CN103160219A - 各向异性导电膜组合物、各向异性导电膜和半导体装置 - Google Patents
各向异性导电膜组合物、各向异性导电膜和半导体装置 Download PDFInfo
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- CN103160219A CN103160219A CN201210544591XA CN201210544591A CN103160219A CN 103160219 A CN103160219 A CN 103160219A CN 201210544591X A CN201210544591X A CN 201210544591XA CN 201210544591 A CN201210544591 A CN 201210544591A CN 103160219 A CN103160219 A CN 103160219A
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- H01L2224/29001—Core members of the layer connector
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- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29399—Coating material
- H01L2224/294—Coating material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29438—Coating material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/29455—Nickel [Ni] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
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- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Dispersion Chemistry (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Non-Insulated Conductors (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Abstract
Description
实施例1 | 实施例2 | 实施例3 | 实施例4 | 对比例1 | 对比例2 | |
固化率(%) | 82 | 81 | 80 | 82 | 64 | 71 |
实施例1 | 实施例2 | 实施例3 | 实施例4 | 对比例1 | 对比例2 | |
玻璃化转变温度(Tg,°C) | 132 | 141 | 137 | 135 | 147 | 121 |
实施例1 | 实施例2 | 实施例3 | 实施例4 | 对比例1 | 对比例2 | |
初始连接电阻(Ω) | 0.52 | 0.48 | 1.5 | 0.63 | 11.8 | 1.0 |
可靠性测试后的连接电阻(Ω) | 1.6 | 1.4 | 2.9 | 1.8 | 62.9 | 11.3 |
Claims (12)
Applications Claiming Priority (2)
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KR10-2011-0134685 | 2011-12-14 | ||
KR1020110134685A KR101391697B1 (ko) | 2011-12-14 | 2011-12-14 | 이방성 도전 필름용 조성물 및 이를 이용한 이방성 도전 필름 |
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CN103160219A true CN103160219A (zh) | 2013-06-19 |
CN103160219B CN103160219B (zh) | 2015-09-23 |
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US (1) | US8766443B2 (zh) |
KR (1) | KR101391697B1 (zh) |
CN (1) | CN103160219B (zh) |
TW (1) | TWI482793B (zh) |
Cited By (4)
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CN105017980A (zh) * | 2014-04-30 | 2015-11-04 | 三星Sdi株式会社 | 各向异性导电膜的组成物、各向异性导电膜及半导体装置 |
CN106189891A (zh) * | 2014-09-01 | 2016-12-07 | 三星Sdi株式会社 | 各向异性导电膜和由其连接的半导体装置 |
CN106537518A (zh) * | 2014-07-25 | 2017-03-22 | 三星Sdi株式会社 | 接着剂组成物、非等向性导电膜及使用其的半导体元件 |
CN107851478A (zh) * | 2015-07-23 | 2018-03-27 | 三星Sdi株式会社 | 非等向性导电膜用组成物、非等向性导电膜及使用其的显示装置 |
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JP6175500B2 (ja) * | 2013-07-23 | 2017-08-02 | 旭化成株式会社 | 銅及び/又は銅酸化物分散体、並びに該分散体を用いて形成された導電膜 |
CN104559653A (zh) * | 2013-10-29 | 2015-04-29 | 中国石油天然气集团公司 | 一种氢化双酚a环氧甲板漆及制造方法 |
JP6329144B2 (ja) * | 2014-05-14 | 2018-05-23 | 積水化学工業株式会社 | 導電ペースト及び導電ペーストの製造方法 |
TWI663608B (zh) * | 2015-01-22 | 2019-06-21 | 日商京瓷股份有限公司 | Conductive resin composition and semiconductor device |
CN109666413B (zh) * | 2018-12-17 | 2020-09-08 | 深圳市华星光电技术有限公司 | 一种各向异性导电胶黏剂及其导电膜 |
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CN105017980A (zh) * | 2014-04-30 | 2015-11-04 | 三星Sdi株式会社 | 各向异性导电膜的组成物、各向异性导电膜及半导体装置 |
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CN106537518A (zh) * | 2014-07-25 | 2017-03-22 | 三星Sdi株式会社 | 接着剂组成物、非等向性导电膜及使用其的半导体元件 |
CN106537518B (zh) * | 2014-07-25 | 2018-06-12 | 三星Sdi株式会社 | 非等向性导电膜及使用其的半导体元件 |
CN106189891A (zh) * | 2014-09-01 | 2016-12-07 | 三星Sdi株式会社 | 各向异性导电膜和由其连接的半导体装置 |
CN106189891B (zh) * | 2014-09-01 | 2020-03-17 | 国都化学株式会社 | 各向异性导电膜和由其连接的半导体装置 |
CN107851478A (zh) * | 2015-07-23 | 2018-03-27 | 三星Sdi株式会社 | 非等向性导电膜用组成物、非等向性导电膜及使用其的显示装置 |
Also Published As
Publication number | Publication date |
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CN103160219B (zh) | 2015-09-23 |
TWI482793B (zh) | 2015-05-01 |
KR101391697B1 (ko) | 2014-05-07 |
US8766443B2 (en) | 2014-07-01 |
KR20130067779A (ko) | 2013-06-25 |
US20130154093A1 (en) | 2013-06-20 |
TW201331252A (zh) | 2013-08-01 |
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