CN103146953A - 185-DEG C lead-free low-temperature alloy for fuse burned-out core and preparation method thereof - Google Patents
185-DEG C lead-free low-temperature alloy for fuse burned-out core and preparation method thereof Download PDFInfo
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- CN103146953A CN103146953A CN2013100948781A CN201310094878A CN103146953A CN 103146953 A CN103146953 A CN 103146953A CN 2013100948781 A CN2013100948781 A CN 2013100948781A CN 201310094878 A CN201310094878 A CN 201310094878A CN 103146953 A CN103146953 A CN 103146953A
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- lead
- temperature alloy
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- free low
- temperature
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- 239000000956 alloy Substances 0.000 title claims abstract description 45
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 45
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 15
- 229910052738 indium Inorganic materials 0.000 claims abstract description 12
- 229910052718 tin Inorganic materials 0.000 claims abstract description 12
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052802 copper Inorganic materials 0.000 claims abstract description 8
- 229910052709 silver Inorganic materials 0.000 claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 6
- 239000002994 raw material Substances 0.000 claims abstract description 6
- 239000004332 silver Substances 0.000 claims abstract description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- 238000001125 extrusion Methods 0.000 claims description 5
- 230000004927 fusion Effects 0.000 claims description 4
- 239000000203 mixture Substances 0.000 abstract description 8
- 239000002184 metal Substances 0.000 abstract description 7
- 229910052751 metal Inorganic materials 0.000 abstract description 7
- 230000008901 benefit Effects 0.000 abstract description 5
- 230000008018 melting Effects 0.000 abstract description 5
- 238000002844 melting Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 3
- 238000005266 casting Methods 0.000 abstract description 2
- 239000006023 eutectic alloy Substances 0.000 abstract description 2
- 238000007872 degassing Methods 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000002893 slag Substances 0.000 abstract 1
- 239000010935 stainless steel Substances 0.000 abstract 1
- 229910001220 stainless steel Inorganic materials 0.000 abstract 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 5
- 229910052797 bismuth Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
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Abstract
The invention relates to a 185-DEG C lead-free low-temperature alloy for a fuse burned-out core and a preparation method thereof. The 185-DEG C lead-free low-temperature alloy comprises the following raw materials in percentage by weight: 0.4%-0.6% of Cu, 2.8%-3.2% of Ag, 13.5%-14.5% of In and the balance being Sn. The preparation method of the 185-DEG C lead-free low-temperature alloy comprises the following preparation steps of: putting metal tin to a stainless steel crucible; heating up the crucible by using an electric furnace; adding metal copper at 280-320 DEG C when the tin is molten; adding metal silver after the metal copper is molten down; adding indium after the metal sliver is molten down; conventionally adding a degassing agent for degassing after the indium is molten down; and removing the slag and casting. The lead-free low-temperature alloy containing Sn, Cu, In and Ag disclosed by the invention is used for manufacturing a burned-out core of a temperature fuse, and the melting point of the lead-free low-temperature alloy is 185 DEG C +/-3 DEG C. The low-temperature alloy is eutectic alloy which has the characteristics of good composition uniformity, narrow melting point range, low cost and the like, and is a lead-free environment-friendly material. Moreover, the 185-DEG C lead-free low-temperature alloy has good social benefits and economic benefits.
Description
Technical field
The invention belongs to the alloy field, relate to the lead-free low-temperature alloy, especially a kind of 185 ℃ of fuse burn-out core lead-free low-temperature Alloy And Preparation Methods.
Background technology
Fusible core is the heart of Thermal Cutoffs, be the technological core of Thermal Cutoffs production technique, traditional Thermal Cutoffs mostly is tinsel, as a kind of material-lead that is harmful to environment, be detrimental to health in production and use procedure, environment is had great pollution.
Low-temperature alloy can be used for the protection of electronic circuit in electron trade, multiplex fusing core in making Thermal Cutoffs.It is that company is lived by thousand of the alpha of the U.S. and Japan that current low-temperature alloy leads the production firm of world's modern technique.
According to the retrieval, find the following patent documentation relevant to the application, wherein CN102296208A discloses a kind of lead-free low-temperature alloy of the fusing core for making Thermal Cutoffs, and its raw material consists of and weight percentage ranges is respectively: Bi:34%-36%; Zn:3.5%-4.5%; Sn: surplus; The step of its preparation method is: metallic tin is put into stainless crucible, heat on electric furnace, after the tin fusing, under 250-280 ℃, add metallic zinc, fusion clear after, then add bismuth metal, air release agent is degassed, slagging-off to carry out conventional adding after melting clearly, is cast into the low-temperature alloy rod that needs size.Patent documentation CN102912204A discloses a kind of lead-free low-temperature Alloy And Preparation Method and application, and this low-temperature alloy is comprised of tin, bismuth, three kinds of metals of indium, and each weight percentages of components is as follows: tin 15-17%; Bismuth 32-34%; Surplus is indium, and its preparation methods steps is: ⑴ melts tin; ⑵ melt bismuth; ⑶ melt indium; ⑷ degassed; ⑸ casting.Patent documentation CN101812623A discloses a kind of novel environment-friendly low-temperature alloy and preparation method thereof, and it mainly is made of indium, tin, bismuth, zinc, silver metal, on the basis that is associated gold at Bi-In-Sn, adds Zn, the metals such as Ag.
Front two pieces in above-mentioned patent documentation is the technical scheme of protection of the applicant application of this patent; from the application's other part be the composition of its alloy and component content different; the fusing point of final alloy is different; belong to different products; the 3rd piece of file is other applicants' technical scheme; have larger difference with the application's technical scheme, its product fusing point and component content are all different.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art part, provide a kind of melting range narrow, cost is low, 185 ℃ of fuse burn-out core lead-free low-temperature alloys of leadless environment-friendly, the preparation method of this simple, easy to operate alloy of step is provided simultaneously, and the fuse burn-out core of this alloy preparation, the fusing point of the low-temperature alloy of present method preparation is 185 ± 3 ℃.
The objective of the invention is to be achieved through the following technical solutions:
A kind of 185 ℃ of fuse burn-out core lead-free low-temperature alloys, its raw material consists of and weight percentage ranges is respectively:
Cu：0.4%-0.6%；
Ag:2.8%-3.2%；
In：13.5%-14.5%；
Sn: surplus.
And its raw material consists of and weight percentage ranges is respectively:
Cu：0.5%；
Ag:?3%；
In：15%；
Sn：82.5。
A kind of its preparation method of 185 ℃ of fuse burn-out core lead-free low-temperature alloys, step is:
⑴ put into stainless crucible with metallic tin, heats on electric furnace, treats the tin fusing;
⑵ add metallic copper under 280-320 ℃, fusion clear after, then add argent, silver molten clear after, then add indium, moltenly carry out conventional adding after clear air release agent be degassed, slagging-off, be cast into the low-temperature alloy rod that needs size.
A kind of 185 ℃ of fuse burn-out cores push the low-temperature alloy rod with extrusion machine, extrusion temperature is 80 ℃, and extruding needs the low-temperature alloy of size silk as the fusing core of Thermal Cutoffs.
Advantage of the present invention and positively effect are:
1, the lead-free low-temperature alloy that contains Sn, Cu, In, Ag of the present invention's preparation, ratio by the various compositions of meticulous adjusting, make the fusing point of the alloy of preparing reach 185 ± 3 ℃, melting range is narrow, this low-temperature alloy is eutectic alloy, have the characteristics such as homogeneous chemical composition, cost are low, be used for making the fusing core of Thermal Cutoffs, safe and reliable.
2, low-temperature alloy of the present invention is the leadless environment-friendly material, can replace traditional tinsel, and its composition is not leaded, is therefore the leadless environment-friendly material, has good social benefit and economic benefit.
Embodiment
Further illustrate the present invention below in conjunction with specific embodiment; It is emphasized that: to those skilled in the art, can be improved according to the above description or conversion, and all these improve and conversion all should belong to the protection domain of claims of the present invention.
A kind of 185 ℃ of fuse burn-out core lead-free low-temperature alloys, its concrete composition is Sn
82.5Cu
0.5In
14Ag
3, concrete composition and weight proportion are as follows:
Cu：0.5%；
Ag:?3%；
In：15%；
Sn：82.5%。
Can also adopt as the proportioning in following table, summation is 100%
| Chemical composition % | Sn | Cu | In | Ag |
| 100% | 81.5-83.5 | 0.4-0.6 | 13.5-14.5 | 2.8-3.2 |
A kind of preparation method of 185 ℃ of fuse burn-out core lead-free low-temperature alloys, step is:
⑴ put into metallic tin by weight ratio stainless crucible, is heated to the tin fusing on electric furnace;
⑵ add metallic copper under 280-320 ℃, fusion clear after, then add argent, silver molten clear after, then add indium, moltenly add that air release agent is degassed, slagging-off after clear, being cast into diameter is the low-temperature alloy rod of 25mm;
⑶ with the vertical extruder of 100 tons extruding, and extrusion temperature is 80 ℃, and mould is the 5 holes extruding of 25mm, and the low-temperature alloy silk of extruding diameter and be 1.0mm uses as the fusing core of Thermal Cutoffs.
The metallic tin that uses in the embodiment of the present invention, copper, silver, indium and air release agent are the known products of the industry.
The fusing point that confirms by experiment the alloy prepare reaches 185 ± 3 ℃.
Claims (4)
1. one kind 185 ℃ fuse burn-out core lead-free low-temperature alloys is characterized in that: its raw material consists of and weight percentage ranges is respectively:
Cu：0.4%-0.6%；
Ag:2.8%-3.2%；
In：13.5%-14.5%；
Sn: surplus.
2. 185 ℃ of fuse burn-out core lead-free low-temperature alloys according to claim 1 is characterized in that: its raw material consists of and weight percent is respectively:
Cu：0.5%；
Ag:?3%；
In：15%；
Sn：82.5%。
3. its preparation method of one kind 185 ℃ fuse burn-out core lead-free low-temperature alloys, it is characterized in that: step is:
⑴ heat metallic tin, treats the tin fusing;
⑵ add metallic copper under 280-320 ℃, fusion clear after, then add argent, silver molten clear after, then add indium, moltenly carry out conventional adding after clear air release agent be degassed, slagging-off, be cast into the low-temperature alloy rod that needs size.
4. 185 ℃ of fuse burn-out cores, it is characterized in that: the low-temperature alloy rod that claim 3 is prepared pushes with extrusion machine, and extrusion temperature is 80 ℃, and extruding needs the low-temperature alloy of size silk as the fusing core of Thermal Cutoffs.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310094878.1A CN103146953B (en) | 2013-03-22 | 2013-03-22 | 185-DEG C lead-free low-temperature alloy for fuse burned-out core and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310094878.1A CN103146953B (en) | 2013-03-22 | 2013-03-22 | 185-DEG C lead-free low-temperature alloy for fuse burned-out core and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103146953A true CN103146953A (en) | 2013-06-12 |
| CN103146953B CN103146953B (en) | 2015-01-07 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310094878.1A Active CN103146953B (en) | 2013-03-22 | 2013-03-22 | 185-DEG C lead-free low-temperature alloy for fuse burned-out core and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109192636A (en) * | 2018-10-26 | 2019-01-11 | 东莞市福实五金有限公司 | Fuse the preparation method of core in a kind of novel early warning fuse and fuse |
| US20220362890A1 (en) * | 2018-08-31 | 2022-11-17 | Indium Corporation | Snin solder alloys |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005220374A (en) * | 2004-02-03 | 2005-08-18 | Fcm Kk | Terminal, and component and product having the same |
| CN101675558A (en) * | 2007-03-12 | 2010-03-17 | 千住金属工业株式会社 | Anisotropic electroconductive material |
| KR20100062016A (en) * | 2008-12-01 | 2010-06-10 | 주식회사 코멧네트워크 | Solder alloy for manufacturing sputtering target |
| CN102912204A (en) * | 2012-10-18 | 2013-02-06 | 天津百瑞杰焊接材料有限公司 | Low temperature alloy and preparation method and application thereof |
-
2013
- 2013-03-22 CN CN201310094878.1A patent/CN103146953B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005220374A (en) * | 2004-02-03 | 2005-08-18 | Fcm Kk | Terminal, and component and product having the same |
| CN101675558A (en) * | 2007-03-12 | 2010-03-17 | 千住金属工业株式会社 | Anisotropic electroconductive material |
| KR20100062016A (en) * | 2008-12-01 | 2010-06-10 | 주식회사 코멧네트워크 | Solder alloy for manufacturing sputtering target |
| CN102912204A (en) * | 2012-10-18 | 2013-02-06 | 天津百瑞杰焊接材料有限公司 | Low temperature alloy and preparation method and application thereof |
Non-Patent Citations (1)
| Title |
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| 王俭辛等: "Sn-Ag-Cu-In无铅钎料润湿性能及显微组织", 《焊接学报》 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220362890A1 (en) * | 2018-08-31 | 2022-11-17 | Indium Corporation | Snin solder alloys |
| US11999018B2 (en) | 2018-08-31 | 2024-06-04 | Indium Corporation | SnBi and SnIn solder alloys |
| CN109192636A (en) * | 2018-10-26 | 2019-01-11 | 东莞市福实五金有限公司 | Fuse the preparation method of core in a kind of novel early warning fuse and fuse |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103146953B (en) | 2015-01-07 |
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Address after: 300 350 No. 38 Baoyuan Road, Jinnan Economic Development Zone (East District), Tianjin Patentee after: Tianjin Bairuijie Welding Materials Co.,Ltd. Address before: No. 38 Baoyuan Road, Jinnan District, Tianjin City, 300350 Patentee before: TIANJIN BAIRUIJIE WELDING MATERIAL Co.,Ltd. |
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