CN103064002B - Fast calibration method of crystal oscillator temperature compensation chip - Google Patents
Fast calibration method of crystal oscillator temperature compensation chip Download PDFInfo
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- CN103064002B CN103064002B CN201210514248.0A CN201210514248A CN103064002B CN 103064002 B CN103064002 B CN 103064002B CN 201210514248 A CN201210514248 A CN 201210514248A CN 103064002 B CN103064002 B CN 103064002B
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Abstract
The invention provides a fast calibration method of a crystal oscillator temperature compensation chip. The method includes establishing a temperature frequency database of the chip, setting an nth frequency correction function related to the temperature of the chip, measuring frequency values of k temperature information points of the chip, wherein 0<k<n, retrieving the database according to the measured frequency values of the k temperature information points, retrieving information of a chip similar to the correction function of the to-be-measured chip, calculating information of other information points of the to-be-measured chip according to the information of the retrieved similar chip, and calculating the correction function of the to-be-measured chip. According to the fast calibration method, only data of a few information points are needed to calculate the correction function, manufacture cost of the chip is lowered, and production speed is accelerated.
Description
[technical field]
The invention relates to a kind of crystal oscillator temperature compensation chip, particularly about the fast calibration method of crystal oscillator temperature compensation chip.
[background technology]
Crystal oscillator is commonly used to provide standard clock frequency; the frequency that usual crystal oscillator exports at different temperature its output frequency variation with temperature can produce drift; for ensureing that the frequency that crystal oscillator exports is standard frequency, usually temperature compensation can be carried out by temperature-compensated chip to the output frequency of crystal oscillator.Due to crystal oscillator output frequency vary with temperature for function be curve, temperature-compensated chip also needs to be that corresponding curve could compensate temperature drift to the function that output frequency carries out timing, so the correction function of temperature-compensated chip is generally repeatedly curvilinear function, such as quafric curve function or cubic curve function etc., when such as 3 functions carry out rectification building-out in employing, correction function is f (x)=a*x
3+ b*x
2+ c*x+d, x are temperature sensor value.To obtain a, b, c, d coefficient accurately, need four data points, for temperature compensation chip, need the error amount under test four different temperatures, when producing in batches, these four temperature spots have become to keep in check the key factor of output and cost.If by measuring less temperature spot, and reach the effect close with test four points, production cost and faster production can be reduced like this.
[summary of the invention]
A kind of needs is the object of the present invention is to provide to measure the method that a lot of temperature spot just can determine temperature-compensated chip verification function fast.
For reaching aforementioned object, the fast calibration method of a kind of temperature-compensated chip of the present invention, it comprises the temperature versus frequency data storehouse setting up chip; The n secondary frequencies correction function about temperature arranging chip to be tested is f (x)=d
1x
n+ d
2x
n-1+ d
3x
n-2+ d
n+1, this function reflects the frequency departure situation of chip when different temperatures, and wherein x is temperature or temperature sensor value, f (x) at x temperature to the correction function of the frequency departure of standard frequency, d
1, d
2, d
3d
n+1for the coefficient of correction function, measure the frequency values of k temperature information point of this chip to be tested, wherein 0<k<n, according to the frequency values of k the temperature information point recorded, database is retrieved, retrieve the information of the similar chip of the physical characteristics of chip to be tested to this, because physical characteristics is similar therefore correction function is similar, calculated the information of other temperature frequency information points of chip to be tested by the information of the similar chip of the physical characteristics retrieved, and then calculate the coefficient of correction function of chip to be tested;
The information that wherein said temperature versus frequency data storehouse stores is:
C
1：T-F
1(T
x1,F
y1),T-F
2(T
x2,F
y2),...T-F
i(T
xi,F
yi)...,T-F
n(T
xn,F
yn)
C
2：T-F
1(T
x1,F
y1),T-F
2(T
x2,F
y2),...T-F
i(T
xi,F
yi)...,T-F
n(T
xn,F
yn)
C
3：T-F
1(T
x1,F
y1),T-F
2(T
x2,F
y2),...T-F
i(T
xi,F
yi)...,T-F
n(T
xn,F
yn)
C
4：T-F
1(T
x1,F
y1),T-F
2(T
x2,F
y2),...T-F
i(T
xi,F
yi)...,T-F
n(T
xn,F
yn)
C
5：T-F
1(T
x1,F
y1),T-F
2(T
x2,F
y2),...T-F
i(T
xi,F
yi)...,T-F
n(T
xn,F
yn)
C
6：T-F
1(T
x1,F
y1),T-F
2(T
x2,F
y2),...T-F
i(T
xi,F
yi)...,T-F
n(T
xn,F
yn)
C
i：T-F
1(T
x1,F
y1),T-F
2(T
x2,F
y2),...T-F
i(T
xi,F
yi)...,T-F
n(T
xn,F
yn)
Wherein C
ichip number, T-F
ithe information point of temperature frequency, T
xithe temperature of this information point or the value of temperature sensor collection, F
yithe frequency dependant value of this information point, wherein i ∈ N, i=1,2,3 ... n;
The information retrieving the similar chip of the physical characteristics of chip to be tested to this is specially: k the information point utilizing the chip to be tested recorded, and retrieve database, search condition is:
P1x-m1<=T
x1<=P1x+m1 and P1y-n1<=F
y1<=P1y+n1;
P2x-m2<=T
x2<=P2x+m2 and P2y-n2<=F
y2<=P2y+n2;
Pix-mi<=T
xi<=Pix+mi and Piy-ni<=F
yi<=Piy+ni;
Pkx-mk<=T
xk<=Pkx+mk and Pky-nk<=F
yk<=Pky+nk;
Wherein m1, m2 ... mk, n1, n2 ... nk is the hunting zone of setting, P1x, P2x ... Pkx is the temperature sensor value of k the information point that chip to be tested has been surveyed, P1y, P2y ... Pky is the frequency dependant value of k the information point that chip to be tested has been surveyed, and the chip meeting aforementioned condition is chip akin with chip to be tested;
If the chip searched is one chip, then get all the other n-ks the information point of value as chip to be tested of residue n-k information point of this searched chip arrived, utilize k the information point measured and n-k the information point searched to substitute into the correction function coefficient that correction function f (x) calculates chip to be tested;
If the result searched is multiple chip, then to these chips searched out and chip to be measured, sequence is carried out and stepping according to the order of magnitude of the frequency at a certain temperature, only adopt the chip information of the gear residing for chip to be tested, to final effective chip, its mean value is asked respectively to its remaining n-k information point, as the value of all the other n-k information point of chip to be tested, substitutes into correction function and can solve correction coefficient.
According to one embodiment of present invention, the numerical value k=1 of the point of described measurement, the correction function about temperature of described chip to be tested is f (x)=d
1+ d
2(x-a)
2+ d
3(x-a)
3+ ... + d
n(x-a)
n, wherein d
1, d
2, d
3d
n, a is constant, and the point wherein measured is the temperature spot P1 close to normal temperature, and its information comprised is (P1x, P1y), wherein for the C in database
iindividual chip, the constant term d1 of its correction function
ibe ti=d1 with the frequency-splitting of measurement point
i-F
y1if there is N number of chip in database, then t=(t1+t2+t3 ... + tN)/N, then predict the constant term d1 of the correction function of chip to be tested
p1=P1y+t, the condition of the chip that search is similar to chip to be tested is P1x-m1<=T in a database
xi<=P1x+m1
P1y-n1<＝F
yi<＝P1y+n1
d1
p1-δc<＝d1
i<＝d1
p1+δc
Wherein m1, n1 and δ c is the hunting zone of setting, wherein T
xifor chip C
itemperature sensor value when the P1 temperature spot of chip to be tested, F
yifor chip C
ifrequency dependant value when the P1 temperature spot of chip to be tested, d1
ifor chip C
icorrection function in constant term.
According to one embodiment of present invention, for the temperature sensor value T of residue n-k information point of the chip searched
xirevise, obtain the temperature sensor value T with all the other n-k information point of chip similar chips to be tested
xi, get the temperature sensor value T of k information point and the revised n-k information point recorded
xiand frequency dependant value F
yicalculate the correction function of chip to be tested.
According to one embodiment of present invention, the method for described correction is: the temperature sensor value of remaining n-k information point of chip to be tested is Pix=T
xi-t, wherein t=[(T
x1-P1x)+(T
x2-P2x)+... (T
xk-Pkx)]/k, wherein k is the quantity of the information point measured.
According to one embodiment of present invention, the method for described correction is: for the temperature sensor value T of the temperature information point of each chip
xia function about temperature, the near chip C searched
itemperature sensor T
xithe temperature curve equation of value and temperature x is Txi=g1 (x)=d
1* x
n+ d
2* x
n-1+ d
3* x
n-2+ ... + d
n* x+d
n+1, the temperature of wherein having tested k information point of chip to be tested is t1, t2 ... tk, utilizes the information (t1, P1x) recorded, (t2, P2x) ... (tk, Pkx) solves the local temperature curve h of chip to be tested
1(x)=e
k* x
k-1+ e
k-1* x
k-2+ ... e
2* x+e
1, wherein e
ifor constant, for chip C
i, combine its information point (t1, T
x1), (t2, T
x2) ... (tk, T
xk), solve its local temperature curve h
2(x)=f
k* x
k-1+ f
k-1* x
k-2+ ... + f
2* x+f
1, make d
n+1=(e
1+ f
1)/2, d
n=(e
2+ f
2)/2 ... d
k=(e
k+ f
k)/2 obtain the portion temperature curve of chip to be tested: Pix=g2 (x)=d
1* x
n+ d
2* x
n-1+ d
3* x
n-2+ ... + d
k* x
k+ d
n* x+d
n+1, can according to the residue n-k of the near chip a searched information point, the horizontal ordinate of approximate remaining n-k the information point thinking chip to be tested is Pnx=g2 (tn).
For reaching aforementioned object, the fast calibration method of a kind of temperature-compensated chip of the present invention, it comprises:
Set up the temperature versus frequency data storehouse of temperature-compensated chip;
Measure the frequency values of at least one temperature spot of chip to be tested, the number of the coefficient being less than temperature compensation correction function of counting wherein measured;
According to the temperature frequency value of counting of the chip to be tested measured, setting query context, finds chip akin with chip to be tested in the database;
Using the temperature frequency value of counting with the residue of the akin chip of chip to be tested that the searches unmeasured temperature frequency value of counting as chip to be tested, in conjunction with the temperature frequency value of counting that chip to be tested has been measured, calculate the coefficient of the correction function of chip to be tested, to determine the correction function of chip to be tested.
According to one embodiment of present invention, if the result searched is multiple chip, then by the error size of the frequency at a certain temperature recorded with chip to be tested, stepping is carried out to the frequency of the chip that these search out, only adopt the chip information of the gear residing for chip to be tested, to final effective chip, get it and remain the mean value of counting, as the unmeasured temperature frequency value of counting of chip to be tested, in conjunction with the temperature frequency value of counting that chip to be tested has been measured, calculate the coefficient of the correction function of chip to be tested, to determine the correction function of chip to be tested.
Compared with prior art, method of the present invention, by setting up the database of chip, measure the information being less than the temperature spot of correction function coefficient, by the information of measured temperature spot, search the chip similar to chip to be tested in a database, the information of other information points of chip to be tested is calculated by the information of the similar chips searched, and then draw the coefficient of correction function of chip to be tested, do not need the information measuring all temperature spots can determine the correction function of chip to be tested, the rapid verification of chip can be realized, reduce production cost and faster production.
[accompanying drawing explanation]
Fig. 1 is the step schematic diagram of method of the present invention.
Fig. 2 is that search in method of the present invention is similar the schematic diagram of two kinds of distinct methods of chip.
Fig. 3 be search in method of the present invention be similar chip method in the method schematic diagram of horizontal ordinate correction.
[embodiment]
Alleged herein " embodiment " or " embodiment " refers to special characteristic, structure or the characteristic that can be contained at least one implementation of the present invention.Different local in this manual " in one embodiment " occurred not all refers to same embodiment, neither be independent or optionally mutually exclusive with other embodiments embodiment.
The invention relates to the fast calibration method of crystal oscillator output frequency temperature-compensated chip.As previously mentioned, the frequency that usual crystal oscillator exports at different temperature its output frequency variation with temperature can produce drift, for ensureing that the frequency that crystal oscillator exports is standard frequency, usually can carry out temperature compensation by temperature-compensated chip to the output frequency of crystal oscillator.Due to crystal oscillator output frequency vary with temperature for function be curve, temperature-compensated chip also needs to be that corresponding curve could compensate temperature drift to the function that output frequency carries out timing, the correction function of temperature-compensated chip to temperature compensation is generally repeatedly curvilinear function, the function of temperature compensation can be adopt quadratic function or cubic function or more higher order functionality etc., the number of times of function is higher, and the precision of verification is higher.For each deblocking temperature compensation chips, all need to verify, to determine the coefficient of the correction function of this temperature-compensated chip.
First adopt cubic function to carry out rectification building-out for chip piece below, fast calibration method of the present invention is described.Induction and conclusion is adopted the method that n function carries out correcting below.
Refer to shown in Fig. 1, fast calibration method of the present invention comprises:
Step 1: the database setting up temperature-compensated chip.Wherein this database is the database of the various correction functions of temperature-compensated chip, i.e. the database of the various frequency of temperature-compensated chip and the function of temperature.This database can be measure the temperature of multiple chip and the functional value of frequency in advance, and these correction functions are stored in database.Wherein the correction function of each chip is that the frequency values measured under corresponding temperature according to the power of correction function is determined, adopt cubic function to carry out the chip of rectification building-out, then database is the data adopting cubic function to carry out the chip of rectification building-out.
The database that such as existence one is following, wherein C
ichip number, T-F
nthe information point of temperature frequency, T
xnthe temperature sensor value of this information point, T
ynthe frequency dependant value of this information point, wherein i ∈ N, n=1,2,3,4.The data of its record are as follows:
C
1：T-F
1(T
x1,F
y1),T-F
2(T
x2,F
y2),T-F
3(T
x3,T
y3),T-F
4(T
x4,T
y4)
C
2：T-F
1(T
x1,F
y1),T-F
2(T
x2,F
y2),T-F
3(T
x3,T
y3),T-F
4(T
x4,T
y4)
C
3：T-F
1(T
x1,F
y1),T-F
2(T
x2,F
y2),T-F
3(T
x3,T
y3),T-F
4(T
x4,T
y4)
C
4：T-F
1(T
x1,F
y1),T-F
2(T
x2,F
y2),T-F
3(T
x3,T
y3),T-F
4(T
x4,T
y4)
C
5：T-F
1(T
x1,F
y1),T-F
2(T
x2,F
y2),T-F
3(T
x3,T
y3),T-F
4(T
x4,T
y4)
C
6：T-F
1(T
x1,F
y1),T-F
2(T
x2,F
y2),T-F
3(T
x3,T
y3),T-F
4(T
x4,T
y4)
C
7：T-F
1(T
x1,F
y1),T-F
2(T
x2,F
y2),T-F
3(T
x3,T
y3),T-F
4(T
x4,T
y4)
C
i：T-F
1(T
x1,F
y1),T-F
2(T
x2,F
y2),T-F
3(T
x3,T
y3),T-F
4(T
x4,T
y4)
Step 2: wherein at least one information point measuring chip, the number of the coefficient being less than temperature compensation correction function of counting wherein measured.
Step 3: then utilize the information point recorded to find the information of the chip close with this chip in a database.
Utilize the information point of the chip measured, search for the method for akin chip in a database, for the situation that chip accuracy requirement is lower, can adopt and only utilize single information point to carry out the method for searching for, be referred to as one-point method, for the situation that chip accuracy requirement is higher, the searching method of measurement 2 information points can be adopted, be referred to as two-point method.Respectively one-point method and two-point method are described below.
Step 31: the one-point method of database search
Utilize the method for the close chip in one-point method search database to be only measure a temperature information point, this wherein measurement puts the point needing selection one representative and more balanced, can select the temperature spot close to normal temperature in actual applications.
The correction function adopting one-point method to carry out database search chip is f (x)=c+d (x-a)
2+ b* (x-a)
3, according to chip design principle, and the statistical law of reality, frequency shift (FS) difference under the constant term c of correction function and this chip normal temperature is very close, and its difference has certain statistical property, because if constant a is a number close to normal temperature, if then x is normal temperature, then f (x)=c.
The chip C stored in database
ithe information point comprised is: T-F
1(T
x1, F
y1), T-F
2(T
x2, F
y2), T-F
3(T
3x, T
y3), T-F
4(T
x4, T
y4), assuming that T-F
1(T
x1, F
y1) be the information point under normal temperature, the constant term c of its correction function and the difference of normal temperature lower frequency are: ti=c-Fy1, if there be n chip in database, then t=(t1+t2+t3 ... tn)/n, the t obtained are values with ubiquity.In addition, in order to the t more pressed close to, can only select the T-F utilizing chip A
1information preliminary screening q chips out calculate t, then t=(... ti+tj+ ... )/q.Wherein the method for preliminary screening is the information P1 (P1x, P1y) utilizing chip A, setting search condition
P1x-m1<＝T
x1<＝P1x+m1
Wherein m1 is the hunting zone of setting.
According to the information of the single-point of known measurement, the information point (P1x, P1y) namely under chip A normal temperature, due to the constant term c=Fy1+t of correction function, utilizes the t that previous calculations goes out, the meter constant item c of prediction chip A
p1be similar to c
p1=P1y+t, utilizes information (P1x, P1y) and c
p1, carry out search and can obtain the general chip similar to chip A, search condition is as follows:
P1x-m1<＝T
x1<＝P1x+m1
P1y-n1<＝F
y1<＝P1y+n1
c
p1-δc<＝c
i<＝c
p1+δc
Wherein m1, n1 and δ c is the hunting zone of setting, wherein c
ifor chip C
icorrection function in constant term.
Step 4: the correction function calculating chip A to be tested according to the similar chips searched.
If only find when search database a chip similar to chip A to be tested, then adopt the information point of T3 and T4 of this chip as the data of P3 and the P4 information point for test chip A, carry out the correction function calculating chip A to be tested.If the result searched is multiple chip, then to these chips searched out and chip to be measured, sequence is carried out and stepping according to the order of magnitude of the frequency at a certain temperature, only adopt the chip information of the gear residing for chip to be tested, to final effective chip, its mean value is asked respectively to its remaining n-k information point, as the value of all the other n-k information point of chip to be tested, substitutes into correction function and can solve correction coefficient.Its mean value is asked respectively to its remaining n-k information point, as the value of all the other n-k information point of chip to be tested, substitutes into correction function and can solve correction coefficient.
Foregoing is the method adopting one-point method to carry out similar chips search in step 2, tells about below and adopts two-point method to carry out the method for similar chips search in step 2.
Step 32: the two-point method of database search
Step 321: two information points measuring chip, search out chip akin with chip to be measured by these two information points.
Such as, that a certain chip A adopts is 3 correction function f (x)=a*x
3+ b*x
2+ c*x+d, then the coefficient of this function is a, b, c, d tetra-coefficients, normally for determining that this correction function needs to measure T-F
1, T-F
2, T-F
3, T-F
4the frequency of four temperature information points, and the present invention only measures 2 temperature information points of chip, the quantity of the temperature information point namely wherein measured is less than the number of coefficients of this chip correction function, two information points such as measured are P1 (P1x, P1y), P2 (P2x, P2y) 1., utilize the P1 measured, P2 information finds the information of the akin chip with this chip at database, obtains the T-F of similar chips
3, T-F
4information.Wherein search and the following condition of chip A akin chip demand fulfillment
P1x-m1<＝T
x1<＝P1x+m1
P1y-n1<＝F
y1<＝P1y+n1
P2x-m2<＝T
x2<＝P2x+m2
P2y-n2<＝F
y2<＝P2y+n2
Wherein T
x1, F
y1the T-F of close chip
1the data of information point, T
x2, F
y2the T-F of close chip
2the data of information point, m1, m2, n1, n2 are hunting zones, and the selection of this value is relevant with the error of equipment.Such as, greenhouse temperature error causes temperature sensor value error about 10, then m1, m2 can select 10, and frequency meter error can value 0.5 at about 0.5ppm, n1, n2.M1, the value of m2 can suitably be relaxed, because the temperature sensor value of different chip and the homologous thread of temperature different, but there is its similitude, such as all be similar to the very close straight line of a slope, so can relax m1, the search condition of m2, the later stage can carry out the correction of temperature sensor value for the chip searched.And frequency change is high order curve, be the target corrected, so need suitably to tighten up search restriction.
With searching the condition of work above, in database, search chip C
isatisfy condition:
C
i：T-F
1(T
x1,F
y1),T-F
2(T
x2,F
y2),T-F
3(T
3x,T
y3),T-F
4(T
x4,T
y4) ②
For those search less than the chip to be tested of similar chips, need to carry out separately 4 tests accurately, then chip information is added database.When database save bit by bit a certain amount of after, most chip can find similar chips.
Because the T of each chip
xivalue is the numerical value that temperature sensor gathers, be one with the value of temperature correlation, it has corresponding relation with temperature, and corresponding relation wherein can use function representation, T
xi=g (x)=d
1* x
n+ d
2* x
n-1+ d
3* x
n-2+ ... + d
n* x+d
n+1, wherein x is temperature, T
xifor the value that the x temperature of temperature sensor collection is corresponding.For different chip, the corresponding relation between its temperature and the value of temperature sensor collection may be different, namely T
xibeing not identical with the coefficient of the function of temperature x, is such as 85 DEG C equally, the T that the temperature sensor of chip A 85 DEG C of gathering are corresponding
xivalue be 300, and the value of 85 DEG C of the temperature sensor collection of chip I corresponding Txi is 310.
That is for the chip C that chip A to be measured is found by previous searches
i, when accuracy requirement is higher, can not directly with the C of the chip searched
it
x3and T
x4as P3x, P4x of chip A to be tested, otherwise have error, therefore need to revise the horizontal ordinate of the chip searched.Correction about horizontal ordinate will be told about below again.
In preceding method, be T in the hunting zone of P1x
x1in ± 5, or more among a small circle in, need not horizontal ordinate correction be carried out, also not advise carrying out.Carrying out extensive search as T
x1± 20 or wider, time not harsh to accuracy requirement, can horizontal ordinate correction be carried out.
Because if good operational consistency can not be kept at production period, can big error be added to the correction of horizontal ordinate, as do not reached 40 DEG C at chip A internal temperature, during just to 35 DEG C, the data point of collection is actual is (g (35), f (g (35)).When revising, we obtain the temperature sensor value close to g (40) by horizontal ordinate correction, (g (40) is obtained after combination, f (g (35))), and actual needs (g (40, (information point of g (40), the result obtained like this has very large error to f certainly.
If so can not keep consistency, horizontal ordinate correction need not be carried out.Even if in order to be similar to, (g (35), f (g (35)) this point, also can not affect the precision of chip, not affect this algorithm the point gathered in addition.
Step 4: the correction function calculating chip A to be tested according to the similar chips searched.
If only find when search database a chip similar to chip A to be tested, then adopt the information point of T3 and T4 of this chip as the data of P3 and the P4 information point for test chip A, carry out the correction function calculating chip A to be tested.If find when search database multiple chip similar to chip A to be tested, then adopt stepping method similar in mentioned single point method, stepping is carried out to the multiple chips found, then gets the T-F with the chip of the shelves at chip A place
3, T-F
4the mean value of information is as the P3 of chip A to be tested, and the information of P4 point, then calculates the correction function of chip A to be tested according to the information of P1, P2, P3, P4.
Mention above, if the consistance in chip production run can be kept, then by after horizontal ordinate correction, chip precision can be made higher.
As: ensure that the information that all chips of database collect at 40 DEG C is very accurate or the good information of consistance,
We dope the temperature sensor value Px of chip A 40 DEG C time by horizontal ordinate correction, utilize this Px to carry out binary search to database, can filter out the chip more similar to chip A.
Meanwhile, if database is enough large, even if the consistance of database is not fine, carries out binary search by the revised Px of horizontal ordinate and also can filter out the chip more similar to chip A.
Tell about the method for horizontal ordinate correction below.
Step 322: after searching similar chips in a database, the horizontal ordinate of the information of similar chips is revised.
Wherein the method for horizontal ordinate correction can have two kinds again
Horizontal ordinate modification method 1:
Test through us finds T
xiwith the curve of degree celsius temperature after carrying out cubic fit its quadratic term and cubic term coefficient very little, approach straight line.In error allowed band, we can do following simple correction.
T=[(T
x1-P1x)+(T
x2-P2x)]/2, t be the average error of the intercept of the close straight line of two slopes.
Can be similar to and think P3x=T
x3-t; P4x=T
x4-t 3.
Horizontal ordinate modification method 2:
Four temperature spots of test are t1, t2, t3, t4, unit DEG C
For chip C
i, we pass through 2. can combined information point (t1, T
x1), (t2, T
x2), (t3, T
x3), (t4, T
x4)
Substitute into C
itemperature curve equation: T
xi=g1 (x)=a1*x
3+ b1*x
2+ c1*x+d1 can solve four coefficients.
Know by observing curve and statistical law, coefficient a1 and b1 of g1 (x) is very little, major decision temperature curve be Monomial coefficient c1 and constant term d1.
We do following integration:
For chip A, utilize 1., combined information point (t1, P1x), (t2, P2x), solves its local temperature straight line h1 (x)=k1*x+z1
For chip C
i, utilize 2., combined information point (t1, T
x1), (t2, T
x2), solve its local temperature straight line h2 (x)=k2*x+z2
We make c2=(k1+k2)/2, d2=(z1+z2)/2
Obtain the portion temperature curve of chip A:
g2(x)＝a1*x
3+b1*x
2+c2*x+d2
Can be similar to and think that P3x=g2 (t3), P4x=g2 (t4) are 3.
The P3x that this modification method of empirical tests obtains, P4x are relatively more accurate, when database is larger, can be used for searching for for 2 times.
Step 4: the correction function calculating chip A to be tested according to the similar chips searched.
Utilize the information P1 of measure two information points above, P2 (namely label 1.) above, and pass through P1, similar chips that P2 searches out (namely label 2.) above, and the P3x after revising, the information of P4x (namely label 3.) above can carry out 2 search to database, and the final like this chip that chip a and to be tested can be found in a database more similar is such as C
k, then C is got
kt-F
3, T-F
4the T of information point
y3and T
y4as the P3y of chip A to be tested, P4y, i.e. P3y=T
y3, P4y=T
y44..Then by 1. 2. 3. information 4. can obtain the information A:(P1x of whole 4 points of chip A to be tested, P1y), P2 (P2x, P2y), P3 (P3x, P3y), this information of 4 is substituted into cubic term calibration curve f (x)=a*x by P4 (P4x, P4y)
3+ b*x
2+ c*x+d, can draw the correction coefficient a of chip A to be tested, b, c, d, thus determines the correction function of chip A to be tested.
The situation of above lifted example to be correction function be 3 functions, aborning, may carry out emending frequency curve with the curve of more high order.At this moment similar database fast calibration method can still be adopted.
For n correction function f (x), need n information temperature spot, determine n coefficient of function.
When the information point of test chip, the selection of temperature spot is very important, need to select representational temperature spot as much as possible, such as add up the temperature curve of a collection of chip, calculate the temperature spot that limit is corresponding, the temperature spot that the zero point of its 1 order derivative, limit are corresponding, the temperature spot etc. near ultimate temperature.
After Information Monitoring point, obtain database:
C1：T-F
1(T
x1,F
y1),T-F
2(T
x2,F
y2),...T-F
i(T
xi,F
yi)...,T-F
n(T
xn,F
yn)
C2：T-F
1(T
x1,F
y1),T-F
2(T
x2,F
y2),...T-F
i(T
xi,F
yi)...,T-F
n(T
xn,F
yn)
C3：T-F
1(T
x1,F
y1),T-F
2(T
x2,F
y2),...T-F
i(T
xi,F
yi)...,T-F
n(T
xn,F
yn)
C4：T-F
1(T
x1,F
y1),T-F
2(T
x2,F
y2),...T-F
i(T
xi,F
yi)...,T-F
n(T
xn,F
yn)
C5：T-F
1(T
x1,F
y1),T-F
2(T
x2,F
y2),...T-F
i(T
xi,F
yi)...,T-F
n(T
xn,F
yn)
C6：T-F
1(T
x1,F
y1),T-F
2(T
x2,F
y2),...T-F
i(T
xi,F
yi)...,T-F
n(T
xn,F
yn)
For chip A to be tested, measure k (0<k<n) individual information point in advance.The temperature spot of this k information point is selected not only representative, also needs guarantee to be evenly distributed among n temperature spot, adopts simultaneously as far as possible and commonly uses temperature spot, such as normal temperature, ultimate temperature, the temperature etc. that zero point, limit are corresponding.
K the information point utilizing chip A to record, retrieves database, search condition;
The chip similar to chip A need meet the following conditions:
P1x-m1<=T
x1<=P1x+m1 and P1y-n1<=F
y1<=P1y+n1
P2x-m2<=T
x2<=P2x+m2 and P2y-n2<=F
y2<=P2y+n2
Pix-mi<=T
xi<=Pix+mi and Piy-ni<=F
yi<=Piy+ni
Pkx-mk<=T
xk<=Pkx+mk and Pky-nk<=F
yk<=Pky+nk
Optionally horizontal ordinate correction is carried out to the j chips retrieved, utilizes all the other n-k information point to be combined into n the test point of A:
A：(P1x,P1y),P2(P2x,P2y),...Pi(Pix,Piy)...,Pn(Pnx,Pny)
Be brought into correction function f (x), solve n coefficient of function.
The method wherein revised is as the modification method of cubic function above, and can have two kinds of modification methods, a kind of modification method is: the temperature sensor value of remaining n-k information point of chip to be tested is Pix=T
xi-t, wherein t=[(T
x1-P1x)+(T
x2-P2x)+... (T
xk-Pkx)]/k, wherein k is the quantity of the information point measured.
Another modification method is: for the value T of the temperature information point of each chip
xia function about temperature, the near chip C searched
it
xithe temperature curve equation of value and temperature x is T
xi=g1 (x)=d
1* x
n+ d
2* x
n-1+ d
3* x
n-2+ ... + d
n* x+d
n+1, the temperature of wherein having tested k information point of chip to be tested is t1, t2 ... tk, utilize the information (t1, P1x) recorded, (t2, P2x) ... (tk, Pkx) solves local temperature curve h1 (the x)=e of chip to be tested
k* x
k-1+ e
k-1* x
k-2+ ... e
2* x+e
1, wherein e
ifor constant, for chip C
i, combine its information point (t1, T
x1), (t2, T
x2) ... (tk, T
xk), solve its local temperature curve h2 (x)=f
k* x
k-1+ f
k-1* x
k-2+ ... + f
2* x+f
1, make d
n+1=(e
1+ f
1)/2, d
n=(e
2+ f
2)/2 ... d
k=(e
k+ f
k)/2 obtain the portion temperature curve of chip to be tested: Pix=g2 (x)=d
1* x
n+ d
2* x
n-1+ d
3* x
n-2+ ... + d
k* x
k+ d
n* x
n+ d
n+1, can according to the residue n-k of the near chip a searched information point, the horizontal ordinate of approximate remaining n-k the information point thinking chip to be tested is Pnx=g2 (tn).
Method of the present invention, by setting up the database of chip, measure the information being less than the temperature spot of correction function coefficient, by the information of measured temperature spot, search the chip similar to chip to be tested in a database, the information of other information points of chip to be tested is calculated by the information of the similar chips searched, and then draw the coefficient of correction function of chip to be tested, do not need the information measuring all temperature spots can determine the correction function of chip to be tested, the rapid verification of chip can be realized, reduce production cost and faster production.
Above-mentioned explanation fully discloses the specific embodiment of the present invention.It is pointed out that the scope be familiar with person skilled in art and any change that the specific embodiment of the present invention is done all do not departed to claims of the present invention.Correspondingly, the scope of claim of the present invention is also not limited only to previous embodiment.
Claims (7)
1. a fast calibration method for temperature-compensated chip, it comprises the temperature versus frequency data storehouse setting up chip; The n secondary frequencies correction function about temperature arranging chip to be tested is f (x)=d
1x
n+ d
2x
n-1+ d
3x
n-2+ d
n+1, this function reflects the frequency departure situation of chip when different temperatures, and wherein x is temperature or temperature sensor value, f (x) at x temperature to the correction function of the frequency departure of standard frequency, d
1, d
2, d
3d
n+1for the coefficient of correction function, measure the frequency values of k temperature information point of this chip to be tested, wherein 0<k<n, according to the frequency values of k the temperature information point recorded, database is retrieved, retrieve the information of the similar chip of the physical characteristics of chip to be tested to this, because physical characteristics is similar therefore correction function is similar, calculated the information of other temperature frequency information points of chip to be tested by the information of the similar chip of the physical characteristics retrieved, and then calculate the coefficient of correction function of chip to be tested;
The information that wherein said temperature versus frequency data storehouse stores is:
C
1：T-F
1(T
x1,F
y1),T-F
2(T
x2,F
y2),...T-F
i(T
xi,F
yi)...,T-F
n(T
xn,F
yn)
C
2：T-F
1(T
x1,F
y1),T-F
2(T
x2,F
y2),...T-F
i(T
xi,F
yi)...,T-F
n(T
xn,F
yn)
C
3：T-F
1(T
x1,F
y1),T-F
2(T
x2,F
y2),...T-F
i(T
xi,F
yi)...,T-F
n(T
xn,F
yn)
C
4：T-F
1(T
x1,F
y1),T-F
2(T
x2,F
y2),...T-F
i(T
xi,F
yi)...,T-F
n(T
xn,F
yn)
C
5：T-F
1(T
x1,F
y1),T-F
2(T
x2,F
y2),...T-F
i(T
xi,F
yi)...,T-F
n(
Txn,F
yn)
C
6：T-F
1(T
x1,F
y1),T-F
2(T
x2,F
y2),...T-F
i(T
xi,F
yi)...,T-F
n(T
xn,F
yn)
.
.
.
.
C
i：T-F
1(T
x1,F
y1),T-F
2(T
x2,F
y2),...T-F
i(T
xi,F
yi)...,T-F
n(T
xn,F
yn)
Wherein C
ichip number, T-F
ithe information point of temperature frequency, T
xithe temperature of this information point or the value of temperature sensor collection, F
yithe frequency dependant value of this information point, wherein i ∈ N, i=1,2,3 ... n;
The information retrieving the similar chip of the physical characteristics of chip to be tested to this is specially: k the information point utilizing the chip to be tested recorded, and retrieve database, search condition is:
P1x-m1<=T
x1<=P1x+m1 and P1y-n1<=F
y1<=P1y+n1;
P2x-m2<=T
x2<=P2x+m2 and P2y-n2<=F
y2<=P2y+n2;
.
.
.
Pix-mi<=T
xi<=Pix+mi and Piy-ni<=F
yi<=Piy+ni;
.
.
.
Pkx-mk<=T
xk<=Pkx+mk and Pky-nk<=F
yk<=Pky+nk;
Wherein m1, m2 ... mk, n1, n2 ... nk is the hunting zone of setting, P1x, P2x ... Pkx is the temperature sensor value of k the information point that chip to be tested has been surveyed, P1y, P2y ... Pky is the frequency dependant value of k the information point that chip to be tested has been surveyed, and the chip meeting aforementioned condition is chip akin with chip to be tested;
If the chip searched is one chip, then get all the other n-ks the information point of value as chip to be tested of residue n-k information point of this searched chip arrived, utilize k the information point measured and n-k the information point searched to substitute into the correction function coefficient that correction function f (x) calculates chip to be tested;
If the result searched is multiple chip, then to these chips searched out and chip to be measured, sequence is carried out and stepping according to the order of magnitude of the frequency at a certain temperature, only adopt the chip information of the gear residing for chip to be tested, to final effective chip, its remaining n-k information point is asked respectively to the mean value of its information, as the value of information of all the other n-k information point of chip to be tested, substitute into correction function and can solve correction coefficient.
2. the fast calibration method of temperature-compensated chip as claimed in claim 1, it is characterized in that: the numerical value k=1 of the point of described measurement, the correction function about temperature of described chip to be tested is f (x)=d
1+ d
2(x-a)
2+ d
3(x-a)
3+ ... + d
n(x-a)
n, wherein d
1, d
2, d
3d
n, a is constant, and the point wherein measured is the temperature spot P1 close to normal temperature, and its information comprised is (P1x, P1y), wherein for the C in database
iindividual chip, the constant term d1 of its correction function
ibe ti=d1 with the frequency-splitting of measurement point
i-F
y1if there is N number of chip in database, then t=(t1+t2+t3 ... + tN)/N, then predict the constant term d1 of the correction function of chip to be tested
p1=P1y+t, the condition of the chip that search is similar to chip to be tested is P1x-m1<=T in a database
xi<=P1x+m1
P1y-n1<＝F
yi<＝P1y+n1
d1
p1-δc<＝d1
i<＝d1
p1+δc
Wherein m1, n1 and δ c is the hunting zone of setting, wherein T
xifor chip C
itemperature sensor value when the P1 temperature spot of chip to be tested, F
yifor chip C
ifrequency dependant value when the P1 temperature spot of chip to be tested, d1
ifor chip C
icorrection function in constant term.
3. the fast calibration method of temperature-compensated chip as claimed in claim 2, is characterized in that: for the temperature sensor value T of residue n-k information point of the chip searched
xirevise, obtain the temperature sensor value T with all the other n-k information point of chip similar chips to be tested
xi, get the temperature sensor value T of k information point and the revised n-k information point recorded
xiand frequency dependant value F
yicalculate the correction function of chip to be tested.
4. the fast calibration method of temperature-compensated chip as claimed in claim 3, is characterized in that: the method for described correction is: the temperature sensor value of remaining n-k information point of chip to be tested is Pix=T
xi-t, wherein t=[(T
x1-P1x)+(T
x2-P2x)+... (T
xk-Pkx)]/k, wherein k is the quantity of the information point measured.
5. the fast calibration method of temperature-compensated chip as claimed in claim 3, is characterized in that: the method for described correction is: for the temperature sensor value T of the temperature information point of each chip
xia function about temperature, the near chip C searched
itemperature sensor T
xithe temperature curve equation of value and temperature x is T
xi=g1 (x)=d
1* x
n+ d
2* x
n-1+ d
3* x
n-2+ ... + d
n* x+d
n+1, the temperature of wherein having tested k information point of chip to be tested is t1, t2 ... tk, utilizes the information (t1, P1x) recorded, (t2, P2x) ... (tk, Pkx) solves the local temperature curve h of chip to be tested
1(x)=e
k* x
k-1+ e
k-1* x
k-2+ ... e
2* x+e
1, wherein e
ifor constant, for chip C
i, combine its information point (t1, T
x1), (t2, T
x2) ... (tk, T
xk), solve its local temperature curve h
2(x)=f
k* x
k-1+ f
k-1* x
k-2+ ... + f
2* x+f
1, make d
n+1=(e
1+ f
1)/2, d
n=(e
2+ f
2)/2 ... d
k=(e
k+ f
k)/2 obtain the portion temperature curve of chip to be tested: Pix=g2 (x)=d
1* x
n+ d
2* x
n-1+ d
3* x
n-2+ ... + d
k* x
k+ d
n* x+d
n+1, can according to the residue n-k of the near chip a searched information point, the horizontal ordinate of approximate remaining n-k the information point thinking chip to be tested is Pnx=g2 (tn).
6. a fast calibration method for temperature-compensated chip, it comprises:
Set up the temperature versus frequency data storehouse of temperature-compensated chip;
Measure the frequency values of at least one temperature spot of chip to be tested, the number of the coefficient being less than temperature compensation correction function of counting wherein measured;
According to the temperature frequency value of counting of the chip to be tested measured, setting query context, finds chip akin with chip to be tested in the database;
Using the temperature frequency value of counting with the residue of the akin chip of chip to be tested that the searches unmeasured temperature frequency value of counting as chip to be tested, in conjunction with the temperature frequency value of counting that chip to be tested has been measured, calculate the coefficient of the correction function of chip to be tested, to determine the correction function of chip to be tested.
7. the fast calibration method of temperature-compensated chip as claimed in claim 6, it is characterized in that: if the result searched is multiple chip, then by the error size of the frequency at a certain temperature recorded with chip to be tested, stepping is carried out to the frequency of the chip that these search out, only adopt the chip information of the gear residing for chip to be tested, to final effective chip, its residue is counted and asks for the mean value of its temperature frequency respectively, as the unmeasured temperature frequency value of counting of chip to be tested, in conjunction with the temperature frequency value of counting that chip to be tested has been measured, calculate the coefficient of the correction function of chip to be tested, to determine the correction function of chip to be tested.
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| CN107543960B (en) * | 2017-06-19 | 2022-06-17 | 江汉大学 | High-stability crystal oscillator measuring device |
| CN109342984A (en) * | 2018-11-16 | 2019-02-15 | 南方电网科学研究院有限责任公司 | Temperature and humidity influence correction compensation system and method for magnetic resistance chip |
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| CN1531296A (en) * | 2003-03-12 | 2004-09-22 | 日本电气株式会社 | Frequency calibrating method and device for long period of variation |
| CN102082548A (en) * | 2010-11-12 | 2011-06-01 | 成都天奥电子股份有限公司 | High-accuracy microcomputer-compensated surface-mounted temperature compensation crystal oscillator |
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