CN103264219B - The preparation method of a kind of tungsten, oxygen-free copper composite material - Google Patents
The preparation method of a kind of tungsten, oxygen-free copper composite material Download PDFInfo
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- CN103264219B CN103264219B CN201310216988.0A CN201310216988A CN103264219B CN 103264219 B CN103264219 B CN 103264219B CN 201310216988 A CN201310216988 A CN 201310216988A CN 103264219 B CN103264219 B CN 103264219B
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Abstract
The invention discloses the preparation method of a kind of tungsten, oxygen-free copper composite material, the composite material and preparation method thereof of especially a kind of electron tube oxygen-free copper and tungsten, described method comprises the steps, carries out surface treatment to needing the metal material of compound; Form interference fit between the part that the fixture made by high temperature low-expansion material or metal material are made, keep in touch state by between the metal material after process; The various metals material of the state of keeping in touch is placed with in the high temperature furnace of reducing atmosphere and heats 930-1000 DEG C, behind temperature retention time >=2 hour, with stove cooling down.The oxygen-free copper obtained after compound and the composite of tungsten can carry out processing and welding, comprise car, milling, mill and Linear cut etc., also pickling can be carried out, when welding the composite of described oxygen-free copper and tungsten, do not find there is any impact to the binder course of oxygen-free copper and tungsten when welding temperature≤900 DEG C.
Description
Technical field
The invention belongs to field of composite material preparation, be specifically related to a kind of oxygen-free copper of electron tube and the composite material and preparation method thereof of tungsten.
Background technology
(some high energy device and ionic devices are comprised) in microwave electron tube, during described devices function, the electrons of emission of cathode is under action of high voltage, with sizable electron energy bombardment nucleophobic piece surface that connects, cause this local, surface or overall ablation, thus cause the meeting such as surface smoothness, size off-design requirement along with prolongs operating time, device is scrapped in advance.Such as, cavity in oscillating device, anode or some other parts just belong to this type of situation.At present, owing to considering the many reasons such as electric conductivity, loss of device, great majority all adopt oxygenless copper material to make this parts thereof, therefore, receiving the local surfaces of electronics or Ions Bombardment, must have certain thickness metal material to make up the deficiency of oxygen-free copper with a kind of high temperature resistant, resistance to bombardment, and tungsten is best selection.The methods such as oxygen-free copper surface available vapour deposition, sputtering, thermal spraying carry out coated with tungsten, but its thickness is restricted, and generally only has below 0.1mm, and tungsten layer thickness will be made to reach more than 1mm, also cannot realize.If the two is combined by the method that tungsten and oxygen-free copper utilize high-temperature solder to weld, its heat resistance can be reduced, therefore, how tungsten and oxygen-free copper are firmly connected by non-solder method and the needs of existing machining and follow-up welding can be accepted, there is very real meaning.
Summary of the invention
The object of the invention is to solve the problems of the technologies described above, the preparation method of a kind of tungsten, oxygen-free copper composite material is provided, especially the composite material and preparation method thereof of electron tube, described method cost is low, efficiency is high, be easy to realization, and between the composite material that described method is made, bond strength is high.
Realizing technical scheme of the present invention is: the preparation method of a kind of tungsten, oxygen-free copper composite material, described method comprises the steps:
1) to needing the metal material of compound to carry out surface treatment, described surface treatment is one or more in pickling, alkali cleaning, Ultrasonic Cleaning;
2) by the 1st) keep in touch state between metal material to be composite after step process, the described state of keeping in touch is that the fixture made by high temperature low-expansion material makes to keep in touch state between metal material, or forms interference fit between the part made of metal material and make to keep in touch state between metal material;
3) the various metals material of the state of keeping in touch is placed with in the high temperature furnace of the reducing atmosphere of hydrogen is heated to 930-1000 DEG C, temperature retention time>=2 hour, with stove cooling down; Or heating in a vacuum, vacuum is≤1 × 10
-4p
a
, tungsten plate dull and stereotyped to oxygen-free copper carries out compound tense, stacked by tungsten/copper/tungsten order, then by high temperature low-expansion material, described stacked metal material is tightened, to make can keep enough pressure in the process that heats at high temperature furnace between described no-oxygen copper plate and tungsten plate.
When by anaerobic copper ring inner circle and tungsten compound tense, the tungsten ring of interference fit will be formed or tungsten bar embeds in anaerobic copper ring with described anaerobic copper ring inner circle, again anaerobic copper ring cylindrical high temperature low-expansion material is tightened, to make can keep enough pressure between anaerobic copper ring inner circle and tungsten ring or tungsten bar in high temperature furnace heating process.
Oxygen-free copper inner ring and tungsten bar value of interference fit are generally 0.04-0.07mm.
Described high temperature low-expansion material is molybdenum, molybdenum nickel or tungsten.
The invention has the beneficial effects as follows: to the oxygen-free copper after high temperature furnace heating and the composite of tungsten, the thickness of tungsten can reach more than 1mm, composite can be processed and weld, comprise car, milling, mill and Linear cut etc., also pickling can be carried out, when welding the composite of described oxygen-free copper and tungsten, do not find there is any impact to the binder course of oxygen-free copper and tungsten when welding temperature≤900 DEG C.
Accompanying drawing explanation
The schematic diagram of Fig. 1 anaerobic copper ring inner circle and tungsten compound;
The schematic diagram of Fig. 2 anaerobic copper ring cylindrical and tungsten compound;
The two-sided schematic diagram with tungsten compound of Fig. 3 no-oxygen copper plate;
Number in the figure: 1-tungsten material, 2-oxygenless copper material, 3-molybdenum filament, 4-molybdenum sheet, the fixture that 5-tungsten material makes.
Detailed description of the invention
The present invention is illustrated below in conjunction with example.
Embodiment 1:
Anaerobic copper ring inner circle and tungsten ring carry out compound tense, cooperatively interacting with tungsten ring cylindrical the face fineness contacted to oxygen-free copper inner circle should more than 0.4, Ultrasonic Cleaning, described anaerobic copper ring inner circle and tungsten ring cylindrical interference fit, oxygen-free copper cylindrical wrapping molybdenum sheet also ties up molybdenum nickel wire or tungsten filament, to make can keep enough pressure between anaerobic copper ring inner circle and tungsten ring cylindrical in high temperature furnace heating process, in general, between oxygen-free copper inner circle and tungsten ring cylindrical, value of interference fit is 0.04 ~ 0.07mm, the high temperature furnace that anaerobic copper ring and tungsten ring are placed in hydrogen is heated, heating-up temperature is 930-1000 DEG C, temperature retention time >=2 hour, with stove cooling down.More than 1mm can be reached to the thickness of composite tungsten of the oxygen-free copper after high temperature furnace heating and tungsten, composite can carry out processing and normal weld, comprise car, milling, mill and Linear cut etc., also pickling can be carried out, when welding the composite of described oxygen-free copper and tungsten, do not find there is any impact to the binder course of oxygen-free copper and tungsten when welding temperature≤900 DEG C.
Embodiment 2:
Anaerobic copper ring cylindrical and tungsten ring carry out compound tense, the face fineness that contacts is cooperatively interacted more than 0.4 to oxygen-free copper cylindrical and tungsten ring inner circle, Ultrasonic Cleaning, described anaerobic copper ring cylindrical and tungsten ring inner circle interference fit, in general, between oxygen-free copper cylindrical and tungsten ring inner circle, value of interference fit is 0.04 ~ 0.07mm, the high temperature furnace that anaerobic copper ring and tungsten ring are placed in hydrogen is heated, heating-up temperature is 930-1000 DEG C, temperature retention time >=2 hour, with stove cooling down.More than 1mm can be reached to the thickness of composite tungsten of the oxygen-free copper after high temperature furnace heating and tungsten, composite can carry out processing and welding, comprise car, milling, mill and Linear cut etc., also pickling can be carried out, when welding the composite of described oxygen-free copper and tungsten, do not find there is any impact to the binder course of oxygen-free copper and tungsten when welding temperature≤900 DEG C.
Embodiment 3:
Oxygen-free copper is dull and stereotyped, tungsten plate carries out compound tense, the face fineness of contact is cooperatively interacted more than 0.4 to no-oxygen copper plate, tungsten plate, Ultrasonic Cleaning, then tungsten plate/copper coin/tungsten plate order is pressed stacked, described stacked metal material is compressed by the fixture made by tungsten material, and heated by the high temperature furnace that no-oxygen copper plate and tungsten plate are placed in hydrogen, heating-up temperature is 930-1000 DEG C, temperature retention time >=2 hour, with stove cooling down.More than 1mm can be reached to the thickness of composite tungsten of the no-oxygen copper plate after high temperature furnace heating and tungsten plate, composite can carry out processing and welding, comprise car, milling, mill and Linear cut etc., also pickling can be carried out, when welding the composite of described oxygen-free copper and tungsten, do not find there is any impact to the binder course of oxygen-free copper and tungsten when welding temperature≤900 DEG C.
Claims (5)
1. a preparation method for tungsten, oxygen-free copper composite material, is characterized in that: described method comprises the steps:
1) to needing the metal material of compound to carry out surface treatment, described surface treatment is one or more in pickling, alkali cleaning, Ultrasonic Cleaning;
2) by the 1st) keep in touch state between metal material to be composite after step process, the described state of keeping in touch is that the fixture made by high temperature low-expansion material makes to keep in touch state between metal material, or forms interference fit between the part made of metal material and make to keep in touch state between metal material;
3) the various metals material of the state of keeping in touch is placed with in the high temperature furnace of the reducing atmosphere of hydrogen is heated to 930-1000 DEG C, temperature retention time>=2 hour, with stove cooling down; Or heating in a vacuum, vacuum is≤1 × 10
-4p
a.
2. the preparation method of tungsten as claimed in claim 1, oxygen-free copper composite material, it is characterized in that: compound tense is carried out to no-oxygen copper plate, tungsten plate, stacked by tungsten/copper/tungsten order, then by high temperature low-expansion material, described stacked metal material is tightened, to make can keep enough pressure in the process that heats at high temperature furnace between described no-oxygen copper plate and tungsten plate.
3. the preparation method of tungsten as claimed in claim 1, oxygen-free copper composite material, it is characterized in that: by anaerobic copper ring inner circle and tungsten compound tense, the tungsten ring of interference fit will be formed or tungsten bar embeds in anaerobic copper ring with described anaerobic copper ring inner circle, again anaerobic copper ring cylindrical high temperature low-expansion material is tightened, to make can keep enough pressure between anaerobic copper ring inner circle and tungsten ring or tungsten bar in high temperature furnace heating process.
4. the preparation method of tungsten as claimed in claim 3, oxygen-free copper composite material, is characterized in that: anaerobic copper ring inner circle and tungsten bar value of interference fit are 0.04-0.07mm.
5. the tungsten as described in claim 1,2 or 3, the preparation method of oxygen-free copper composite material, is characterized in that: described high temperature low-expansion material is molybdenum, molybdenum nickel or tungsten.
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| CN201310216988.0A CN103264219B (en) | 2013-06-04 | 2013-06-04 | The preparation method of a kind of tungsten, oxygen-free copper composite material |
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| CN201310216988.0A CN103264219B (en) | 2013-06-04 | 2013-06-04 | The preparation method of a kind of tungsten, oxygen-free copper composite material |
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| CN103264219B true CN103264219B (en) | 2015-09-30 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104070284B (en) * | 2014-07-10 | 2016-04-27 | 中航力源液压股份有限公司 | A kind of tubing and the welded diffusion welding method of tubing |
| CN104625623A (en) * | 2014-12-15 | 2015-05-20 | 中国航空工业集团公司北京航空材料研究院 | Cu-W/Cu-Cu composite board preparation method |
| CN107335880B (en) * | 2017-06-15 | 2019-10-01 | 湖北汉光科技股份有限公司 | The processing method of high-power klystron microwave output window closure |
| CN111687530B (en) * | 2019-03-12 | 2022-02-01 | 中南大学 | Method for compounding hydrogen absorption expansion substance and other materials |
| CN111618415A (en) * | 2020-05-28 | 2020-09-04 | 北京朗信智能科技有限公司 | Diffusion welding method |
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| US3909917A (en) * | 1973-08-09 | 1975-10-07 | Viktor Fedorovich Lebedev | Method of brazing refractory metals and compounds based thereon |
| CN85107155A (en) * | 1985-09-19 | 1987-04-08 | 王新魂 | The solid-state pressure diffusion welding (DW) of no silver alloy solder sealing-in pottery and Ke watt, pottery and copper |
| JPH02121781A (en) * | 1988-10-31 | 1990-05-09 | Brother Ind Ltd | Liquid phase diffusion joining method using powder brazing filler metal |
| CN1198191A (en) * | 1995-04-21 | 1998-11-04 | 材料研究有限公司 | Method of making sputter target/backing plate assembly |
| CN101518848A (en) * | 2009-03-25 | 2009-09-02 | 山东大学 | Method for preparing magnesium and aluminum dissimilar metal clad plate |
| CN101704160A (en) * | 2009-12-03 | 2010-05-12 | 西安交通大学 | Heterogeneous metal connecting method for tungsten, copper and alloy thereof |
| CN102728944A (en) * | 2011-04-01 | 2012-10-17 | 光洋应用材料科技股份有限公司 | Diffusion bonding method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1166466C (en) * | 2001-09-18 | 2004-09-15 | 长沙升华微电子材料有限公司 | Method for producing copper-molybdenum-copper three layer composite plate |
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2013
- 2013-06-04 CN CN201310216988.0A patent/CN103264219B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3909917A (en) * | 1973-08-09 | 1975-10-07 | Viktor Fedorovich Lebedev | Method of brazing refractory metals and compounds based thereon |
| CN85107155A (en) * | 1985-09-19 | 1987-04-08 | 王新魂 | The solid-state pressure diffusion welding (DW) of no silver alloy solder sealing-in pottery and Ke watt, pottery and copper |
| JPH02121781A (en) * | 1988-10-31 | 1990-05-09 | Brother Ind Ltd | Liquid phase diffusion joining method using powder brazing filler metal |
| CN1198191A (en) * | 1995-04-21 | 1998-11-04 | 材料研究有限公司 | Method of making sputter target/backing plate assembly |
| CN101518848A (en) * | 2009-03-25 | 2009-09-02 | 山东大学 | Method for preparing magnesium and aluminum dissimilar metal clad plate |
| CN101704160A (en) * | 2009-12-03 | 2010-05-12 | 西安交通大学 | Heterogeneous metal connecting method for tungsten, copper and alloy thereof |
| CN102728944A (en) * | 2011-04-01 | 2012-10-17 | 光洋应用材料科技股份有限公司 | Diffusion bonding method |
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