CN103108492B - The manufacture method of flexible print circuit and manufacturing installation - Google Patents
The manufacture method of flexible print circuit and manufacturing installation Download PDFInfo
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- CN103108492B CN103108492B CN201310016355.5A CN201310016355A CN103108492B CN 103108492 B CN103108492 B CN 103108492B CN 201310016355 A CN201310016355 A CN 201310016355A CN 103108492 B CN103108492 B CN 103108492B
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Abstract
The present invention discloses a kind of manufacture method and device thereof of flexible print circuit, and the method is mainly: provide a patterned flexible print circuit substrate being coated with nanometer conductive ink or slurry; Pressure is applied to described flexible print circuit substrate; Described flexible print circuit substrate is sintered executing the stressed xenon lamp sintering process of adopting simultaneously, obtain target product; The method can manufacture printed circuit fast on low temperature flexibility substrate, can obtain the metal film that adhesion, conductivity and compactness are good, and cheap for manufacturing cost; This method avoid the techniques such as the photoetching corrosion in conventional flex printed circuit manufacture process, achieve quick free of contamination flexible print circuit manufacture, be applicable to production and the manufacture of the flexible print circuit of low-temperature substrate.
Description
Technical field
The present invention relates to sintering technology, belong to material sintering new technical field, particularly relate to a kind of manufacture method and manufacturing installation thereof of flexible print circuit.
Background technology
In electron trade, along with the fast development of modern consumer electronics and miniaturized instrument and equipment, flexible print circuit (FPCB), due to advantages such as it is lightweight, thickness is thin, volume is little, density is high, pliabilities, is more and more applied in the electronic products such as mobile phone, notebook computer, digital camera, LCDs.Further, its quantity used also constantly is increasing.In traditional mobile phone, approximately need 3 ~ 5, in intelligent mobile phone, significantly rise to 7 ~ 10, and the products such as the iPAD that apple is released are especially up to 15 more than.According to Taiwan circuit board association (Taiwan Printed circuit Association; And NEC loop industry meeting (Japan Electronics Packaging Circuits Association TPCA); JPCA) the statistics display of up-to-date announcement, the market rate of growth of current flexible print circuit (FPCB) reaches twenties percent, and its market scale constantly expands.Relevant soft board manufacturer also benefits from the market demand, and its achievement also constantly rises.
But the production of current flexible print circuit (FPCB) and general employing of manufacture cover Copper Foil in polyimides substrate, substrate and Copper Foil are bonded, then carry out the manufacture that the technique such as photoetching, burn into reprocessing carries out electronic circuit by cementing layer.Its technological process is complicated, production cost is large, need the techniques such as etching big for environment pollution.
And along with the development of modern nanometer technology and application, the research adopting the conductive ink of nano particle to carry out flexible print circuit manufacture is also constantly carried out and reports.The conductive ink of nano particle is disperseed uniformly in the solution by metal nanoparticle, as metallic particles such as silver, copper.Be wrapped at these extra-granular the gathering that the material such as polymer, dispersant prevents particle, the performance index such as solid content, viscosity of ink can adjust according to concrete technological requirement simultaneously.Therefore, the nanometer particle ink of this solubilize can adopt the various typographies such as inkjet printing, intaglio printing, letterpress, silk screen printing, adagio printing, trans-printing and aerosol printing graphically to manufacture, thus avoids traditional complicated technologies such as photoetching corrosion.Conductive ink after graphical has polymer due to metal nanoparticle outer wrap, there is no conductivity, need by corresponding sintering technology, intergranular polymer, dispersant equal solvent to be removed, and make nano particle mutually merge the patterned metal film forming conduction.
Metallic particles in conductive ink arrives nanometer scale because its size is little, and have larger specific area, its melt temperature is reduced to 150 ~ 300 DEG C greatly, and the melt temperature of reguline metal generally needs thousands of degree.Therefore, adopt the conductive ink of nano particle by lower sintering temperature, make metallic particles mutually merge formation conductive metal film.At present, the sintering technology of multiple nanometer conductive ink has been developed, as convection oven, thermal station, electric current sintering technology, Microwave Sintering Techniques, pressure sintering technology, laser sintering technology and xenon lamp sintering technology etc.Wherein convection oven and thermal station are the most frequently used methods, and it is the baking carried out by the conductive ink after graphical about half an hour, and temperature generally needs about 200 DEG C, and therefore, it has the heatproof requirement of more than 250 DEG C to base material, and efficiency is not high.Electric current sintering technology is a kind of contact sintering technology, its method is the big current adding direct current or interchange at the two ends of conductive pattern, the heat produced by the resistive of conductive ink sinters, and the method is suitable only for very simply and has the figure of electrode contact point.Microwave Sintering Techniques utilizes microwave and nano particle to interact, and make ink Middle molecule shake the heat produced and sinter, but this needs corresponding HIGH-POWERED MICROWAVES instrument, and directly can not carry out on industrial production line.Pressure sintering technology be also a kind of long time to heat sintering technology, being generally in a mold to being sintered the certain pressure of material, after heat sintering and cooling, forming fine and close structure.Laser sintering technology utilizes the high-energy of laser by the solvent gasification in material, nano particle melts combination and forms conductive pattern, but utilize the laser sintered power, the spot size and sintering velocity etc. that need fine adjustment laser, and because the hot spot of laser is very little, the sintering of a figure needs the longer time, is not suitable for large area, large batch of suitability for industrialized production.Xenon lamp sintering technology adopts high power xenon flashlamp to irradiate material, make material transient heating and do not damage base material, show that xenon flash lamp can make the instantaneous temperature of nanometer conductive ink reach thousands of degree according to research, and the temperature being transmitted to substrate is no more than 100 DEG C.But the transient heating due to xenon flash lamp makes the solvent in ink volatilize fast, the material after sintering is made to form a kind of porous shape, the conductivity of the metallic film formed after have impact on sintering and density.
For these above-mentioned sintering technologies, some needs heating for a long time, is not suitable for the low temperature flexibility substrate of low cost; Some needs instrumentation, limits its large-scale industrial production; Although and laser sinteredly can directly to carry out on streamline, laser sintered due to its spot size very little, the sintering completing a large scale or complex figure needs long time, is not substantially suitable for industrial production in enormous quantities; Adopting high power xenon flashlamp sintering technology to sinter instantaneously conductive ink by the pulsed light of Millisecond, and the temperature of substrate is remained unchanged substantially, is therefore a good method of manufacturing flexible printed circuit.At present, the NovaCentrix company of the U.S. and Xenon company etc. are all in the corresponding xenon flash lamp sintering equipment system of exploitation, and Applied Nanotech company and NanoMas company etc. are all in the nanometer conductive ink of exploitation based on xenon flash lamp sintering technology.But the metallic film that its sintering is formed is all a kind of open structure of porous, its adhesion, conductivity, metal film compactness can't compared with the metal formings of calendering or electrolysis.Therefore, how to improve the sintering quality of nanometer conductive ink, improve electric conducting material adhesion, the conductivity of metallic film and the compactness of film forming, this is all numerous researchers technical barrier urgently to be resolved hurrily.
Summary of the invention
The object of the invention is to for the deficiencies in the prior art, a kind of manufacture method of flexible print circuit is provided, the method can manufacture printed circuit fast on low temperature flexibility substrate, can obtain the metal film that adhesion, conductivity and compactness are good, and cheap for manufacturing cost; The present invention also provides the manufacturing installation of this flexible print circuit.
For achieving the above object, present invention employs following technical scheme:
A manufacture method for flexible print circuit, comprises the following steps: provide a patterned flexible print circuit substrate being coated with nanometer conductive ink or slurry; Pressure is applied to the upper surface of described flexible print circuit substrate; Described flexible print circuit substrate is sintered executing the stressed xenon lamp sintering process of adopting simultaneously, obtain flexible print circuit.
Wherein, the pulse energy range of xenon lamp sintering process is 1 J/cm
2~ 50 J/cm
2, the time that sintering continues is 0.1ms ~ 5s; When sintering, the temperature of flexible print circuit substrate remains on less than 60 DEG C.
Concrete, described flexible print circuit substrate is polymer thin-film material or composite film material; Described polymer thin-film material comprises polyethylene, polypropylene, polyvinyl chloride, polyethylene terephthalate, Merlon, PEN and polyimides; Described composite film material comprises composite material or the multilayer polymer film material of different polymer.
Wherein, executing stressed mode to flexible print circuit substrate is the mode of constant pressure or the mode of pressure changeable; Stressed size of executing is 0 ~ 40MPa.
The nano particle forming conductive layer in described nanometer conductive ink or slurry after oversintering comprises the materials such as gold, silver, copper, aluminium, platinum, ITO, nickel; Described conductive ink is by the formulated black aqueous solution of above-mentioned nano-particle material; Described electrocondution slurry is also through the formulated pasty masses of multiviscosisty by above-mentioned nano-particle material.
Present invention also offers the manufacturing installation of flexible print circuit, this device comprises:
Pressure-loaded mechanism, for applying the pressure of 0 ~ 40MPa to the upper surface of flexible print circuit substrate;
Xenon lamp sintering mechanism, for stressedly to sinter flexible print circuit substrate executing simultaneously.；
Control pressurer system, for controlled pressure load maintainer;
Xenon lamp control system, for controlling xenon lamp sintering mechanism;
Computer control system, be mainly used in receiving parameter setting and to control pressurer system and the instruction of xenon lamp control system signal transmission; And then controlled pressure load maintainer applies pressure to flexible print circuit substrate, control xenon lamp sintering mechanism and flexible print circuit substrate is sintered.
Further, this device also comprises the structure cooling system for cooling pressure load maintainer and xenon lamp sintering machine, and, for the connecting gear sent by flexible print circuit substrate feeding pressure-loaded mechanism and xenon lamp sintering mechanism and by the flexible print circuit after sintering; Described connecting gear comprises sending to be rolled up and rolling-up mechanism, automatic deviation rectifying device and alignment sensor, this mechanism adopts discontinuous transmission mode, transmit after being about to need the flexible print circuit of sintering to be sent to sintering station and stop, the position stopped is determined by alignment sensor, conveyer shifts out station by completing the flexible print circuit after sintering simultaneously, enters postchannel process process.
Graphically be printed on the suprabasil nanometer conductive ink of flexible print circuit after the pre-treatments such as super-dry, be sent to sintering station by connecting gear; Computer control system applies pressure by control pressurer system controlled pressure load maintainer to flexible print circuit substrate, executing stressed while, computer control system controls xenon lamp sintering mechanism by xenon lamp control system and carries out Millisecond pulse irradiation, make nanometer conductive ink Fast Sintering under pressurised conditions, obtain fine and close conductive metal film.
Concrete, described xenon lamp sintering mechanism comprises xenon flash lamp, reflection shield, lampshade and fluorescent tube cooling system; Described xenon flash lamp adopts air-cooled or water-cooled xenon flash lamp, and its wave-length coverage is 200nm ~ 1000nm, and minimum pulse width is 0.1ms, and single pulse energy weight range is 1 J/cm
2~ 50 J/cm
2; The light that xenon flash lamp sends by described reflection shield carries out reflection shaping, and the light energy that xenon lamp is sent is uniformly distributed in sintering area; Fluorescent tube, reflection shield and associated cable combine by described lampshade, and are blocked by the stray light at irradiation area edge; Meanwhile, in lampshade, be provided with pulse energy transducer, for the light energy that Real-Time Monitoring xenon flash lamp sends, and by information feed back to controller; Controller adjusts xenon flash lamp parameter in real time according to feedback information; Described fluorescent tube cooling system is used for cooling to xenon lamp fluorescent tube, prevents that fluorescent tube is overheated causes performance degradation; The type of cooling that its cooling system adopts is determined by lamp type, and as adopted air-cooled fluorescent tube, then cooling system adopts exhausting cooling, and air-cooled pipeline is incorporated in lampshade, includes air filter in air inlet pipeline simultaneously; As adopted water-cooled fluorescent tube, then adopting water-cooling system, in water-cooling system, adopting deionized water, reduce the impact on light energy output.
Concrete, described pressure-loaded mechanism comprises pressure cylinder, pressure plare and pressure-bearing substrate; Described pressure-bearing substrate is for placing flexible print circuit substrate; The pressure that pressure cylinder produces applies pressure by pressure plare to flexible print circuit substrate; Described pressure cylinder is cylinder or hydraulic cylinder, and the Pressure maximum value of generation is 40MPa; Described pressure plare is low reflection quartz glass, most light that described low reflection quartz glass can be launched through xenon flash lamp, does not substantially lose the irradiation energy of xenon flash lamp; Described pressure-bearing substrate being provided with vacuum absorption holes, for flexible print circuit substrate being adsorbed when sintering, preventing the slippage of flexible print circuit substrate; Described pressure-bearing substrate bottom comprises cooling device, guarantees that the temperature of pressure-bearing substrate remains on less than 60 DEG C.
Preferably, pressure-loaded mechanism adopts four-column type structure, and apply pressure to pressure plare by four pressure cylinders, the pressure of each cylinder carries out Real-Time Monitoring by pressure sensor, and feeds back in control pressurer system, and control pressurer system compresses into the real-time adjustment of row to cylinder simultaneously.
Compared to prior art, beneficial effect of the present invention is mainly reflected in: (1) adopts xenon lamp sintering process to combine with pressurization and forms photon pressure sintering, achieve and flexible base material is not affected on the selectivity low-temperature sintering of nanometer conductive ink, be applicable to the low temperature flexibility substrate of low cost, as PET, PEN, PC etc.; (2) adopt xenon lamp sintering process to combine with pressurization and form photon pressure sintering, increase the density of the rear metallic film of sintering, strengthen the adhesion of metallic film and improve conductivity, avoiding the porous loose structure caused due to the quick volatilization of solvent in nanometer conductive ink; (3) the method is by all print manufacture technics flexible print circuit, avoid using traditional photoetching corrosion etc. environment to be had to the technique of contamination hazard, the whole sintering course of processing only needs several time to tens seconds, achieve quick, pollution-free, high-quality flexible circuit manufacture, be applicable to large-scale industrial production and manufacture.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the overall structure schematic diagram of flexible print circuit manufacturing installation in a preferred embodiment of the present invention;
Fig. 2 is the structural representation of pressure-loaded mechanism and xenon lamp sintering mechanism in flexible print circuit manufacturing installation in a preferred embodiment of the present invention;
Fig. 3 is the schematic flow sheet of flexible print circuit manufacture method in a preferred embodiment of the present invention;
Fig. 4 is that in a preferred embodiment of the present invention, xenon flash lamp irradiates the curve chart with conductive ink temperature;
Fig. 5 is the curve chart of conductive ink temperature and pressure-loaded relation when sintering in a preferred embodiment of the present invention.
Embodiment
As previously mentioned, in the manufacturing process of existing flexible print circuit, still there is many deficiencies in nanoparticle conductive ink sintering technology, for this reason, the present invention spy provides the photon pressure sintering technology that a kind of high power xenon flashlamp combines with pressure, propose a kind of manufacture method of flexible print circuit, it comprises the following steps: provide a patterned flexible print circuit substrate being coated with nanometer conductive ink; Pressure is applied to the upper surface of described flexible print circuit substrate; Described flexible print circuit substrate is sintered executing the stressed xenon lamp sintering process of adopting simultaneously, obtain flexible print circuit.
Wherein, according to the different choice of the material of flexible print circuit substrate, executing stressed mode to flexible print circuit substrate can be the mode of constant pressure or the mode of pressure changeable; Execute stressed size and select in the scope of 0 ~ 40MPa.
Wherein, the nano particle forming conductive layer in described nanometer conductive ink or slurry after oversintering comprises the materials such as gold, silver, copper, aluminium, platinum, ITO, nickel; Described conductive ink is by the formulated black aqueous solution of above-mentioned nano-particle material; Described electrocondution slurry is also through the formulated pasty masses of multiviscosisty by above-mentioned nano-particle material.
Present invention also offers the manufacturing installation of flexible print circuit, this device mainly comprises:
Pressure-loaded mechanism, for applying the pressure of 0 ~ 40MPa to the upper surface of flexible print circuit substrate;
Xenon lamp sintering mechanism, for stressedly to sinter flexible print circuit substrate executing simultaneously.；
Control pressurer system, for controlling pulling force load maintainer;
Xenon lamp control system, for controlling xenon lamp sintering mechanism;
Computer control system, be mainly used in receiving parameter setting and to control pressurer system and the instruction of xenon lamp control system signal transmission; And then controlled pressure load maintainer applies pressure to flexible print circuit substrate, control xenon lamp sintering mechanism and flexible print circuit substrate is sintered.
Present invention achieves and the fast selective of conductive ink in low-temperature substrate is sintered, and fine and close high metallic film can be obtained, thus add adhesion and the conductivity of metallic film, avoid the porous loose structure that the quick volatilization due to solvent in ink causes.Simultaneously, the method is by all print manufacture technics flexible print circuit, traditional photoetching corrosion etc. is avoided environment to be had to the technique of contamination hazard, whole sintering process only needs several time to tens seconds, really achieve quick, pollution-free, high-quality flexible circuit manufacture, be specially adapted to large-scale industrial production and manufacture.
Below in conjunction with accompanying drawing and embodiment, the present invention is further illustrated, be convenient to understand, but these relevant embodiments illustrates the restriction do not formed the scope of application of the present invention to make innovation essence of the present invention.
As shown in Figure 3, as long as the manufacturing process of this flexible print circuit comprises: by being graphically printed on the suprabasil nanometer conductive ink of flexible print circuit after the pre-treatments such as super-dry, be sent to sintering station by connecting gear; Computer control system applies pressure by control pressurer system controlled pressure load maintainer to flexible print circuit substrate, executing stressed while, computer control system controls xenon lamp sintering mechanism by xenon lamp control system and carries out Millisecond pulse irradiation, make nanometer conductive ink Fast Sintering under pressurised conditions, obtain flexible print circuit.
Consult Fig. 1-2, the manufacturing installation of flexible print circuit forms primarily of pressure-loaded mechanism, xenon lamp sintering mechanism, control pressurer system 3, xenon lamp control system 2, computer control system 1, cooling system 4 and connecting gear 6.Computer control system 1 receiving parameter setting and to control pressurer system 3 and the instruction of xenon lamp control system 2 signal transmission; And then controlled pressure load maintainer applies pressure to flexible print circuit substrate 7, control xenon lamp sintering mechanism and flexible print circuit substrate 7 is sintered.
Described xenon lamp sintering mechanism comprises xenon flash lamp 505, reflection shield 504, lampshade 503, fluorescent tube cooling system, power supply, controller and connection cable etc.; Described power supply and controller are arranged in the rack of xenon lamp control system 2; Described xenon flash lamp 505 is installed in lampshade 503, and is furnished with reflection shield 504; Described reflection shield 504 is designed to semicircular arc, the light that energy reflected impulse xenon lamp 505 sends, and makes output polishing form nearly directional light and exports, be uniformly distributed on sintered surface; Described fluorescent tube cooling system then mates for air-cooled or water-cooled according to used lamp type; Described xenon lamp sintering mechanism is arranged on above sintered surface, and it is highly 8 ~ 15cm, makes light on sintered surface, be uniformly distributed the best and is advisable; Pulse energy transducer is provided with, for the light energy that Real-Time Monitoring xenon flash lamp sends, and by information feed back to controller in the light source of described xenon lamp sintering mechanism; Controller adjusts xenon flash lamp parameter in real time according to feedback information.
Described pressure-loaded mechanism comprises pressure cylinder 501, fixture 508, pressure plare 506, pressure-bearing substrate 507 and pressure sensor; Described pressure-bearing substrate 507 is for placing flexible print circuit substrate 7; The pressure that pressure cylinder 501 produces is acted on pressure plare 506 by fixture 508, then applies pressure by pressure plare 506 to flexible print circuit substrate 7; Described pressure cylinder 501 is cylinder or hydraulic cylinder, and the Pressure maximum value of generation is 40MPa; Described pressure plare 506 is low reflection quartz glass, most light that described low reflection quartz glass can be launched through xenon flash lamp 505, does not substantially lose the irradiation energy of high power xenon flashlamp; Described pressure-bearing substrate 507 being provided with vacuum absorption holes, for flexible print circuit substrate 7 being adsorbed when sintering, preventing the slippage of flexible print circuit substrate 7; Described pressure-bearing substrate 507 bottom comprises cooling device, guarantees that the temperature of pressure-bearing substrate remains on less than 60 DEG C.
Preferably, pressure-loaded mechanism adopts four-column type structure, apply pressure to fixture by four pressure cylinders simultaneously, the pressure of each cylinder carries out Real-Time Monitoring by pressure sensor, and feed back in control pressurer system, control pressurer system compresses into the real-time adjustment of row to cylinder, makes being distributed on fixture of pressure uniform.
Described connecting gear 6 is volume to volume substrate transport mechanism, for flexible print circuit substrate 7 is sent into pressure-loaded mechanism and xenon lamp sintering mechanism and by sintering after flexible print circuit send; Described connecting gear 6 comprises sending to be rolled up and rolling-up mechanism, automatic deviation rectifying device and alignment sensor, this mechanism adopts discontinuous transmission mode, transmit after being about to need the flexible print circuit of sintering to be sent to sintering station and stop, the position stopped is determined by alignment sensor, conveyer shifts out station by completing the flexible print circuit after sintering simultaneously, enters postchannel process process.
Described cooling system 4 is mainly used in cooling pressure load maintainer and xenon lamp sintering mechanism.The type of cooling for xenon flash lamp 505 decides according to the type of used fluorescent tube, if use water cooling tube, then uses the water-cooling system of deionized water; If use forced air cooled tube, then use air cooling system, but need to carry out corresponding filtration according to actual conditions to air; For the cooling of pressure-bearing substrate 507, be ensure that pressure-bearing substrate 507 is when xenon flash lamp 505 works long hours, its temperature will remain at less than 60 DEG C, prevents temperature from rising and makes the generation deformation of the flexible print circuit substrate 7 of low temperature.
Below in conjunction with accompanying drawing 1-5, the course of work of the manufacturing installation of flexible print circuit is described in more detail:
Consult Fig. 1, after computer control system 1 completes optimum configurations by operating personnel, calculate corresponding high power xenon flashlamp waveform parameter and exert pressure parameter, and it is sent to respectively in the controller 201,202 of xenon lamp control system 2 and in the signal controller 301 of control pressurer system 3; According to the delivering position of calculation of parameter flexible print circuit substrate 7 and the displacement that need sintered surface, and these parameters are sent in volume to volume connecting gear 6.
When carrying out flexible print circuit sintering, computer system 1 sends instructions to volume to volume substrate transport mechanism 6, unreeling and rolling-up mechanism action in connecting gear 6, and the flexible print circuit substrate 7 that need sinter correctly is located by automatic deviation rectifying device and alignment sensor, make flexible print circuit substrate 7 be correctly transferred to sintering station.Consult Fig. 2, after the flexible print circuit substrate 7 that need sinter arrives sintering station, volume to volume substrate transport mechanism 6 stops action, and information flexible print circuit substrate 7 having been arrived sintering station sends computer control system 1 to; Computer control system 1 subsequently pressure-bearing substrate 507 carries out vacuum suction, flexible print circuit substrate 7 is tightly adsorbed on pressure-bearing substrate 507, the displacement of flexible print circuit substrate 7 when preventing from sintering or fold.
Consult Fig. 3, after flexible print circuit substrate 7 is adsorbed on metal substrate 507, computer control system 1 sends instructions to control pressurer system 3 and carries out pressure-loaded, cylinder pressure controller 302 provides cylinder pressure for pressure cylinder 501, pressure is sent to pressure plare 506 by fixture 508, and then acts in flexible print circuit substrate 7.Applied pressure by the pressure sensor Real-time Feedback of each pressure cylinder in pressure signal controller 301, the pressure signal controller 301 cylinder pressure of adjustment to each cylinder in real time again, what make pressure uniform is distributed on fixture; Meanwhile, real-time pressure data is fed back to computer control system 1 by pressure signal controller 301.Control pressurer system 3 exert pressure reach set point time, computer control system 1 sends instructions to xenon lamp control system 2, xenon lamp control system 2 is according to state modulator xenon flash lamps 505 such as the pulse strength of setting and pulsewidths, xenon flash lamp 505 adopts the QXA series fluorescent tube of PerkinElmer company, reflection shield 504 paired pulses light carries out reflection shaping, make light be uniformly distributed on whole sintered surface, the relation of the conductive ink temperature that its pulsed light and the flexible print circuit substrate 7 that need sinter apply consults Fig. 4.
When sintering flexible print circuit substrate 7, pressure-loaded mechanism can adopt the mode of constant voltage (consulting Fig. 5) to the pressure that flexible print circuit substrate 7 is exerted pressure, and also can adopt the mode of pressure changeable, namely changes the size of pressure when sintering.After xenon flash lamp 505 sends a series of pulsed light, the pressure sintering of conductive ink photon completes, and control pressurer system 3 controlled pressure cylinder 501 progressively unloading pressure, lifts device for exerting pressure plare 506 and fixture 508.Computer control system 1 controls pressure-bearing substrate 507 and stops vacuum suction, controls volume to volume substrate transport mechanism 6 subsequently again and the flexible print circuit sintered is shifted out sintering station, carries out corresponding rear road quality testing or postchannel process process.
In sintering process, the main paired pulses xenon lamp 505 of cooling system 4 and pressure-bearing substrate 507 cool.In xenon flash lamp lampshade 503, be provided with temperature sensor, be used for detecting the temperature of high power xenon flashlamp 505, when temperature exceedes the temperature of setting, cooling system 4 cools the temperature of fluorescent tube by air-cooled or water-cooled, prevents that fluorescent tube is overheated causes performance degradation.Pressure-bearing substrate 507 can cause temperature to rise after xenon flash lamp irradiates for a long time, the generation deformation of flexible print circuit substrate 7 may be made, cooling system 4 makes it be cooled to less than 60 DEG C by the cooling line of equipment bottom pressure-bearing substrate 507, and is changed by the monitors temperature of pressure-bearing substrate 507.
It should be noted that, in this article, the such as relational terms of first and second grades and so on is only used for an entity or operation to separate with another entity or operating space, and not necessarily requires or imply the relation that there is any this reality between these entities or operation or sequentially.And, term " comprises ", " comprising " or its any other variant are intended to contain comprising of nonexcludability, thus make to comprise the process of a series of key element, method, article or equipment and not only comprise those key elements, but also comprise other key elements clearly do not listed, or also comprise by the intrinsic key element of this process, method, article or equipment.When not more restrictions, the key element limited by statement " comprising ... ", and be not precluded within process, method, article or the equipment comprising described key element and also there is other identical element.
The above is only the embodiment of the application; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the application's principle; can also make some improvements and modifications, these improvements and modifications also should be considered as the protection range of the application.
Claims (14)
1. a manufacture method for flexible print circuit, is characterized in that, comprises the following steps:
The one patterned flexible print circuit substrate being coated with nanometer conductive ink or slurry is provided;
Apply pressure to the upper surface of described flexible print circuit substrate, pressure limit is 0 ~ 40MPa;
Described flexible print circuit substrate is sintered executing the stressed xenon lamp sintering process of adopting simultaneously, obtain the flexible print circuit that surface has metal film.
2. the manufacture method of flexible print circuit according to claim 1, is characterized in that, the pulse energy range of xenon lamp sintering process is 1 J/cm
2~ 50 J/cm
2, the time that sintering continues is 0.1ms ~ 5s.
3. the manufacture method of flexible print circuit according to claim 1, is characterized in that, described flexible print circuit substrate adopts polymer thin-film material or composite film material; Described polymer thin-film material comprises one of them of polyethylene, polypropylene, polyvinyl chloride, polyethylene terephthalate, Merlon, PEN and polyimides; Described composite film material comprises composite material or the multilayer polymer film material of different polymer.
4. the manufacturing installation of the arbitrary described flexible print circuit of claims 1 to 3, is characterized in that, comprising:
Pressure-loaded mechanism, for applying the pressure of 0 ~ 40MPa to the upper surface of flexible print circuit substrate;
Xenon lamp sintering mechanism, for stressedly to sinter flexible print circuit substrate executing simultaneously.
5. the manufacturing installation of flexible print circuit according to claim 4, is characterized in that, also comprises:
Computer control system, applies pressure for controlled pressure load maintainer to flexible print circuit substrate, controls xenon lamp sintering mechanism and sinters flexible print circuit substrate.
6. the manufacturing installation of flexible print circuit according to claim 4, is characterized in that, the light source of described xenon lamp sintering mechanism is xenon flash lamp, and its wave-length coverage is 200nm ~ 1000nm, and minimum pulse width is 0.1ms, and single pulse energy weight range is 1 J/cm
2~ 50 J/cm
2.
7. the manufacturing installation of flexible print circuit according to claim 6, is characterized in that, is provided with pulse energy transducer in described light source, for the light energy that Real-Time Monitoring xenon flash lamp sends.
8. the manufacturing installation of flexible print circuit according to claim 4, is characterized in that, also comprises: cooling system, for cooling pressure load maintainer and xenon lamp sintering mechanism.
9. the manufacturing installation of flexible print circuit according to claim 4, is characterized in that, also comprises: connecting gear, for flexible print circuit substrate feeding pressure-loaded mechanism and xenon lamp being sintered mechanism and being sent by the flexible print circuit after sintering.
10. the manufacturing installation of flexible print circuit according to claim 4, is characterized in that, described pressure-loaded mechanism comprises pressure cylinder, pressure plare and pressure-bearing substrate; Described pressure-bearing substrate is for placing flexible print circuit substrate; The pressure that pressure cylinder produces applies pressure by pressure plare to flexible print circuit substrate.
The manufacturing installation of 11. flexible print circuits according to claim 10, is characterized in that, pressure-loaded mechanism adopts four-column type structure, and apply pressure to pressure plare by four pressure cylinders, the pressure of each cylinder carries out Real-Time Monitoring by pressure sensor simultaneously.
The manufacturing installation of 12. flexible print circuits according to claim 10, it is characterized in that, described pressure plare is low reflection quartz glass, most light that described low reflection quartz glass can be launched through xenon flash lamp, does not substantially lose the irradiation energy of xenon flash lamp.
The manufacturing installation of 13. flexible print circuits according to claim 10, is characterized in that, described pressure-bearing substrate is provided with vacuum absorption holes, for flexible print circuit substrate being adsorbed when sintering.
The manufacturing installation of 14. flexible print circuits according to claim 13, is characterized in that, described pressure-bearing substrate bottom comprises cooling device.
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| CN103552351B (en) * | 2013-11-04 | 2016-03-16 | 昆山美连德电子科技有限公司 | A kind of copper-surfaced paper tinsel machine |
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