CN103208470A - Non-medium inosculating heat conduction method and application thereof - Google Patents
Non-medium inosculating heat conduction method and application thereof Download PDFInfo
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- CN103208470A CN103208470A CN201210088694XA CN201210088694A CN103208470A CN 103208470 A CN103208470 A CN 103208470A CN 201210088694X A CN201210088694X A CN 201210088694XA CN 201210088694 A CN201210088694 A CN 201210088694A CN 103208470 A CN103208470 A CN 103208470A
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Abstract
The invention discloses a non-medium inosculating heat conduction method and an application of the non-medium inosculating heat conduction method in heat conduction and heat dissipation devices. The method comprises that two contact faces which are required to be subjected to heat conduction and heat dissipation are changed physically, and heat conduction and heat dissipation capabilities of the two contact faces are improved without intervention of a heat conduction medium.
Description
Technical field
The present invention relates to the chimeric heat-conducting method of a kind of non-medium and application thereof, belong to hot transmission method field.
Background technology
Heat transmission is divided thermal radiation, convection current, three kinds of basic modes of heat conduction.Thermal radiation is that high temp objects sends energy with the form of electromagnetic radiation by the phenomenon of the directly outside heat of emission of high temp objects, and temperature is more high, and radiation is more strong; Convection current by the mode that flows to conduct heat of gas or liquid, makes temperature be tending towards uniform process by circulating between hot part and the colder part in liquid or the gas; The mode of the lower part of temperature is passed in heat conduction, heat along object from the higher part of object temperature.The heat conduction is the main mode that heat is transmitted in the solid.
At present in the application facet of conducting physics, most media with certain conductive performance that adopt, medium is acted between heater and the radiator, be connected with the heat conducting of radiator as heater, the heat of heater is led on the radiator by medium, and purpose maintains under the normal temperature conditions heater.
But all working medium conduction tend to because the physical property of medium and applied environment change conductive performance be descended even lost efficacy, especially in heat conduction application facet, because of medium through certain hour constantly expand with heat and contract with cold the circulation after, make itself and heater and radiator be fitted with certain interval, cause its conductive performance between heater and radiator to descend in addition failure phenomenon the most outstanding.Cause the early failure of equipment or device, cause huge property loss and inferior social image, and have many potential safety hazards, hindered popularization, the application of many advanced technologies, caused huge waste.
At present in the prior art in the heat conducting medium, what the thermal conductance effect was best be rare precious metal, and annual expense of only conducting with rare precious metal is up to more than tens billion of dollars.
According to incompletely statistics, the economic loss that cause because of heat conduction failure in the annual whole world is up to hundreds billion of dollars, and the security incident loss that causes is also very huge.Thoroughly reverse the bad phenomenon in many application medium conduction, overcome the application obstacle of many new technologies, new material, prolong the service time of relevant device greatly, retrieve because the huge property loss that conduction failure causes, for the rare precious metal very limited earth originally, save rare precious metal, the cost that reduces relevant industries and industry is our problem demanding prompt solution.
Summary of the invention
One of purpose of the present invention discloses a kind of new hot transmission method, and this hot transmission method is non-medium transmission method.
Two of purpose of the present invention discloses on the chimeric transmission method of non-medium basis and has utilized conduction physics, heat conduction physics, Material Physics principle, by the contact-making surface area of increase heater and radiator, thereby improves pyroconductivity.
Three of purpose of the present invention discloses the application of the non-medium transmission method of the present invention in association area.
Temperature difference between object or intrasystem each point is heat conducting necessary condition.The heat transfer rate that is caused by heat exchange pattern (being called for short heat conduction speed) is decided by the distribution situation of temperature in the object.The temperature field be exactly arbitrary moment object or system in the Temperature Distribution summation of each point.
To be exactly heat pass to another part or passed to the phenomenon of another system by a system from the part of system for heat conduction.It is the main mode that heat is transmitted in the solid.Heat conduction essence is that the molecular thermalmotion by big quantity of material clashes into mutually, and makes energy reach the low temperature part from the high-temperature part of object, or is passed to the process of cryogenic object by high temp objects.In solid, heat conducting microprocess is: in the high part of temperature, the particulate vibration kinetic energy in the crystal on the node is bigger.In the low temperature part, particulate vibration kinetic energy is less.Because the vibration of particulate interknits, thus the vibration of particulate just takes place at crystals, kinetic energy by the big part of kinetic energy to the little part transmission of kinetic energy.The conduction of heat is exactly the migration of energy in solid.In metallics, because there being a large amount of free electrons, ceaselessly doing random warm-up movement.The energy of general lattice vibrations is less, and free electron conduction to heat in metallic crystal plays a major role.
In the metal thermal conductivity be arranged in former be: silver-colored Ag thermal conductivity is that 428 W/mK, copper Cu thermal conductivity are that 398 W/mK, golden Au thermal conductivity are that 317.9 W/mK, aluminium Al thermal conductivity are 247 W/mK, so what the thermal conductance effect was best in metal is silver, but because its price factor, so generally select copper to substitute, but for saving cost, a lot of enterprises more are partial to select aluminium as the thermal conductance metal.
Non-medium transmission method of the present invention, namely directly contact with radiator by heater, replace heater and radiator by the medium indirect contact, heater is directly conducted to heat on the radiator, but not be as middle conductive medium by heat-conduction medium.Whole conductive process omitted transmitting medium this part, make hot transmission method and the transmission method ratio of tradition by transmitting medium, the novelty breakthrough has been arranged technically.
Contact-making surface area by increase heater and radiator of the present invention, thus pyroconductivity improved, be by making the contact-making surface area Sr of heater and radiator, Sp＜Sr＜NSp, wherein Sr is the actual contact face, and Sp is horizontal area, and N is the multiple greater than 1.Making heater and radiator is not only that pro forma face contacts, diversification contact especially, by heater and radiator contact surface are handled, make their surface area become the multiple growth, make its area increase several times, tens times, hundred times even several thousand times, guarantee heater surface and radiator surface coupling, as shown in Figure 1 chimeric mutually mutually simultaneously.Circular result's heater can contact by thread forms is chimeric with radiator in addition, with the area of deepening engage thread acquisition N direct contact surface doubly as shown in Figure 2, perhaps can directly suit contact as shown in Figure 3 by many-sided, A, B, three contacts of C.Above-mentionedly be referred to as not have the chimeric hot transmission method of medium.
It is a kind of for the securing member on heater and the radiator that the present invention provides on the other hand, and this securing member is the rigidity metal fastenings of steel elasticity positive temperature coefficient.Generally, heater and radiator all are fastening by screw, and along with expanding with heat and contract with cold repeatedly, the gap between heater and the radiator can be strengthened, and the surface of heater and radiator also can form poor conductor of heat---oxide layer, has influenced the effect of heat conduction and heat radiation.This phenomenon is particularly evident in the LED light fixture, causes a large amount of LED lamps owing to the decline of heat conduction and heat dispersion, and early stage serious light decay appears in a large amount of led light sources.
The inventor is for adapting to high heat conduction, adopt fastening structure can make heater and radiator remain excellent contact, when temperature rises, because fastening structure is elastic construction, expansion increases the pressure of heat carrier and radiator contact-making surface, and contact is better; When temperature descended, because shrinkage character makes securing member of the present invention still keep the contraction between heater and the radiator to oppress power, heat conduction and heat dispersion were kept normality between assurance heater one radiator, and fastener constructions as shown in Figure 4.Use elastic fastener can guarantee that heater closely contacts in maintenance all the time with radiator on the other hand, prevent that its contact-making surface from producing gap and forming oxide layer, reduces the heat-conductive characteristic between heater and the radiator.
The application of the inventive method among the present invention can be used for military equipment greatly, and I in every case need be heat conducting to be used for daily life, all can realize by method of the present invention.The inventive method preferably applies to heat conduction, the heat radiation of LED diode lights and computer CPU.
Description of drawings
Accompanying drawing must not be as the restriction of invention scope of the present invention only for the present invention is further explained among the present invention.
The chimeric heat conduction structure schematic diagram of accompanying drawing 1 no medium
The chimeric thread forms contact of accompanying drawing 2 no media schematic diagram
The chimeric many-sided contact schematic diagram of accompanying drawing 3 no media
Accompanying drawing 4 fastener constructions schematic diagrames: 1 is holding screw, and 2 is elastic washer, and 3 is heater, and 4 is radiator, and 5 is nut.
The liquid rare metal heat conduction and heat radiation of accompanying drawing 5 LED structural representation
Accompanying drawing 6 LED do not have the chimeric heat conducting and heat radiating device structural representation of medium
Accompanying drawing 7 dwindles the apparatus structure schematic diagram after 1/3
4 small embossments are respectively arranged respectively on the accompanying drawing 5-7, be the led chip schematic diagram
Embodiment
Embodiments of the invention are only for to make an explanation to the present invention, and being convenient to those of ordinary skills can content can implement the present invention according to the present invention, must not be as the restriction of invention scope of the present invention.
The identical material test of inhomogeneity device
The device that does not have the chimeric hot transmission method of medium with the present invention and liquid rare metal heat conducting and heat radiating device carry out the contrast experiment under the identical material, extract the integrated LED module of 100 50 watts of COB, its heater and radiator are copper, be divided into liquid rare metal group, the chimeric hot conduction group of no medium at random, two groups, each organizes 50, add inorganic liquid glue by silver powder between liquid rare metal its heater of group and the radiator and be deployed into liquid rare metal as heat-conduction medium heat conduction, structure as shown in Figure 5; Its heater and radiator are organized in the chimeric hot conduction of no medium, directly contact, and as shown in Figure 6 chimeric mutually.The result is as follows:
1, under the normal luminous situation of LED, liquid rare metal group can only horizontal mode heat conduction, otherwise very big by the conductor temperature difference, maximum temperature difference reaches 7 ℃; The chimeric hot conduction group temperature difference of no medium of the present invention is very little, and maximum temperature difference has only 2 ℃, and does not require for the disposing way of LED module, can arbitrarily angledly put.
2, the LED module junction temperature of the mode of liquid rare metal group heat conduction (LED diode P-N junction temperature) is 52 ℃ ± 1.5 ℃ (25 ℃ of environment); The junction temperature (LED diode P-N junction temperature) that the present invention does not have the chimeric hot conduction group of medium is 47 ℃ ± 1.2 ℃ (25 ℃ of environment).
3, liquid rare metal group, the chimeric hot conduction group of no medium all are placed on 150 ℃ of baking ovens after interior 100 hours, the P-N junction temperature (25 ℃ of environment) of liquid rare metal group rises to 61 ℃ ± 1.3 ℃, be 47 ℃ ± 1.4 ℃ and adopt the chimeric hot conduction group P-N junction temperature of no medium of the present invention, remain unchanged substantially.
The test of same item device unlike material:
Extract the integrated LED module of 100 50 watts of COB, its heat conduction of preparation, the heat abstractor that do not have the chimeric hot transmission method of medium with the present invention, be divided into two groups at random, one group of its heating, radiator are copper, one group of its heating, radiator are aluminium matter, relative copper, the material price decline 2-3 of aluminium times, the experimental test result is as follows:
1, copper its LED diode P-N junction temperature is 47 ℃ ± 1.2 ℃.
2, its LED diode P-N junction temperature of aluminium matter is 49 ℃ ± 1.1 ℃.
In sum, aluminium matter heater, radiator use technology of the present invention only to promote 3 degree than its copper P-N junction temperature, with respect to copper liquid rare metal as the decline of medium 3 degree, save cost, and combined factors such as temperature drop situation consider down, preferably use the aluminum substrate of the technology of the present invention.
The identical material test of same item device:
Extract the integrated LED module of 100 50 watts of COB, its heat conduction of preparation, the heat abstractor that do not have the chimeric hot transmission method of medium with the present invention, its heating, radiator are aluminium matter, be divided into two groups at random as shown in Figure 7, one group of its radiator is by original size such as A, one group of its radiator is contracted to 1/2-1/3 such as the B of life size, and the experimental test result is as follows:
3, its LED diode P-N junction temperature of original size is 49 ℃ ± 1.1 ℃.
4, be contracted to 51 ℃ ± 1.3 ℃ of its LED diode P-N junction temperatures of 1/2-1/3.
In sum, using technology of the present invention dwindling radiator, is not too big to LED diode P-N junction temperature influence under the situation about reducing cost, so present technique is universal for promoting the use of our LED diode, provides a price advantage.
Claims (11)
1. a hot transmission method is characterized in that heater and radiator are solid matter, between directly contact, the intervention of no transmitting medium.
2. the described hot transmission method of claim 1 is characterized in that heater and radiator are selected from solid metallic.
3. the described hot transmission method of claim 2 is characterized in that heater and radiator are selected from: silver, copper, gold, aluminium.
4. the described hot transmission method of claim 1 is characterized in that heater and radiator contact area Sr, Sp＜Sr＜NSp, and wherein Sr is the actual contact face, and Sp is the area before the surface treatment, and N is the multiple greater than 1.
5. the described hot transmission method of claim 1-4 is characterized in that further comprising the securing member of fastening heater and radiator.
6. the described hot transmission method of claim 5 is characterized in that securing member is the rigidity metalwork of elasticity and positive temperature coefficient.
7. the described hot transmission method of claim 1 is characterized in that heater and radiator can be by to increasing after its former contact-making surface area multipleization.
8. the described hot transmission method of claim 1 is characterized in that heater and radiator can be by many-sided direct the contacts.
9. the described hot transmission method of claim 1 is characterized in that heater can contact by thread forms with radiator, with deepening the area that engage thread obtains N direct contact surface doubly.
10. the application of the described hot transmission method of claim 1-9 in needing heat conduction, heat abstractor.
11. the described application of claim 10 is characterized in that heat conduction, heat radiation for LED light-emitting diode and computer CPU.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201210088694XA CN103208470A (en) | 2012-03-30 | 2012-03-30 | Non-medium inosculating heat conduction method and application thereof |
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| CN201210088694XA CN103208470A (en) | 2012-03-30 | 2012-03-30 | Non-medium inosculating heat conduction method and application thereof |
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| CN103208470A true CN103208470A (en) | 2013-07-17 |
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| CN201210088694XA Pending CN103208470A (en) | 2012-03-30 | 2012-03-30 | Non-medium inosculating heat conduction method and application thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107785500A (en) * | 2017-09-21 | 2018-03-09 | 京东方科技集团股份有限公司 | A kind of radiator structure and OLED display |
| WO2021213107A1 (en) * | 2020-04-21 | 2021-10-28 | 青岛海信激光显示股份有限公司 | Laser assembly |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201078675Y (en) * | 2007-04-29 | 2008-06-25 | 李家茂 | Multi-layer type light apparatus structure |
| CN102042518A (en) * | 2009-10-16 | 2011-05-04 | 富士迈半导体精密工业（上海）有限公司 | Lighting device |
| CN201904372U (en) * | 2010-12-11 | 2011-07-20 | 山东开元电子有限公司 | Bottom connection-type integrated power LED with heat dissipation effect |
-
2012
- 2012-03-30 CN CN201210088694XA patent/CN103208470A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201078675Y (en) * | 2007-04-29 | 2008-06-25 | 李家茂 | Multi-layer type light apparatus structure |
| CN102042518A (en) * | 2009-10-16 | 2011-05-04 | 富士迈半导体精密工业（上海）有限公司 | Lighting device |
| CN201904372U (en) * | 2010-12-11 | 2011-07-20 | 山东开元电子有限公司 | Bottom connection-type integrated power LED with heat dissipation effect |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107785500A (en) * | 2017-09-21 | 2018-03-09 | 京东方科技集团股份有限公司 | A kind of radiator structure and OLED display |
| CN107785500B (en) * | 2017-09-21 | 2019-11-05 | 京东方科技集团股份有限公司 | A kind of radiator structure and OLED display |
| WO2021213107A1 (en) * | 2020-04-21 | 2021-10-28 | 青岛海信激光显示股份有限公司 | Laser assembly |
| CN115461945A (en) * | 2020-04-21 | 2022-12-09 | 青岛海信激光显示股份有限公司 | Laser assembly |
| CN115461945B (en) * | 2020-04-21 | 2024-05-28 | 青岛海信激光显示股份有限公司 | Laser assembly |
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Application publication date: 20130717 |