CN103076822B - Regulate control method and the implement device thereof for the treatment of device temperature processed in vacuum equipment - Google Patents
Regulate control method and the implement device thereof for the treatment of device temperature processed in vacuum equipment Download PDFInfo
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- CN103076822B CN103076822B CN201210583059.9A CN201210583059A CN103076822B CN 103076822 B CN103076822 B CN 103076822B CN 201210583059 A CN201210583059 A CN 201210583059A CN 103076822 B CN103076822 B CN 103076822B
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Abstract
The present invention relates to and a kind ofly regulate in vacuum equipment the temperature-controlled process and implement device thereof for the treatment of device temperature processed, this device comprises locating device, heating arrangement and heat sink, locating device is for treating location and the installation of device processed, and heating arrangement is between locating device and heat sink.Locating device is provided with size and structure and treats the locating slot that device processed matches; Be provided with Tunnel-hole in heating arrangement, be provided with heater element in Tunnel-hole, the electrode of heater element is connected in parallel mutually or is connected in series; Be provided with liquid cooled medium passage in heat sink, and be provided with two liquid cooled media interface.Locating device, heating arrangement and heat sink also can be designed to integral structure by this device.The present invention is by heat riser and heat sink is ingenious is combined as a whole, treat in effective implemention vacuum equipment that the accurate temperature of device heating and cooling processed controls, utilize to maximum efficiency heating arrangement energy, and reduce the thermal resistance between heating arrangement and heat sink on heat passage.
Description
Technical field
The present invention relates to semiconductor electronic technical field, particularly a kind ofly regulate in vacuum equipment the temperature-controlled process and implement device thereof for the treatment of device temperature processed.
Background technology
In semiconductor electronic technology and field of optoelectronic devices, a lot of manufacturing technology and technique is had to relate to vacuum equipment, such as vacuum coating equipment, Vacuum Eutectic soldering furnace etc., some manufacturing process and Implementation Technology, need in these vacuum equipments, carry out accurately temperature to chip or device wait system product to control to realize, in other words, temperature is a very important technological parameter in these process conditions, can sensitive and accurately Controlling Technology temperature, it is the key realizing related manufacturing process (the solder eutectic welding technology such as between different elements), therefore, accurately heat, each temperature controlling stages such as constant temperature and cooling, it is the necessary condition realizing these technologies.Temperature control equipment in existing Vacuum Eutectic welding gear does not establish the heat sink of heat sink or setting cannot realize treating the fast cooling of device processed usually, and the efficiency of utilization of heating arrangement is low, is unfavorable for that treating device processed realizes accurate temperature controlling.Common Vacuum Eutectic welding gear temperature control equipment typical structure as shown in Figure 1, infrared heating fluorescent tube 4 is placed in below warm table 3, eutectic weld jig 2 is placed on warm table 3, treat that device 1 (such as treating eutectic welding device) processed is arranged in eutectic weld jig 2, infrared heating fluorescent tube 4 is by its electrode 41 electrified regulation, can be that electricity is connected in parallel or is electrically connected in series between each infrared lamp, infrared heating fluorescent tube 4 also can be substituted by other the equipment with heating function, such as heater strip or ceramic heating pipe etc., after infrared heating fluorescent tube 4 electrified regulation, warm table 3 temperature is raised, warm table 3 adopts graphite material to make usually, there is good thermal conductivity and thermal radiation absorption ability, warm table 3 passes through heat exchange pattern, by heat conduction to eutectic weld jig 2, thus heat is delivered to and treats on device 1 processed the most at last, realize the temperature conditions required for its manufacture craft, said temperature control device does not arrange heat sink, this stepped construction also not easily design and installation heat sink, under vacuum conditions, be difficult to realize fast cooling, and, heat is sent by radiation by infrared lamp 4, in said apparatus, radiation only towards warm table 3 just can be absorbed, thermal loss is comparatively serious, and, this mode being carried out transferring heat by sandwich construction, make warm table 3 and treat there is sizable temperature difference between device 1 processed, this is unfavorable for the technological temperature accurately controlling to treat device processed.Therefore, existing Vacuum Eutectic welding gear temperature control equipment does not install heat sink, be difficult to realize fast cooling, under vacuum conditions, the heating fluorescent tube of this device and treat that between device processed, the temperature difference is comparatively large, is difficult to the accurate temperature control realizing treating device processed, and, the heating fluorescent tube efficiency of utilization of this device is lower, and the used heat do not utilized also easily causes the temperature fluctuation of other parts of vacuum equipment inside cavity.
Summary of the invention
Technical matters to be solved by this invention is to provide a kind of temperature-controlled process and implement device thereof of vacuum equipment, by heat riser with heat sink is ingenious is combined as a whole, the accurate temperature of effective implemention heating and cooling controls, can utilize heating arrangement energy to maximum efficiency, and the thermal resistance reduced between heating arrangement and heat sink on heat passage, thus provide good physical arrangement for realizing accurate temperature controlling.
The technical scheme that the present invention solves the problems of the technologies described above is as follows: a kind of for regulating the temperature control equipment treating device temperature processed in vacuum equipment, it is characterized in that, comprise locating device, heating arrangement and heat sink, described locating device is for treating location and the installation of device processed, described locating device is positioned on heating arrangement, and described heating arrangement is positioned on heat sink.
On the basis of technique scheme, the present invention can also do following improvement:
Further, described locating device is provided with locating slot, size and the structure of described locating slot and treat that device processed matches.
Further, be provided with Tunnel-hole in described heating arrangement, be provided with heater element in described Tunnel-hole, described Tunnel-hole diameter is greater than heater element diameter, and leaves gap between described Tunnel-hole and described heater element.This tunnel structure, by the heat absorption of most of infrared heating fluorescent tube C radiation, can drastically increase the energy utilization efficiency of heating arrangement.
Further, described heater element quantity is identical with Tunnel-hole quantity.
Further, the electrode of described heater element is connected to each other, and described connection is for being connected in parallel or being connected in series.
Further, described heater element is infrared heating fluorescent tube, heater strip or ceramic heating pipe.
Further, be provided with liquid cooled medium passage in described heat sink, described liquid cooled medium passage two ends are connected with liquid cooled medium input interface and liquid cooled medium output interface respectively.
Further, describedly treat that the temperature control equipment of device temperature processed is integrated for regulating in vacuum equipment, the material of described temperature control equipment is graphite, and graphite has good thermal conductivity and thermal radiation absorption ability.
Another technical scheme that the present invention solves the problems of the technologies described above is as follows: a kind ofly regulate in vacuum equipment the temperature-controlled process treating device temperature processed, it is characterized in that comprising the following steps:
To device processed location be treated, be arranged in the locating device of described temperature control equipment;
To the heating arrangement electrified regulation of described temperature control equipment, heat is passed to locating device by heat transfer by heating arrangement, to treating that device processed heats in locating device;
The temperature of heat sink of the temperature control equipment described in being reduced by liquid cooled medium, heat sink absorbs the heat of heating arrangement and locating device by heat transfer, to treating that device processed is lowered the temperature in locating device.
Further, be provided with Tunnel-hole in described heating arrangement, be provided with heater element in described Tunnel-hole, described is heat the electrifying electrodes of the heater element in the Tunnel-hole of heating arrangement to heating arrangement electrified regulation.
Further, liquid cooled medium passage is provided with in described heat sink, described liquid cooled medium passage two ends are connected with liquid cooled medium input interface and liquid cooled medium output interface respectively, and the described temperature by liquid cooled medium reduction heat sink is in the liquid cooled medium passage of heat sink, pass into the temperature that liquid cooled medium reduces heat sink by the input of liquid cooled medium, output interface.
The invention has the beneficial effects as follows: the invention provides one and realize treating device temperature precision Control Technology implementation method processed and temperature control equipment for Vacuum Eutectic welding gear or similar vacuum equipment, by heat riser with heat sink is ingenious is combined as a whole, effective implemention treats that the accurate temperature of device heating and cooling processed controls, utilize to maximum efficiency heating arrangement energy, and the thermal resistance reduced between heating arrangement and heat sink on heat passage, thus provide good physical arrangement for realizing accurate temperature controlling, achieve and treat that the temperature of device processed accurately controls in vacuum equipment, as heated up, constant temperature, cooling etc.
Accompanying drawing explanation
Fig. 1 is the heating apparatus typical structure schematic diagram in existing Vacuum Eutectic welding gear;
Fig. 2 is temperature control equipment (lifting/lowering temperature) the typical structure schematic diagram in Vacuum Eutectic welding gear of the present invention;
Fig. 3 is temperature control equipment (lifting/lowering temperature) diagrammatic cross-section in Vacuum Eutectic welding gear of the present invention;
Fig. 4 is the temperature control device structure schematic diagram in the Vacuum Eutectic welding gear of integral structure of the present invention;
Fig. 5 is the temperature control equipment diagrammatic cross-section in the Vacuum Eutectic welding gear of integral structure of the present invention;
Fig. 6 is the temperature control equipment detonation configuration schematic diagram in the Vacuum Eutectic welding gear of integral structure of the present invention.
In accompanying drawing, the list of parts representated by each label is as follows:
A, integral structure device, B, treat device processed, C, infrared heating fluorescent tube, C1, electrode, D, eutectic weld jig, E, warm table, E1, Tunnel-hole, F, refrigeratory, F1, liquid cooled medium passage, F2, liquid cooled media interface.
Embodiment
Be described principle of the present invention and feature below in conjunction with accompanying drawing, example, only for explaining the present invention, is not intended to limit scope of the present invention.
As shown in Figures 2 and 3, Tunnel-hole E1 is provided with in the middle of warm table E, infrared heating fluorescent tube C is arranged in the Tunnel-hole E1 of warm table E, infrared heating fluorescent tube C quantity is consistent with Tunnel-hole E1 quantity, Tunnel-hole E1 diameter is a bit larger tham the diameter of infrared heating fluorescent tube C, infrared heating fluorescent tube C external diameter does not contact with the Tunnel-hole E1 hole wall on warm table E, infrared lamp C is by its electrode C1 electrified regulation, can be that electricity is connected in parallel between each infrared lamp also can be electrically connected in series, infrared lamp C also can be substituted by other the equipment with heating function, such as heater strip or ceramic heating pipe etc., eutectic weld jig D is arranged on warm table E upper surface, warm table E is arranged on refrigeratory F upper surface, refrigeratory F adopts liquid cooled medium to realize cooling function, liquid cooled medium passage F1 is provided with in refrigeratory F, and be provided with two liquid cooled media interface F2, respectively as input and output interface, treat that device B processed is arranged in the locating slot of the eutectic weld jig D mated with its structure and size, the configuration achieves the combination of heat riser and heat sink, when needing in process until device B processed to heat up, infrared heating fluorescent tube C is energized work, pass through heat radiation, the Tunnel-hole E1 hole wall of warm table E is heated, this tunnel structure, can by the heat absorption of most of infrared heating fluorescent tube C radiation, drastically increase the energy utilization efficiency of heating arrangement, by heat transfer by the eutectic weld jig D on warm table E top and treat that device B temperature processed raises, if need cooling, liquid cooled medium is passed in refrigeratory F, just can reduce the temperature of refrigeratory F, pass through heat exchange pattern, absorb the heat of warm table E, reduce its temperature, thus reduce the technological temperature treating device B processed, by reasonably utilizing infrared heating lamp system device and chiller system device, the accurate temperature controlling of temperature control equipment can be realized in Vacuum Eutectic welding gear.
Said temperature control device is in vacuum environment, multiple physical interface is had between warm table E and eutectic weld jig D and refrigeratory F, if surface ratio is more coarse or flatness is not high, may cause in heat passage and have larger thermal resistance, present invention provides a kind of technic relization scheme reducing this interface resistance, warm table E, eutectic weld jig D and refrigeratory F are designed to integral structure.
As shown in Figure 4, Figure 5 and Figure 6, integral structure device A is provided with Tunnel-hole A1, for installation infrared heating fluorescent tube C, realize heating function, integral structure device A bottom is provided with liquid cooled medium passage A3 and liquid cooled media interface A4, pass into liquid cooled medium and can realize the function that cools, integral structure device A top is provided with locating slot A2, for treating location and the installation of device B processed, this temperature control equipment ideally can realize the accurate temperature controlling treating device B processed, and integral structure device A generally can adopt graphite material.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (9)
1. one kind for regulating the temperature control equipment treating device temperature processed in vacuum equipment, it is characterized in that, comprise locating device, heating arrangement and heat sink, described locating device is for treating location and the installation of device processed, described locating device is positioned on heating arrangement, and described heating arrangement is positioned on heat sink; Tunnel-hole is provided with in described heating arrangement, in described Tunnel-hole, heater element is installed, described Tunnel-hole diameter is greater than heater element diameter, and leaves gap between described Tunnel-hole and described heater element, and the external diameter of described heater element does not contact with the hole wall of described Tunnel-hole;
Described locating device, described heating arrangement and described heat sink are integrated.
2. a kind ofly according to claim 1 it is characterized in that for regulating the temperature control equipment treating device temperature processed in vacuum equipment, described locating device is provided with locating slot, size and the structure of described locating slot and treat that device processed matches.
3. a kind ofly according to claim 1 it is characterized in that for regulating the temperature control equipment treating device temperature processed in vacuum equipment, described heater element quantity is identical with Tunnel-hole quantity.
4. a kind ofly according to claim 3 it is characterized in that for regulating the temperature control equipment treating device temperature processed in vacuum equipment, the electrode of described heater element is connected to each other, and described connection is for being connected in parallel or being connected in series.
5. a kind ofly according to claim 3 or 4 it is characterized in that for regulating the temperature control equipment treating device temperature processed in vacuum equipment, described heater element is infrared heating fluorescent tube, heater strip or ceramic heating pipe.
6. a kind of for regulating the temperature control equipment treating device temperature processed in vacuum equipment according to claim 1,2,3 or 4, it is characterized in that, be provided with liquid cooled medium passage in described heat sink, described liquid cooled medium passage two ends are connected with liquid cooled medium input interface and liquid cooled medium output interface respectively.
7. a kind ofly according to claim 6 it is characterized in that for regulating the temperature control equipment treating device temperature processed in vacuum equipment, described temperature control equipment is integrated, and the material of described temperature control equipment is graphite.
8. regulate in vacuum equipment the temperature-controlled process treating device temperature processed, it is characterized in that comprising the following steps:
By treat device processed location, be arranged on as arbitrary in claim 1 to 7 as described in temperature control equipment locating device in;
To the heating arrangement electrified regulation of described temperature control equipment, Tunnel-hole is provided with in described heating arrangement, in described Tunnel-hole, heater element is installed, described Tunnel-hole diameter is greater than heater element diameter, and leaving gap between described Tunnel-hole and described heater element, the external diameter of described heater element does not contact with the hole wall of described Tunnel-hole; Heat is passed to locating device by heat transfer by heating arrangement, to treating that device processed heats in locating device;
The temperature of heat sink of the temperature control equipment described in being reduced by liquid cooled medium, heat sink absorbs the heat of heating arrangement and locating device by heat transfer, to treating that device processed is lowered the temperature in locating device.
9. a kind ofly according to claim 8 regulate in vacuum equipment the temperature-controlled process treating device temperature processed, it is characterized in that, to the heating arrangement electrified regulation of described temperature control equipment, heat is passed to locating device by heat transfer by heating arrangement, to treating in the step that device processed heats in locating device, described is heat the electrifying electrodes of the heater element in the Tunnel-hole of heating arrangement to heating arrangement electrified regulation.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210583059.9A CN103076822B (en) | 2012-12-27 | 2012-12-27 | Regulate control method and the implement device thereof for the treatment of device temperature processed in vacuum equipment |
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| CN201210583059.9A CN103076822B (en) | 2012-12-27 | 2012-12-27 | Regulate control method and the implement device thereof for the treatment of device temperature processed in vacuum equipment |
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| CN103076822A CN103076822A (en) | 2013-05-01 |
| CN103076822B true CN103076822B (en) | 2015-09-09 |
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| CN107219030B (en) * | 2016-03-21 | 2020-07-21 | 中国科学院深圳先进技术研究院 | Film stress tester and testing method thereof |
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| JPS60245776A (en) * | 1984-05-21 | 1985-12-05 | Hitachi Ltd | Thin film forming device |
| EP0746010A2 (en) * | 1993-06-07 | 1996-12-04 | Applied Materials, Inc. | Sealing device and method useful in semiconductor processing apparatus for bridging materials having a thermal expansion differential |
| WO1998029704A1 (en) * | 1997-01-02 | 1998-07-09 | Cvc Products, Inc. | Thermally conductive chuck for vacuum processor |
| CN1472359A (en) * | 2003-06-27 | 2004-02-04 | 西北工业大学 | Heating temperature controller and method for preparing method |
| CN101038856A (en) * | 2006-03-17 | 2007-09-19 | 中国电子科技集团公司第四十八研究所 | Enclosed infrared heating device for semiconductor chip |
| CN101465285A (en) * | 2007-12-21 | 2009-06-24 | 新光电气工业株式会社 | Substrate temperature adjusting-fixing devices |
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2012
- 2012-12-27 CN CN201210583059.9A patent/CN103076822B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60245776A (en) * | 1984-05-21 | 1985-12-05 | Hitachi Ltd | Thin film forming device |
| EP0746010A2 (en) * | 1993-06-07 | 1996-12-04 | Applied Materials, Inc. | Sealing device and method useful in semiconductor processing apparatus for bridging materials having a thermal expansion differential |
| WO1998029704A1 (en) * | 1997-01-02 | 1998-07-09 | Cvc Products, Inc. | Thermally conductive chuck for vacuum processor |
| CN1472359A (en) * | 2003-06-27 | 2004-02-04 | 西北工业大学 | Heating temperature controller and method for preparing method |
| CN101038856A (en) * | 2006-03-17 | 2007-09-19 | 中国电子科技集团公司第四十八研究所 | Enclosed infrared heating device for semiconductor chip |
| CN101465285A (en) * | 2007-12-21 | 2009-06-24 | 新光电气工业株式会社 | Substrate temperature adjusting-fixing devices |
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Address after: 264006 Yantai economic and Technological Development Zone, Guiyang, No. 11 main street, Shandong Patentee after: Yantai Rui micro nano technology Limited by Share Ltd Address before: 264006 Yantai economic and Technological Development Zone, Guiyang, No. 11 main street, Shandong Patentee before: Yantai Raytron Technology Co., Ltd. |