CN103205209A - Adhesive tape - Google Patents
Adhesive tape Download PDFInfo
- Publication number
- CN103205209A CN103205209A CN 201310007780 CN201310007780A CN103205209A CN 103205209 A CN103205209 A CN 103205209A CN 201310007780 CN201310007780 CN 201310007780 CN 201310007780 A CN201310007780 A CN 201310007780A CN 103205209 A CN103205209 A CN 103205209A
- Authority
- CN
- China
- Prior art keywords
- adhesive tape
- self adhesive
- butylene
- binder layer
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Dicing (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides an adhesive tape which may inhibit cracks and gaps during abrasive machining of wafers. The adhesive tape (100) has an adhesion agent layer (10) having a tensile modulus of elasticity of above 1.5N/mm2 and below 100N/mm2 at 20 DEG C. The adhesion agent layer (10) preferably is formed by a resin composition containing an amorphous propylene - (1 - butylene) copolymer.
Description
Technical field
The present invention relates to self adhesive tape.More specifically, the present invention relates to semiconductor crystal wafer processing self adhesive tape.
Background technology
The semiconductor crystal wafer that is formed by silicon, gallium, arsenic etc. is with large diameter state manufacturing, after the surface forms pattern, grinding is carried out at the back side, usually with the wafer wear down to thickness 30 ~ 500 μ m, and then cut off and separate (cutting (dicing)) one-tenth element small pieces, and then move to installation (mount) operation.
The back side of semiconductor crystal wafer is carried out use self adhesive tape for the pattern plane of protecting semiconductor crystal wafer in the operation (back side grinding process) of grinding.After this self adhesive tape is attached at the pattern plane of semiconductor crystal wafer usually, cut into this wafer shape, behind the wafer rear grinding process, peel off.The self adhesive tape that is used for this purpose needs the bounding force of the degree that grinding process overleaf do not peel off; On the other hand, require to peel off easily and not damage behind the grinding process overleaf the low bounding force of the degree of semiconductor crystal wafer.
All the time, as such self adhesive tape, use be the self adhesive tape that is coated with tackiness agent at base material, for example, the base material that has proposed to contain polyethylene-based resin is provided with the self adhesive tape (patent documentation 1) of the binder layer that is coated with acrylic adhesive.But, when using such self adhesive tape that wafer rear is carried out grinding, exist on the wafer crack, the problem of breach.
The prior art document
Patent documentation
Patent documentation 1: international open WO2007/116856 brochure
Summary of the invention
The problem that invention will solve
The present invention proposes in order to solve above-mentioned existing problem, and its purpose is, provides a kind of and cracks when suppressing the wafer ground finish, the self adhesive tape of breach.
For the scheme of dealing with problems
The inventor etc. further investigate, and found that problem adhesive tape cutting (tapecut) property when self adhesive tape is cut into the wafer shape of crackle, the breach of above-mentioned wafer has relation, thereby have finished the present invention.
Self adhesive tape of the present invention is that self adhesive tape is used in semiconductor crystal wafer processing, and it modulus in tension that possesses at 20 ℃ is 1.5N/mm
2More than and 100N/mm
2Following binder layer.
In preferred embodiment, above-mentioned binder layer is formed by the resin combination that contains amorphous propene-(1-butylene) multipolymer.
In preferred embodiment, above-mentioned resin combination comprises crystalline resin, and it is resin that this crystalline resin comprises crystalline polypropylene.
In preferred embodiment, with respect to the gross weight of above-mentioned amorphous propene-(1-butylene) multipolymer and this crystalline resin, the ratio that contains of above-mentioned crystalline resin is below the 65 weight %.
In preferred embodiment, with respect to the gross weight of the resin in the above-mentioned resin combination, the ratio that always contains of the structural unit in the 1-butylene source in this resin combination is more than the 1.0 weight % and below the 60 weight %.
In preferred embodiment, the thickness of binder layer is 10 μ m ~ 300 μ m.
In preferred embodiment, also possess substrate layer, described self adhesive tape is formed to form with the material co-extrusion modling with material and substrate layer by binder layer and obtains.
The effect of invention
According to the present invention, can provide by the modulus in tension that makes binder layer to be in specific scope, thus the self adhesive tape of the generation of the crackle can suppress the ground finish of wafer rear time the, breach.Particularly, be in specific scope by the modulus in tension that makes binder layer, adhesive tape cutting excellence when the self adhesive tape that is attached at the pattern plane of wafer is cut into this wafer shape, can suppress well to produce glueballs (glue ball), burr by what cutting caused at crystal round fringes.Thus, reach the high smoothness of crystal round fringes, thereby can when ground finish, suppress the generation of crackle, breach well.
Description of drawings
Fig. 1 is the schematic section of the self adhesive tape of preferred implementation of the present invention.
Description of reference numerals
10 binder layers
20 substrate layers
100 self adhesive tapes
Embodiment
A. the integral body of self adhesive tape constitutes
Fig. 1 is the schematic section of the self adhesive tape of preferred implementation of the present invention.Self adhesive tape 100 possesses binder layer 10 and is arranged on the one-sided substrate layer 20 of binder layer 10.In the illustrated embodiment, self adhesive tape 100 possesses substrate layer 20, but self adhesive tape of the present invention also can not possess substrate layer.Though diagram not, for practicality, self adhesive tape of the present invention is provided with isolated body until in use in adhesive layer surface.In addition, self adhesive tape of the present invention can also possess other suitable layers arbitrarily.
The thickness of self adhesive tape is different according to its formation, and representational is 20 μ m ~ 1000 μ m, is preferably 40 μ m ~ 800 μ m, more preferably 50 μ m ~ 600 μ m.
The thickness of above-mentioned binder layer can be set at the value of any appropriate according to formation of self adhesive tape etc.Representational is 10 μ m ~ 300 μ m.Particularly, when self adhesive tape possessed substrate layer, the thickness of binder layer was preferably 10 μ m ~ 200 μ m, and more preferably 10 μ m ~ 150 μ m especially are preferably 10 μ m ~ 100 μ m.When self adhesive tape did not possess substrate layer, the thickness of binder layer was preferably 50 μ m ~ 300 μ m, and more preferably 75 μ m ~ 250 μ m especially are preferably 75 μ m ~ 200 μ m.According to the present invention, even if must thicker (for example more than the 100 μ m) with the thickness setting of binder layer, also can suppress the glueballs that is caused by the adhesive tape cutting, the generation of burr, the crackle in the time of can suppressing ground finish well, the generation of breach.
The thickness of above-mentioned substrate layer is preferably 10 μ m ~ 150 μ m, more preferably 20 μ m ~ 100 μ m.With respect to the total thickness of binder layer and substrate layer, the thickness of substrate layer is preferably 10% ~ 90%, and more preferably 15% ~ 80%.
For self adhesive tape of the present invention, 50 ℃ of following slakings after 2 days, with semi-conductor minute surface wafer (silicon system) as test board, according to JIS Z0237(2000) the bounding force measured of method (180 ° on the roller of laminating condition: 2kg 1 time back and forth, peeling rate: 300mm/min, peel angle) be preferably 0.15N/20mm ~ 2.0N/20mm, 0.17N/20mm ~ 1.9N/20mm more preferably, more preferably 0.18N/20mm ~ 1.8N/20mm especially is preferably 0.20N/20mm ~ 1.7N/20mm.During for such scope, can take into account bounding force and separability.For example, in the ground finish at the back side of semiconductor crystal wafer, can not peel off, after ground finish, can peel off easily.
B. binder layer
Above-mentioned binder layer is preferably 1.5N/mm at 20 ℃ modulus in tension
2More than, 2N/mm more preferably
2More than.Be in such scope by the modulus in tension that makes binder layer, the self adhesive tape of the generation of crackle, the breach when ground finish that can suppress wafer rear can be provided.Particularly, according to such binder layer, adhesive tape cutting excellence when self adhesive tape is cut into this wafer shape, can suppress well to produce glueballs, burr by what cutting caused at crystal round fringes.Thus, reach the high smoothness of crystal round fringes, thereby when ground finish, can suppress the generation of crackle, breach well.On the other hand, binder layer is preferably 100N/mm at 20 ℃ modulus in tension
2Below, 50N/mm more preferably
2Below.
The storage modulus of above-mentioned binder layer under the adhesive tape cutting temperature is preferably 2.5 * 10
5More than the Pa, more preferably 3.0 * 10
5More than the Pa.On the other hand, the storage modulus of binder layer under the adhesive tape cutting temperature is preferably 7.5 * 10
6Pa is following, more preferably 6.0 * 10
6Below the Pa.Wherein, the adhesive tape cutting temperature is representational is 20 ℃ ~ 150 ℃.
Above-mentioned binder layer is preferably 5.0 * 10 22 ℃ storage modulus
5More than the Pa, more preferably 7.5 * 10
5More than the Pa.
Above-mentioned binder layer is preferably 2.5 * 10 80 ℃ storage modulus
5More than the Pa, more preferably 3.0 * 10
5More than the Pa.
Above-mentioned binder layer is preferably formed by the resin combination that contains amorphous propene-(1-butylene) multipolymer.According to such resin combination, can satisfy above-mentioned Young's modulus well, and the balance excellence of bounding force and separability, the property handled also can be excellent.In addition, even if must be thicker with the thickness setting of binder layer, also can suppress the glueballs that is caused by the adhesive tape cutting, the generation of burr, the crackle when suppressing ground finish very well, the generation of breach.And then, can utilize with the co-extrusion modling of substrate layer and make self adhesive tape.Need to prove that in this specification sheets, " amorphous " refers to not have the character as the clear and definite fusing point of crystalline.
The ratio that contains of the structural unit in the 1-butylene source in above-mentioned amorphous propene-(1-butylene) multipolymer is preferably 1 mole of % ~ 15 mole %, more preferably 1 mole of % ~ 10 mole %.During for such scope, the balance of toughness and flexibility can be excellent.
The ratio that contains of the structural unit in the propylene source in above-mentioned amorphous propene-(1-butylene) multipolymer is preferably 80 moles of % ~ 99 mole %, and more preferably 85 moles of % ~ 99 mole % especially are preferably 90 moles of % ~ 99 mole %.
Above-mentioned amorphous propene-(1-butylene) multipolymer can be segmented copolymer, also can be random copolymers.
The weight-average molecular weight (Mw) of above-mentioned amorphous propene-(1-butylene) multipolymer is preferably more than 200,000, and more preferably 200,000 ~ 500,000, especially be preferably 200,000 ~ 300,000.During for such scope, can suppress the glueballs that is caused by the adhesive tape cutting, the generation of burr, the crackle when suppressing ground finish very well, the generation of breach.In addition, low molecular weight compositions is few, can prevent the pollution of adherend.And then, can when adopting co-extrusion modling, not process poorly formed binder layer.In addition, even if self adhesive tape of the present invention does not possess above-mentioned substrate layer, also have and to supply in the processing of practicality.
The molecular weight distribution (Mw/Mn) of above-mentioned amorphous propene-(1-butylene) multipolymer is preferably below 3, more preferably below 2.7, and more preferably 1.1 ~ 2.6, especially be preferably 1.2 ~ 2.5.Such amorphous propene-(1-butylene) multipolymer can suppress the glueballs that is caused by the adhesive tape cutting, the generation of burr, the crackle when suppressing ground finish very well, the generation of breach because low molecular weight compositions is few.In addition, can prevent the pollution of the adherend that caused by low molecular weight compositions.
The melt flow rate (MFR) of above-mentioned amorphous propene-(1-butylene) multipolymer under 230 ℃, 2.16kgf is preferably 1g/10min ~ 50g/10min, and more preferably 5g/10min ~ 30g/10min especially is preferably 5g/10min ~ 20g/10min.When the melt flow rate (MFR) of amorphous propene-(1-butylene) multipolymer was such scope, the formability of binder layer can be excellent.For example, can when adopting co-extrusion modling, not process the uniform binder layer of poorly formed thickness.Need to prove that melt flow rate (MFR) can be measured according to the method for JIS K7210.
Above-mentioned amorphous propene-(1-butylene) multipolymer just can use the multipolymer of any appropriate as long as can obtain above-mentioned desired characteristics.Preferred amorphous propene-(1-butylene) multipolymer that adopts metallocene catalyst to make propylene and 1-butylene polymerization and obtain that uses.This is because the low molecular weight compositions of such amorphous propene-(1-butylene) multipolymer is few, can satisfy above-mentioned molecular weight distribution well.Particularly, amorphous propene-(1-butylene) multipolymer can obtain by following operation: use metallocene catalyst to make the polymerization process of propylene and 1-butylene polymerization, behind this polymerization process, remove the operation of residual catalyst, the postprocessing working procedures such as operation of removal foreign matter.Representationally be to obtain amorphous propene-(1-butylene) multipolymer of shapes such as Powdered, particulate state through such operation.As metallocene catalyst, for example can enumerate the mixed uniformly metallocene catalyst that comprises metallocene compound and aikyiaiurnirsoxan beta, load has the carried metallocene catalyst of metallocene compound etc. on particulate carrier.
In the scope of not damaging effect of the present invention, above-mentioned amorphous propene-(1-butylene) multipolymer can contain the structural unit in other monomer sources.As other monomers, for example can enumerate alpha-olefins such as ethene, 1-amylene, 1-butylene, 1-hexene, 1-octene, 1-decene, 4-methyl-1-pentene, 3-Methyl-1-pentene.
In one embodiment, above-mentioned resin combination preferably also contains crystalline resin.By containing crystalline resin, can increase the Young's modulus of the binder layer that obtains.Its result, the crackle in the time of can suppressing ground finish very well, the generation of breach.The self adhesive tape of the property handled excellence can be provided in addition.For example, even if do not possess above-mentioned substrate layer, the property handled is also excellent.And then, thereby make the bounding force of binder layer that the self adhesive tape of the balance excellence of bounding force and separability lowly can be provided.
As above-mentioned crystalline resin, preferably using crystalline polypropylene is resin.Crystalline polypropylene is that resin can be homo-polypropylene, also can be by propylene and the multipolymer that can obtain with the monomer of copolymerization of propylene.As can with the monomer of copolymerization of propylene, for example can enumerate alpha-olefins such as ethene, 1-butylene, 1-amylene, 1-hexene, 1-octene, 1-decene, 4-methyl-1-pentene, 3-Methyl-1-pentene etc.In one embodiment, crystalline polypropylene is that resin is preferably crystallinity propylene-(1-butylene) multipolymer.Thus, by using multipolymer, for example, can increase the Young's modulus of the binder layer that obtains, and keep excellent bounding force.
Above-mentioned crystalline polypropylene be resin preferably with above-mentioned amorphous propene-(1-butylene) multipolymer similarly, obtain by using metallocene catalyst to carry out polymerization.When using the crystalline resin obtain thus, can prevent the pollution of the adherend that caused by low molecular weight compositions.
The degree of crystallinity of above-mentioned crystalline resin is preferably more than 10%, more preferably more than 20%.Degree of crystallinity is representational to be to utilize dsc (DSC) or X-ray diffraction to try to achieve.
With respect to the gross weight of above-mentioned amorphous propene-(1-butylene) multipolymer and this crystalline resin, the ratio that contains of above-mentioned crystalline resin is preferably below the 65 weight %, more preferably below the 60 weight %, especially is preferably below the 50 weight %.During for such scope, the glueballs that can suppress to be caused by the adhesive tape cutting, the generation of burr, improve chipping resistance (Chipping Resistance).In addition, can provide the self adhesive tape of the balance excellence of bounding force and separability, particularly, fully be fixed on the self adhesive tape that easily to peel off from semiconductor crystal wafer on the semiconductor crystal wafer, after the ground finish in the time of can providing ground finish.When surpassing 65 weight %, the worry that can't obtain sufficient adhesive is arranged.
With respect to the gross weight of the resin in the resin combination, the ratio that always contains of the structural unit in the 1-butylene source in the above-mentioned resin combination is preferably more than the 1.0 weight %, more preferably more than the 1.5 weight %.On the other hand, the ratio that always contains of the structural unit in 1-butylene source is preferably below the 60 weight %, more preferably below the 55 weight %.During for such scope, can provide the self adhesive tape of the balance excellence of the bounding force that is suitable for protecting semiconductor crystal wafer and separability.Need to prove that in this specification sheets, " structural unit in 1-butylene in resin combination source always contain ratio " refers to, the structural unit in the 1-butylene source that all resins in the resin combination has always contain ratio.Particularly, in the above-mentioned resin combination, except amorphous propene-(1-butylene) multipolymer, comprise under the situation of crystalline resin (for example crystallinity propylene-(1-butylene) multipolymer) of the structural unit with 1-butylene source, the structural unit that the structural unit that refers to the 1-butylene source in amorphous propene-(1-butylene) multipolymer and the 1-butylene in the crystalline resin are originated always contain ratio.
The melt flow rate (MFR) of above-mentioned resin combination under 230 ℃, 2.16kgf is preferably 1g/10min ~ 20g/10min, and more preferably 2g/10min ~ 18g/10min especially is preferably 3g/10min ~ 15g/10min.When the melt flow rate (MFR) of resin combination was such scope, the formability of binder layer can be excellent.For example, can when adopting co-extrusion modling, not process poorly formed binder layer.
Preferred above-mentioned binder layer does not contain F in fact
-, Cl
-, Br
-, NO
2 -, NO
3 -, SO
4 2-, Li
+, Na
+, K
+, Mg
2+, Ca
2+, NH
4 +This is because can prevent because of this ionic soil adherend.Particularly, when being used for semiconductor crystal wafer processing purposes, can not take place opening circuit or short circuit etc. of circuit.Thereby the binder layer that does not contain above-mentioned ion for example can obtain amorphous propene-(1-butylene) multipolymer of containing in this binder layer by using metallocene catalyst to carry out solution polymerization as mentioned above.This has used in the solution polymerization of metallocene catalyst, amorphous propene-(1-butylene) multipolymer can use the poor solvent different with polymer solvent and repeat to separate out and separate (reprecipitation method), and make with extra care, thereby can obtain not contain the binder layer of above-mentioned ion.Need to prove, in this specification sheets, " do not contain F in fact
-, Cl
-, Br
-, NO
2 -, NO
3 -, SO
4 2-, Li
+, Na
+, K
+, Mg
2+, Ca
2+, NH
4 +" refer to, in typical ion chromatography (for example using the ion chromatography of Dionex corporate system, trade(brand)name " DX-320 ", " DX-500 "), be lower than detectability.Particularly, refer to respect to binder layer 1g, F
-, Cl
-, Br
-, NO
2 -, NO
3 -, S O
4 2-And K
+Respectively do for oneself below the 0.49 μ g Li
+And Na
+Respectively do for oneself below the 0.20 μ g Mg
2+And Ca
2+Respectively do for oneself below the 0.97 μ g NH
4 +It is the following situation of 0.5 μ g.
In the scope of not damaging effect of the present invention, above-mentioned binder layer can also comprise other compositions.As these other compositions, for example can enumerate antioxidant, UV light absorber, photostabilizer, thermo-stabilizer, static inhibitor etc.The kind of other compositions and usage quantity can suitably be selected according to purpose.
C. substrate layer
Above-mentioned substrate layer can be by the resin formation of any appropriate.But be preferably the thermoplastic resin of co-extrusion modling described later, for example can enumerate polyethylene-based resin.As the object lesson of polyethylene-based resin, can enumerate vinyl-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer (EEA), ethylene-methacrylic acid copolymer (EMA), styrene-ethylene-butylene-styrene block polymerization body (SEBS), High molecular weight polyethylene (HDPE), low molecular weight polyethylene (LDPE), straight chain shape low molecular weight polyethylene (LLDPE).
The weight-average molecular weight of above-mentioned vinyl-vinyl acetate copolymer (Mw) is preferably 10,000 ~ 200,000, and more preferably 30,000 ~ 190,000.When the weight-average molecular weight of vinyl-vinyl acetate copolymer (Mw) is such scope, can when co-extrusion modling, not process poorly formed substrate layer.
The melt flow rate (MFR) of the resin that forms above-mentioned substrate layer under 230 ℃, 2.16kgf is preferably 2g/10min ~ 20g/10min, and more preferably 5g/10min ~ 15g/10min especially is preferably 7g/10min ~ 12g/10min.When the melt flow rate (MFR) that forms the resin of substrate layer was such scope, the formability of substrate layer can be excellent.For example, can when adopting co-extrusion modling, not process poorly formed substrate layer.
In the scope of not damaging effect of the present invention, above-mentioned substrate layer can also contain other compositions.As these other compositions, for example can use the same composition of other compositions that can contain in the binder layer that illustrated with above-mentioned B item.
D. other
As recited above, for practicality, self adhesive tape of the present invention can arrange isolated body and provides in adhesive layer surface.Self adhesive tape of the present invention for example can batch the rolling shape under adhesive layer surface is provided with the state of isolated body.Isolated body can have the protection self adhesive tape until supplying in the function as protecting materials of practicality.As isolated body, for example can enumerate plastics (for example, polyethylene terephthalate (PET), polyethylene, polypropylene) film, non-woven fabrics or paper etc. that strippers such as utilizing silicone-based stripper, fluorine series stripping agent, chain alkyl acrylate series stripping agent has carried out surface coated.
When self adhesive tape of the present invention is not protected by isolated body, can implement the back side to the outermost layer that is positioned at the binder layer opposition side (representational be, in the side that binder layer is not set of substrate layer) and handle.The back side is handled and for example can be used strippers such as silicone-based stripper, chain alkyl acrylate series stripping agent to carry out.Self adhesive tape of the present invention is handled by carrying out the back side, can coil into web-like.
As above-mentioned other the layer, for example can enumerate be arranged on substrate layer be positioned at the binder layer opposition side, can give self adhesive tape with stable on heating upper layer.
E. the manufacture method of self adhesive tape
Self adhesive tape of the present invention is preferably made with the formation of material and above-mentioned substrate layer the formation of above-mentioned binder layer with the material co-extrusion modling.Can be with less process number and do not make the good self adhesive tape of adhesiveness between layers according to co-extrusion modling with an organic solvent.Need to prove, in this specification sheets " formation of binder layer with material (binder layer form use material) " refer to above-mentioned resin combination and above-mentioned other mixture of ingredients.
In the above-mentioned co-extrusion modling, form to form with material and above-mentioned substrate layer as above-mentioned binder layer and use material, can use by any appropriate method material that the composition of above-mentioned each layer is mixed.
Concrete method as above-mentioned co-extrusion modling, for example can enumerate following method: at least 2 forcing machines that die head (dies) is connected, supplying with binder layer to 1 respectively forms with material, to other 1 supply substrate layer formation material, after the fusion, extrude, utilize the traction of touch roll (touch-roll) method of forming, the method for moulding duplexer.When extruding, it is more more preferred near die head exit (die lip (dies lip)) that each forms the part of converging with material.This is because be not easy to take place respectively to form in the die head bad with converging of material.Thereby, as above-mentioned die head, preferably use the die head of branch manifold form.In addition, converge under the condition of poor, converge unequal bad order, wavy outward appearance inequality takes place between the binder layer of particularly extruding and the substrate layer, thus not preferred.In addition, converging bad is owing to for example different types of formation uses the difference of the velocity of shear of material to take place greatly with the formation big and each layer of the difference of the flowability (melt viscosity) of material in die head, thereby when using the die head of branch manifold form, for the different sorts formation material with difference of flowability, with other forms (for example, feed head (feed block) form) compares the range extension that material is selected.Be used for each screw-type that forms the forcing machine of the fusion of using material and can be single screw rod or twin screw.Forcing machine can be for more than 3.Forcing machine is 3 when above, can also supply with the formation material of other layers.In addition, when using the self adhesive tape of the forcing machine 2 layers of structure of manufacturing (substrate layer+binder layer) more than 3, as long as adjacent forcing machine more than 2 is supplied with a kind of formation with material, for example, when using 3 forcing machines, can supply with a kind of formation material 2 adjacent forcing machines.
Mold temperature in the above-mentioned co-extrusion modling is preferably 160 ℃ ~ 220 ℃, more preferably 170 ℃ ~ 200 ℃.During for such scope, the forming stability excellence.
Above-mentioned binder layer forms with material and above-mentioned substrate layer and forms with material at 180 ℃ of temperature, velocity of shear 100sec
-1Under poor (tackiness agent form form use material with material-substrate layer) of shear viscosity, be preferably-150Pas ~ 600Pas, more preferably-100Pas ~ 550Pas, especially be preferably-50Pas ~ 500Pas.During for such scope, above-mentioned tackiness agent forms with material and substrate layer and forms with material mobile close in die head, can prevent from converging bad generation.In addition, shear viscosity can utilize the elongation viscosity meter of double capillary type to measure.
Embodiment
Below, carry out specific description by the present invention of embodiment, but the present invention is not subjected to any restriction of these embodiment.Wherein, the measuring method of each characteristic is the following stated.In addition, following in, " part " refers to " weight part ".
1. modulus in tension
At 20 ℃, use tensile testing machine (SIMADZU CORPORATION. system, Tensilon), at stretch along its length under the condition of 50mm, the draw speed 0.5m/min sample (binder layers of thickness 30 μ m) of wide 10mm, long 80mm of spacing jig, measure stress-strain curve.Calculate modulus in tension by following formula (I).
E
t＝（σ
2-σ
1）/（ε
2-ε
1）……（I）
E
t: modulus in tension ［ MPa ］
σ
1: strain stress
1=0.05% tensile stress ［ MPa ］
σ
2: strain stress
2=0.25% tensile stress ［ MPa ］
2. storage modulus
Use dynamic viscoelastic spectrometry device (RHEOMETRIC SCIENTIFIC corporate system, goods name " ARES "), under the condition of 5 ℃/minute of frequency 10Hz, heat-up rate in-50 ℃ ~ 100 ℃ scopes the storage shear modulus of working sample (binder layers of thickness 30 μ m).
3. the molecular weight of amorphous propene-(1-butylene) multipolymer
After test portion is prepared into the THF solution of 1.0g/l and leaves standstill an evening, use the membrane filter of aperture 0.45 μ m to filter, use TO SOH corporate system HLC-8120GPC, by following condition the filtrate that obtains is measured, calculate by polystyrene conversion.
Post: TSKgel SuperHZM-H/HZ4000/HZ3000/HZ2000
Column dimension: 6.0mmI.D. * 150mm
Column temperature: 40 ℃
Elutriant: THF
Flow: 0.6ml/min
Injection rate: 20 μ l
Detector: RI(differential refraction rate detector)
4. crystalline polypropylene is the molecular weight of resin
Test portion is melted down at 140 ℃, preparation 0.10%(w/w) o-dichlorobenzene solution, use the sintered filter of aperture 1.0 μ m that this solution is filtered, use Waters corporate system gel permeation chromatography Alliance GPC2000 type, by following condition the filtrate that obtains measured, calculate by polystyrene conversion.
Post: TSKgel GMH
6-HT, TSKgel GMH
6-HTL
Each 2 of column dimension: 7.5mmI.D. * 300mm
Column temperature: 140 ℃
Elutriant: orthodichlorobenzene
Flow: 1.0ml/min
Injection rate: 0.4ml
Detector: RI(differential refraction rate detector)
5. melt flow rate (MFR)
Measure according to JIS K7210.
［ embodiment 1 ］
As binder layer formation material, use utilizes metallocene catalyst polymerisation and amorphous propene-(1-butylene) multipolymer of obtaining (structural unit in sumitomo chemical company system, trade(brand)name " TAFTHREN H5002 ", 1-butylene source: 2 weight %, Mw=230,000, Mw/Mn=1.8, melt flow rate (MFR): 10g/10min) 100 parts.
As substrate layer formation material, use vinyl-vinyl acetate copolymer (Mitsui E.I.Du Pont Company system, trade(brand)name " EVAFLEX P-1007 ", vinyl acetate ester concentration: 10 weight %, melt flow rate (MFR): 9g/10min).
Above-mentioned tackiness agent formation is formed with in the material input forcing machine separately with material and substrate layer, carry out T die head fusion coextrusion (forcing machine: GM ENGINEERING corporate system, trade(brand)name " GM30-28 "/T die head: feed head mode; 180 ℃ of extrusion temperatures), with the resin of molten state with to the Si coating PET isolated body of touch roll forming part paper feed (Mitsubishi Chemical Ind's system, trade(brand)name " DIAFOIL MRF ": after 38 μ m) stacked, cool off, the thickness that obtains binder layer is that the thickness of 30 μ m, substrate layer is the self adhesive tape of 100 μ m.Wherein, the thickness of each layer is controlled by the shape of T die head exit.
［ embodiment 2 ］
As binder layer formation material, use comprises amorphous propene-(1-butylene) multipolymer (sumitomo chemical company system of utilizing metallocene catalyst polymerisation and obtaining, trade(brand)name " TAFTHREN H5002 ", the structural unit in 1-butylene source: 2 weight %, Mw=230,000, Mw/Mn=1.8, melt flow rate (MFR): 10g/10min) 80 parts, the crystalline polypropylene that obtains with utilizing metallocene catalyst polymerisation is resin (Japan polypropylene corporation system, trade(brand)name " WINTEC WFX4 ", Mw=363,000, Mw/Mn=2.87, melt flow rate (MFR): 7g/10min) 20 parts resin combination (structural unit in 1-butylene in resin combination source always contain ratio: 1.6 weight %, the melt flow rate (MFR) of resin combination: 9g/10min), in addition, obtain self adhesive tape similarly to Example 1.
［ embodiment 3 ］
As binder layer formation material, use comprises amorphous propene-(1-butylene) multipolymer (sumitomo chemical company system of utilizing metallocene catalyst polymerisation and obtaining, trade(brand)name " TAFTHREN H5002 ", the structural unit in 1-butylene source: 2 weight %, Mw=230,000, Mw/Mn=1.8, melt flow rate (MFR): 10g/10min) 70 parts, the crystalline polypropylene that obtains with utilizing metallocene catalyst polymerisation is resin (Japan polypropylene corporation system, trade(brand)name " WINTEC WFX4 ", Mw=363,000, Mw/Mn=2.87, melt flow rate (MFR): 7g/10min) 30 parts resin combination (structural unit in 1-butylene in resin combination source always contain ratio: 1.4 weight %, the melt flow rate (MFR) of resin combination: 9g/10min), in addition, obtain self adhesive tape similarly to Example 1.
［ embodiment 4 ］
As binder layer formation material, use comprises amorphous propene-(1-butylene) multipolymer (sumitomo chemical company system of utilizing metallocene catalyst polymerisation and obtaining, trade(brand)name " TAFTHREN H5002 ", the structural unit in 1-butylene source: 2 weight %, Mw=230,000, Mw/Mn=1.8, melt flow rate (MFR): 10g/10min) 60 parts, the crystalline polypropylene that obtains with utilizing metallocene catalyst polymerisation is resin (Japan polypropylene corporation system, trade(brand)name " WINTEC WFX4 ", Mw=363,000, Mw/Mn=2.87, melt flow rate (MFR): 7g/10min) 40 parts resin combination (structural unit in 1-butylene in resin combination source always contain ratio: 1.2 weight %, the melt flow rate (MFR) of resin combination: 9g/10min), in addition, obtain self adhesive tape similarly to Example 1.
［ embodiment 5 ］
As binder layer formation material, use comprises amorphous propene-(1-butylene) multipolymer (sumitomo chemical company system of utilizing metallocene catalyst polymerisation and obtaining, trade(brand)name " TAFTHREN H5002 ", the structural unit in 1-butylene source: 2 weight %, Mw=230,000, Mw/Mn=1.8, melt flow rate (MFR): 10g/10min) 60 parts, with crystallinity propylene-(1-butylene) multipolymer (Mitsui Chemicals corporate system, trade(brand)name " TAFMER XM7070 ", the structural unit in 1-butylene source: 34 weight %, Mw=240,000, Mw/Mn=2.2, melt flow rate (MFR): 10g/10min) 40 parts resin combination (structural unit in 1-butylene in resin combination source always contain ratio: 14.8 weight %, the melt flow rate (MFR) of resin combination: 10g/10min), in addition, obtain self adhesive tape similarly to Example 1.
［ comparative example 1 ］
As binder layer formation material, use comprises amorphous propene-(1-butylene) multipolymer (sumitomo chemical company system of utilizing metallocene catalyst polymerisation and obtaining, trade(brand)name " TAFTHREN H5002 ", the structural unit in 1-butylene source: 2 weight %, Mw=230,000, Mw/Mn=1.8, melt flow rate (MFR): 10g/10min) 20 parts, the crystalline polypropylene that obtains with utilizing metallocene catalyst polymerisation is resin (Japan polypropylene corporation system, trade(brand)name " WINTEC WFX4 ", Mw=363,000, Mw/Mn=2.87, melt flow rate (MFR): 7g/10min) 80 parts resin combination (structural unit in 1-butylene in resin combination source always contain ratio: 0.4 weight %, the melt flow rate (MFR) of resin combination: 8g/10min), in addition, obtain self adhesive tape similarly to Example 1.
［ comparative example 2 ］
Under 25 ℃, drop into 3 parts of 100 parts of n-butyl acrylates, vinylformic acid, 2 in the flask, 0.1 part of 2'-Diisopropyl azodicarboxylate, as 200 parts of the ethyl acetate of diluting solvent.Then, in flask, introduced nitrogen about 1 hour while stirring, with the air of nitrogen replacement inside.Then, to the flask heating, make the temperature in the flask rise to 60 ℃, keep about 6 hours to carry out polymerization, obtain polymers soln.With respect to 100 parts of the polymer solids compositions that obtains, behind 0.5 part of 2 parts of interpolation polyisocyanate compounds (Japanese polyurethane industrial system, trade(brand)name " CORONATE L ") and the multi-functional epoxy compound (Mitsubishi's gas chemistry system, trade(brand)name " TETRAD C "), thereby stir until the even binder solution that obtains with ethyl acetate dilution limit on the limit.
At the binder solution that PET isolated body coating obtains, use drying oven 130 ℃ dry 3 minutes down, form the binder layer of thickness 15 μ m.
The binder layer that obtains is fitted in the mode of thickness 115 μ m vinyl-vinyl acetate copolymer (Mitsui E.I.Du Pont Company system, trade(brand)name " EVAFLEX P-1007 ") extruded and on the base material that obtains, obtained self adhesive tape.
［ comparative example 3 ］
Make by 75 moles of 2-EHAs, 25 moles of acryloyl morpholines, 22 moles of compounding composition copolymerization in toluene solution that constitute of vinylformic acid 2-hydroxyl ethyl ester, obtain the acrylic acid series copolymerized polymer.Make the acrylic acid series copolymerized polymer that obtains like this and 11 moles 2-methylacryoyloxyethyl isocyanic ester carry out addition reaction, side chain is introduced carbon-to-carbon double bond in polymer molecule.Then, with respect to 100 parts of this polymer solids compositions, further mix 0.2 part of polyisocyanate compound (Japanese polyurethane industrial system, trade(brand)name " CORONATE L "), methyl phenyl ketone and be Photoepolymerizationinitiater initiater (BASF system, " IRGACURE651 ") thus 3 parts obtain binder solution.Except using the binder solution that obtains like this, similarly obtain self adhesive tape with comparative example 2.
［ evaluation ］
The self adhesive tape that embodiment and comparative example are obtained carries out following evaluation.The result is as shown in table 1.
(1) bounding force (to silicon)
For the self adhesive tape that will obtain at 50 ℃ of following slakings bounding force to the minute surface face (silicon system) of 4 inches semiconductor crystal wafers after 2 days, according to JIS Z0237(2000) method (laminating condition: 180 ° on 2kg roller 1 time back and forth, peeling rate: 300mm/min, peel angle) measure.
(2) adhesive tape cutting (glueballs, burr)
Use grinding back surface boundary belt adhering device (a day eastern smart machine (strain) system, DR-3000III); at room temperature; the self adhesive tape that obtains is attached on the pattern plane of semiconductor crystal wafer, uses cutting machine (OLFA system, trade(brand)name " ART KNIFE BLADE XB10 ") to cut into this wafer shape.After the cutting, by glueballs, the burr number that the edge of checking wafer produces, estimate the adhesive tape cutting.In addition, the cutting machine temperature when making cutting is 80 ℃ of room temperatures, estimates the adhesive tape cutting respectively.
(3) grindability (crackle of wafer, breach)
Use milling drum ((strain) Disco system, DGP-8760) that grinding is carried out at the back side that is pasted with the wafer of self adhesive tape in the above-mentioned evaluation (2), making final thickness is 50 μ m.After the grinding, the quantity that has or not and check the breach more than the 10 μ m of the crackle by confirming wafer is estimated grindability.
［ table 1 ］
According to the self adhesive tape of each embodiment, the crackle in the time of can suppressing ground finish well, the generation of breach.On the other hand, can be clear and definite according to comparative example 2,3, possess the self adhesive tape of the binder layer that does not satisfy specific modulus in tension, in ground finish, crack breach.In addition, the self adhesive tape of comparative example 1 can't be fitted on the semiconductor crystal wafer, can't carry out each and estimate.
Can be clear and definite by table 1, the adhesive tape cutting of the self adhesive tape of each embodiment is very excellent, relative therewith, and comparative example 2,3 can't obtain excellent adhesive tape cutting.
Utilizability on the industry
Self adhesive tape of the present invention is applicable to the protection of workpiece (semiconductor crystal wafer etc.) when semiconductor device is made.
Claims (7)
1. self adhesive tape is used in a semiconductor crystal wafer processing, and it modulus in tension that possesses at 20 ℃ is 1.5N/mm
2More than and 100N/mm
2Following binder layer.
2. self adhesive tape according to claim 1, wherein, described binder layer is formed by the resin combination that contains amorphous propene-(1-butylene) multipolymer.
3. self adhesive tape according to claim 2, wherein, described resin combination comprises crystalline resin, and it is resin that this crystalline resin comprises crystalline polypropylene.
4. self adhesive tape according to claim 3, wherein, with respect to the gross weight of described amorphous propene-(1-butylene) multipolymer and this crystalline resin, the ratio that contains of described crystalline resin is below the 65 weight %.
5. according to each described self adhesive tape of claim 2 ~ 4, wherein, with respect to the gross weight of the resin in the described resin combination, it is more than the 1.0 weight % and below the 60 weight % that the structural unit in the 1-butylene source in this resin combination always contains ratio.
6. according to each described self adhesive tape of claim 1 ~ 5, wherein, the thickness of binder layer is 10 μ m ~ 300 μ m.
7. according to each described self adhesive tape of claim 1 ~ 6, wherein, also possess substrate layer, described self adhesive tape is formed to form with the material co-extrusion modling with material and substrate layer by binder layer and obtains.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-004671 | 2012-01-13 | ||
| JP2012004671A JP5970191B2 (en) | 2012-01-13 | 2012-01-13 | Adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103205209A true CN103205209A (en) | 2013-07-17 |
Family
ID=48752620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201310007780 Pending CN103205209A (en) | 2012-01-13 | 2013-01-09 | Adhesive tape |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5970191B2 (en) |
| CN (1) | CN103205209A (en) |
| TW (1) | TW201329190A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103242751A (en) * | 2012-02-13 | 2013-08-14 | 日东电工株式会社 | Binding tape |
| CN103289586A (en) * | 2012-02-27 | 2013-09-11 | 日东电工株式会社 | Adhesive sheet for cutting |
| CN112055736A (en) * | 2019-04-08 | 2020-12-08 | 古河电气工业株式会社 | Adhesive tape for electronic component and method for processing electronic component |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11323273A (en) * | 1998-05-12 | 1999-11-26 | Nitto Denko Corp | Adhesive sheet |
| JP2006286808A (en) * | 2005-03-31 | 2006-10-19 | Furukawa Electric Co Ltd:The | Wafer-working tape and method of working wafer using the same |
| JP2011178879A (en) * | 2010-03-01 | 2011-09-15 | Nitto Denko Corp | Protective sheet and use thereof |
| JP4718640B2 (en) * | 2010-04-14 | 2011-07-06 | 日東電工株式会社 | Dicing die bond film |
| JP5736139B2 (en) * | 2010-09-16 | 2015-06-17 | 日東電工株式会社 | Adhesive tape |
| JP2013129686A (en) * | 2011-12-20 | 2013-07-04 | Nitto Denko Corp | Adhesive sheet |
-
2012
- 2012-01-13 JP JP2012004671A patent/JP5970191B2/en not_active Expired - Fee Related
- 2012-11-14 TW TW101142510A patent/TW201329190A/en unknown
-
2013
- 2013-01-09 CN CN 201310007780 patent/CN103205209A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103242751A (en) * | 2012-02-13 | 2013-08-14 | 日东电工株式会社 | Binding tape |
| CN103289586A (en) * | 2012-02-27 | 2013-09-11 | 日东电工株式会社 | Adhesive sheet for cutting |
| CN112055736A (en) * | 2019-04-08 | 2020-12-08 | 古河电气工业株式会社 | Adhesive tape for electronic component and method for processing electronic component |
| CN112055736B (en) * | 2019-04-08 | 2022-05-27 | 古河电气工业株式会社 | Adhesive tape for electronic component and method for processing electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201329190A (en) | 2013-07-16 |
| JP5970191B2 (en) | 2016-08-17 |
| JP2013144722A (en) | 2013-07-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102399504B (en) | Pressure-sensitive adhesive tape | |
| US20120070658A1 (en) | Pressure-sensitive adhesive tape | |
| CN103429690A (en) | Adhesive tape | |
| CN104231962A (en) | Bonding sheet | |
| CN103305146B (en) | Bonding sheet | |
| CN103102819A (en) | Adhesive sheet with separating film | |
| CN103242751A (en) | Binding tape | |
| CN102449090B (en) | Adhesive sheet and method for grinding back surface of semiconductor wafer | |
| CN103205209A (en) | Adhesive tape | |
| CN103289586A (en) | Adhesive sheet for cutting | |
| CN102470652A (en) | Surface protective film | |
| TWI540196B (en) | Adhesive sheet | |
| CN104046287A (en) | Adhensive sheet | |
| CN103289588A (en) | Adhesive sheet | |
| CN103038300B (en) | Selection method for separator and adhesive sheet using separator selected by selection method | |
| CN104178043A (en) | Bonding sheet for machining semiconductor wafer | |
| JP2013185148A (en) | Self-adhesive sheet | |
| CN104419340A (en) | Adhesive piece for removing residuals |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130717 |