CN103238229A - Oled module - Google Patents
Oled module Download PDFInfo
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- CN103238229A CN103238229A CN2011800508140A CN201180050814A CN103238229A CN 103238229 A CN103238229 A CN 103238229A CN 2011800508140 A CN2011800508140 A CN 2011800508140A CN 201180050814 A CN201180050814 A CN 201180050814A CN 103238229 A CN103238229 A CN 103238229A
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- oled
- oled module
- plate
- carrier element
- module
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- 239000011241 protective layer Substances 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 16
- 238000007639 printing Methods 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
- H10K59/179—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention relates to an OLED module comprising an OLED panel (10) and a plate-shaped carrier element (30) having a surface (35) on which the OLED panel (10) is arranged. The carrier element (30) has a region (36) projecting with respect to the OLED panel (10). Furthermore, the OLED module comprises a driver electronics arrangement (32) for electronically driving the OLED panel (10). The driver electronics arrangement (32) comprises a component (32') which is arranged at the projecting region (36) on the carrier element (30) and which does not extend beyond the OLED panel (10) in a direction (R) perpendicular to the surface (35). This arrangement enables configuring the OLED module in a particularly flat fashion, the driver electronics arrangement (32) having no effect on the minimum structural height of the OLED module.
Description
The present invention relates to a kind of OLED module (OLED: Organic Light Emitting Diode), this OLED module comprises OLED plate and the plate-shaped support element that has for the surface that this OLED plate is set, wherein carrier element has the outburst area outstanding with respect to described OLED plate, and this OLED module comprises drive electronics, and this drive electronics is used for controlling described OLED plate in the mode of electronics.The present invention relates to a kind of with the lamp of this OLED module as light source in addition.
Corresponding OLED module is open in US 2008/0231180A1, and wherein carrier element is printed circuit board (PCB).Here drive electronics relatively arranges with respect to OLED plate and printed circuit board (PCB).Can provide bigger structure height especially for the OLED module thus.
Task of the present invention is, a kind of improved OLED module is provided, and this OLED module especially can be with smaller structure height manufacturing.A kind of lamp with this OLED module is provided in addition.
This task solves by the theme that relates in the independent claims according to the present invention.The specific embodiment of the present invention illustrates in the dependent claims.
According to the present invention, a kind of OLED module is provided, this OLED module comprises OLED plate and plate-shaped support element, and this carrier element has for the surface that described OLED plate is set, and wherein said carrier element has the outburst area outstanding with respect to described OLED plate.In addition, described OLED module comprises drive electronics, and this drive electronics is used for controlling described OLED plate in the mode of electronics.Drive electronics described here comprises such structure member, and this structure member is arranged on the outburst area on the described carrier element and does not extend beyond described OLED plate on perpendicular to the direction on institute art surface.
Can make the OLED module by this layout especially flatly, particularly manufacture and make the OLED module have such structure height, this structure height is not more than the thickness sum of thickness and the OLED plate of plate-shaped support element.Especially, described drive electronics influences the minimum constructive height of OLED module by this way and not.
Particularly advantageously be, all structure members of described drive electronics all are arranged on the described outburst area on the described carrier element, and these all structure members do not extend beyond described OLED plate on perpendicular to the direction on described surface here.In addition, the described OLED module of structure makes all structure members of described drive electronics not extend beyond described surperficial 2.0mm on described direction especially like this.
Described carrier element advantageously has depression or the space that is positioned at described surface at described outburst area, and wherein, at least one structure member of described drive electronics is at least partially disposed in this depression or this space.Thus, can reduce structure height to a great extent.In addition, can make the relevant structure member that on described carrier board, mechanically keeps described drive electronics thus.
Described OLED plate especially has smooth side, described OLED plate utilizes this smooth side to be arranged on the described surface of described carrier element, wherein, all structure members of described drive electronics all are arranged in the zone of the lateral boundaries of this smooth side.Can realize especially thus constructing the OLED module in flexible or pliable and tough mode, this flexible is only limited relatively tinily by the structure member of drive electronics.
Described OLED module especially also has at least one electric contacts, and this electric contacts is used for being electrically connected and mechanical connection between described carrier element and the described OLED plate.Can set up accordingly by this way and be electrically connected, strengthen the mechanical stability of described OLED plate on described carrier element in addition.
In addition advantageously, described OLED module also has the protective layer element, and this protective layer element is relatively arranging on the described OLED plate about described OLED plate and described carrier element.Protection for described OLED plate not only can be realized by this protective layer element, and the complanation on the surface of described OLED plate can be realized.When the protective layer element is made in the mode of printing opacity, can realize that passing this protective layer element from the light that described OLED plate produces outwards exports.
Described carrier element is printed circuit board (PCB) particularly, and this printed circuit board (PCB) is connected with described OLED plate with mechanical system with electric means.
In addition, have such thickness at described carrier element, that is, this thickness especially under the situation less than 100 μ m, can be realized the low especially structure height of OLED module less than 1000 μ m.
In addition, described OLED module can advantageously be configured to the OLED module of flexible OLED module or rigidity.
Also has mould material in described OLED module; this mould material is around at least one structure member of described drive electronics; especially under the situation about arranging around all structure members of described drive electronics, can realize the good especially protection of described drive electronics and/or the good especially stability of described OLED module.Especially waterproof and/or the flexible material of mould material described here.
By the protection that can realize around the shell of described OLED plate setting to a great extent.Here this shell is especially made with metal.Can loose particularly well thus except issuable heat when the OLED module is moved.
Described carrier element can advantageously have hexagonal shape.In this case, for example in the time will combining a plurality of similar OLED modules in order to constitute the light output area of lamp together, this OLED module is particularly suitable for.
According to another aspect of the present invention, provide a kind of lamp, this lamp with at least one OLED module according to the present invention as light source.
Explain the present invention below with reference to accompanying drawing according to execution mode.In the accompanying drawing:
Fig. 1 shows the schematic cross sectional view of first execution mode of OLED module of the present invention,
Fig. 2 shows the schematic cross sectional view of second execution mode,
Fig. 3 shows the meaning profile of the 3rd execution mode,
Fig. 4 shows the schematic plan of the 3rd execution mode,
Fig. 5,6a and 6b show another schematic diagram with embodiment of hexagonal shape,
Fig. 7 and 8 shows the schematic perspective view of the embodiment with hexagonal shape.
Schematically shown the profile of first execution mode of OLED module of the present invention among Fig. 1.This OLED module has OLED plate 10 and plate-shaped support element 30, and this carrier element 30 has for the surface 35 that OLED plate 10 is set.
The OLED module has drive electronics 32 in addition, and this drive electronics is used for the mode driving OLED plate 10 with electronics.Here this drive electronics 32 comprises structure member 32 ', and this structure member 32 ' is arranged on the outburst area 36 on the surface 35 on the carrier element 30 especially, and does not extend beyond OLED plate 10 on the direction R perpendicular to surface 35.That is to say that with reference to shown in Figure 1 structure member 32 ' is no more than surface 35 and extends and do not continue upwards to be higher than 10 extensions of OLED plate.That is to say that 35 calculate from the surface, the extension of structure member 32 ' is not more than the extension of OLED plate 10.
Can be flat especially or with especially little structure height structure OLED module by this layout.
Can stipulate that especially OLED plate 10 has smooth side 15 (hereinafter being also referred to as downside 15), OLED plate 10 utilizes this side 15 to be arranged on the surface 35 of carrier element 30.Here such zone of representing carrier element 30 with outburst area 36, this zone are positioned at downside 15 or side 15 outside the upright projection or vertical plane P of carrier element 30.
When all structure members of drive electronics 32 all are arranged on the outburst area 36 on the carrier element 30 corresponding to above-mentioned layout, can realize flat especially generally frame mode.Realized by this way: the neither one structure member extends beyond OLED plate 10 at the direction R perpendicular to surface 35 in the structure member of drive electronics 32.For example can be such structure: the structure member neither one of drive electronics 32 extends beyond surperficial 352.0mm or 1.8mm.
Have at outburst area 36 at carrier element 30 and to be arranged in surface 35 depression or at least one structure member of space (not shown) and drive electronics 32 is at least partially disposed under the situation in this depression or this space, can dwindle structure height to a greater degree.Can make advantageously by this way that relevant structure member and carrier element 30 are electric to be contacted and also mechanically remain on the carrier element 30 thus.
The OLED module can have at least one electric contacts 31 in addition, and this electric contacts is used for being electrically connected and mechanical connection between carrier element 30 and OLED plate 10.As illustrative among Fig. 1, OLED plate 10 can have base members 10 ' and the closure elements of for example being made by glass 10 ", wherein the downside 15 of OLED plate 10 is closure elements 10 " side or downside.Here base members 10 ' is with respect to closure elements 10 " can have outburst area 13; and wherein use such zone of this outburst area 13 (being similar to the above-mentioned definition to the outburst area 36 of carrier element 30) expression base members 10 ' of base members 10 ', this zone is positioned at downside 15 or side 15 outside the upright projection on the carrier element 30 or vertical plane P.The contact-making surface 11 of the electrode of OLED plate 10 can be set at these outburst area 13 places of base members 10 ', and this contact-making surface also is used for contacting with electric contacts 31.Can set up between OLED plate 10 and the carrier element 30 thus fairly simplely and be electrically connected reliably and mechanical connection.
That is to say that in this structure, on the one hand produce one " space " between the outburst area 13 of the surface 35 of carrier element 30 and base members 10 ', this space advantageously can be used for arranging drive electronics 32 at least in part.When vertical view, this space can be configured to circlewise around closure elements 10 ".
Total can arrange a plurality of (for example four) this electric contacts 31 or contact-making surface 11.
In addition as a supplement, can between the downside 15 of OLED plate 10 and carrier element 30 layer of adhesive material be set, it is used for the mechanical connection between these two parts.
In addition, the OLED module can have the especially protective layer element 20 of printing opacity, and this protective layer element relatively is arranged on the OLED plate 10 about OLED plate 10 and carrier element 30.Correspondingly the light of OLED plate 10 output can realize by the protective layer element 20 with the formal construction of printing opacity.
With reference to shown in Figure 1, that is to say that protective layer element 20 is arranged on the OLED plate 10 and light output upwards is provided.Protective layer element 20 can be connected on the OLED plate 10 with optical mode and mechanical system system, in order to make the surface 16 of OLED plate 10 form the plane.Protective layer element 20 can or remain on the OLED plate 10 by the layer of adhesive material setting.
That is to say that the OLED module comprises three layers particularly, wherein, ground floor is made of protective layer element 20, and the second layer is made of OLED plate 10, and the 3rd layer is made of carrier element 30.
Drive electronics 32 can have the driver IC of supplying with for the constant current of OLED plate 10, and passive structural elements, for example is used for the resistance that electric current regulates or coil and the capacitor that is used for smooth output voltage.Can be provided for bus interface integrated of the external control of OLED module in addition.For this reason especially can an integrated microcontroller, and optional level converter, and passive structural elements (if desired).
With reference to shown in Figure 1, that is to say that especially the entire infrastructure parts of drive electronics 32 all have flat planform, make these structure members upwards not extend beyond OLED plate 10.Here these structure members be arranged on the next door of OLED plate 10 or be arranged on the outburst area 13 of base members 10 ' and the surface 35 of carrier element 30 between.Realized the compared with prior art small construction height of OLED module by this flat planform.Be arranged on closure elements 10 in the zone of contact that the structural detail of drive electronics 32 can be between carrier element 30 (perhaps printed circuit board (PCB)) and OLED plate 10 " " space " in, make this space be utilized particularly well.
The OLED module can have electric connection terminal 33 in order to be electrically connected in addition.
That is to say, use active and passive actuator component and the splicing ear 33 of at least one electric connecting element that is used for OLED plate 10 31, drive electronics 32, printed circuit board (PCB) can outwards mechanically be fastened at OLED plate 10 with electric means simultaneously; Can strengthen mechanical stability and the control of OLED module in addition like this.
The structure member of drive electronics 32 can be arranged on especially in the zone of the lateral boundaries of downside 15, that is is arranged on when vertical view in the zone of an annular of downside 15.The flexibility of OLED module or pliability can by this arrangement constraints or at the most only faintly the restriction, perhaps flexibility or pliability only above-mentioned around downside 15 the zone in restricted.
Fig. 2 has schematically shown another execution mode.Unless otherwise indicated, the explanation with respect to first execution mode also is suitable for and uses similarly Reference numeral to second execution mode.Explanation different with first execution mode only below that is to say.
Fig. 3 has schematically shown the 3rd execution mode; Fig. 4 illustrates corresponding vertical view.Top explanation correspondingly is suitable for again, so the difference for top expression only is described.
In this implementation, the OLED module has shell 50 in addition.This shell 50 can have base plate, and this base plate relatively arranges with respect to carrier element 30 and OLED plate 10, that is can say so, as other that is on above-mentioned three layers meaning the 4th layer.
This shell can arrange around OLED plate 10 especially.Can improve the sealing of OLED module to a great extent by shell 50.Shell 50 is made of metal especially.Can loose particularly well thus except issuable heat when OLED plate 10 moves.
Can advantageously influence external shape or the profile of OLED module in addition by shell 50, the feasible possibility of improving external form by this way with respect to the outside image of OLED module.
If remove mould material 40 or shell 50 in Fig. 4, then can obtain is the corresponding views of first or second execution mode.Use the light-emitting area of Reference numeral 12 expression OLED plates 10.
As from Fig. 4, also finding out, can stipulate that carrier board 30 is rectangle, wherein the structure member of drive electronics 32 only is being arranged on the carrier board 30 on two relative sides that provide by this shape.Limit the flexible around the axis that is parallel to related both sides of OLED module thus especially in some cases especially littlely.
But the rectangular shape on the vertical view is not enforceable.Can stipulate also that according to the present invention the OLED module has such shape when vertical view: it is not rectangle, and for example is hexagon.This is illustrated among Fig. 5,6a and the 6b according to another execution mode.Top explanation correspondingly is suitable for again, and therefore the difference with top explanation only is described below.
Fig. 5 represents corresponding profile, and Fig. 6 a represents the vertical view that does not have protective layer element 20 of OLED module, and Fig. 6 b represents the vertical view with protective layer element 20 of OLED module.
The hexagonal shape of OLED module can obtain by the corresponding shape of carrier element 30.OLED plate 10 for example can be configured to octagon and for example have circular light-emitting area 12 in addition.
The hexagonal shape of OLED module is particularly suitable for such situation, that is, with a plurality of OLED modules as far as possible near-earth combine, make to constitute the lamp with light radiating surface, this light radiating surface is made up of the light-emitting area of single OLED module.
Fig. 7 represents the exploded view of last-mentioned execution mode in the mode of schematic diagram.Here represent to export coupled system with Reference numeral 21, represent optical surface (diffusion/reflection) with Reference numeral 22.
Fig. 8 example illustrates carrier element 30, and here as printed circuit board (PCB), this printed circuit board (PCB) has integrated element or the structure member of drive electronics 32.Drive electronics 32 for example can have PWM current driver, DMX 512 interfaces, optionally touch interface; Pwm driver performance parameter: 12V or 24V power supply, 350mAPWM drive, 400: 1 dim light degree, 82% efficient, the structure height of 1.7mm.
The light source that OLED module according to the present invention is particularly suitable as lamp uses, for example room illumination.Therefore a kind of lamp also is provided according to the present invention, its with at least one OLED module as light source.Here this lamp can advantageously be made corresponding to top explanation especially flatly.
Claims (14)
1. OLED module, this OLED module has:
-OLED plate (10);
-plate-shaped support element (30), this carrier element have for the surface (35) that described OLED plate (10) is set;
Wherein said carrier element (30) have with respect to the outstanding outburst area (36) of described OLED plate (10) and
-drive electronics (32), this drive electronics are used for controlling described OLED plate (10) in the mode of electronics,
It is characterized in that,
Described drive electronics (32) comprises such structure member, described structure member is arranged on the described outburst area (36) of described carrier element (30), and this structure member does not extend beyond described OLED plate (10) on the direction (R) perpendicular to described surface (35).
2. OLED module according to claim 1,
Wherein, all structure members of described drive electronics (32) all are arranged on the described outburst area of described carrier element (30), and do not extend beyond described OLED plate (10) on perpendicular to the direction on described surface.
3. OLED module according to claim 1 and 2,
Wherein, all structure members of described drive electronics (32) do not extend beyond described surface (35) 2.0mm.
4. each described OLED module in requiring according to aforesaid right,
Wherein, described carrier element (30) has depression or the space that is positioned at described surface (35) at described outburst area, and at least one structure member of described drive electronics (32) is at least partially disposed in this depression or this space.
5. each described OLED module in requiring according to aforesaid right,
Wherein, described OLED plate (10) has smooth side (15), described OLED plate utilizes this side to be arranged on the described surface (35) of described carrier element (30), and all structure members of wherein said drive electronics (32) all are arranged in the zone of the lateral boundaries of described smooth side (15).
6. each described OLED module in requiring according to aforesaid right,
This OLED module also has,
-at least one electric contacts (31), described electric contacts is used for being electrically connected and mechanical connection between described carrier element (30) and the described OLED plate (10).
7. each described OLED module in requiring according to aforesaid right,
This OLED module also has,
-protective layer element (20), this protective layer element relatively is arranged on the described OLED plate (10) about described OLED plate (10) and described carrier element (30), and wherein, described protective layer element (20) is printing opacity especially.
8. each described OLED module in requiring according to aforesaid right,
Wherein, described carrier element (30) is printed circuit board (PCB), and this printed circuit board (PCB) is connected with described OLED plate (10) with mechanical system with electric means.
9. each described OLED module in requiring according to aforesaid right,
Wherein, described carrier element (30) has such thickness, and this thickness is less than 1000 μ m, especially less than 100 μ m.
10. each described OLED module in requiring according to aforesaid right,
This OLED module structure becomes flexible OLED module or is configured to the OLED module of rigidity.
11. according to each described OLED module in the aforesaid right requirement,
This OLED module also has,
-mould material (40), this mould material arranges around at least one structure member of described drive electronics (32), and especially all structure members around described drive electronics (32) arrange,
Wherein, described mould material (40) especially waterproof and/or flexible.
12. according to each described OLED module in the aforesaid right requirement,
This OLED module also has,
-shell (50), this shell arranges around described OLED plate (10), and wherein, described shell (50) preferably is made of metal.
13. according to each described OLED module in the aforesaid right requirement,
Wherein, described carrier element (30) has hexagonal shape.
14. each described OLED module is as light source a lamp, this lamp require at least one according to aforesaid right in.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102010042727.6 | 2010-10-21 | ||
| DE102010042727A DE102010042727A1 (en) | 2010-10-21 | 2010-10-21 | OLED module |
| PCT/EP2011/068395 WO2012052531A1 (en) | 2010-10-21 | 2011-10-21 | Oled module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103238229A true CN103238229A (en) | 2013-08-07 |
| CN103238229B CN103238229B (en) | 2016-05-18 |
Family
ID=44860360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180050814.0A Expired - Fee Related CN103238229B (en) | 2010-10-21 | 2011-10-21 | Oled module |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP2630680A1 (en) |
| CN (1) | CN103238229B (en) |
| DE (1) | DE102010042727A1 (en) |
| WO (1) | WO2012052531A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104712922A (en) * | 2013-12-11 | 2015-06-17 | 力志国际光电股份有限公司 | Organic light emitting diode illuminating device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012223162B4 (en) | 2012-12-14 | 2022-08-25 | Pictiva Displays International Limited | AREA LIGHT SYSTEM |
| DE102013113001B4 (en) * | 2013-09-13 | 2018-05-24 | Osram Oled Gmbh | Module and arrangement with a module |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050001543A1 (en) * | 2003-05-13 | 2005-01-06 | Ryoji Nomura | Light emitting device and method for manufacturing the same |
| CN1638554A (en) * | 2003-12-30 | 2005-07-13 | Lg.菲利浦Lcd株式会社 | Organic electroluminescent device and method of fabricating the same |
| CN1822384A (en) * | 2005-02-18 | 2006-08-23 | 株式会社半导体能源研究所 | Semiconductor device and method for manufacturing the same |
| US20060199461A1 (en) * | 2001-02-22 | 2006-09-07 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method of manufacturing the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004005370B4 (en) * | 2004-02-03 | 2007-08-16 | Samsung SDI Co., Ltd., Suwon | Electrical device with a housing and an OLED display element and method for its production |
| US7855498B2 (en) | 2005-07-27 | 2010-12-21 | Koninklijke Philips Electronics N.V. | Light-emitting device with a sealing integrated driver circuit |
| JP2007234232A (en) * | 2006-02-27 | 2007-09-13 | Hitachi Displays Ltd | Image display device |
| DE102007046730A1 (en) * | 2007-09-28 | 2009-04-02 | Osram Opto Semiconductors Gmbh | Organic electronic component for organic light emitting diodes, polymer elements, organic photovoltaic cell or electrochromic elements, has substrate and is provided on substrate |
| US20090167171A1 (en) * | 2007-11-22 | 2009-07-02 | Samsung Mobile Display Co., Ltd. | Display device, organic light emitting diode display and manufacturing method of the same |
| DE102008049056A1 (en) * | 2008-09-26 | 2010-04-08 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Organic photoelectric device and a method for producing an organic photoelectric device |
-
2010
- 2010-10-21 DE DE102010042727A patent/DE102010042727A1/en not_active Withdrawn
-
2011
- 2011-10-21 WO PCT/EP2011/068395 patent/WO2012052531A1/en active Application Filing
- 2011-10-21 EP EP11774036.5A patent/EP2630680A1/en not_active Withdrawn
- 2011-10-21 CN CN201180050814.0A patent/CN103238229B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060199461A1 (en) * | 2001-02-22 | 2006-09-07 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method of manufacturing the same |
| US20050001543A1 (en) * | 2003-05-13 | 2005-01-06 | Ryoji Nomura | Light emitting device and method for manufacturing the same |
| CN1638554A (en) * | 2003-12-30 | 2005-07-13 | Lg.菲利浦Lcd株式会社 | Organic electroluminescent device and method of fabricating the same |
| CN1822384A (en) * | 2005-02-18 | 2006-08-23 | 株式会社半导体能源研究所 | Semiconductor device and method for manufacturing the same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104712922A (en) * | 2013-12-11 | 2015-06-17 | 力志国际光电股份有限公司 | Organic light emitting diode illuminating device |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102010042727A1 (en) | 2012-05-10 |
| WO2012052531A1 (en) | 2012-04-26 |
| EP2630680A1 (en) | 2013-08-28 |
| CN103238229B (en) | 2016-05-18 |
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