CN103252804A - Groove processing tool and groove processing apparatus for substrate - Google Patents
Groove processing tool and groove processing apparatus for substrate Download PDFInfo
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- CN103252804A CN103252804A CN2013100103713A CN201310010371A CN103252804A CN 103252804 A CN103252804 A CN 103252804A CN 2013100103713 A CN2013100103713 A CN 2013100103713A CN 201310010371 A CN201310010371 A CN 201310010371A CN 103252804 A CN103252804 A CN 103252804A
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- 238000012545 processing Methods 0.000 title claims abstract description 75
- 239000000758 substrate Substances 0.000 title claims abstract description 49
- 238000012423 maintenance Methods 0.000 claims description 19
- 230000007246 mechanism Effects 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 6
- 238000011144 upstream manufacturing Methods 0.000 claims description 5
- 230000000717 retained effect Effects 0.000 abstract 2
- 239000010408 film Substances 0.000 description 23
- 238000009434 installation Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- DVRDHUBQLOKMHZ-UHFFFAOYSA-N chalcopyrite Chemical compound [S-2].[S-2].[Fe+2].[Cu+2] DVRDHUBQLOKMHZ-UHFFFAOYSA-N 0.000 description 1
- 229910052951 chalcopyrite Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Milling, Broaching, Filing, Reaming, And Others (AREA)
- Photovoltaic Devices (AREA)
Abstract
The invention provides a groove processing tool and a groove processing apparatus for a substrate, which can be used for groove processing relatively accurately without adjustment of processing position even under the condition of replacement of tools. The groove processing tool (2) is retained on a retaining tool (17) and the groove processing tool and the retaining tool move oppositely on the substrate as the processing target together. The tool for forming a groove on the substrate comprises a tool body (36) and a blade tip part (37). The tool body (36) comprises an engaging surface (36a) pressed against the retaining tool (17) and is retained to the retaining tool (17). The blade tip part (37) is formed at the front end of the tool body (36), a reference surface (37a) extending from the engaging surface (36a) continuously and being coplanar with the engaging surface (36a) and has an established width from the reference surface (37a).
Description
Technical field
The invention relates to a kind of groove processing instrument, especially about a kind of maintenance tool that remains in, and with keeping tool one to coexist relatively moving on the substrate as processing object in order to form the groove processing instrument of the substrate of groove at substrate.In addition, the invention relates to a kind of groove processing apparatus that possesses above groove processing instrument.
Background technology
Thin film solar cell is for example by method manufacturing as follows.That is at first the substrate at glass etc. forms the lower electrode film that is made of the Mo film, afterwards, forms groove at the lower electrode film, is divided into short rectangular-shaped whereby.Then, form at the lower electrode film comprise CIGS(Copper Indium Gallium Selenide, CIGS) compound semiconductor film of the chalcopyrite construction compound semiconductor film of film etc.And the part of above-mentioned semiconductor film is band (strip) shape ground by groove processing to be removed and is divided into short rectangular-shapedly, and forms the upper electrode film to cover above-mentioned mode.At last, the part of upper electrode film is by groove processing and peels off bandedly and be divided into short rectangular-shaped.
Groove processing instrument as using in the above method is disclosed in the patent documentation 1.At the groove processing instrument that this patent documentation 1 discloses, have to remain in and keep the tool tool body and be formed at the leading section of tool body and have the blade tip portion of the blade that groove processing uses.
Patent documentation 1: the Japan Patent spy opens the 2011-142235 communique
Learn as waiting from Fig. 3 of patent document 1, at the existing known employed instrument of groove processing apparatus, only be formed with blade at the central portion with the width of the moving direction quadrature of instrument.That is, in existing at interval toward between the installed surface that keeps tool and the blade of instrument.This interval changes according to the mismachining tolerance of instrument itself.
Under this kind situation, when changing the situation of instrument because of the wearing and tearing of instrument etc., there is following situation: because above-mentioned mismachining tolerance causes variable in distance from the instrument installed surface that keeps tool to the blade of instrument.In case this variable in distance then can't precision be processed groove goodly.Therefore, whenever at the instrument of replacing the time, all need to adjust Working position.
Summary of the invention
The objective of the invention is to, overcome the problem that existing groove processing apparatus exists, and provide a kind of groove processing instrument and groove processing apparatus of substrate of new structure, technical problem to be solved comprises, even during the situation of the instrument of replacing, also need not to adjust Working position, but and precision is carried out groove processing goodly.
The groove processing instrument of the substrate of the 1st invention is to remain in the maintenance tool, and coexisting with maintenance tool one, possesses tool body and blade tip portion are arranged in order to form the instrument of groove at substrate as relatively moving on the substrate of processing object.Tool body has the bearing surface that is connected to the maintenance tool, and remains in the maintenance tool.Blade tip portion is formed at the leading section of tool body, and have from bearing surface form continuously and bearing surface with the datum level of one side, and have set width from reference plane.
Herein, blade tip portion has the bearing surface that keeps tool with being installed on of tool body and is the datum level with one side, and forms with set width from this reference plane.Therefore, do not have following situation: the bearing surface of tool body and the distance between the blade are different in each instrument because of mismachining tolerance.Therefore, when the instrument of replacing, the adjustment that need not Working position can precision be processed groove goodly.
The groove processing instrument of substrate of the 2nd invention at the groove processing instrument of the 1st invention, be formed with blade at the front end of blade tip portion, and when moving direction was observed, the leading section that comprises the blade tip portion of blade was square.
Herein, be square owing to comprise the blade tip portion of blade, even the therefore blade of instrument wearing and tearing, the groove width of processing is also for fixing.
The groove processing instrument of the substrate of the 3rd invention at the groove processing instrument of the 2nd invention, at the sidepiece of the blade that is formed with blade tip portion, is formed with the inclined-plane that tilts along with the past moving direction upstream side away from blade.
Herein, owing to be formed with the inclined-plane at the sidepiece of the instrument that is formed with blade, therefore the discharge of the part of the substrate of removing becomes good.Therefore, the situation peeled off such as film that can suppress the groove periphery.
The groove processing instrument of the substrate of the 4th invention, at the groove processing instrument of the 1st or the 2nd invention, it is mobile to keep tool to come and go.In addition, blade tip portion have be formed at moving direction toward the 1st blade of the front end of moving side and the 2nd blade that is formed at the front end that returns side.And the 1st sidepiece and the 2nd sidepiece that is formed with the blade tip portion of the 2nd blade in the blade tip portion that is formed with the 1st blade are formed with the inclined-plane that tilts along with the past moving direction upstream side away from each blade.
Herein, can be achieved as follows situation by making round movement of maintenance tool: the 1st blade with instrument when past moving carries out groove processing, and the 2nd blade with instrument carries out groove processing when returning.In addition, with the 3rd invention in the same manner, the both sides at the instrument that is formed with each blade are formed with the inclined-plane, the discharge of the part of the substrate of therefore removing becomes good.Therefore, the situation peeled off such as film that can suppress the groove periphery.
The groove processing apparatus of the substrate of the 5th invention, form the device of groove along the pattern lines of substrate, possess the platform that the mounting substrate is arranged, the head that the arbitrary groove processing instrument in the 1st to the 4th invention is installed and with so that the travel mechanism that platform and head relatively move in horizontal plane.And head has maintenance tool moving up and down and makes and remains in the pressing member that the groove processing instrument that keeps tool is pressed substrate with set pressing force.
At this device, the groove processing instrument is pressed substrate and is come and gone mobile with set pressing force by pressing member.And, when moving when returning, form groove at substrate.
The groove processing apparatus of substrate of the 6th invention, in the device of the 5th invention, keeping tool is to keep the groove processing instrument, and to have with the swinging axle with the moving direction quadrature be that fulcrum is swung, obtained toward moving position and the oscillating structural member that returns the position.
As above the present invention, have following advantage and beneficial effect at least: even changing the situation of instrument, but also need not to adjust Working position and precision is carried out groove processing goodly.
In sum, the present invention has obvious improvement technically, and has significantly positive technique effect, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and the cooperation Figure of description, be described in detail as follows.
Description of drawings
Fig. 1 is the stereoscopic figure of groove processing apparatus that the groove processing instrument of an example of the present invention is installed.
Fig. 2 is the front view of the head of groove processing apparatus.
Fig. 3 (a) and Fig. 3 (b) are the sides, positive graphic of expression groove processing instrument.
Fig. 4 (a), Fig. 4 (b) and Fig. 4 (c) are the schematic diagrames of the action when groove processing to be described.
[main element symbol description]
1 platform, 2 instruments
3 heads 6 move supporting mechanism
17 keep tool 18 oscillating structural members
19 cylinders 22 keep the tool body
36 tool bodies, 37 blade tip portions
38a, 38b blade 40a, 40b inclined-plane
The specific embodiment
For further set forth the present invention be reach technological means that predetermined goal of the invention takes with and effect, below in conjunction with accompanying drawing and preferred embodiment, the groove processing instrument of the substrate that foundation the present invention is proposed and the specific embodiment, structure, feature and the effect thereof of groove processing apparatus, describe in detail as after.
Fig. 1 represents to be equipped with the stereoscopic figure of groove processing apparatus of the groove processing instrument of an example of the present invention.
[integral body of groove processing apparatus constitutes]
This device possesses platform 1 that mounting substrate W is arranged, the groove processing instrument is installed (below, brief note instrument) 2 head 3 and respectively is two video camera 4 and display 5.
Two video cameras 4 are individually fixed in pedestal 12.Each pedestal 12 can move along the guiding element 14 that is arranged at the past directions X extension of supporting platform 13.But two video camera 4 knee-actions, and the image of taking with each video camera 4 is shown in corresponding display 5.
[head]
In Fig. 2, extract head 3 out and represent.Head 3 has tabular base 16, keeps tool 17 and cylinder 19.
Keep tool 17 to be supported sliding freely at above-below direction with respect to base 16 via not shown rail bar.Keep tool 17 to have support member 23 and the oscillating structural member 18 that keeps tool body 22, is fixed in the surface that keeps tool body 22.
It is tabular to keep tool body 22 to form, and has opening 22a on top.Support member 23 is to be long rectangular-shaped member at horizontal direction, and is formed with the oscillating structural member 18 slotting through hole 23a that lead in inside.
Oscillating structural member 18 is to swing to be supported at freely to keep tool body 22 and support member 23.Oscillating structural member 18 has the instrument installation portion 24 of bottom and extends and the extension 25 of formation toward the top from instrument installation portion 24.
Be formed with groove at instrument installation portion 24, and insert instrument 2 at this groove, further, by fixed head 24a instrument 2 is fixed in the groove.
In the bottom of extension 25, be formed with in the horizontal direction and toward and groove form the hole 25a that the direction of direction quadrature connects.And oscillating structural member 18 is that swing is freely centered by connecting the pin 26 of this hole 25a.Pin 26 is by keeping tool body 22 to support with support member 23.
In the left and right sides of the upper end of extension 25 25b, be provided with 1 couple of limiting member 27a, 27b.As shown in Figure 4, each limiting member 27a, 27b have cylindrical member 28a, the 28b that is fixed in maintenance tool body 22 and spring 29a, the 29b that is inserted in the inside of cylindrical member 28a, 28b.And the front end of each spring 29a, 29b is connected to the upper end 25b of extension 25, and oscillating structural member 18 is maintained at the neutral position shown in Fig. 2 and Fig. 4 (b) whereby.In addition, oscillating structural member 18 swing and press arbitrary spring 29a, 29b, and the upper end 25b of extension 25 is connected to cylindrical member 28a, 28b, limits pendulum angle whereby.
In addition, be provided with spring support member 31 on the top of base 16.Between spring support member 31 and maintenance tool 17, be provided with spring 32, and by spring 32, keep tool 17 to suppress toward tops.Can roughly offset weighing of maintenance tool 17 itself by this spring 32.
The left and right sides keeping tool 17 is provided with 1 couple of gas supply part 34a, 34b.1 couple of gas supply part 34a, 34b are identical formation, and have joint 35 and air nozzle 36 respectively.
[instrument]
Details at Fig. 3 representational tool 2.Fig. 3 (a) is the side view from moving direction viewing tool 2, and this figure (b) is this front view.Moving direction M at Fig. 3 (b) representational tool 2.
Front end in blade tip portion 37 is formed with the 1st blade 38a and the 2nd blade 38b in the both sides of moving direction.Herein, the 1st blade 38a is in order at the blade that carries out groove processing when moving, and the 2nd blade 38b is in order to carry out the blade of groove processing when returning.
In addition, shown in Fig. 3 (a), in blade tip portion 37, with the width W of the direction of moving direction quadrature, the width that forms than the equidirectional of tool body 36 is narrow.As mentioned above, blade tip portion 37 is formed at moving direction, so the width of the blade tip portion 37 of this direction is that to spread all over total length be identical width W.Further, learn according to Fig. 3 (a), the part of blade tip portion 37 sides of tool body 36, be with the width of the direction of moving direction quadrature along with the mode that narrows down near blade tip portion 37 tilts with angle D.
[groove processing action]
When use is carried out the situation of groove processing as above device and to the thin film solar cell substrate, by mobile supporting mechanism 6 head 3 is moved, and platform 1 is moved, and utilize video camera 4 and display 5 that instrument 2 is positioned on the preset lines that forms groove.
After carrying out as above location, drive cylinder 19 and make and keep tool 17 and oscillating structural member 18 to descend, and make the front end contact membrane of instrument 2.The plus-pressure to film of the instrument 2 of this moment is adjusted by the air pressure that is supplied to cylinder 19.
Then, CD-ROM drive motor 10 and head 3 is scanned along the groove processing preset lines.In Fig. 4, schematically show the oscillating structural member 18 of this moment and the posture of instrument 2.
Shown in Fig. 4 (a), when moving (in Fig. 4 for turn right mobile the time), the contact resistance of the film on the 1st blade 38a and the substrate, and oscillating structural member 18 past clockwise direction centered by pin 26 is swung.This swing is connected to the cylindrical member 28a on right side and is limited by the upper end 25b of oscillating structural member 18.Therefore, instrument 2 is kept the inclination attitude shown in Fig. 4 (a), and is connected to the state that film on the substrate and the 2nd blade 38b are not connected to the surface of substrate with the 1st blade 38a, and past+M direction moves and forms groove.
Afterwards, make head 3 with respect to substrate and relativity ground is mobile, and on the groove processing preset lines that instrument 2 is moved to next should descend.Then, ground same as described above is pressed into the film on the substrate with instrument 2 and makes head 3 toward moving with above-mentioned opposite direction.
Shown in Fig. 4 (c), when this returns (in Fig. 4 be toward left side mobile time), the contact resistance of the film on the 2nd blade 38b and the substrate, oscillating structural member 18 is swung toward counter clockwise direction centered by pin 26.This swing is connected to the cylindrical member 28b in left side and is limited by the upper end 25b of oscillating structural member 18.Therefore, instrument 2 is kept the inclination attitude shown in Fig. 4 (c), and is connected to the state that film on the substrate and the 1st blade 38a are not connected to the surface of substrate with the 2nd blade 38b, and past-M direction moves, and forms groove.
As above groove processing in, the fore-end in the blade tip portion 37 that comprises instrument 2 is formed with inclined-plane 40a, 40b, therefore by each blade 38a, 38b and can with the film removed successfully toward substrate top row from.Therefore, the film that can suppress the groove periphery is peeled off.
In addition, when groove processing or groove processing finish, remove the film from strippable substrate from the air nozzle 36 ejection air of each gas supply part 34a, 34b.
Situation in that the blade tip portion 37 of instrument 2 has worn away needs replacing instrument 2.When the replacing of this instrument 2, only need bearing surface 36a with tool body 36 be connected to the surface that keeps tool body 22 and install and get final product.Blade tip portion 37 is from being the datum level with one side with bearing surface 36a, forming with set width, so the position of each blade 38a, 38b can not change to some extent in each instrument.Therefore, when the replacing of instrument 2, the position of blade 38a, 38b can not change before and after changing to some extent, makes when the instrument of replacing the adjustment of the installation site of tool free.
[feature]
(1) blade tip portion 37 forms with set width for the datum level 37a with one side from the bearing surface 36a that is installed on maintenance tool 17 with tool body 36.Therefore, can be in each instrument with respect to the position of each blade 38a, the 38b that keep tool 17 and different, and when the instrument of replacing, need not to carry out the adjustment of Working position.
(2) blade tip portion 37 is for square when moving direction is observed, even therefore blade 38a, 38b abrasion, the groove width of processing is also for fixing.
Therefore (3) at the sidepiece of the instrument 2 that comprises blade tip portion 37, be formed with inclined-plane 40a, 40b, the discharge of removed film become well, and the film that can suppress the groove periphery is peeled off.
[other examples]
The shape of blade tip portion can be carried out various changes.For example, can make the width W shown in Fig. 3 (a) for identical with the width of tool body 36, in addition also can be greater than the width of tool body 36.In addition, also can be with the sidepiece of the blade of angle formation arbitrarily.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the method that can utilize above-mentioned announcement and technology contents are made a little change or be modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, any simple modification that foundation technical spirit of the present invention is done above embodiment, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (6)
1. the groove processing instrument of a substrate remains in the maintenance tool, and coexisting with above-mentioned maintenance tool one relatively moves on the substrate as processing object, and in order to form groove at substrate, it is characterized in that possessing:
Tool body has the bearing surface that is connected to above-mentioned maintenance tool, and remains in above-mentioned maintenance tool; And
Blade tip portion is formed at the leading section of above-mentioned tool body, and have from above-mentioned bearing surface form continuously and above-mentioned bearing surface with the datum level of one side, and have set width from the said reference face.
2. the groove processing instrument of substrate as claimed in claim 1 is characterized in that wherein, is formed with blade at the front end of above-mentioned blade tip portion, and the leading section that comprises the above-mentioned blade tip portion of above-mentioned blade is square when moving direction is observed.
3. the groove processing instrument of substrate as claimed in claim 2 is characterized in that wherein, at the sidepiece of the blade that is formed with above-mentioned blade tip portion, be formed with along with away from above-mentioned blade toward the inclined-plane that the moving direction upstream side tilts.
4. the groove processing instrument of substrate as claimed in claim 1 or 2 is characterized in that wherein, and above-mentioned maintenance tool comes and goes mobile;
Above-mentioned blade tip portion, have be formed at moving direction toward the 1st blade of the front end of moving side and the 2nd blade that is formed at the front end that returns side;
The 1st sidepiece of the above-mentioned blade tip portion that is formed with above-mentioned the 1st blade, with the 2nd sidepiece of the above-mentioned blade tip portion that is formed with above-mentioned the 2nd blade, be formed with along with away from above-mentioned each blade toward the inclined-plane that the moving direction upstream side tilts.
5. the groove processing apparatus of a substrate forms groove along the pattern lines of substrate, it is characterized in that possessing:
Platform, the mounting substrate;
Head is installed the described groove processing instrument of arbitrary claim in the claim 1 to 4; And
Travel mechanism uses so that above-mentioned platform and above-mentioned head relativity ground in horizontal plane is mobile; And
Above-mentioned head has:
Keep tool, can move up and down; And
Pressing member makes the groove processing instrument that remains in above-mentioned maintenance tool press substrate with set pressing force.
6. the groove processing apparatus of substrate as claimed in claim 5, it is characterized in that wherein, above-mentioned maintenance tool keeps above-mentioned groove processing instrument, and have with the swinging axle of above-mentioned moving direction quadrature for a spot wobble and obtain toward moving position and the oscillating structural member that returns the position.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-032895 | 2012-02-17 | ||
| JP2012032895A JP5826665B2 (en) | 2012-02-17 | 2012-02-17 | Substrate groove processing tool and groove processing apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103252804A true CN103252804A (en) | 2013-08-21 |
| CN103252804B CN103252804B (en) | 2016-10-05 |
Family
ID=48957185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310010371.3A Active CN103252804B (en) | 2012-02-17 | 2013-01-10 | The groove processing instrument of substrate and groove processing apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5826665B2 (en) |
| KR (1) | KR101510175B1 (en) |
| CN (1) | CN103252804B (en) |
| TW (1) | TWI498298B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105280754A (en) * | 2014-05-29 | 2016-01-27 | 三星钻石工业股份有限公司 | Tool holder and groove processing apparatus |
| CN112091298A (en) * | 2020-09-16 | 2020-12-18 | 中国航发贵州黎阳航空动力有限公司 | Straight groove machining tool and machining method |
| CN112620762A (en) * | 2020-12-18 | 2021-04-09 | 贵州华烽电器有限公司 | Shell keyway cutting process device |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI513671B (en) * | 2013-12-06 | 2015-12-21 | Ind Tech Res Inst | Cutting tool and glass cutting device using the same |
| KR102563577B1 (en) * | 2017-12-27 | 2023-08-03 | 현대자동차주식회사 | Producing apparatus of electrode for membrane electrode assembly and manufacturing method of electrode for membrane electrode assembly using the same |
| CN112466785B (en) * | 2020-11-23 | 2022-09-02 | 江西世星科技有限公司 | Integrated circuit V-shaped groove grooving machine |
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| JPS6295813U (en) * | 1985-12-09 | 1987-06-18 | ||
| JP2002346803A (en) * | 2001-05-25 | 2002-12-04 | Ricoh Co Ltd | Groove processing method, grooved goods, and, optical parts or presision parts |
| CN2728681Y (en) * | 2004-03-14 | 2005-09-28 | 侯宝长 | Shaping machine table planing machine two-plane iron cutting surface holder |
| US20070212177A1 (en) * | 2006-03-13 | 2007-09-13 | Matsushita Electric Industrial Co., Ltd. | Machining tools having concave cutting surfaces for precision machining and methods of manufacturing such |
| CN102130217A (en) * | 2010-01-08 | 2011-07-20 | 三星钻石工业股份有限公司 | Groove machining tool for use with a thin-film solar cell |
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| Publication number | Priority date | Publication date | Assignee | Title |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105280754A (en) * | 2014-05-29 | 2016-01-27 | 三星钻石工业股份有限公司 | Tool holder and groove processing apparatus |
| CN105280754B (en) * | 2014-05-29 | 2017-12-08 | 三星钻石工业股份有限公司 | Tool holder and grooving apparatus |
| CN112091298A (en) * | 2020-09-16 | 2020-12-18 | 中国航发贵州黎阳航空动力有限公司 | Straight groove machining tool and machining method |
| CN112620762A (en) * | 2020-12-18 | 2021-04-09 | 贵州华烽电器有限公司 | Shell keyway cutting process device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201335087A (en) | 2013-09-01 |
| JP5826665B2 (en) | 2015-12-02 |
| KR101510175B1 (en) | 2015-04-08 |
| JP2013169600A (en) | 2013-09-02 |
| KR20130095201A (en) | 2013-08-27 |
| CN103252804B (en) | 2016-10-05 |
| TWI498298B (en) | 2015-09-01 |
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