CN103131979A - Annealing method in silver metallic oxide composite electrical contact making - Google Patents
Annealing method in silver metallic oxide composite electrical contact making Download PDFInfo
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- CN103131979A CN103131979A CN2013100488294A CN201310048829A CN103131979A CN 103131979 A CN103131979 A CN 103131979A CN 2013100488294 A CN2013100488294 A CN 2013100488294A CN 201310048829 A CN201310048829 A CN 201310048829A CN 103131979 A CN103131979 A CN 103131979A
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- metal oxide
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Abstract
The invention relates to an annealing method in silver metallic oxide composite electrical contact making. The annealing method in the silver metallic oxide composite electrical contact making includes the steps of annealing silver alloy in fuse salt of 550-600 DEG C for 1-2 hours, taking out the silver alloy to wash and dry, implementing internal oxidation, and welding the silver alloy with basic material to form an electrical contact of a composite structure. According to the annealing method in the silver metallic oxide composite electrical contact making, an annealing environment is not an air environment or a vacuum environment but the liquid fuse salt, so that the surface of contact material is necessarily contacted with liquid. Accordingly, contacts can be effectively avoided to be contacted directly, so that alloying elements cannot be spread and moved into a fine silver layer covering on the contact material. The annealing method in the silver metallic oxide composite electrical contact making has good application prospect.
Description
Technical field
The invention belongs to the siluer metal oxide compound electrical contact and make the field, the method for annealing during particularly a kind of siluer metal oxide compound electrical contact is made.
Background technology
Electrical contact is the core component in the devices such as switch, isolating switch, rly., contactor, plays conducting and breaking circuits.In electrical contact material, siluer metal oxide has the performances such as good anti-melting welding, anti-electrical wear, is used widely.Due to silver-colored price, so electrical contact often adopts composite structure, only adopts siluer metal oxide at working face, and the consumption of silver is reduced thus with body materials such as copper in other positions.
Can hinder the combination of silver-based contact and body material due to the oxide compound in the siluer metal oxide contact material, therefore need to cover in advance a thin fine silver layer on the bonding surface of contact material, and carry out diffusion annealing and process.Anneal is carried out in special atmosphere oven or vacuum oven usually.
Yet, in anneal, owing to can be in contact with one another between contact, so in heat-processed, on fine silver face that the alloy face directly contacts, the diffusive migration phenomenon of alloying element can occur.Its result, in contact and body material recombination process, those siluer metal oxide contact materials that contain the high-vapor-pressure oxide compound can produce gas, form the space on bonding interface thereby make, and cause bonding strength to descend.
For avoiding the appearance of the problems referred to above, the ceramic particles such as the contact material that needs to cover silver and aluminum oxide mix, being in contact with one another between the insulating contact material.This method shortcoming is: this need to separate contact material after annealing on the one hand with ceramic particle, cause thus the pollution of dust, can cause on the other hand pottery to embed in softening fine silver, needs follow-up grinding, to determine to remove ceramic particle for this reason.
Summary of the invention
Technical problem to be solved by this invention is to provide the method for annealing in a kind of siluer metal oxide compound electrical contact manufacturing, the method is because anneal environment is not gas or vacuum environment, but liquid melting salt, therefore the contact material surface is inevitable is in contact with one another with liquid, this just can effectively be avoided the direct contact between contact, alloying element also just can not diffusive migration to overlaying in surperficial fine silver layer, have a good application prospect.
Method for annealing during a kind of siluer metal oxide compound electrical contact of the present invention is made comprises:
Then silver alloys is annealed in 550 ~ 600 ℃ of melting salts 1 ~ 2h takes out cleaning-drying, carries out interior oxidation, welds at last the electrical contact of formation composite structure with body material.
Described silver alloys is the sheet alloy that contains 18wt%Cd, surplus silver, and single face covers fine silver.
Described melting salt is KNO
3, NaNO
2, NaNO
3In one or more, as 100wt%KNO
3, 100wt%NaNO
2, 50 ~ 55wt%KNO
3With 45 ~ 50wt%NaNO
2Mixture, 55wt%NaNO
3And 45wt%NaNO
2Mixture.
The processing parameter of described interior oxidation is: 700 ~ 750 ℃ of temperature, oxygen pressure 0.3 ~ 0.4MPa, time 48 ~ 60h.
The material that obtains after described interior oxidation grinds with nitric acid, cleaning-drying.
Described body material is the copper matrix.
The solution of the present invention is mainly:
1, the contact material that in melting salt, single face is covered with fine silver carries out the manufacture method of the silver-metallic oxide composite structure electrical contact of anneal;
When 2, melting salt is processed, more than the fusing point of melting salt used, the following temperature range of silver alloys fusing point, certain hour dipping;
3, silver alloys is the high silver alloys of vapour pressure of alloying element or its metal oxide.
Beneficial effect
The present invention is because anneal environment is not gas or vacuum environment, but liquid melting salt, therefore the contact material surface is inevitable is in contact with one another with liquid, this just can effectively be avoided the direct contact between contact, alloying element also just can not diffusive migration to overlaying in surperficial fine silver layer, have a good application prospect.
Description of drawings
Fig. 1 is the contact sheet stock of embodiment 1 and the interface microscopic appearance of copper matrix, and the Ag/Cu interface is in conjunction with good;
Fig. 2 is the contact sheet stock of Comparative Examples and the interface microscopic appearance of copper matrix, and Ag/Cu has space (bottom black region) on the interface.
Embodiment
Below in conjunction with specific embodiment, further set forth the present invention.Should be understood that these embodiment only to be used for explanation the present invention and be not used in and limit the scope of the invention.Should be understood that in addition those skilled in the art can make various changes or modifications the present invention after the content of having read the present invention's instruction, these equivalent form of values fall within the application's appended claims limited range equally.
Embodiment 1
Contain the sheet alloy of 18wt%Cd, surplus silver, single face covers fine silver.Be washed into the sheet material that is of a size of 4.0 * 4.5 * 2mm, with the sheet stock of the 10 kilograms of left and right cylinder mould of packing into, put into the KNO of 550 ℃
3Middle dipping 1h.Take out from cylinder mould afterwards, clean and remove salt and the drying of adhering on sheet stock, the Cd content of analyzing the fine silver face is 0.030%.Sheet stock is moved on to oxidation with in container, put into oxidized still and carry out oxidation (700 ℃ of temperature, oxygen pressure 0.3MPa, time 48h).Grind with rare nitric acid (25vol%) in cylinder afterwards, cleaning-drying welds on the copper matrix, the electrical contact of preparation composite structure.With shear testing maschine, the bonding strength of compound electrical contact is measured, repeated 5 times.
Comparative Examples
Get the sheet stock identical with embodiment 10 kilograms of left and right oxidation container of packing into, then put into the protective atmosphere heat treatment furnace, pass into nitrogen after vacuum exhaust, be warming up to 550 ℃ of insulation 1h.Then stove is chilled to 200 ℃ and takes out sheet stock, and the Cd content of analyzing the fine silver face is 1.74%.After annealing, sheet stock is dry after cleaning with rare nitric acid is simple, and sheet stock is moved on to oxidation with in container, puts into oxidized still and carries out oxidation.Grind afterwards cleaning-drying with rare nitric acid in cylinder.Weld the electrical contact of preparation composite structure on the copper matrix that it is identical with embodiment.With shear testing maschine, the bonding strength of compound electrical contact is measured, repeated 5 times.
(weight percent, wt%), after interior oxidation, the bonding strength (kgf/mm2) of alloy and copper matrix as shown in Table 1 and Table 2 for fine silver face Cd content after embodiment 1 and Comparative Examples annealing.
Table 1: the Cd concentration (wt%) of fine silver face after annealing
| Sample | 1 | 2 | 3 | 4 | 5 | On average |
| Embodiment 1 | 0.030 | 0.025 | 0.025 | 0.017 | 0.047 | 0.029 |
| Comparative Examples | 1.74 | 1.57 | 0.70 | 1.83 | 2.09 | 1.59 |
Table 2: the bonding strength (kgf/mm of compound electrical contact after interior oxidation
2)
Claims (6)
1. the method for annealing during a siluer metal oxide compound electrical contact is made comprises:
Then silver alloys is annealed in 550 ~ 600 ℃ of melting salts 1 ~ 2h takes out cleaning-drying, carries out interior oxidation, welds at last the electrical contact of formation composite structure with body material.
2. the method for annealing during a kind of siluer metal oxide compound electrical contact according to claim 1 is made, it is characterized in that: described silver alloys is the sheet alloy that contains 18wt%Cd, surplus silver, and single face covers fine silver.
3. the method for annealing during a kind of siluer metal oxide compound electrical contact according to claim 1 is made, it is characterized in that: described melting salt is KNO
3, NaNO
2, NaNO
3In one or more.
4. the method for annealing during a kind of siluer metal oxide compound electrical contact according to claim 1 is made, it is characterized in that: the processing parameter of described interior oxidation is: 700 ~ 750 ℃ of temperature, oxygen pressure 0.3 ~ 0.4MPa, time 48 ~ 60h.
5. the method for annealing during a kind of siluer metal oxide compound electrical contact according to claim 1 is made, it is characterized in that: the material that obtains after described interior oxidation grinds with nitric acid, cleaning-drying.
6. the method for annealing during a kind of siluer metal oxide compound electrical contact according to claim 1 is made, it is characterized in that: described body material is the copper matrix.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100488294A CN103131979A (en) | 2013-02-07 | 2013-02-07 | Annealing method in silver metallic oxide composite electrical contact making |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100488294A CN103131979A (en) | 2013-02-07 | 2013-02-07 | Annealing method in silver metallic oxide composite electrical contact making |
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|---|---|
| CN103131979A true CN103131979A (en) | 2013-06-05 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3802062A (en) * | 1973-01-23 | 1974-04-09 | Duerrwaechter E Dr Doduco | PROCESS OF PRODUCING SOLDERABLE COMPOSITES CONTAINING AgCdO |
| US3935988A (en) * | 1973-07-05 | 1976-02-03 | Eugen Durrwachter Doduco | Process of producing solderable composites containing AgCdO |
-
2013
- 2013-02-07 CN CN2013100488294A patent/CN103131979A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3802062A (en) * | 1973-01-23 | 1974-04-09 | Duerrwaechter E Dr Doduco | PROCESS OF PRODUCING SOLDERABLE COMPOSITES CONTAINING AgCdO |
| US3935988A (en) * | 1973-07-05 | 1976-02-03 | Eugen Durrwachter Doduco | Process of producing solderable composites containing AgCdO |
Non-Patent Citations (4)
| Title |
|---|
| 山岸宣行等: "电触头材料", 《电工材料》, 20 September 2012 (2012-09-20) * |
| 桂林电器科学研究所: "内氧化法制造银氧化镉触头材料工艺试验", 《电工合金通讯》, 31 December 1977 (1977-12-31) * |
| 桂林电器科学研究所技术情报室: "国外银系触头材料的发展概况", 《电工合金通讯》, 30 December 1976 (1976-12-30) * |
| 陈乐生等: "电阻钎焊AgCdO触头与铜触桥的焊接检测", 《低压电器》, no. 10, 31 October 2010 (2010-10-31) * |
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Application publication date: 20130605 |