CN103105182A - 近接感应模块的制造方法 - Google Patents
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Abstract
本发明公开一种近接感应模块的制造方法,近接感应模块用以贴附于一移动装置的壳体内表面,并与移动装置的主机电路的对应接点接触形成电连接,制造方法的步骤包含:提供一导电膜,并裁切导电膜形成一导接部及一连接导接部的感应电路图案,导接部用以与主机电路的对应接点电连接;以一面积能涵盖导接部与感应电路图案的粘胶片,覆盖于导接部及感应电路图案并与其粘合,且粘胶片形成一穿孔以露出导接部。
Description
技术领域
本发明涉及一种近接感应模块的制造方法,特别是涉及一种用以贴附于一移动装置的壳体内表面的近接感应模块的制造方法。
背景技术
目前在例如移动电话、平板电脑等的移动装置中,通常设有电容式的近接感测器(proximity sensor),用以在侦测到使用者接近移动装置时,降低移动装置发射的电磁波强度,以减少电磁波对人体的伤害。
然而,现有用于移动装置的电容式距离感测器的感应模块(电极片)是设置在移动装置的主机电路板上,不仅制作工序繁琐,也因为感应模块必须具有特定的形状以具有较佳的感应效果,而且感应模块需在主机电路板上占用特定的空间,导致感应模块的形状与主机电路板的机构设计必须互相迁就,降低了感应模块的设计弹性及主机电路板机构设计的设计弹性。
发明内容
因此,本发明的目的在于提供一种制作工序简单且能贴附于移动装置的壳体内表面的近接感应模块的制造方法,可以简化制作工艺并降低制造成本,且不占用移动装置的主机电路板的空间,以增加近接感应模块的设计弹性及主机电路板的机构设计的设计弹性。
于是,本发明近接感应模块的制造方法,该近接感应模块用以贴附于一移动装置的壳体内表面,并与该移动装置的主机电路板的对应接点接触形成电连接,该制造方法的步骤包含:
提供一导电膜,并裁切该导电膜形成一导接部及一连接该导接部的感应电路图案,该导接部用以与该主机电路的对应接点电连接;及
以一面积能涵盖该导接部与该感应电路图案的粘胶片,覆盖于该导接部及该感应电路图案并与其粘合,且该粘胶片形成一穿孔以露出该导接部。
较佳地,该导电膜先贴合于一离形膜上,再裁切移除该导电膜的多余部分,以形成该导接部与该感应电路图案。
较佳地,该制造方法还包含由另一导电膜形成一补强垫的步骤,即先由一第一导电膜制备一补强垫,再提供一第二导电膜与该补强垫可导电地贴合,并依据该补强垫位置裁切该第二导电膜及该补强垫以形成该导接部及该感应电路图案,使该导接部与该补强垫对应叠合。
较佳地,该第一导电膜先贴合于一离形膜,再裁切移除该第一导电膜的多余部分以形成该补强垫,且该第二导电膜覆盖该补强垫并贴合于该离形膜上,再裁切移除该第二导电膜及该补强垫的多余部分,以形成该导接部与该感应电路图案。
较佳地,该制造方法还包含在该粘胶片的另一表面覆盖一保护膜的步骤,且该保护膜形成一穿孔以露出该导接部。
较佳地,该制造方法还包含在该保护膜与该粘胶片贴合后,进一步切除非必要范围的步骤。
本发明的功效,本发明不仅制作工序简单,且材料选择较有弹性,能够大幅降低制作工艺时间及制造成本,并具有薄形及重量轻的优点。再者,近接感应模块与移动装置的主机电路板分开制造,可以提供主机电路板的机构设计者有较多的设计弹性空间,同时对于近接感应模块的感应电路图案也有较多的设计弹性空间。
附图说明
图1是一流程图,其说明本发明近接感应模块的制造方法的一较佳实施例;
图2与图3是说明该较佳实施例制备一补强垫的示意图;
图4与图5是说明该较佳实施例形成一导接部及一感应电路图案的示意图;
图6是说明该较佳实施例覆盖一粘胶片的示意图;
图7是说明该较佳实施例覆盖一保护膜的示意图;
图8是说明该较佳实施例在粘胶片与保护膜形成一穿孔的示意图;
图9是说明该较佳实施例切除非必要范围的示意图;及
图10是说明该较佳实施例安装于移动装置的壳体内表面的示意图。
主要元件符号说明
100 步骤
200 步骤
300 步骤
400 步骤
1 第一导电膜
11 补强垫
2 离形膜
3 第二导电膜
31 导接部
32 感应电路图案
321 感应区块
322 连接线路
4 粘胶片
5 保护膜
6 穿孔
7 壳体
具体实施方式
有关本发明的前述及其他技术内容、特点与功效,在以下配合参考附图的一较佳实施例的详细说明中,将可清楚的呈现。
在本发明被详细描述之前,要注意的是,在以下的说明内容中,类似的元件是以相同的编号来表示。
本发明近接感应模块的制造方法的一较佳实施例所制得的近接感应模块用以贴附于一移动装置的壳体内表面,并与移动装置的主机电路板的对应接点接触形成电连接,前述移动装置可例如平板电脑、移动电话等。参阅图1,本较佳实施例主要步骤包含:
步骤100,制备一补强垫;
步骤200,对应补强垫形成一导接部及一连接导接部的感应电路图案;
步骤300,于导接部及感应电路图案覆盖一粘胶片并与其粘合;及
步骤400,在粘胶片的另一表面覆盖一保护膜。
每一步骤的具体做法详述如下:
参阅图2与图3,步骤100的具体做法是先将一具有预定宽度的长条状第一导电膜1利用贴合机在第一导电膜1的表面涂布背胶并贴合于一离形膜2上,再利用冲压机裁切第一导电膜1,并将第一导电膜1的多余部分撕去移除以形成一补强垫11。在同一离形膜2上可以同时形成多个相间隔的补强垫11,相邻补强垫11的间隔距离是依据近接感应模块的整体结构而定,由此可于后续步骤同步进行或连续进行多个近接感应模块的制作,以加快生产的速度。
参阅图4与图5,为方便说明起见,图4与图5仅图示制作单一近接感应模块为代表说明,步骤200的具体做法是提供一第二导电膜3,并将第二导电膜3与补强垫11可导电地贴合,亦即利用贴合机将第二导电膜3的表面涂布导电胶使其覆盖并贴合于补强垫11及离形膜2上,并依据补强垫11位置利用冲压机裁切第二导电膜3及补强垫11以切出一导接部31及一感应电路图案32的形状,再将第二导电膜3及补强垫11的多余部分撕去移除以形成导接部31及感应电路图案32,使导接部31与补强垫11对应叠合,导接部31与补强垫11共同构成与移动装置的主机电路板(未图示)电连接的接点(本实施例共有三个接点),而具有双层导电箔的厚度以增加接点的机械强度,并且设于移动装置的壳体内表面时可以较为凸出,以容易与主机电路板的对应接点相接触,当然,若省去补强垫11,仅利用导接部31为接点也可实施。在本实施例中,感应电路图案32包括多个感应区块321及一连接线路322,连接线路322连接该多个感应区块321及导接部31,其中感应区块321的形状大小及位置是配合移动装置(未图示)的主机电路板所设计,可以依据实际设计而调整。此外,在本实施例中,第一导电膜1及第二导电膜2皆为铜箔,以具有较佳的导电效果,但是第一导电膜1及第二导电膜2也可以采用其它可导电的膜材。
参阅图6、图7与图8,步骤300与步骤400的具体做法一并说明。参阅图6,步骤300是以一面积能涵盖导接部31与感应电路图案32的粘胶片4,覆盖于导接部31及感应电路图案32并与其粘合,粘胶片4也与离形膜2未覆盖导接部31与感应电路图案32的部分贴合。参阅图7,步骤400是在粘胶片4的另一表面覆盖一保护膜5,保护膜5也可先贴覆于粘胶片4的表面后,再将粘胶片4的另一表面相对与离形膜2、导接部31及感应电路图案32贴合。参阅图8,以冲压机在粘胶片4及保护膜5上对应导接部31的区域裁切,将此部分移除而在粘胶片4及保护膜5上分别形成对应导接部31的穿孔6以露出导接部31。在本实施例中,粘胶片4是采用3M公司的商品(型号1683),双面具有粘性且较软,所以再覆盖以PET材质制成的保护膜5,来保护粘胶片4的表面并提升整体结构的刚性,以容易将制得的近接感应模块安装于移动装置的壳体内表面。若采用材质较具有刚性的粘胶片4,且仅在相对导接部31与感应电路图案32的表面设有粘胶,则可以省去设置保护膜5。
参阅图9,进一步地,以冲压机裁切粘胶片4及保护膜5以界定出近接感应模块整体的轮廓,并移除非必要范围,以减少近接感应模块整体的体积及重量,而制得近接感应模块。
参阅图10,通过补强垫11、感应电路图案32及粘胶片4的表面均有粘胶,欲将近接感应模块安装于移动装置的壳体7内表面时,只要移除离形膜2,即可将近接感应模块贴附于壳体7内表面的对应位置,组装工序简单方便。而且,利用粘胶片4及保护膜5覆盖感应电路图案32仅露出导接部31与主机电路板的对应接点接触,如此可以保护感应电路图案32避免受外力作用而损坏。
本较佳实施例的近接感应模块主要由导电膜3、粘胶片4与保护膜5叠合构成,不仅制作工序简单,且材料选择较有弹性,能够大幅降低制作工艺时间及制造成本,并具有薄形及重量轻的优点。再者,近接感应模块与移动装置的主机电路板分开制造,可以提供主机电路板的机构设计者有较多的设计弹性空间,同时对于近接感应模块的感应电路图案32也有较多的设计弹性空间,因此确实能达成本发明的目的。
以上所述的仅为本发明的较佳实施例而已,当不能以此限定本发明实施的范围,即大凡依本发明权利要求及发明说明内容所作的简单的等效变化与修饰,皆仍属本发明专利涵盖的范围内。
Claims (9)
1.一种近接感应模块的制造方法,该近接感应模块用以贴附于一移动装置的壳体内表面,并与该移动装置的主机电路板的对应接点接触形成电连接,该制造方法的步骤包含:
提供一导电膜,并裁切该导电膜形成一导接部及一连接该导接部的感应电路图案,该导接部用以与该主机电路板的对应接点电连接;及
以一面积能涵盖该导接部与该感应电路图案的粘胶片,覆盖于该导接部及该感应电路图案并与其粘合,且该粘胶片形成一穿孔以露出该导接部。
2.依据权利要求1所述的近接感应模块的制造方法,其中,该导电膜先贴合于一离形膜上,再裁切移除该导电膜的多余部分,以形成该导接部与该感应电路图案。
3.依据权利要求1所述的近接感应模块的制造方法,还包含由另一导电膜形成一补强垫的步骤,即先由一第一导电膜制备一补强垫,再提供一第二导电膜与该补强垫可导电地贴合,并依据该补强垫位置裁切该第二导电膜以形成该导接部及该感应电路图案,使该导接部与该补强垫对应叠合。
4.依据权利要求3所述的近接感应模块的制造方法,其中,该第一导电膜先贴合于一离形膜,再裁切移除该第一导电膜的多余部分以形成该补强垫,且该第二导电膜覆盖该补强垫并贴合于该离形膜上,再裁切移除该第二导电膜及该补强垫的多余部分,以形成该导接部与该感应电路图案。
5.依据权利要求2或4所述的近接感应模块的制造方法,其中,该粘胶片还与该离形膜未覆盖该导接部与该感应电路图案的部分贴合。
6.依据权利要求1至4任一项所述的近接感应模块的制造方法,还包含在该粘胶片的另一表面覆盖一保护膜的步骤,且该保护膜形成一穿孔以露出该导接部。
7.依据权利要求6所述的近接感应模块的制造方法,还包含在该保护膜与该粘胶片贴合后,进一步切除非必要范围的步骤。
8.依据权利要求1所述的近接感应模块的制造方法,其中,该感应电路图案包括多个感应区块及一连接线路,该连接线路连接该多个感应区块及该导接部。
9.依据权利要求1所述的近接感应模块的制造方法,该导电膜为铜箔。
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US20130118676A1 (en) | 2013-05-16 |
CN103105182B (zh) | 2015-11-18 |
US8657982B2 (en) | 2014-02-25 |
TWI483548B (zh) | 2015-05-01 |
TW201320598A (zh) | 2013-05-16 |
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