CN103217112A - Single-point thickness measurement method of SMT screen plate - Google Patents

Single-point thickness measurement method of SMT screen plate Download PDF

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Publication number
CN103217112A
CN103217112A CN2012100157047A CN201210015704A CN103217112A CN 103217112 A CN103217112 A CN 103217112A CN 2012100157047 A CN2012100157047 A CN 2012100157047A CN 201210015704 A CN201210015704 A CN 201210015704A CN 103217112 A CN103217112 A CN 103217112A
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CN
China
Prior art keywords
thickness
web plate
displacement sensor
measurement point
laser displacement
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Pending
Application number
CN2012100157047A
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Chinese (zh)
Inventor
魏志凌
宁军
沈晓
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Kunshan Theta Micro Co Ltd
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Kunshan Theta Micro Co Ltd
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Priority to CN2012100157047A priority Critical patent/CN103217112A/en
Publication of CN103217112A publication Critical patent/CN103217112A/en
Pending legal-status Critical Current

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Abstract

The invention relates to the technical field of laser processing, in particular to a screen plate thickness measurement method. According to the method, the coordinate of a measurement point on a screen plate breadth is (x,y), firstly a laser displacement sensor is moved to the measurement point through shafting motions, measurement is started and thickness data are obtained. The method further includes the following steps: setting a radius r for representing a position range, moving the laser displacement sensor within the position range of the radius r according to a set path, constantly measuring the thickness of the screen plate in the moving process and storing the data until scanning of the laser displacement sensor is completed and the laser displacement sensor returns to the point (x,y), and eventually indicating the thickness of the measurement point with the average value of the obtained thickness data. According to the technical scheme, the thickness of the measured screen plate is obtained, thickness measurement precision of the SMT screen plate is improved, and errors are reduced.

Description

A kind of SMT web plate single-point method for measuring thickness
 
Technical field
The present invention relates to technical field of laser processing, be specifically related to a kind of web plate method for measuring thickness.
 
Background technology
In the Laser Micro-Machining industry, all need to measure web plate thickness for the SMT web plate and whether meet the demands to check this web plate.Generally be the point of getting some in the web plate breadth with the equispaced, the thickness of measuring these points as shown in Figure 1, is got the thickness of the thickness average value of 9 points with expression web plate 1 to represent this web plate average thickness value on web plate 1.
Conventional measuring method is only got a bit when the thickness of measurement point, do not consider the flatness of web plate in the environs, so can not represent near the thickness of the position of this point, as shown in Figure 2, draw from the xsect of web plate, near the thickness of a bit position of certain of web plate can differ greatly with the thickness of this point.Thereby use the some position average thickness value that this kind measuring method obtains can cause data error bigger with expression web plate thickness, influence the commercial production quality.
 
Summary of the invention
The objective of the invention is to, a kind of SMT web plate single-point method for measuring thickness is provided, solve above technical matters.
Technical matters solved by the invention can realize by the following technical solutions:
A kind of SMT web plate single-point method for measuring thickness, measurement point coordinate on the web plate breadth is (x, y), at first laser displacement sensor is moved to the measurement point position by the motion of axle system, begin to measure and obtain thickness data, it is characterized in that, also comprise the steps: to set the radius r of expression position range, according to a set path, at the radius r position range, mobile laser displacement sensor, constantly measure web plate thickness in the moving process and preserve data, finish up to laser displacement sensor scanning and to get back to that (mean value of a plurality of thickness datas of finally getting acquisition is with the thickness of expression measurement point position for x, y) point.
The present invention gathers a plurality of dot thickness information in the peripheral direction of measurement point, gets the thickness that its mean value is represented the measurement point position, has avoided in this measurement point because the surface of steel plate flatness causes numerical value unilateral and can not represent herein thickness inadequately.The present invention has improved the thickness measure accuracy of SMT web plate, reduces error.
At the radius r position range, mobile laser displacement sensor is taken to few 4 web plate thickness and preserves data in the moving process, and will at least four point measurements to web plate thickness and the thickness of the measurement point that measures be averaged, represent the thickness of measurement point position.
Beneficial effect: owing to adopt technique scheme, the present invention is used to measure web plate thickness and is, has improved the thickness measure accuracy of SMT web plate, reduces error.
 
Description of drawings
When Fig. 1 is traditional measurement web plate thickness, get a synoptic diagram;
Fig. 2 is the web plate cross sectional representation;
Fig. 3 is a synoptic diagram of getting of embodiment of the present invention one.
 
Embodiment
For technological means, creation characteristic that the present invention is realized, reach purpose and effect is easy to understand, further set forth the present invention below in conjunction with concrete diagram.
A kind of SMT web plate single-point method for measuring thickness comprises the steps:
The first step, measurement point coordinate on the web plate breadth is that (x y), at first moves to the measurement point position by the motion of axle system with laser displacement sensor, begins to measure and obtain the thickness data of measurement point.
Second step, set the radius r of representing position range, according to a set path, at the radius r position range, mobile laser displacement sensor is constantly measured web plate thickness and is preserved data in the moving process, finish up to laser displacement sensor scanning and get back to (x, y) point.
The 3rd step is with the mean value of a plurality of thickness datas of the obtaining thickness with expression measurement point position.
The present invention gathers a plurality of dot thickness information in the peripheral direction of measurement point, gets the thickness that its mean value is represented the measurement point position, has avoided in this measurement point because the surface of steel plate flatness causes numerical value unilateral and can not represent herein thickness inadequately.The present invention has improved the thickness measure accuracy of SMT web plate, reduces error.
At the radius r position range, mobile laser displacement sensor is taken to few 4 web plate thickness and preserves data in the moving process, and will at least four point measurements to web plate thickness and the thickness of the measurement point that measures be averaged, represent the thickness of measurement point position.
Embodiment one: in the radius r position range, the mobile route of setting according to as shown in Figure 3 1-8, laser displacement sensor moves to (x respectively, y-r), (x, y+r), (x-r, y), (x+r, y), get the web plate thickness of above-mentioned four point coordinate positions, and the web plate thickness of above-mentioned 4 web plate thickness with the measurement point that measures is averaged, the mean value that obtains is thought the web plate thickness of measurement point.
More than show and described ultimate principle of the present invention and principal character and advantage of the present invention.The technician of the industry should understand; the present invention is not restricted to the described embodiments; that describes in the foregoing description and the instructions just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.The claimed scope of the present invention is defined by appending claims and equivalent thereof.

Claims (2)

1. SMT web plate single-point method for measuring thickness, measurement point coordinate on the web plate breadth is (x, y), at first laser displacement sensor is moved to the measurement point position by the motion of axle system, begin to measure and obtain thickness data, it is characterized in that, also comprise the steps: to set the radius r of expression position range, according to a set path, at the radius r position range, mobile laser displacement sensor, constantly measure web plate thickness in the moving process and preserve data, finish up to laser displacement sensor scanning and to get back to that (mean value of a plurality of thickness datas of finally getting acquisition is with the thickness of expression measurement point position for x, y) point.
2. a kind of SMT web plate single-point method for measuring thickness according to claim 1, it is characterized in that, at the radius r position range, mobile laser displacement sensor, be taken to few 4 web plate thickness in the moving process and preserve data, and with at least four point measurements to web plate thickness and the thickness of the measurement point that measures be averaged the thickness of expression measurement point position.
CN2012100157047A 2012-01-19 2012-01-19 Single-point thickness measurement method of SMT screen plate Pending CN103217112A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012100157047A CN103217112A (en) 2012-01-19 2012-01-19 Single-point thickness measurement method of SMT screen plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012100157047A CN103217112A (en) 2012-01-19 2012-01-19 Single-point thickness measurement method of SMT screen plate

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CN103217112A true CN103217112A (en) 2013-07-24

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106500633A (en) * 2016-12-29 2017-03-15 苏州逸美德科技有限公司 A kind of measurement method of planeness
CN107270823A (en) * 2017-07-28 2017-10-20 深圳市兴华炜科技有限公司 A kind of steel mesh thickness detecting equipment and detection method
WO2019019131A1 (en) * 2017-07-28 2019-01-31 深圳市兴华炜科技有限公司 Steel mesh thickness measurement device and measurement method
CN111928787A (en) * 2020-08-04 2020-11-13 歌尔光学科技有限公司 Height measuring method, measuring apparatus and storage medium

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050137829A1 (en) * 2003-12-17 2005-06-23 Siemens Westinghouse Power Corporation System and method for measuring coating thickness
CN101408412A (en) * 2007-10-09 2009-04-15 松下电器产业株式会社 Method for measuring three-dimensional shape
CN101435696A (en) * 2008-12-08 2009-05-20 昆山思拓机器***有限公司 Device and method for measuring light sheet thickness
CN102141381A (en) * 2010-12-23 2011-08-03 苏州天准精密技术有限公司 Thickness and dimension automatic measuring instrument for insulation layer and protective sleeve of image type cable
CN201964876U (en) * 2010-12-22 2011-09-07 无锡上机数控股份有限公司 Silicon block thickness measuring device
CN202002629U (en) * 2010-12-27 2011-10-05 柯尼卡美能达商用科技(无锡)有限公司 Thickness measuring device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050137829A1 (en) * 2003-12-17 2005-06-23 Siemens Westinghouse Power Corporation System and method for measuring coating thickness
CN101408412A (en) * 2007-10-09 2009-04-15 松下电器产业株式会社 Method for measuring three-dimensional shape
CN101435696A (en) * 2008-12-08 2009-05-20 昆山思拓机器***有限公司 Device and method for measuring light sheet thickness
CN201964876U (en) * 2010-12-22 2011-09-07 无锡上机数控股份有限公司 Silicon block thickness measuring device
CN102141381A (en) * 2010-12-23 2011-08-03 苏州天准精密技术有限公司 Thickness and dimension automatic measuring instrument for insulation layer and protective sleeve of image type cable
CN202002629U (en) * 2010-12-27 2011-10-05 柯尼卡美能达商用科技(无锡)有限公司 Thickness measuring device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106500633A (en) * 2016-12-29 2017-03-15 苏州逸美德科技有限公司 A kind of measurement method of planeness
CN107270823A (en) * 2017-07-28 2017-10-20 深圳市兴华炜科技有限公司 A kind of steel mesh thickness detecting equipment and detection method
WO2019019131A1 (en) * 2017-07-28 2019-01-31 深圳市兴华炜科技有限公司 Steel mesh thickness measurement device and measurement method
CN111928787A (en) * 2020-08-04 2020-11-13 歌尔光学科技有限公司 Height measuring method, measuring apparatus and storage medium

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