CN103289476B - Dip-coating ink, and preparation method and application thereof - Google Patents
Dip-coating ink, and preparation method and application thereof Download PDFInfo
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- CN103289476B CN103289476B CN201310121862.5A CN201310121862A CN103289476B CN 103289476 B CN103289476 B CN 103289476B CN 201310121862 A CN201310121862 A CN 201310121862A CN 103289476 B CN103289476 B CN 103289476B
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- coating ink
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- carboxyl
- nitrogenous
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- 238000003618 dip coating Methods 0.000 title claims abstract description 70
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 44
- 239000002904 solvent Substances 0.000 claims abstract description 28
- 150000002576 ketones Chemical class 0.000 claims abstract description 15
- 239000000080 wetting agent Substances 0.000 claims abstract description 14
- 229920000642 polymer Polymers 0.000 claims abstract description 4
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 41
- KXDAEFPNCMNJSK-UHFFFAOYSA-N Benzamide Chemical compound NC(=O)C1=CC=CC=C1 KXDAEFPNCMNJSK-UHFFFAOYSA-N 0.000 claims description 26
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 24
- 239000000203 mixture Substances 0.000 claims description 24
- 238000003756 stirring Methods 0.000 claims description 14
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 12
- 238000000227 grinding Methods 0.000 claims description 12
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 12
- -1 polyoxyethylene Polymers 0.000 claims description 12
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 10
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical group CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 9
- 238000002156 mixing Methods 0.000 claims description 9
- PTBDIHRZYDMNKB-UHFFFAOYSA-N 2,2-Bis(hydroxymethyl)propionic acid Chemical compound OCC(C)(CO)C(O)=O PTBDIHRZYDMNKB-UHFFFAOYSA-N 0.000 claims description 8
- 239000000975 dye Substances 0.000 claims description 8
- 239000011148 porous material Substances 0.000 claims description 8
- 238000009288 screen filtration Methods 0.000 claims description 8
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 claims description 8
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 6
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 6
- 125000004432 carbon atom Chemical group C* 0.000 claims description 6
- 229920000909 polytetrahydrofuran Polymers 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- 241001062009 Indigofera Species 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 238000007598 dipping method Methods 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 15
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 239000002351 wastewater Substances 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 abstract description 4
- 238000010147 laser engraving Methods 0.000 abstract description 4
- 239000002131 composite material Substances 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 abstract description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract 2
- 239000012528 membrane Substances 0.000 abstract 2
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052757 nitrogen Inorganic materials 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 229920005573 silicon-containing polymer Polymers 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- IQXJCCZJOIKIAD-UHFFFAOYSA-N 1-(2-methoxyethoxy)hexadecane Chemical compound CCCCCCCCCCCCCCCCOCCOC IQXJCCZJOIKIAD-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229950009789 cetomacrogol 1000 Drugs 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- Inks, Pencil-Leads, Or Crayons (AREA)
- Paints Or Removers (AREA)
Abstract
The invention discloses a dip-coating ink and a preparation method and application thereof. The dip-coating ink provided by the invention comprises, by mass, 30 to 80 parts of a polymer containing a carboxyl group and nitrogen, 20 to 60 parts of a ketone or methanamide solvent and 0.01 to 0.2 part of a wetting agent. The above-mentioned composition materials are simple and easily available and need low cost. The preparation method for the dip-coating ink is simple and suitable for large-scale productized production. The dip-coating ink is applied to manufacturing of outer circuits of a circuit board. When the dip-coating ink is uniformly coated on the surface (including walls of conductive holes) of a copper-clad plate, a protective effect similar to that of a dry photosensory membrane used in a conventional process is produced; after processing by using laser engraving technology, an effect similar to that of the dry photosensory membrane used in the conventional process is obtained. Moreover, the dip-coating ink provided by the invention has the advantages of less usage amount and no generation of waste water, so the dip-coating ink is beneficial for environment protection.
Description
Technical field
The present invention relates to ink material field, particularly a kind of dip-coating ink and preparation method thereof and application.
Background technology
At present; in circuit board outer layer circuit making processes; usual needs cover pressure photosensitive dry film in the copper-clad plate of existing conductive hole; after exposure, development; photosensitive dry film is formed required line pattern; then the copper-clad plate after development treatment is soaked into etching solution, by etching solution, copper face copper-clad plate not having photosensitive dry film protect is etched away, and then in copper-clad plate, form the line pattern of needs.Because photosensitive dry film is after overexposure, development, can produce a large amount of developing solution waste water, the meeting of developing solution waste water causes serious environmental pollution; And the price of photosensitive dry film is very high, the production cost of circuit board making can be increased undoubtedly.
Therefore, a kind ofly photosensitive dry film can be substituted and environmental protection, product at a low price are urgently developed.
Summary of the invention
Main purpose of the present invention, for providing a kind of dip-coating ink, is intended to alternative photosensitive dry film to make circuit board outer layer circuit preparation process environmental protection more, at a low price.
Another object of the present invention is to the preparation method that above-mentioned dip-coating ink is provided.
Another object of the present invention is to provide the application of above-mentioned dip-coating ink on wiring board outer-layer circuit manufactures.
The present invention proposes a kind of dip-coating ink, comprise each component of following mass parts:
Containing the nitrogenous superpolymer of carboxyl 30 ~ 80 parts;
Ketones solvent or benzamide type solvent 20 ~ 60 parts;
Wetting agent 0.01 ~ 0.2 part;
Shown in the described following formula I of molecular structural formula containing the nitrogenous superpolymer of carboxyl or formula II:
Wherein, in described formula I or formula II:
R
1for
R
2for
R
3for containing 8 ~ 30 carbon atoms
Wherein, m is for meeting R
3containing the value of 8-30 carbon atom;
Containing the nitrogenous molecular weight of high polymer of carboxyl between 1000 ~ 10000, the carboxyl-content containing the nitrogenous superpolymer of carboxyl accounts for 1 ~ 10% of total molecular weight.
Preferably, described dip-coating ink also comprises the dyestuff of 0.01 ~ 0.2 mass parts.
Preferably, described dip-coating ink comprises each component of following mass parts:
Preferably, described ketones solvent is at least one in acetone or butanone; Described benzamide type solvent is dimethyl formamide.
Preferably, described wetting agent is silicone polymkeric substance.
Preferably, described dyestuff is the gorgeous indigo plant of alcohol insoluble basic.
Invention further provides the preparation method of above-mentioned dip-coating ink, comprise following concrete steps:
(1) tolylene diisocyanate of the dimethylol propionic acid of 3 ~ 30 mass parts, 6 ~ 60 mass parts and the terminal hydroxy group oligopolymer of 10 ~ 50 mass parts are reacted 1 ~ 20h under 0 ~ 100 DEG C of condition, obtained containing the nitrogenous superpolymer of carboxyl;
(2) by the wetting agent mixing of the ketones solvent containing the nitrogenous superpolymer of carboxyl, 20 ~ 60 mass parts obtained for 30 ~ 80 mass parts steps (1) or benzamide type solvent and 0.01 ~ 0.2 mass parts, and after stirring, grinding, obtained mixture;
(3) mixture obtained for described step (2) is filtered, obtained dip-coating ink.
Preferably, in described step (1), described terminal hydroxy group oligopolymer is at least one in polyoxyethylene glycol, polytetramethylene glycol or polytetrahydrofuran;
Described step (2) is more specifically: by the ketones solvent containing the nitrogenous superpolymer of carboxyl, 20 ~ 60 mass parts of 30 ~ 80 mass parts or benzamide type solvent, the wetting agent of 0.01 ~ 0.2 mass parts and the dyestuff mixing of 0.01 ~ 0.2 mass parts, and after stirring, grinding, obtained mixture.
Preferably, in step (2), described stirring is stir 10 ~ 20min under 100 ~ 1500 revs/min of speed;
In step (3), described mixture is through 1 ~ 5 micron pore size screen filtration.
The present invention further provides the application that above-mentioned dipping ink online road plate outer-layer circuit manufactures.
The invention provides a kind of dip-coating ink and preparation method thereof and application.Dip-coating ink of the present invention comprises 30 ~ 80 mass parts containing the nitrogenous superpolymer of carboxyl, 20 ~ 60 mass parts ketones solvents and benzamide type solvent and 0.01 ~ 0.2 mass parts wetting agent, and composition material is simple and easy to get, cost is low; The preparation method of dip-coating ink of the present invention is simple, is suitable for mass productization and produces.Dip-coating ink of the present invention is applied in wiring board outer-layer circuit and manufactures; by dip-coating ink being evenly coated on copper coin surface (comprising conductive hole hole wall); play the provide protection that in former technique, photosensitive dry film is same; to being coated with the copper coin of dip-coating ink after laser-engraving technique process; can reach the effect that in former technique, photosensitive dry film can reach, and dip-coating ink usage of the present invention is less; emit no waste water, be beneficial to environment protection.
Embodiment
Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
The invention provides a kind of dip-coating ink, comprise each component of following mass parts: 30 ~ 80 parts containing the nitrogenous superpolymer of carboxyl, 20 ~ 60 parts of ketones solvents or benzamide type solvent and 0.01 ~ 0.2 part of wetting agent, wherein, containing shown in the following formula I of molecular structural formula of the nitrogenous superpolymer of carboxyl or formula II:
Wherein, in described formula I or formula II:
R
1for
R
2for
R
3for containing 8 ~ 30 carbon atoms
Wherein, m is for meeting R
3containing the value of 8-30 carbon atom.
In actual application; the nitrogenous molecular weight of high polymer of carboxyl that contains of the present invention is between 1000 ~ 10000; and; 1 ~ 10% of total molecular weight should be accounted for containing the carboxyl-content of the nitrogenous superpolymer of carboxyl; wherein, have important effect containing the carboxyl-content in the nitrogenous superpolymer of carboxyl for the performance of dip-coating ink, as carboxyl-content is low, ink is difficult to alkali lye and peels off; as carboxyl-content is too high, ink is difficult to the attack resisting etching solution, is unfavorable for the protection of ink to copper face.
In addition, dip-coating ink of the present invention more preferably includes 60 ~ 80 mass parts containing the nitrogenous superpolymer of carboxyl, 20 ~ 40 mass parts ketones solvents or benzamide type solvent, 0.01 ~ 0.2 mass parts wetting agent and 0.01 ~ 0.2 mass parts dyestuff, wherein, when the solid content (i.e. the content of the nitrogenous superpolymer of carboxyl) in dip-coating ink higher than 60% time, ink viscosity can be low to moderate 300 centipoises under 25.C condition, and this dip-coating ink can form the dry ink thickness of thickness 5 ~ 15um between the copper facing conductive hole hole wall of 0.01 ~ 2mm in diameter 0.05 ~ 6mm, length.
The present invention further provides the preparation method of above-mentioned dip-coating ink, comprises following concrete steps:
(1) tolylene diisocyanate of the dimethylol propionic acid of 3 ~ 30 mass parts, 6 ~ 60 mass parts and the terminal hydroxy group oligopolymer of 10 ~ 50 mass parts are reacted 1 to 20 hour under 0 ~ 100 DEG C of condition, obtained containing the nitrogenous superpolymer of carboxyl;
(2) by the wetting agent mixing of the ketones solvent containing the nitrogenous superpolymer of carboxyl, 20 ~ 60 mass parts obtained for 30 ~ 80 mass parts steps (1) or benzamide type solvent and 0.01 ~ 0.2 mass parts, and after stirring, grinding, obtained mixture;
(3) mixture obtained for described step (2) is filtered, obtained dip-coating ink.
In the preparation process of dip-coating ink of the present invention, first the nitrogenous superpolymer of carboxyl is contained by preparing a kind of necessary component mixing being obtained at 0 ~ 100 DEG C, then this coordinated the simple mix and blend grinding of other each components containing the nitrogenous superpolymer of carboxyl and obtain after filtering, preparation method is simple, starting material are conventional to be easy to get, and is suitable for large-scale commercial production.
In addition, dip-coating ink of the present invention can be according to actual needs, such as regulate the color of dip-coating ink, in step (2), the dyestuff adding 0.01 ~ 0.2 mass parts in the ketone solution of nitrogenous for the carboxyl of 30 ~ 80 mass parts superpolymer, 20 ~ 60 mass parts and the wetting agent of 0.01 ~ 0.2 mass parts again can be realized.
Invention still further provides the application that above-mentioned dipping ink online road plate outer-layer circuit manufactures; by by dip-coating ink after copper-clad plate surface (comprising conductive hole hole wall) is evenly coated; play the provide protection that in former technique, photosensitive dry film is same; again after laser-engraving technique process; can reach the effect that in former technique, photosensitive dry film can reach, and dip-coating ink usage of the present invention is less; emit no waste water, be beneficial to environment protection.
The present invention describes further by following examples according to technique scheme content.
Embodiment 1
(1) by the terminal hydroxy group oligopolymer (cetomacrogol 1000, commercially available) of the dimethylol propionic acid of 3g, the tolylene diisocyanate of 6g and 50g reaction response 1 hour under 100 DEG C of conditions, obtained containing the nitrogenous superpolymer of carboxyl;
(2) the nitrogenous superpolymer of carboxyl, the acetone of 20g, the silicone polymkeric substance (BYK-378 of 0.2g is contained by what obtain in 80g step (1), Germany Bi Ke) mixing, and under 1500 revs/min, stir 10min, grinding, obtained mixture;
(3) by the mixture 5 micron pore size screen filtrations that step (2) is obtained, obtained dip-coating ink 1, the viscosity that rotational viscosimeter VT-04 tests this dip-coating ink is 1000 centipoises.
Embodiment 2
(1) by the terminal hydroxy group oligopolymer (mixed by 3g polyoxyethylene glycol, 3g polytetramethylene glycol and 4g polytetrahydrofuran and form) of the dimethylol propionic acid of 30g, the tolylene diisocyanate of 60g and 10g; React 20 hours under 0 DEG C of condition, obtained containing the nitrogenous superpolymer of carboxyl;
(2) silicone polymer (BYK-378, German Bi Ke) of the acetone containing the nitrogenous superpolymer of carboxyl, 60g obtained for 30g step (1) and 0.01g is mixed, and under 100 revs/min, stir 20min, grinding, obtained mixture;
(3) by the mixture 15 micron pore size screen filtrations that step (2) is obtained, obtained dip-coating ink 2, the viscosity that rotational viscosimeter VT-04 tests this dip-coating ink is 150 centipoises.
Embodiment 3
(1) the terminal hydroxy group oligopolymer (mixed by 3g polyoxyethylene glycol, 3g polytetramethylene glycol and 4g polytetrahydrofuran and form) of the dimethylol propionic acid of 15g, the tolylene diisocyanate of 30g and 20g is reacted 4h under 25 DEG C of conditions, obtained containing the nitrogenous superpolymer of carboxyl;
(2) silicone polymer (BYK-378, German Bi Ke) of the acetone containing the nitrogenous superpolymer of carboxyl, 40g obtained for 60g step (1) and 0.1g is mixed, and under 1000 revs/min, stir 15min, grinding, obtained mixture;
(3) by the mixture 3 micron pore size screen filtrations that step (2) is obtained, obtained dip-coating ink 3, the viscosity that rotational viscosimeter VT-04 tests this dip-coating ink is 300 centipoises.
Embodiment 4
(1) dimethylol propionic acid of 5g, the tolylene diisocyanate of 45 grams and the terminal hydroxy group oligopolymer (mixed by 3g polyoxyethylene glycol, 3g polytetramethylene glycol and 4g polytetrahydrofuran and form) of 25g are reacted 3h under 40 DEG C of conditions, obtained containing the nitrogenous superpolymer of carboxyl;
(2) obtained for the step (1) of 30g is contained the nitrogenous superpolymer of carboxyl, the dimethyl formamide of 60g, the silicone polymer (BYK-378 of 0.01g, Germany Bi Ke) and the gorgeous indigo plant mixing of the alcohol insoluble basic of 0.01g, and 15min is stirred under 1000 revs/min, grinding, obtained mixture;
(3) by the mixture 4 micron pore size screen filtrations that step (2) is obtained, obtained dip-coating ink 4, the viscosity that rotational viscosimeter VT-04 tests this dip-coating ink is 150 centipoises.
Embodiment 5
(1) the terminal hydroxy group oligopolymer (mixed by 3g polyoxyethylene glycol, 3g polytetramethylene glycol and 4g polytetrahydrofuran and form) of the dimethylol propionic acid of 20g, the tolylene diisocyanate of 32g and 35g is reacted 2 hours under 60 DEG C of conditions, obtained containing the nitrogenous superpolymer of carboxyl;
(2) by 80g containing the nitrogenous superpolymer of carboxyl, the butanone of 20g, the silicone polymer (BYK-378 of 0.2g, Germany Bi Ke) and the gorgeous indigo plant mixing of the alcohol insoluble basic of 0.2g, and under 1300 revs/min, stir 15min, grinding, obtained mixture;
(3) by the mixture 4 micron pore size screen filtrations that step (2) is obtained, obtained dip-coating ink 5, the viscosity that rotational viscosimeter VT-04 tests this dip-coating ink is 1000 centipoises.
Comparative example
(1) 80g terminal carboxyl polyester (commercially available, trade mark P-1000), 20g acetone and 0.2g alkaline bright blue are mixed, under 1300 revs/min, stir 15min, grinding, obtained mixture;
(2) mixture step (1) obtained is through 4 micron pore size screen filtrations, and obtained dip-coating ink 6, rotational viscosimeter VT-04 tests the viscosity of this dip-coating ink more than 10000 centipoises.
Effect example
Choose dip-coating ink 2,3,5,6 obtained in above-described embodiment and comparative example to test, specific experiment method comprises the following steps:
(1) conductive hole diameter 0.05mm ~ 6mm, the copper-clad plate of bore length between 0.01m ~ 2mm is chosen, copper-clad plate is immersed in ink, slowly pull-up after 10 seconds, puts into baking box 80 ~ 100 DEG C baking 5 ~ 10 minutes the copper-clad plate being coated with curing ink, makes the ink setting in copper-clad plate;
(2) laser engraving machine is put in copper-clad plate, by the figure engraving after setting;
(3) the live width line-spacing of figure is measured under the corresponding product that dip-coating ink 2,3,5,6 obtains respectively being shown microcomputer hundred.
Find after microscopic examination, the linewidth error of the product prepared by dip-coating ink 2,3,5 is lower than 5%, and meet production requirement, but be greater than 5% by the linewidth error of dip-coating ink 6 preparing product, do not meet production requirement, data list one is as follows:
Table one
| Example 1 | Example 2 | Example 3 | Example 5 | Example 6 |
| Live width 3 μm | Live width 3.05 μm | Live width 3.04 μm | Live width 3.04 μm | Live width 3.31 μm |
| Line-spacing 3 μm | Line-spacing 2.95 μm | Line-spacing 2.96 μm | Line-spacing 2.96 μm | Line-spacing 2.69 μm |
Dip-coating ink 2,3,5 is mainly than the reason of dip-coating ink 6 superior performance of comparative example, first, compare common containing the nitrogenous superpolymer of carboxyl (as terminal carboxyl polyester) in identical solid content situation, the carboxyl-content containing the nitrogenous superpolymer of carboxyl of the present invention's synthesis accounts for 1 ~ 10% of total molecular weight, very low sticky end can be reached by this ink containing the manufacture of carboxyl nitrogenous superpolymer, when dip application, uniform ink film can be formed in copper-clad plate face and conductive hole inwall copper face; And the common ink made containing the nitrogenous superpolymer of carboxyl due to viscosity too high, all uniform ink film can not be formed at copper face and hole wall, if and a large amount of solvent of simple interpolation reaches the object reducing sticky end, the then corresponding reduction of solid content, can not form the ink surface of uniform thickness (5 ~ 15 microns) equally at copper face and hole wall.
In addition, containing containing proper N in the nitrogenous superpolymer of carboxyl synthesized by the present invention, this makes this superpolymer and ketones solvent and benzamide type solvent have high intermiscibility.
Finally, compared with photosensitive dry film, dip-coating ink 2,3,5 of the present invention does not have waste water to produce in the application process of wiring board outer-layer circuit manufacture.
Shortcoming and defect compared to existing technology, the present invention has the following advantages:
(1) composition material that dip-coating ink of the present invention is used is simple and easy to get, cost is low.
(2) preparation method of dip-coating ink of the present invention is simple, is suitable for mass productization and produces.
(3) dip-coating ink of the present invention is applied in the manufacture of wiring board outer-layer circuit, can play the effect that in former technique, photosensitive dry film is identical, and in addition, dip-coating ink of the present invention also has consumption and less, without waste water produces, and is beneficial to environment protection.
The foregoing is only the preferred embodiments of the present invention; not thereby the scope of the claims of the present invention is limited; every equivalent transformation utilizing description of the present invention to do, or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (10)
1. a dip-coating ink, is characterized in that, comprises each component of following mass parts:
Containing the nitrogenous superpolymer of carboxyl 30 ~ 80 parts;
Ketones solvent or benzamide type solvent 20 ~ 60 parts;
Wetting agent 0.01 ~ 0.2 part;
Shown in the described following formula I of molecular structural formula containing the nitrogenous superpolymer of carboxyl or formula II:
Wherein, in described formula I or formula II:
R
1for
R
2for
R
3for containing 8 ~ 30 carbon atoms
Wherein, m is for meeting R
3containing the value of 8-30 carbon atom;
Containing the nitrogenous molecular weight of high polymer of carboxyl between 1000 ~ 10000, the carboxyl-content containing the nitrogenous superpolymer of carboxyl accounts for 1 ~ 10% of total molecular weight.
2. dip-coating ink as claimed in claim 1, is characterized in that, also comprise the dyestuff of 0.01 ~ 0.2 mass parts.
3. dip-coating ink as claimed in claim 2, is characterized in that, comprise each component of following mass parts:
4. the dip-coating ink as described in any one of claims 1 to 3, is characterized in that, described ketones solvent is at least one in acetone or butanone; Described benzamide type solvent is dimethyl formamide.
5. the dip-coating ink as described in any one of claims 1 to 3, is characterized in that, described wetting agent is silicone polymkeric substance.
6. dip-coating ink as claimed in claim 3, it is characterized in that, described dyestuff is the gorgeous indigo plant of alcohol insoluble basic.
7. the preparation method of the dip-coating ink as described in any one of claim 1 ~ 6, is characterized in that, comprises following concrete steps:
(1) tolylene diisocyanate of the dimethylol propionic acid of 3 ~ 30 mass parts, 6 ~ 60 mass parts and the terminal hydroxy group oligopolymer of 10 ~ 50 mass parts are reacted 1 ~ 20h under 0 ~ 100 DEG C of condition, obtained containing the nitrogenous superpolymer of carboxyl;
(2) by the wetting agent mixing of the ketones solvent containing the nitrogenous superpolymer of carboxyl, 20 ~ 60 mass parts obtained for 30 ~ 80 mass parts steps (1) or benzamide type solvent and 0.01 ~ 0.2 mass parts, and after stirring, grinding, obtained mixture;
(3) mixture obtained for described step (2) is filtered, obtained dip-coating ink.
8. the preparation method of dip-coating ink as claimed in claim 7, it is characterized in that, in described step (1), described terminal hydroxy group oligopolymer is at least one in polyoxyethylene glycol, polytetramethylene glycol or polytetrahydrofuran;
Described step (2) is more specifically: by the ketones solvent containing the nitrogenous superpolymer of carboxyl, 20 ~ 60 mass parts of 30 ~ 80 mass parts or benzamide type solvent, the wetting agent of 0.01 ~ 0.2 mass parts and the dyestuff mixing of 0.01 ~ 0.2 mass parts, and after stirring, grinding, obtained mixture.
9. the preparation method of dip-coating ink as claimed in claim 8, is characterized in that, in step (2), described stirring is stir 10 ~ 20min under 100 ~ 1500 revs/min of speed;
In step (3), described mixture is through 1 ~ 5 micron pore size screen filtration.
10. the application that the dipping ink online road plate outer-layer circuit as described in any one of claim 1 ~ 6 manufactures.
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|---|---|---|---|
| CN201310121862.5A CN103289476B (en) | 2013-04-09 | 2013-04-09 | Dip-coating ink, and preparation method and application thereof |
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|---|---|---|---|
| CN201310121862.5A CN103289476B (en) | 2013-04-09 | 2013-04-09 | Dip-coating ink, and preparation method and application thereof |
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| CN103289476B true CN103289476B (en) | 2014-12-17 |
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| CN1676556A (en) * | 2004-03-30 | 2005-10-05 | 天津科技大学 | Screen printing water-soluble ink |
| JP6025353B2 (en) * | 2011-03-30 | 2016-11-16 | キヤノン株式会社 | Ink jet ink, ink cartridge, and ink jet recording method |
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Effective date of registration: 20160920 Address after: 516100, Guangdong, Huizhou province Boluo County Town Po Village Patentee after: Huizhou Red Forest Industrial Co., Ltd. Address before: 518172, No. 1820-1823, building two, dragon garden, Longcheng street, Longcheng District, Shenzhen City, Guangdong Province, Longgang Patentee before: Wang Junsheng |