CN103092007B - 曝光机掩膜版安装装置 - Google Patents
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70816—Bearings
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
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- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
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- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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Abstract
本发明公开了一种曝光机掩膜版安装装置,包括:用于固定掩膜版的掩膜架;设置在所述掩膜架下方的气囊,所述气囊用于支撑掩膜架;所述气囊通过供气管路连通气体供给单元;所述供气管路上设置有气动开关阀,当气体供给单元供给中断时,气动开关阀控制供气管路关闭,防止气囊泄气。本发明通过在气囊供气管路上设置气动开关阀,能够在气体供给单元供给中断后,气动开关阀自动切换到不通状态,将气囊中的气体封堵,避免气囊泄气而造成掩膜架掉落,在气体供给单元正常供给后,气动开关阀控制供气管路继续给气囊供应气体,避免了气体供给单元中断所带来的掩膜架掉落危险。
Description
技术领域
本发明涉及一种曝光机结构,特别是涉及一种安全性高可防止设备中掩膜架脱落的曝光机掩膜版安装装置。
背景技术
掩膜版(Mask)是曝光***中重要部件,掩膜版在使用时需要通过一定的装置夹持和支撑,如图1所示,掩膜版9安装在曝光设备的掩膜架8上,掩膜架8为一个方形框架结构,掩膜版9位于掩膜架8的中心位置,掩膜版9边缘区域的上部和下部通过吸附或支撑结构来保证掩膜版9的稳定。具体地,在掩膜架8上设置有负压单元,吸附掩膜版9的边缘区域上部;在掩膜版9的边缘区域下部设置有支撑部支撑掩膜版9,在负压单元中断时,通过支撑部来支撑掩膜版9,以确保掩膜版9的可靠固定,支撑部与气缸活塞连接,由气缸活塞伸缩带动支撑部活动。
进一步地,掩膜架8由多个气囊支撑,如图1中标注的第一气囊6和第二气囊7,掩膜版9处于正常状态时,通过与气囊连通的压缩干燥空气(Compressed DryAir,CDA)供给单元向气囊提供气体,气囊支撑在掩膜架8下方,维持掩膜版9的安全状态。气囊分为四组,分别设置在掩膜架8的四条边框结构的下方,CDA供给单元与每组气囊之间的支供气管路上分别设置有减压阀和压力表,如图1中所示的第一支减压阀4和第一支压力表5,在靠近CDA供给单元供气一端的主供气管路上设置有通气阀1、总减压阀2和总压力表3,通过减压阀和压力表来保证供气的安全性,以及确保所提供的压缩气体压力能够满足需求。CDA供给单元除了为气囊提供气体外,还为上述的气缸提供动力源。但是,上述结构存在以下缺陷:一旦CDA供给单元或负压单元供给异常,就会出现气囊泄气、气缸活塞回缩、或负压单元吸附力消失,致使掩膜架下降、掩膜版掉落、损坏,损失十分严重。
发明内容
(一)要解决的技术问题
本发明要解决的技术问题是如何避免掩膜版安装装置中因CDA供给单元和负压单元供给异常所带来的掩膜版损坏问题。
(二)技术方案
为了解决上述技术问题,本发明提供一种曝光机掩膜版安装装置,包括:
用于固定掩膜版的掩膜架;
设置在所述掩膜架下方的气囊,所述气囊用于支撑掩膜架;
所述气囊通过供气管路连通气体供给单元;
所述供气管路上设置有气动开关阀,当气体供给单元供给中断时,气动开关阀控制供气管路关闭,防止气囊泄气。
其中,所述气囊为多个且间隔设置于所述掩膜架下方。
其中,所述供气管路包括控制管路和多个支供气管路,所述支供气管路连通所述气囊,所述控制管路连通所述气体供给单元和支供气管路;
所述气动开关阀设置在所述控制管路上,或者所述支供气管路上,或者同时设置在所述控制管路和支供气管路上。
其中,所述控制管路上还设置有通气阀、总减压阀和总压力表。
其中,所述通气阀、总减压阀和总压力表设置在控制管路上靠近所述气体供给单元的一端;所述总气动开关阀设置在控制管路上靠近气囊的一端。
其中,所述支供气管路上还设置有减压阀和压力表。
其中,所述减压阀和压力表设置在支供气管路上靠近所述气体供给单元的一端;所述支气动开关阀设置在支供气管路上靠近气囊的一端。
其中,所述曝光机掩膜版安装装置还包括支撑部,
所述支撑部设置在所述掩膜版下部边缘,用于支撑掩膜版;
所述支撑部通过连杆与气缸的气缸活塞相连,所述气缸为自锁气缸,所述气缸活塞的伸缩牵引所述支撑部靠近或远离所述掩膜版。
其中,所述气缸由所述气体供给单元提供压缩气体。
其中,所述掩膜架内设置有真空吸盘,所述真空吸盘用于固定掩膜版。
(三)有益效果
上述技术方案所提供的曝光机掩膜版安装装置,通过在气囊供气管路上设置气动开关阀,能够在气体供给单元供给中断后,气动开关阀自动切换到不通状态,将气囊中的气体封堵,避免气囊泄气而造成掩膜架掉落,在气体供给单元正常供给后,气动开关阀控制供气管路继续给气囊供应气体,避免了气体供给单元中断所带来的掩膜架掉落危险,防止了掩膜版的损坏。进一步地,在掩膜版下部边缘设置由自锁气缸控制的支撑部,在负压供给中断时,自锁气缸会将气缸活塞抱死,支撑部不会离开掩膜版,阻止掩膜版下落,自锁气缸由气体供给单元驱动,没有气体的供应,锁定不会解除,在负压和气体供应正常后,锁定会自动解除。
附图说明
图1是现有技术中曝光机掩膜版安装装置的结构示意图;
图2是本发明实施例曝光机掩膜版安装装置的结构示意图;
图3是图2中局部结构的放大图;
图4是本发明另一种实施例曝光机掩膜版安装装置中与图3相对应的放大图;
图5是本发明又一种实施例曝光机掩膜版安装装置中与图3相对应的放大图;
图6是本发明再一种实施例曝光机掩膜版安装装置中与图3相对应的放大图;
图7是本发明实施例曝光机掩膜版安装装置中防掩膜版掉落结构的示意图。
其中,1:通气阀;2:总减压阀;3:总压力表;4:第一支减压阀;5:第一支压力表;6:第一气囊;7:第二气囊;8:掩膜架;9:掩膜版;10:总气动开关阀;11:第一支气动开关阀;12:支撑部;13:气缸活塞;14:自锁汽缸;15:连杆。
具体实施方式
下面结合附图和实施例,对本发明的具体实施方式作进一步详细描述。以下实施例用于说明本发明,但不用来限制本发明的范围。
图2示出了本实施例曝光机掩膜版安装装置的结构示意图,图3是图2中的局部结构放大图,图4是防掩膜版掉落结构的示意图。参照图2和图3,该曝光机掩膜版安装装置包括:固定掩膜版9的掩膜架8,设置在所述掩膜架8下方用于支撑掩膜架8的多个气囊,与所述气囊连通的气体供给单元(图中未示出),该气体供给单元可以是CDA供给单元;连通所述气体供给单元与气囊之间的供气管路上设置有气动开关阀,当气体供给单元供给中断时,气动开关阀控制供气管路关闭,防止气囊泄气,以避免掩膜架8的掉落。
通常情况下,所述气囊具有多个,间隔布置在所述掩膜架8下方,如图中标示的第一气囊6和第二气囊7。连通气囊与气体供给单元的所述供气管路包括控制管路和多个支供气管路,所述支供气管路连通所述气囊,所述控制管路连通所述气体供给单元和支供气管路,由气体供给单元提供的气体先经由控制管路,然后再经由各支供气管路供应给每个气囊。为了避免气体供给单元供应中断时气囊泄气产生气体回流,所述气动开关阀可以单独设置在所述控制管路上,或者单独设置所述支供气管路上,或者同时设置在所述控制管路和支供气管路上。
下面以气动开关阀同时设置在所述控制管路和支供气管路上为例,进行其整体结构性和原理性描述。
此时,供气管路上的气动开关阀包括如图中标注的第一支气动开关阀11和总气动开关阀10,在所述气体供给单元供应正常的情况下,高压的压缩气体能够将总气动开关阀10打通,使得总气动开关阀10处于“开”的状态,高压的压缩空气进一步通向各支气动开关阀,将各支气动开关阀打通,使得各支气动开关阀处于“开”的状态,在此状态下,由所述气体供给单元通向各个气囊的供气管路上的开关阀都打开,供气顺畅。所述气体供给单元供应中断的情况下,总气动开关阀10和各支气动开关阀均没有高压压缩空气来打通,处于关闭的状态,气囊内的气体也被各支气动开关阀封止,不会出现泄气的情况,能够保证气囊正常支撑在掩膜架8下方,掩膜架8不会出现掉落的现象。
所述控制管路上,靠近所述气体供给单元的一端设置有通气阀1、总减压阀2和总压力表3,通气阀1位于总减压阀2与所述气体供给单元之间,总气动开关阀10设置在控制管路上靠近气囊的一端,通过通气阀1、总减压阀2和总压力表3,实现对所述气体供给单元的开关控制和压力实时监控,保证通向总气动开关阀10和各个气囊的压缩气体能够满足所需要的压力指标。每个支供气管路上还设置有减压阀和压力表,如图中所示的第一支减压阀4和第一支压力表5,所述减压阀和压力表设置在支供气管路上靠近所述气体供给单元的一端;所述支气动开关阀设置在支供气管路上靠近气囊的一端,减压阀和压力表实时监测由所述气体供给单元供给气囊的气体的压力指数。
上述总气动开关阀10和各支气动开关阀的设置,能够避免气体供给单元供给中断的情况下致使掩膜架8掉落的危险,并且双重气动开关阀的设置能够更有效地保证气囊内的气体不会泄气回流,适用于重力较大的掩膜架结构,效果更显著。同时,也可以根据实际情况,在掩膜架结构重力不是很大的情况下,采用上述的将气动开关阀单独设置在所述控制管路上,或者单独设置所述支供气管路上,也能够保证气体供给单元供应中断时,气动开关阀将供气管路关闭,放置气囊泄气。气动开关阀单独设置在所述控制管路上的结构示意图如图4所示,其设置位置与上述总气动开关阀10的设置位置相同,此时每个支供气管路上仅设置减压阀和压力表即可;气动开关阀单独设置在所述支供气管路上的结构示意图如图5或图6所示,其设置位置与上述支气动开关阀的设置位置相同,此时控制管路上仅设置通气阀1、总减压阀2和总压力表3即可。
进一步地,如图7所示,本实施例的曝光机掩膜版安装装置还包括设置在所述掩膜版9下部边缘、用于支撑所述掩膜版9的支撑部12,所述支撑部12通过连杆15与气缸的气缸活塞13相连,所述气缸为自锁气缸14,其由所述气体供给单元提供压缩气体,如图中B和C所示,所述气缸活塞13的伸缩牵引所述支撑部12靠近或远离所述掩膜版9。掩膜版9在通常情况下通过上部负压单元的真空吸盘的吸附进行固定,负压单元通过图6中所示的A处进行真空吸附,实现对掩膜版9的吸附作用;在负压单元中断的情况下,掩膜版9在其下部支撑部12的支撑作用下进行固定,下部支撑部12在自锁气缸14的气缸活塞13作用下,实现对掩膜版9的支撑,自锁汽缸14由所述气体供给单元提供压缩气体,一旦所述气体供给单元供给中断,能够通过自锁汽缸14的自锁作用,防止气缸活塞13回缩,继续保持支撑部12支撑在掩膜版9下部,以避免负压单元中断和气体供给单元同时中断所引起的掩膜版9掉落。
为了实现气体供给单元中断之后能够再继续进行气体供给,在保证上述气动开关阀具有很好的气密性的同时,还要能够实现气体供给继续时能够将气动开关阀打开;在保证自锁气缸具有足够锁紧力的同时,还要能够实现气体供给继续时气缸自锁解除。
由以上实施例可以看出,本发明通过在气囊供气管路上设置气动开关阀,能够在气体供给单元供给中断后,气动开关阀自动切换到不通状态,将气囊中的气体封堵,避免气囊泄气而造成掩膜架掉落,在气体供给单元正常供给后,气动开关阀控制供气管路继续给气囊供应气体,避免了气体供给单元中断所带来的掩膜架掉落危险,防止了掩膜版的损坏。进一步地,在掩膜版下部边缘设置由自锁气缸控制的支撑部,在负压供给中断时,自锁气缸会将气缸活塞抱死,支撑部不会离开掩膜版,阻止掩膜版下落,自锁气缸由气体供给单元驱动,没有气体的供应,锁定不会解除,在负压和气体供应正常后,锁定会自动解除。
以上所述仅是本发明的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明技术原理的前提下,还可以做出若干改进和替换,这些改进和替换也应视为本发明的保护范围。
Claims (6)
1.一种曝光机掩膜版安装装置,包括:
用于固定掩膜版的掩膜架;
设置在所述掩膜架下方的气囊,所述气囊用于支撑掩膜架;
所述气囊通过供气管路连通气体供给单元;
其特征在于,
所述供气管路上设置有气动开关阀,当气体供给单元供给中断时,气动开关阀控制供气管路关闭,防止气囊泄气;所述气囊为多个且间隔设置于所述掩膜架下方;
所述供气管路包括控制管路和多个支供气管路,所述支供气管路连通所述气囊,所述控制管路连通所述气体供给单元和支供气管路;
所述气动开关阀设置在所述控制管路上,或者所述支供气管路上,或者同时设置在所述控制管路和支供气管路上;
所述控制管路上还设置有通气阀、总减压阀和总压力表;
所述通气阀、总减压阀和总压力表设置在控制管路上靠近所述气体供给单元的一端;所述气动开关阀包括总气动开关阀,所述总气动开关阀设置在控制管路上靠近气囊的一端。
2.根据权利要求1所述的曝光机掩膜版安装装置,其特征在于,
所述支供气管路上还设置有减压阀和压力表。
3.根据权利要求2所述的曝光机掩膜版安装装置,其特征在于,
所述减压阀和压力表设置在支供气管路上靠近所述气体供给单元的一端;所述气动开关阀包括支气动开关阀,所述支气动开关阀设置在支供气管路上靠近气囊的一端。
4.根据权利要求1所述的曝光机掩膜版安装装置,其特征在于,
所述曝光机掩膜版安装装置还包括支撑部,
所述支撑部设置在所述掩膜版下部边缘,用于支撑掩膜版;
所述支撑部通过连杆与气缸的气缸活塞相连,所述气缸为自锁气缸,所述气缸活塞的伸缩牵引所述支撑部靠近或远离所述掩膜版。
5.根据权利要求4所述的曝光机掩膜版安装装置,其特征在于,
所述气缸由所述气体供给单元提供压缩气体。
6.根据权利要求1-5任一项所述的曝光机掩膜版安装装置,其特征在于,
所述掩膜架内设置有真空吸盘,所述真空吸盘用于固定掩膜版。
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