CN103281876A - Pit embedded circuit board three-dimensional assembling method - Google Patents
Pit embedded circuit board three-dimensional assembling method Download PDFInfo
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- CN103281876A CN103281876A CN2013102025437A CN201310202543A CN103281876A CN 103281876 A CN103281876 A CN 103281876A CN 2013102025437 A CN2013102025437 A CN 2013102025437A CN 201310202543 A CN201310202543 A CN 201310202543A CN 103281876 A CN103281876 A CN 103281876A
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Abstract
The invention provides a pit embedded circuit board three-dimensional assembling method, which has the advantages of being capable of obviously improving the three-dimensional assembling density of electronic products, reducing the size and the weight and realizing time sequence consistency of transmitting signals of paired used devices. The invention is realized in the following technical scheme that sunken pits for assembling components are designed and manufactured on a printed board, and the selected thin and small components are deployed in the sunken pits of the printed board; appropriate bridging devices are deployed right above the pits to form a pit-type device lamination three-dimensional assembled structural form; wiring in the printed board is carried out according to the circuit design, electrical signal transmission channels are laid among the devices, and are connected with the devices inside and outside the sunken parts through printed conductors on the printed board; patching is carried out on the components on the surface of the printed board (comprising the surfaces of the pits), and device bonding pads are arranged inside and outside the sunken pits and solder paste is coated on the bonding pads according to the device bonding pad design; and the printed board plastered with the components is subjected to reflow soldering, thereby finishing the three-dimensional assembling of the printed board.
Description
Technical field
The invention relates to the three-dimensional package assembly form of electronic panels level.
Background technology
Promoted peripheral pin to face array pin and ball grid array intensive encapsulation development, and impelled it become main flow owing to the development of ultra-large and chip system IC the nineties in last century.Passive device develops into element pasted on surface (SMC), and continue to develop to microminiaturization, the IC device be packaged with surface mount device (SMD), SMD has had very big development in this period, BGA Package BGA, chip size packages CSP, packing forms such as high density high-performance and low-cost FlipChip, multi-chip module MCM have been produced, packaging technology is SMT surface mounting technology and Reflow Soldering, wave-soldering, and continues to thin space and super thin space SMT development.All these impels encapsulation technology more advanced, and chip area more and more levels off to 1 with the ratio of package area, and suitable frequency is higher, and heat resistance is better, and number of pins increases, and pin-pitch reduces, and reliability improves, and uses convenient.Be in popularizing and application period of this technology at present.
Along with the continuation of microelectric technique development, performances such as the speed of device and time of delay are had higher requirement to the interconnection between the device, because interconnect signal delay, crosstalk noise,
Inductance capacitanceCoupling and influence such as electromagnetic radiation are increasing, and the functional circuit that is made of IC and other circuit elements of high-density packages can not satisfy high performance requirement.At present, electronic devices and components are day by day to chip type, microminiaturization, compoundization, the built-inization direction of modularization and substrate develops, the encapsulation of IC is by the quad-flat-pack QFP of one chip, BGA is to CSP, brilliant garden level (WLP) and system in package (SIP) development, passive device is developed into by several identical passive components integrated (IPD) by mounting of surperficial individual devices, realize the leap that encapsulation is designed to the solid space of 3D by the planar design of 2D, thereby make device package amass more miniaturization, the printing board PCB design is more oversimplified, realize more speed, more high density and requirement more cheaply also make printed circuit board main flow multiple-plate direction from FR-4 to the lamination method change.In recent years, the circuit module packaging density increases considerably, and in assembling in form, multiple complicated assembling forms such as the three-dimensional assembling of high density, lamination assembling, little assembling occurred.On electric connecting mode, occurred being connected to salient point connect, flexibly connect, the go between transformation of multiple connected modes such as bonding from solder joint.The three-dimensional package assembly form of plate level from a plurality of printed boards adopt vertical interconnect, side plate is interconnected, the interconnected cable of salient point is interconnected etc., and mutual contact mode realizes that plate is interconnected with the various versions of plate, progressively develop into and adopt various structures such as device (comprising the little printed board assembly of be with standalone feature) is stacked, two-sided assembling to realize that the surperficial solids of printed boards (referring to all kinds of printed boards of surfacing) assemble in single printed board.The tie point fault that produces in the assembling process and electric fault etc. are the outstanding factors that influences the circuit module assembling quality.
More than the three-dimensional assembling of all kinds of plate levels, all based on positive and negative two of printed board table (put down) faces (also have only two surface is installed) are installed, adopt multiple interconnected means to realize that the solid of printed board and components and parts assembles.
But along with constantly widening of development of technology and product demand, present all kinds of three-dimensional package assembly form and interconnected method can not satisfy diversified demand, miniaturization, multi-functional demand force the printing board surface device density high, have had a strong impact on product and have realized; Simultaneously, present signal transmission and information processing requirement, require extremely tight to signal transmission path coupling between the device of pairing use, particularly the signal frequency of system's needs is when several GHz magnitudes, just can't realize by too much, long interconnected path on long bonding wire and the circuit board, for the inhibit signal integrality, need the interconnected of shorter and impedance matching; Moreover in conventional printed board designing wiring process, being the sequential of signal transmission between guarantee two chips (device) sometimes, meeting is the transmission path of prolongation signal specially, but along with the prolongation of transmission path can influence high frequency response again, increase loss; Cause in the printed board that the sequential of signal transmission is difficult to guarantee between device, exist make after the densification, the big problem of assembling difficulty.The method of signal transmission time sequence between device in the existing solution printed board, the main device that will match that adopts designs (namely designing the positive and negative in the printed board same position) back-to-back, or it is arranged in one side, adopt serpentine, guarantee the sequential unanimity of transmission signal.
Adopt design " pit " in the printed board and within it all kinds of devices of outer assembling realize the version of three-dimensional assembling, can for solve above circuit problem, the three-dimensional package assembly type of expansion provides and selects and approach.
Summary of the invention
The objective of the invention is in the present printed board between device the sequential of signal transmission be difficult to guarantee, and make after the densification, the big problem of assembling difficulty, provide a kind of and can save the space, can improve the method that the electrical interconnection of interconnected packaging density encapsulates.
In order to realize above-mentioned purpose of the present invention, the three-dimensional assemble method of the embedding type circuit substrate of a kind of pit provided by the invention, it is characterized in that, comprise the steps: in printed board planning, design and make the sagging pit of assembling components and parts, with thin, the little components and parts layout that chooses in the sagging pit of printed board; The cross-over connection device that layout is suitable directly over " pit " forms the three-dimensional version of assembling of pit type device stack; Carry out connecting up in the printed board according to circuit design, lay signal of telecommunication transmission channel between each device, by the interconnected inside and outside device that sink of printed conductor in the printed board; Then to printing board surface, comprise that pit surface carries out the components and parts paster, according to the device bonding pad design, apply at the soldering paste of the sink inside and outside arranging devices pad 5 of pit and pad 6; Reflow welding is carried out in the printed board that posts components and parts connect, finish the printed board assembling.
The present invention has following beneficial effect than prior art:
The present invention adopts the bowl configurations form, can save the space, with the traditional group packing technique comparatively speaking, more can take full advantage of encapsulated space, realize product miniaturization demand.In the area identical scope, owing to adopted " pit " structure, make and can lay more components and parts in the equal area, be analogous to " the piling up " of having carried out components and parts, thereby dwindled area, taken full advantage of the space, realize miniaturization.
Utilize version of the present invention can improve the three-dimensional packaging density of electronic product significantly, can significantly reduce volume and weight, realize the sequential coherence request that pairing uses the signal of device to transmit." pit " version that the present invention takes, carrying out between device signal transmssion line when laying, very easily realize transmission line weak point, transmission range high conformity, transmission path impedance together, thereby for solving the sequential consistency that signal transmits between device in the printed board, provide new approaches and methods.
" pit " version that the present invention takes has been expanded in " face " of double-clad board.In a printed board, can realize that (printed board one " face " namely can be assembled one deck components and parts, as the single-sided printed board that we often say, namely is to assemble components and parts in one side for three " faces " of components and parts and even four " faces ".Double-clad board namely is all can assemble components and parts at two faces).
The present invention takes the process implementation method of " pit " version, by existing technology, improves a little or optimization, can realize the reliable assembling to this class formation.
Description of drawings
In order more to be expressly understood the present invention, now will simultaneously with reference to accompanying drawing, the present invention be described by the embodiment of the invention, wherein:
What Fig. 1 showed is " pit " version shape appearance figure that the present invention adopts.
That Fig. 2 shows is the realization flow figure that adopts " pit " structure.
Among the figure: 1 printed board.2 sagging pits, 3 cross-over connection devices, 4 interior assembly devices, 5 pads, 6 components and parts device solder joints, 7 transfer wires.
Embodiment
Consult Fig. 1.According to the present invention, in a most preferred embodiment described below, the sagging pit 2 of assembling components and parts is at first planned, designs and make to the three-dimensional package assembly of the embedding type circuit substrate of pit in printed board.In printed board 1 manufacture process, by to the control of printed board 1 each layer profile, form the pit 2 that sink.According to the circuit theory design, carry out wires design in the printed board 1 then, finish signal of telecommunication transmission channel laying between each device; The suitable cross-over connection device 3 of layout directly over the assembly device 4 in the pit 2 that sink is such as the device of lead-in wire around layout designs plastic packaging leaded chip carrier PLCC, the quad flat non-pin package QFN etc. above sinking pit 2 in printed board 1.With thin, the little components and parts that choose, as layouts such as small size BGA encapsulation, CSP packagings in the sagging pit 2 of printed board 1; Form the version of the three-dimensional assembling of device pit type lamination; By the interconnected inside and outside device that sink of printed conductor in the printed board; Adopt chip mounter secondary paster or maintenance work station then, to printing board surface, comprise that the pit that sink carries out the components and parts paster.Also can carry out paster, welding assembly at twice to the components and parts inside and outside the pit that sink respectively, realize reliable interconnect.According to device bonding pad 5 designs, in sagging pit 2 inside and outside layout components and parts solder joint 6 corresponding pads and device bonding pad 5; During assembling, sink pit 2 inside and outside components and parts solder joint 6 corresponding pads and device bonding pad 5 are carried out soldering paste respectively to apply, the pit 2 interior components and parts solder joint 6 corresponding pads that sink apply the low temperature soldering paste, the pit 2 outer components and parts pads 5 that sink apply the slightly high soldering paste of fusing point, guarantee the temperature ladder, form the essential condition that welding needs, welding realizes thereby reach once.Reflow welding is carried out in the printed board that posts components and parts to be connect.
Shown in Figure 2: as at first to carry out printed board planning.When printed board designed, as required, in conjunction with the components and parts encapsulation, planning formed each sagging pit.Can select various encapsulated type sizes as required, highly design forms the sagging pit 2 be complementary with it, determine to need to adopt components and parts and the position of sagging bowl configurations form, and definite pit area size, degree of depth etc. of sinking, carry out the design of printed board contour structures, on this basis, carry out components and parts solder joint 6 corresponding pads and device bonding pad 5 layings.Arrange all kinds of device assembling pads that pairing is used at pit 2 inner bottom surfaces that sink, then according to the circuit design needs, carry out printed board interconnected lead and lay, form the electrical property path.After finishing the printed board design, be with the pit printed board manufacturing of sinking, by adopting printed board layering and printed board manufacturing technology, the production of pit 2 printed boards of sinking is with in realization.In pit assembly device 4 just above assembling active, the passive device 3 that need.In the pit 2 that sink and directly over arrange the device of pairing use.Carry out interconnected laying between device in the plate by PCB routing design related request, realize pressing between device pin the electrical schematic diagram interconnection.Sink in the pit 2 and directly over 3 of the devices arranged, realize interconnected by printed conductor, buried blind via etc.
On the inside and outside printing pad of sagging pit, adopt some glue to apply, print modes such as coating, silk-screen mode and realize that the required soldering paste of the sagging inside and outside assembling of pit applies; Adopt surface mounting technology again, as adopting chip mounter secondary paster or maintenance work station paster mode, printing board surface is comprised that components and parts carry out paster in the pit that sink.Connect equipment by reflow welding at last and weld, form the components and parts solder joint 6 that satisfies reliability requirement.Sink pit 2 inside and outside devices and printed board pad 5 by tin-lead solder, by surface-assembled (SMT) technology or other electrical interconnection methods, realize that by the signal transmission wire of laying 7 signal reliably transmits between device.And by manual pasting or chip mounter paster mode, realize that the printing board surface components and parts mount, adopting reflow welding to connect the outer components and parts of realization " pit " at last reliably assembles, the three-dimensional package assembly assembly of " pit " formula of formation, thereby the interconnected reliable assembling of all components and parts in the realization printed board, the three-dimensional package assembly of " pit " formula that forms.
Claims (5)
1. the three-dimensional assemble method of the embedding type circuit substrate of a pit is characterized in that, comprise the steps: in printed board planning, design and make the sagging pit of assembling components and parts, with thin, the little components and parts layout that chooses in the sagging pit of printed board; The cross-over connection device that layout is suitable directly over " pit " forms the three-dimensional version of assembling of pit type device stack; Carry out connecting up in the printed board according to circuit design, lay signal of telecommunication transmission channel between each device, by the interconnected inside and outside device that sink of printed conductor in the printed board; Then to printing board surface, comprise that pit surface carries out the components and parts paster, according to the device bonding pad design, in the soldering paste coating of the sink inside and outside arranging devices pad of pit (5) and pad (6); Reflow welding is carried out in the printed board that posts components and parts connect, finish the printed board assembling.
2. the three-dimensional assemble method of the embedding type circuit substrate of pit according to claim 1, it is characterized in that, arrange all kinds of device assembling pads that pairing is used at pit (2) inner bottom surface that sink, then according to the circuit design needs, carry out printed board interconnected lead and lay, form the electrical property path.
3. the three-dimensional assemble method of the embedding type circuit substrate of pit according to claim 1 is characterized in that, carries out interconnected laying between device in the plate by PCB routing design related request, realizes pressing between device pin the electrical schematic diagram interconnection.
4. according to the three-dimensional assemble method of the embedding type circuit substrate of the described pit of claim 1, it is characterized in that, in the pit (2) that sink and directly between the device (3) arranged, realize interconnected by printed conductor, buried blind via.
5. according to the three-dimensional assemble method of the embedding type circuit substrate of the described pit of claim 1, it is characterized in that, by manual pasting or chip mounter paster mode, realize that the printing board surface components and parts mount, adopt reflow welding to connect the outer components and parts of realization " pit " at last and reliably assemble, the three-dimensional package assembly assembly of " pit " formula that forms.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2013102025437A CN103281876A (en) | 2013-05-28 | 2013-05-28 | Pit embedded circuit board three-dimensional assembling method |
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| CN2013102025437A CN103281876A (en) | 2013-05-28 | 2013-05-28 | Pit embedded circuit board three-dimensional assembling method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105188255A (en) * | 2015-08-03 | 2015-12-23 | 浪潮集团有限公司 | Method for designing non-branched compatible circuit in PCB |
| CN110062526A (en) * | 2019-04-24 | 2019-07-26 | 南京工程学院 | A kind of PCB circuit board of the patch electronics element based on safety |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6324067B1 (en) * | 1995-11-16 | 2001-11-27 | Matsushita Electric Industrial Co., Ltd. | Printed wiring board and assembly of the same |
| CN101159259A (en) * | 2007-11-09 | 2008-04-09 | 中国科学院上海微***与信息技术研究所 | Three-dimensional multiple chips packaging module and preparation method |
| JP2010103548A (en) * | 2005-10-04 | 2010-05-06 | Samsung Electro-Mechanics Co Ltd | Printed circuit substrate with built-in electronic device, and manufacturing method therefor |
-
2013
- 2013-05-28 CN CN2013102025437A patent/CN103281876A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6324067B1 (en) * | 1995-11-16 | 2001-11-27 | Matsushita Electric Industrial Co., Ltd. | Printed wiring board and assembly of the same |
| JP2010103548A (en) * | 2005-10-04 | 2010-05-06 | Samsung Electro-Mechanics Co Ltd | Printed circuit substrate with built-in electronic device, and manufacturing method therefor |
| CN101159259A (en) * | 2007-11-09 | 2008-04-09 | 中国科学院上海微***与信息技术研究所 | Three-dimensional multiple chips packaging module and preparation method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105188255A (en) * | 2015-08-03 | 2015-12-23 | 浪潮集团有限公司 | Method for designing non-branched compatible circuit in PCB |
| CN110062526A (en) * | 2019-04-24 | 2019-07-26 | 南京工程学院 | A kind of PCB circuit board of the patch electronics element based on safety |
| CN110062526B (en) * | 2019-04-24 | 2021-10-15 | 南京工程学院 | PCB circuit board based on safe paster electronic component |
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Application publication date: 20130904 |