CN103173186A - Low-temperature resistant hot melt adhesive and processing technology thereof - Google Patents
Low-temperature resistant hot melt adhesive and processing technology thereof Download PDFInfo
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- CN103173186A CN103173186A CN2011104369401A CN201110436940A CN103173186A CN 103173186 A CN103173186 A CN 103173186A CN 2011104369401 A CN2011104369401 A CN 2011104369401A CN 201110436940 A CN201110436940 A CN 201110436940A CN 103173186 A CN103173186 A CN 103173186A
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- resistant hot
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Abstract
The invention provides low-temperature resistant hot melt adhesive and a processing technology of the low-temperature resistant hot melt adhesive. The low-temperature resistant hot melt adhesive comprises the following components: polyamide, an ethylene vinyl acetate copolymer, an ethylene-acrylate-maleic anhydride terpolymer, wax, tackifying resin and an antioxidant. The low-temperature resistant hot melt adhesive is high in adhesive strength, excellent in insulating seal performance, environmentally-friendly, nontoxic, simple in production technology and high in repeatability, and is mainly applicable to places requiring high low-temperature performance.
Description
Technical field
The present invention relates to a kind of low-temperature resistant hot melt glue, mainly be applicable to the environment that low-temperature performance is had relatively high expectations.The invention still further relates to the complete processing of this low-temperature resistant hot melt glue.
Background technology
China is vast in territory, makes a clear distinction between the four seasons, and the temperature difference in region and season is larger.The lower temperature resistance of hot melt adhesive is directly connected to the use safety of Various Seasonal, different areas, and whether hot melt adhesive has wider use range.Under northerly cold climate condition, if the hot melt adhesive resistance to low temperature is relatively poor, thereby the bond effect that embrittlement directly has influence on hot melt adhesive occurs very easily.
Chinese patent CN201010233746.9, title " a kind of low-temperature resistant hot melt glue " have adopted ethylene-vinyl acetate copolymer, thermoplastic styrene segmented copolymer, tackifying resin as major ingredient.Take in proportion first blend after each component materials, after carry out melting mixing.This patent advantage is that the hot melt adhesive curing speed of producing is fast, complete processing is simple.Weak point is that the temperature use range is narrower, only anti--20 ℃ low temperature.
Summary of the invention
The invention provides that a kind of cohesive strength is high, insulated enclosure excellent performance, low temperature resistant and environment-protecting asepsis, production technique is simple and low-temperature resistant hot melt glue and the complete processing thereof of good reproducibility.
To achieve these goals, the invention provides following technical scheme:
A kind of low-temperature resistant hot melt glue, it comprises following component according to weight percent:
Polymeric amide 20-70,
Ethylene vinyl acetate copolymer 20-40,
Ethylene-acrylate maleic anhydride terpolymer 1-20,
Wax 0.5-5,
Tackifying resin 5-30,
Oxidation inhibitor 0.5-3.
Preferably, described polymeric amide is that dimer acid type polyamide comprises: homopolyamide and copolyamide, described polymeric amide is that the derivative repeating unit of diamines and di-carboxylic acid consists of, perhaps made by the lactan ring-opening polymerization, wherein, described diamines comprises aliphatie diamine, alicyclic diamine or aromatic diamine, and described di-carboxylic acid comprises the first carboxylic acid of aliphatic dicarboxylic acid, alicyclic di-carboxylic acid or aromatics, described lactan contains 5-12 carbon atom, and the fusing point of described polymeric amide is 100 ℃-160 ℃.
Preferably, the vinyl acetate content according to the described ethylene vinyl acetate copolymer of weight percent is 10-60%, melting index 5-450g/10min.
Preferably, according to weight percent, the vinyl acetate content of described ethylene vinyl acetate copolymer is that 20-40%, melting index are 10-200g/10min.
Preferably, according to weight percent, the acrylate content of described ethylene-acrylate maleic anhydride terpolymer is 1-20%.
Preferably, described tackifying resin is: the petroleum resin of rosin and Abietyl modified derivative, carbon five or carbon nine hydrocarbon and one or more mixtures in hydrogenated products, terpenes and hydrogenated derivatives thereof thereof.
Preferably, described oxidation inhibitor is hindered phenol or is: the hindered phenol of being combined with aid anti-oxidants.
Preferably; described oxidation inhibitor is composite antioxidant; comprise: four (β-(3; three grades of butyl of 5--4-hydroxy phenyl) propionic acid) pentaerythritol ester, N; the mixture that N-pair-[3-(3,5-di-tert-butyl-hydroxy phenyl) propionyl] hexanediamine and three kinds of components of thio-2 acid two octadecyl ester mix according to arbitrary proportion.
Preferably, described wax is paraffin, polyethylene wax or Microcrystalline Wax.
The present invention also provides a kind of complete processing of low-temperature resistant hot melt glue, and it comprises step:
The preparation steps of A, material: formula according to claim 1 takes the material of each component;
B, premix step: carry out the banburying granulation for polymeric amide, ethene hexenoic acid ethyl ester multipolymer and the ethylene-acrylate maleic anhydride terpolymer of indissoluble and then mix with the material of other components;
C, mixing step: adopt twin screw extruder to carry out the material of above-mentioned each component mixing;
D, granulation step: the method that adopts the pelletizing of circulating water hobboing cutter is carried out granulation with above-mentioned material after mixing;
E, packing and storing step: packing box obtains required hot melt adhesive after storing described granulation.
By implementing above technical scheme, has following technique effect: low-temperature resistant hot melt glue provided by the invention and complete processing thereof, added the fabulous ethylene vinyl acetate copolymer of resistance to low temperature (EVA) in this thermosol formula, low temperature that can anti--40 ℃, cohesive strength is unchanged under low temperature environment, also without the embrittlement phenomenon
It is material of main part that this hot melt adhesive adopts polymeric amide, and use temperature a wider range, and in use procedure can not cause because of the rising of envrionment temperature or reduction the reduction of cohesive strength.Applicable to multiple severe environment.
This hot melt adhesive has added the ethylene-acrylate maleic anhydride terpolymer, can effectively bond to polyethylene (PE), polypropylene (PP) and polyvinyl chloride (PVC), and cohesive strength is higher, and is good with insulated enclosure after the external wall material bonding.
This hot melt adhesive (ROHS) detects by " in the electronic electric equipment restriction use some objectionable impurities instruction " that European Union promulgates, human body and environment all without endangering, and are produced without obnoxious flavour in use procedure.
This hot melt adhesive production technique is simple, employing be the blend preparation technology of simple actual effect, avoided solvent recuperation and purification of products, the technique simple and stable, good reproducibility, thus guaranteed quality product.Produce without obnoxious flavour in production process, to environment without harm.Production energy consumption is lower, has economic benefits and suitability for industrialized production prospect preferably.Be specially adapted to connection and the protection of communication cable, power cable, oil and gas pipes joint.The performance index of hot melt adhesive of the present invention are as shown in table 1 below:
Table 1:
Embodiment
Technical scheme for a better understanding of the present invention, the below describes embodiment provided by the invention in detail.
Technical scheme for a better understanding of the present invention, the below describes embodiment provided by the invention in detail.
embodiment one: high-melting-point dimer acid type polyamide resin (trade(brand)name dimeracid YH-17, available from long-range Chemical Group (Guangzhou) 50g of branch office), ethylene vinyl acetate (trade(brand)name EVA220, available from Mitsui company) 10g, ethylene vinyl acetate (trade(brand)name EVA450, available from Mitsui company) 10g, ethylene-acrylate maleic anhydride terpolymer (trade(brand)name 6200, available from ARKEMA Lotader) 5g, terpine resin (trade(brand)name T100, available from Jitian's chemical industry company limited) 22g, oxidation inhibitor (model is 1010) 1g, oxidation inhibitor (model is 1098) 1g, oxidation inhibitor (model is 802) 0.5g, polyethylene wax 0.5g, add carry out in twin screw extruder mixing, melting temperature is 140 ℃, mixing twice, adopt the pelletizing of circulating water hobboing cutter to make the high-melting point polyamide thermosol product, 152 ℃ of the softening temperature positions of this product, viscosity is 150000mpa.s.
embodiment two: high-melting-point dimer acid type polyamide resin (120 ℃ of softening temperatures, trade(brand)name LR-DLB-120, available from Liri Chemical New Materials Co., Ltd. Shanghai) 40g, ethylene vinyl acetate (trade(brand)name EEA210, available from Mitsui company) 10g, ethylene vinyl acetate (trade(brand)name VA920, available from Hyundai petroleum chemistry company) 20g, ethylene-acrylate maleic anhydride terpolymer (trade(brand)name 8200, available from ARKEMA Lotader) 1g, C 5 hydrogenated petroleum resin (trade(brand)name C-100W, available from Nanjing Yi Shiman) 26g, oxidation inhibitor (model is 1010) 1g, oxidation inhibitor (model is 1098) 1g, oxidation inhibitor (model is 802) 0.5g, polyethylene wax 0.5g, all materials add carry out in twin screw extruder mixing, melting temperature is 120 ℃, mixing twice, adopt the pelletizing of circulating water hobboing cutter to make the high-melting point polyamide thermosol product, 120 ℃ of the softening temperature positions of this product, viscosity is 154000mpa.s.
embodiment three: high-melting-point dimer acid type polyamide resin (140 ℃ of softening temperatures, trade(brand)name LR-DLB-150, available from Liri Chemical New Materials Co., Ltd. Shanghai) 50g, ethylene vinyl acetate (trade(brand)name EEA210, available from Mitsui company) 20g, ethylene vinyl acetate (trade(brand)name EVA930, available from Hyundai petroleum chemistry company) 10g, ethylene-acrylate maleic anhydride terpolymer (trade(brand)name 8200, available from ARKEMALotader) 1g, terpine resin (trade(brand)name T100, available from Jitian's chemical industry company limited) 16g, oxidation inhibitor (model is 1010) 1g, oxidation inhibitor (model is 1098) 1g, oxidation inhibitor (model is 802) 0.5g, polyethylene wax 0.5g, all materials add carry out in twin screw extruder mixing, melting temperature is 120 ℃, mixing twice, adopt the pelletizing of circulating water hobboing cutter to make the high-melting point polyamide thermosol product, 145 ℃ of the softening temperature positions of this product, viscosity is 144000mpa.s.
The embodiment of the present invention also provides a kind of complete processing of low-temperature resistant hot melt glue, and it comprises step:
The preparation steps of A, material: formula described according to the various embodiments described above takes the material of each component;
B, premix step: polymeric amide, ethylene ethyl acrylate copolymer and ethylene-acrylate maleic anhydride terpolymer for infusibility melts, can first carry out the banburying granulation, then be mixed to get mixture with other components;
C, mixing step: adopt twin screw extruder that the mixture of above-mentioned each component is carried out mixing, utilize the larger shearing force of twin screw extruder to make material fully mixing.The material that configures carries out mixing under 100 ℃-140 ℃.For guaranteeing mixing homogeneity, answer mixing 2 to 3 times.
D, granulation step: the method that adopts the pelletizing of circulating water hobboing cutter is carried out granulation with above-mentioned material after mixing; Make the particle diameter of this hot melt adhesive micelle even, be beneficial to blanking.
E, packing and storing step: packing box obtains required hot melt adhesive after storing described granulation.Because the hot melt adhesive that makes is easy to suction, should seal preservation.
Above a kind of low-temperature resistant hot melt glue and the complete processing thereof that the embodiment of the present invention is provided is described in detail, for one of ordinary skill in the art, thought according to the embodiment of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (10)
1. a low-temperature resistant hot melt glue, is characterized in that, according to weight percent, comprises following component:
Polymeric amide 20-70,
Ethylene vinyl acetate copolymer 20-40,
Ethylene-acrylate maleic anhydride terpolymer 1-20,
Wax 0.5-5,
Tackifying resin 5-30,
Oxidation inhibitor 0.5-3.
2. low-temperature resistant hot melt glue as claimed in claim 1, it is characterized in that, described polymeric amide is that dimer acid type polyamide comprises: homopolyamide and copolyamide, described polymeric amide is that the derivative repeating unit of diamines and di-carboxylic acid consists of, perhaps made by the lactan ring-opening polymerization, wherein, described diamines comprises aliphatie diamine, alicyclic diamine or aromatic diamine, described di-carboxylic acid comprises the first carboxylic acid of aliphatic dicarboxylic acid, alicyclic di-carboxylic acid or aromatics, described lactan contains 5-12 carbon atom, and the fusing point of described polymeric amide is 100 ℃-160 ℃.
3. as claim 1 or 2 low-temperature resistant hot melt glues, it is characterized in that, is 10-60%, melting index 5-450g/10min according to the vinyl acetate content of the described ethylene vinyl acetate copolymer of weight percent.
4. low-temperature resistant hot melt glue as claimed in claim 3, is characterized in that, according to weight percent, the vinyl acetate content of described ethylene vinyl acetate copolymer is that 20-40%, melting index are 10-200g/10min.
5. low-temperature resistant hot melt glue as claimed in claim 1 or 2, is characterized in that, according to weight percent, the acrylate content of described ethylene-acrylate maleic anhydride terpolymer is 1-20%.
6. low-temperature resistant hot melt glue as claimed in claim 1 or 2, it is characterized in that, described tackifying resin is: the petroleum resin of rosin and Abietyl modified derivative, carbon five or carbon nine hydrocarbon and one or more mixtures in hydrogenated products, terpenes and hydrogenated derivatives thereof thereof.
7. low-temperature resistant hot melt glue as claimed in claim 1 or 2, is characterized in that, described oxidation inhibitor is hindered phenol or is: the hindered phenol of being combined with aid anti-oxidants.
8. low-temperature resistant hot melt glue as claimed in claim 1; it is characterized in that; described oxidation inhibitor is composite antioxidant; comprise: four (β-(3; three grades of butyl of 5--4-hydroxy phenyl) propionic acid) pentaerythritol ester, N; the mixture that N-pair-[3-(3,5-di-tert-butyl-hydroxy phenyl) propionyl] hexanediamine and three kinds of components of thio-2 acid two octadecyl ester mix according to arbitrary proportion.
9. low-temperature resistant hot melt glue as claimed in claim 1 or 2, is characterized in that, described wax is paraffin, polyethylene wax or Microcrystalline Wax.
10. the complete processing of a low-temperature resistant hot melt glue, is characterized in that, comprises step:
The preparation steps of A, material: formula according to claim 1 takes the material of each component;
B, premix step: carry out the banburying granulation for polymeric amide, ethene hexenoic acid ethyl ester multipolymer and the ethylene-acrylate maleic anhydride terpolymer of indissoluble and then mix with the material of other components;
C, mixing step: adopt twin screw extruder to carry out the material of above-mentioned each component mixing;
D, granulation step: the method that adopts the pelletizing of circulating water hobboing cutter is carried out granulation with above-mentioned material after mixing;
E, packing and storing step: packing box obtains required hot melt adhesive after storing described granulation.
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| CN2011104369401A CN103173186A (en) | 2011-12-21 | 2011-12-21 | Low-temperature resistant hot melt adhesive and processing technology thereof |
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| CN2011104369401A CN103173186A (en) | 2011-12-21 | 2011-12-21 | Low-temperature resistant hot melt adhesive and processing technology thereof |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103509490A (en) * | 2013-09-06 | 2014-01-15 | 芜湖市正通电气设备有限公司 | Hot melt adhesive for edge banding of furniture |
| CN103866577A (en) * | 2014-04-01 | 2014-06-18 | 许金补 | Weaving process of wool blended fabrics |
| CN103892492A (en) * | 2014-04-01 | 2014-07-02 | 江西百利纺织有限公司 | Production method of crease-resistant suit fabric |
| CN104015324A (en) * | 2014-05-27 | 2014-09-03 | 东莞市华立实业股份有限公司 | Preparation technology for edge-sealing strip subjected to co-extrusion molding |
| CN104497958A (en) * | 2014-12-09 | 2015-04-08 | 上海海隆石油化工研究所 | Adhesive for corrosion prevention of 3PP pipeline |
| CN104789161A (en) * | 2015-05-08 | 2015-07-22 | 南通天燕纺织器材有限公司 | High-strength wear-resistant textile leather collar |
| CN106147655A (en) * | 2016-06-28 | 2016-11-23 | 广西众昌树脂有限公司 | Low-temperature hot melt adhesive |
| CN107922697A (en) * | 2015-09-14 | 2018-04-17 | Sika技术股份公司 | Polyolefin hotmelt and its purposes laminated for vacuum deep-draw with low reactivating temperature and high-fire resistance |
| CN108913079A (en) * | 2018-05-14 | 2018-11-30 | 启东鑫天鼎热熔胶有限公司 | A kind of formula and preparation method thereof of low temperature resistant polyester hot-melt adhesive |
| CN109135587A (en) * | 2018-07-03 | 2019-01-04 | 定远县嘉恒木业有限公司 | A kind of floor compound adhesive and its manufacturing process |
| CN110733194A (en) * | 2019-10-24 | 2020-01-31 | 东莞市五世昌新材料有限公司 | kinds of net films used for adhering rubber outsole and EVA midsole in compression molding mode |
| CN110845987A (en) * | 2019-12-04 | 2020-02-28 | 南通协鑫热熔胶有限公司 | High-performance copolyamide hot melt adhesive composition |
| CN112778964A (en) * | 2021-01-27 | 2021-05-11 | 东莞新能德科技有限公司 | Hot melt adhesive, preparation method thereof and lead insulation method |
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| CN1990810A (en) * | 2005-12-30 | 2007-07-04 | 上海轻工业研究所有限公司 | High-melting point polyamide thermosol composition and method of making the same |
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Patent Citations (3)
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| US4374231A (en) * | 1980-05-13 | 1983-02-15 | Raychem Corporation | Adhesive composition |
| US4791164A (en) * | 1985-02-13 | 1988-12-13 | Henkel Kommanditgesellschaft Auf Aktien | Polymeric hotmelt adhesive |
| CN1990810A (en) * | 2005-12-30 | 2007-07-04 | 上海轻工业研究所有限公司 | High-melting point polyamide thermosol composition and method of making the same |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103509490A (en) * | 2013-09-06 | 2014-01-15 | 芜湖市正通电气设备有限公司 | Hot melt adhesive for edge banding of furniture |
| CN103509490B (en) * | 2013-09-06 | 2016-05-18 | 繁昌县倍思生产力促进中心有限公司 | A kind of edge sealing hot melt adhesive for furniture |
| CN103866577B (en) * | 2014-04-01 | 2016-03-30 | 青岛文创科技有限公司 | A kind of weaving process of wool blended fabric |
| CN103866577A (en) * | 2014-04-01 | 2014-06-18 | 许金补 | Weaving process of wool blended fabrics |
| CN103892492A (en) * | 2014-04-01 | 2014-07-02 | 江西百利纺织有限公司 | Production method of crease-resistant suit fabric |
| CN103892492B (en) * | 2014-04-01 | 2015-11-18 | 江西百利纺织有限公司 | A kind of preparation method of wrinkle resistant suiting |
| CN104015324A (en) * | 2014-05-27 | 2014-09-03 | 东莞市华立实业股份有限公司 | Preparation technology for edge-sealing strip subjected to co-extrusion molding |
| CN104497958A (en) * | 2014-12-09 | 2015-04-08 | 上海海隆石油化工研究所 | Adhesive for corrosion prevention of 3PP pipeline |
| CN104789161A (en) * | 2015-05-08 | 2015-07-22 | 南通天燕纺织器材有限公司 | High-strength wear-resistant textile leather collar |
| CN107922697A (en) * | 2015-09-14 | 2018-04-17 | Sika技术股份公司 | Polyolefin hotmelt and its purposes laminated for vacuum deep-draw with low reactivating temperature and high-fire resistance |
| CN106147655A (en) * | 2016-06-28 | 2016-11-23 | 广西众昌树脂有限公司 | Low-temperature hot melt adhesive |
| CN108913079A (en) * | 2018-05-14 | 2018-11-30 | 启东鑫天鼎热熔胶有限公司 | A kind of formula and preparation method thereof of low temperature resistant polyester hot-melt adhesive |
| CN108913079B (en) * | 2018-05-14 | 2020-12-22 | 启东鑫天鼎热熔胶有限公司 | Formula and preparation method of low-temperature-resistant polyester hot melt adhesive |
| CN109135587A (en) * | 2018-07-03 | 2019-01-04 | 定远县嘉恒木业有限公司 | A kind of floor compound adhesive and its manufacturing process |
| CN110733194A (en) * | 2019-10-24 | 2020-01-31 | 东莞市五世昌新材料有限公司 | kinds of net films used for adhering rubber outsole and EVA midsole in compression molding mode |
| CN110845987A (en) * | 2019-12-04 | 2020-02-28 | 南通协鑫热熔胶有限公司 | High-performance copolyamide hot melt adhesive composition |
| CN112778964A (en) * | 2021-01-27 | 2021-05-11 | 东莞新能德科技有限公司 | Hot melt adhesive, preparation method thereof and lead insulation method |
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Application publication date: 20130626 |