethylene-methacrylic acid copolymer (EMA), styrene-ethylene-butylene-styrene block polymer (SEBS), High molecular weight polyethylene (HDPE), low molecular weight polyethylene (LDPE), straight chain shape low molecular weight polyethylene (LLDPE).Above-mentioned substrate layer preferably comprises vinyl-vinyl acetate copolymer.
The weight-average molecular weight of above-mentioned vinyl-vinyl acetate copolymer (Mw) is preferably 10000 ~ 200000, and more preferably 30000 ~ 190000.As long as the weight-average molecular weight (Mw) of vinyl-vinyl acetate copolymer is such scope, just can when being shaped, coextrusion not have the poorly formed substrate layer of processing.
The melt flow rate (MFR) of above-mentioned vinyl-vinyl acetate copolymer under 190 ℃, 2.16kgf is preferably 2g/10min ~ 20g/10min, more preferably 5g/10min ~ 15g/10min, more preferably 7g/10min ~ 12g/10min.As long as the melt flow rate (MFR) of vinyl-vinyl acetate copolymer is such scope, just can be shaped by coextrusion does not have the poorly formed substrate layer of processing.
Above-mentioned substrate layer can also further comprise other compositions in the scope of not damaging effect of the present invention.As these other compositions, for example can use with above-mentioned B item in illustrated binder layer the identical composition of other compositions that can comprise.
D. the manufacture method of adhesive sheet
Adhesive sheet of the present invention can use any appropriate means to make.The manufacture method of adhesive sheet of the present invention preferably includes and will form the material of above-mentioned binder layer and the operation of the material coextrusion that forms above-mentioned substrate layer.Be shaped by coextrusion, can be with the less process number manufacturing good adhesive sheet of adhesiveness between layers not with an organic solvent.
In above-mentioned coextrusion is shaped, the material that the material that forms above-mentioned binder layer and above-mentioned substrate layer can use the composition with above-mentioned each layer to mix with any appropriate means.
Concrete grammar as above-mentioned coextrusion shaping, for example can list at least 2 forcing machines that connect mould, respectively to 1 material of supplying with the material of formation binder layer, forming substrate layer to other 1 supply, extrude after the fusion, form the method for duplexer by the traction of touch roll moulding method.Also have under the situation that to give stable on heating upper layer at adhesive sheet, by further appending forcing machine, and supplied with by this forcing machine and to form the material of upper layer, thereby can form duplexer.When extruding, each form part that material collaborates more near mould outlet (die lip) more for preferred.This is bad because be difficult to take place respectively to form the interflow of material at mould inside.Therefore, as above-mentioned mould, preferably use the mould of branch manifold form.Need to prove, take place under the condition of poor of interflow that produce and collaborate bad orders such as inhomogeneous, it is inhomogeneous particularly to produce wavy outward appearance between the binder layer of extruding and substrate layer, is not preferred.In addition, because collaborating bad is that the difference of velocity of shear of the formation material of and each layer big owing to the difference of for example flowability (melt viscosity) of formation material not of the same race in mould produces greatly, if use the mould of branch manifold form, with other forms (for example, feed block (feed block) form) compares, for the formation material not of the same race with mobile difference, can enlarge the scope that material is selected.The screw-type that is used for the forcing machine of each fusion that forms material can also can be 2 for single shaft.Forcing machine also can be for more than 3.In addition, under the situation of the adhesive sheet of forcing machine 2 layers of structure of manufacturing (substrate layer+binder layer) of use more than 3, as long as supply with a kind of formation material to the adjacent forcing machine more than 2, when for example using 3 forcing machines, can supply with a kind of formation material to 2 adjacent forcing machines.
The forming temperature that above-mentioned coextrusion is shaped is preferably 160 ℃ ~ 220 ℃, more preferably 170 ℃ ~ 200 ℃.As long as be such scope, then shape stability excellence.
The material that forms the material of above-mentioned binder layer and form above-mentioned substrate layer is at 180 ℃ of temperature, velocity of shear 100sec
-1Under poor (the forming the material of the material-formation substrate layer of binder layer) of shear viscosity be preferably-150Pas ~ 600Pas, more preferably-100Pas ~ 550Pas, more preferably-50Pas ~ 500Pas.As long as be in such scope, then the flowability of material in mould of the material of above-mentioned formation binder layer and formation substrate layer approaches, and can prevent from collaborating bad generation.Need to prove that shear viscosity can use the extensional viscosity meter of double capillary type to measure.
Embodiment
Below, carry out specific description by the present invention of embodiment, but the present invention is not subjected to any restriction of these embodiment.Need to prove that part refers to weight part.
Embodiment 1
Use vinyl-vinyl acetate copolymer (DU PONT-MISUI CO., LTD. makes, trade(brand)name " EVAFLEXP-1007 ") as the material that forms substrate layer.
The amorphousness propylene that use forms by metallocene catalyst polymerisation-(1-butylene) multipolymer (sumitomo chemical company manufacturing, trade(brand)name " TAFTHREN H5002 ": derive from 90 moles of % of structural unit of propylene/derive from structural unit 10 moles of %, Mw=230000, the Mw/Mn=1.8 of 1-butylene) is as the material that forms binder layer.
The material of the material of 100 parts of above-mentioned formation substrate layers and 100 parts of above-mentioned formation binder layers is dropped into separately forcing machine, carry out T pattern fusion coextrusion (forcing machine:
GM ENGINEERING, Inc. makes, trade(brand)name " GM30-28 "/T pattern: feed block mode, extrusion temperature: 180 ℃).The resin of the molten state that will form from the mould coextrusion and to the Si coating PET barrier film of the logical paper of touch roll shaped portion (Mitsubishi Chemical Ind makes, trade(brand)name " Diafoil MRF ", thickness 38 μ m) so that cool off behind the contacted mode lamination of barrier film and binder layer, obtain the adhesive sheet of substrate layer (thickness 100 μ m)/binder layer (thickness 30 μ m)/barrier film (thickness 38 μ m).Need to prove that the thickness of substrate layer and binder layer is controlled by the shape of T pattern outlet.
Comparative example 1
Under 25 ℃, drop into 100 parts of n-butyl acrylates, 3 parts of vinylformic acid, 0.1 part 2,2 '-Diisopropyl azodicarboxylate, 100 parts of ethyl acetate in the flask of 500ml.Then, in flask, imported nitrogen about 1 hour while stirring, with the air of nitrogen replacement inside.Then, flask is heated, make the temperature in the flask rise to 60 ℃, an amount of ethyl acetate that is used for adjusting viscosity is dropped on the limit, and the limit keeps carrying out polymerization in about 6 hours, obtains polymers soln.
In 100 parts of polymers solns that obtain, add (the Japanese polyurethane industrial manufacturing of 2 parts of polyisocyanate compounds, trade(brand)name " Coronate L "), 0.5 part of multi-functional epoxy compound's (Mitsubishi's gas chemistry manufacturing, trade(brand)name " TETRAD C "), the limit is stirred to evenly with ethyl acetate dilution limit, obtains binder solution.
The binder solution that obtains is coated on Si coating PET barrier film, and (Mitsubishi Chemical Ind makes, trade(brand)name " Diafoil MRF ", thickness 38 μ m) on, 70 ℃ and 130 ℃ respectively dry 3 minutes down, formation thickness was the binder layer of 30 μ m with drying oven.Then, with this binder layer with so that thickness is the mode of 100 μ m extrudes the substrate layer (DU PONT-MISUI CO., LTD. makes, trade(brand)name " EVAFLEXP-1007 " (ethane-acetic acid ethyenyl ester copolymer resins)) that forms and fit, obtain adhesive sheet.
Comparative example 2
Except the multi-functional epoxy compound is operated equally with comparative example 1 being 3.0 parts, obtain adhesive sheet.
Estimate
The adhesive sheet that obtains in embodiment 1 and the comparative example 1 ~ 2 is carried out following evaluation.The results are shown in table 1.
(1) bonding force
With the adhesive sheet that obtains 50 ℃ of following slakings after 2 days, utilize the specular surface (silicon system) of 4 inches semiconductor crystal wafers, according to JIS Z 0237(2000) method (laminating condition: 180 ° on reciprocal 1 time of 2kg roller, peeling rate: 300mm/min, peel angle) measure.
(2) spin viscosity
Utilization is measured according to the method (tilting spin viscosity, pitch angle 30 degree) of JIS Z 0237.Number as spin viscosity, the situation that the spin of ball number 1 is fallen is as 0 with the ball of the maximum spin that keeps.
(3) logical paper
The adhesive sheet that obtains in embodiment and the comparative example is attached the logical paper of machine (day eastern smart machine company make trade(brand)name " DR-3000III ") to semi-conductor with adhesive sheet.The adhesive sheet of having peeled off barrier film can be not attached to each roller ground, and to lead to the situation of paper good as logical paper, and the situation that will be attached to roller, need peel off attachment portion or be difficult to logical paper for logical paper is as bad.
(4) back side grindability
The adhesive sheet that obtains in embodiment and the comparative example is attached at 8 inches minute surface wafers, and it is 100 μ m that the enforcement back side is ground to thickness.As good, will there be grinding water to immerse, can be observed the adhesive sheet of wafer breakage as bad from peripheral part the adhesive sheet of finishing back side grinding no problemly.
Table 1
| ? | Embodiment 1 | Comparative example 1 | Comparative example 2 |
| Bounding force (N/20mm) | 1.09 | 0.43 | 0.12 |
| Spin viscosity | 0 | 4 | 0 |
| Logical paper | Well | Bad | Well |
| Back side grindability | Well | Well | Bad |
The binder layer of the adhesive sheet of embodiment 1 has than high adhesion, and the spin of ball number 1 also falls in the spin adhesive test.Therefore, the adhesive sheet of embodiment 1 can be taken into account good logical paper and good back side grindability.
On the other hand, the adhesive sheet of comparative example 1 is owing to have higher bounding force, so back side grindability excellence.Yet because viscosity is also high, therefore logical paper difficulty, the processing of peeling off behind the barrier film are poor.In addition, low, the logical paper of the adhesive sheet viscosity of comparative example 2 is good.Yet, because bounding force is low, so produced wafer breakage during the grinding of the back side.Like this, the adhesive sheet of comparative example 1 and comparative example 2 is difficult to take into account logical paper and back side grindability.
Utilizability on the industry
The protection of the workpiece (semiconductor crystal wafer etc.) when adhesive sheet of the present invention can be used for for example semiconductor device manufacturing aptly.
Claims (7)
1. adhesive sheet, it possesses substrate layer and binder layer,
The ball of this binder layer in the spin adhesive test number is below 2, and,
Bounding force to the silicon mirror wafer is more than the 0.3N/20mm.
2. adhesive sheet according to claim 1, wherein, described binder layer comprises polyolefin-based resins.
3. adhesive sheet according to claim 2, wherein, described polyolefin-based resins comprises amorphousness propylene-(1-butylene) multipolymer that uses metallocene catalyst polymerisation to form.
4. according to claim 2 or 3 described adhesive sheets, wherein, it is resin that described polyolefin-based resins also comprises crystalline polypropylene.
5. according to each the described adhesive sheet in the claim 1 to 3, it forms material and the coextrusion shaping of substrate layer formation material with binder layer and obtains.
6. adhesive sheet according to claim 4, it forms material and substrate layer with binder layer and forms the material coextrusion and be shaped and obtain.
7. adhesive sheet according to claim 1, it is used for semiconductor crystal wafer processing.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012046107A JP5923344B2 (en) | 2012-03-02 | 2012-03-02 | Adhesive sheet |
| JP2012-046107 | 2012-03-02 |
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| Publication Number | Publication Date |
|---|---|
| CN103289588A true CN103289588A (en) | 2013-09-11 |
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|---|---|---|---|
| CN2013100661391A Pending CN103289588A (en) | 2012-03-02 | 2013-03-01 | Adhesive sheet |
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| JP (1) | JP5923344B2 (en) |
| CN (1) | CN103289588A (en) |
| TW (1) | TW201343862A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105622805A (en) * | 2014-10-30 | 2016-06-01 | 中国石油化工股份有限公司 | 1-butylene polymer preparation method |
| TWI781099B (en) * | 2016-04-28 | 2022-10-21 | 日商琳得科股份有限公司 | Protective film forming film, composite sheet for forming protective film and the using of energy line curable film |
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|---|---|---|---|---|
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| CN101617013A (en) * | 2007-02-23 | 2009-12-30 | 日东电工株式会社 | Surface protective plate |
| CN103173149A (en) * | 2011-12-20 | 2013-06-26 | 日东电工株式会社 | Bonding sheet |
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| CN105622805A (en) * | 2014-10-30 | 2016-06-01 | 中国石油化工股份有限公司 | 1-butylene polymer preparation method |
| CN105622805B (en) * | 2014-10-30 | 2018-05-15 | 中国石油化工股份有限公司 | A kind of preparation method of 1- butene polymers |
| TWI781099B (en) * | 2016-04-28 | 2022-10-21 | 日商琳得科股份有限公司 | Protective film forming film, composite sheet for forming protective film and the using of energy line curable film |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5923344B2 (en) | 2016-05-24 |
| JP2013181109A (en) | 2013-09-12 |
| TW201343862A (en) | 2013-11-01 |
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Application publication date: 20130911 |