CN107271081A - Silicon piezoresistance type pressure transmitter temperature compensation and device based on two benches least square fitting - Google Patents
Silicon piezoresistance type pressure transmitter temperature compensation and device based on two benches least square fitting Download PDFInfo
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- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
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- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/04—Means for compensating for effects of changes of temperature, i.e. other than electric compensation
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
- G01L9/06—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of piezo-resistive devices
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Abstract
The invention belongs to pressure transmitter technical field, and in particular to a kind of silicon piezoresistance type pressure transmitter temperature compensation and device based on two benches least square fitting.The silicon piezoresistance type pressure transmitter temperature compensation based on two benches least square fitting of the present invention comprises the following steps:Model of temperature compensation modeling is carried out by two benches least square method;In the EPROM that the coefficient matrix of the model of temperature compensation is stored in pressure transmitter;The coefficient matrix for measuring AD values, ambient temperature measurement AD values and the model of temperature compensation according to input pressure calculates the pressure value after output temperature compensation.The present invention temperature compensation can adherence pressure transmitter measurement accuracy, reduce pressure transmitter memory consumption, while the operational efficiency of temperature-compensating program can be improved.
Description
Technical field
The invention belongs to pressure transmitter technical field, and in particular to a kind of silicon pressure based on two benches least square fitting
The compensation method of resistance pressure transmitter temperatures and device.
Background technology
Due in the manufacturing process of monocrystalline silicon piezoresistance formula pressure sensor, existing, ion implantation concentration is not quite identical to lead
Cause and cause between temperature coefficient of resistivity difference, encapsulating material that temperature expansion coefficient is mismatched and electronic component performance is by temperature
The factors such as influence, so the change of environment temperature can cause sensor zero point to offset and sensitivity drift, while influenceing sensor
Output linearity degree, cause final measurement result inaccurate, thus issues of temperature compensation be used as improve sensor overall performance
Key link can not be ignored.
Current temperature compensation mainly includes hardware compensating and software compensation.Hardware compensating is by changing circuit parameter
Configuration is optimized to measuring circuit, but this compensation method generally existing debugging inconvenience, limited precision, craft flexibility are not
By force, the shortcomings of increasing cost, is unfavorable for production and promotes, software compensation is then increasingly becoming because that can avoid above weak point
The focus attracted attention.Presently most used software compensation algorithm is subsection linearity inser value method, and this method is by the way that experiment is obtained
The nominal data deposit pressure sensor internal memory (EPROM) obtained carries out temperature-compensating as interpolation point, mainly there is following lack
Point:1st, can not the careful nonlinear characteristic for intactly embodying pressure sensor output, influence measurement accuracy when interpolation point is few;
2nd, the data usually required in deposit pressure sensor internal memory (EPROM) are more, increase hardware cost;3rd, when desired compensation essence
When degree is improved, compensation calculation operational efficiency is low.
The content of the invention
An object of the present invention is to overcome disadvantage mentioned above there is provided a kind of measurement accuracy of adherence pressure transmitter, subtracted
The memory consumption of few pressure transmitter, while the method for the operational efficiency of temperature-compensating program can be improved.
In order to solve the above-mentioned technical problem, the invention provides a kind of silicon piezoresistance type based on two benches least square fitting
Pressure transmitter temperature compensation, comprises the following steps:
Model of temperature compensation modeling is carried out by two benches least square method;
In the EPROM that the coefficient matrix of the model of temperature compensation is stored in pressure transmitter;
The coefficient matrix meter of AD values, ambient temperature measurement AD values and the model of temperature compensation is measured according to input pressure
Calculate the pressure value after output temperature compensation.
Further, the silicon piezoresistance type pressure transmitter temperature-compensating side based on two benches least square fitting
Method, it is characterised in that the model of temperature compensation is:Wherein, P is to compensate pressure value, unit Pa,
UADFor pressure measxurement AD values, CfitFor the coefficient matrix of model of temperature compensation, TADFor temperature survey AD values.
Further, described " model of temperature compensation modeling is carried out by two benches least square method ", be specially:
Under m assigned temperature value, the pressure measxurement AD values under n normal pressure input value are gathered respectively, m*n are obtained
Pressure measxurement AD values;
For each assigned temperature value, number of times is fitted to n normal pressure input value and n pressure measxurement AD value
For k least square fitting, standard pressure input and the multinomial letter of pressure measxurement AD values under the assigned temperature value are obtained
Number mapping relations and first stage coefficient matrix;
Length in m assigned temperature AD value and the first stage coefficient matrix is carried out for m coefficient row vector
The least square fitting that number of times is l is fitted, the polynomial function for obtaining the temperature AD values and first stage coefficient row vector reflects
Penetrate the coefficient matrix of relation and the model of temperature compensation.
Further, standard pressure input and the polynomial function of pressure measxurement AD values map under the assigned temperature value
Relation is:
Standard pressure under the assigned temperature value
The polynomial function coefficient matrix of power input value and pressure measxurement AD values is:Wherein, P is
Input reference pressure value, unit Pa;UADFor pressure measxurement AD values, Ci,kFor fitting coefficient, i=1,2 ..., m, k is the first stage
It is fitted number of times.
Further, the polynomial function mapping relations of the temperature AD values and first stage coefficient row vector are:The coefficient matrix of the model of temperature compensation
For:Wherein, Ck, Ck-1..., C1, C0For first stage fitting coefficient, C0,0~Ck,l
For temperature compensation coefficient, TADFor temperature AD values, k is to be fitted number of times the first stage, and l is that second stage is fitted number of times.
Correspondingly, present invention also offers a kind of silicon piezoresistance type pressure transmitter temperature based on two benches least square fitting
Compensation device is spent, including:
First processing module, for carrying out model of temperature compensation modeling by two benches least square method;
Second processing module, for the coefficient matrix of the model of temperature compensation to be stored in the EPROM of pressure transmitter;
3rd processing module, is mended for measuring AD values, ambient temperature measurement AD values and the temperature according to input pressure
The coefficient matrix for repaying model calculates the pressure value after output temperature compensation.
Further, the model of temperature compensation is:Wherein, P is compensation pressure value, unit
Pa, UADFor pressure measxurement AD values, CfitFor the coefficient matrix of model of temperature compensation, TADFor temperature survey AD values.
Further, the first processing module, including:
First processing units, under m assigned temperature value, the pressure under n normal pressure input value to be gathered respectively
AD values are measured, m*n pressure measxurement AD value is obtained;
Second processing unit, for for each assigned temperature value, being surveyed to n normal pressure input value and n pressure
Amount AD values are fitted the least square fitting that number of times is k, obtain standard pressure input and pressure under the assigned temperature value
Measure the polynomial function mapping relations and first stage coefficient matrix of AD values;
3rd processing unit, for being m to the length in m assigned temperature AD value and the first stage coefficient matrix
Coefficient row vector be fitted the least square fitting that number of times is l, obtain the temperature AD values and first stage line of coefficients to
The polynomial function mapping relations of amount and the coefficient matrix of the model of temperature compensation.
Further, standard pressure input and the polynomial function of pressure measxurement AD values map under the assigned temperature value
Relation is:
Standard pressure under the assigned temperature value
The polynomial function coefficient matrix of power input value and pressure measxurement AD values is:Wherein, P is
Input reference pressure value, unit Pa;UADFor pressure measxurement AD values, Ci,kFor fitting coefficient, i=1,2 ..., m, k is the first stage
It is fitted number of times.
Further, the polynomial function mapping relations of the temperature AD values and first stage coefficient row vector are:The coefficient matrix of the model of temperature compensation
For:Wherein, Ck, Ck-1..., C1, C0For first stage fitting coefficient, C0,0~Ck,l
For temperature compensation coefficient, TADFor temperature AD values, k is to be fitted number of times the first stage, and l is that second stage is fitted number of times.
The beneficial effect of technical solution of the present invention has:
1. can adherence pressure transmitter measurement accuracy.
Technical scheme considers the nonlinear characteristic of pressure transmitter output, by introducing least square method,
Ensure that all interpolation points reach the lower limit of a compensation precision on the whole, i.e., maximum compensation error can be controlled, from
And the nonlinear characteristic of pressure sensor output can not be embodied by solving existing subsection linearity inser value method, beyond interpolation point
The problem of can not ensureing higher compensation precision.
2. reduce the memory consumption of pressure transmitter.
Technical scheme only needs to the coefficient matrix of the storage temperature compensation model in the internal memory of pressure transmitter,
Without all sample interpolation data are stored in into internal memory as subsection linearity inser value method, required internal memory is greatly reduced
Space, it is possible to decrease hardware cost.
3. the operational efficiency of temperature-compensating program can be improved.
Technical scheme only needs to measure AD values, ambient temperature measurement AD values and the temperature by input pressure
The coefficient matrix of degree compensation model can once calculate the pressure value after output temperature compensation, without being calculated as piecewise linear interpolation
Method carries out multiple tabling look-up and gets straightway where the operating point of measurement like that, then is used as input to substitute into the data measured
This section of straight line calculates corresponding pressure output.
Brief description of the drawings
Fig. 1 is a kind of silicon piezoresistance type pressure transmitter temperature-compensating side based on two benches least square fitting of the present invention
Method flow chart of steps.
Fig. 2 is that a kind of of the present invention carries out model of temperature compensation modeling procedure flow chart by two benches least square method.
Fig. 3 is a kind of silicon piezoresistance type pressure transmitter temperature-compensating dress based on two benches least square fitting of the present invention
Put structure chart.
Fig. 4 is a kind of first processing module structure chart of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
In electronic component, in the case that other conditions are constant, its output signal can occur with the change of temperature
Drift, in order to reduce this phenomenon, is usually taken certain algorithm and output result is modified, and reaches elimination in certain limit
The purpose that temperature change influences on component output signal, this processing mode is referred to as the temperature-compensating of electronic component.
Silicon piezoresistance type pressure transmitter is the pressure sensor manufactured according to the piezoresistive effect principle of monocrystalline silicon, by receiving
Ambient pressure is simultaneously converted to standard output signals in proportion, and the signal of silicon piezoresistance type pressure transmitter output equally can be by environment
Temperature influences, therefore issues of temperature compensation can not be ignored as the key link for improving sensor overall performance.
Fig. 1, is a kind of silicon piezoresistance type pressure transmitter temperature-compensating based on two benches least square fitting of the present invention
Method and step flow chart, comprises the following steps:
Step 1, pass through two benches least square method carry out model of temperature compensation modeling;
When environment temperature keeps constant, due to the disturbance of some manufacturing process, silicon piezoresistance type pressure transmitter measurement
Pressure AD values and input pressure value might not be identical, and the determination that can be expressed as polynomial function is there is between them
Nonlinear Mapping relation.With the change of environment temperature, it is believed that temperature actually have impact on multinomial in Nonlinear Mapping
Each term coefficient of function, and then the different Nonlinear Mapping relations formed under condition of different temperatures.
Based on above-mentioned principle, the model of temperature compensation that technical scheme is used for:Its
In, P is compensation pressure value, that is, considers the pressure value after current environmental temperature factor correction, unit Pa, UADFor pressure measxurement AD
Value, i.e., do not consider the pressure value of environment temperature factor, CfitFor the coefficient matrix of model of temperature compensation, TADFor temperature survey AD values,
The AD values of the present invention refer to the data signal exported after analog-to-digital conversion.
Therefore, the key point of technical scheme is how to calculate the coefficient matrix C of model of temperature compensationfit,
It is a kind of by two benches least square method progress model of temperature compensation modeling procedure flow chart of the present invention such as Fig. 2, including with
Lower step:
Step 101, under m assigned temperature value, respectively gather n normal pressure input value under pressure measxurement AD values,
Obtain m*n pressure measxurement AD value;
In order to calculate the coefficient matrix of model of temperature compensation, it is necessary first to carry out the sampling of data, for example, respectively 20,
0th, -20 under the environment temperature of (unit, degree Celsius), 1000,0, -1000 (unit, Pa) pressure value is inputted respectively, is read out
The pressure AD values of silicon piezoresistance type pressure transmitter measurement, obtain 9 sampled values altogether.Referred to herein as environment temperature and input
Pressure value all must be in the permission working range of silicon piezoresistance type pressure transmitter.
Step 102, for each assigned temperature value, n normal pressure input value and n pressure measxurement AD value are carried out
The least square fitting that number of times is k is fitted, standard pressure input and pressure measxurement AD values under the assigned temperature value is obtained
Polynomial function mapping relations and first stage coefficient matrix;
Under any assigned temperature value, it is considered to which the functional relation between pressure input and pressure measxurement AD values is:
Then standard pressure input under m assigned temperature value
Polynomial function mapping relations with pressure measxurement AD values are:
, wherein, P is input reference pressure value, unit Pa;UADFor pressure measxurement AD values, Ci,kFor fitting coefficient, i=1,
2 ..., m, k are the first stage to be fitted number of times.At this moment, it can be calculated using the least square fitting function in MATLAB specified
Standard pressure input and the polynomial function coefficient matrix of pressure measxurement AD values are under temperature value:
Step 103, to the length in m assigned temperature AD value and the first stage coefficient matrix be m line of coefficients
Vector is fitted the least square fitting that number of times is l, and the acquisition temperature AD values are multinomial with first stage coefficient row vector
The coefficient matrix of formula Function Mapping relation and the model of temperature compensation.
If vector form, i.e. coefficient matrix will be expressed as about being fitted the coefficient of order in first stage coefficient matrix
C=[C (k), C (k-1) ..., C (1), C (0)] can be expressed as in the form of vectors, wherein vector C (k)=[C1,k,…Ci,k,…,
Cm,k]TRepresent when temperature grade is m, the coefficient before kth time item.
Because each coefficient vector C (k) has m element, scale of thermometer fixed point is also m, therefore can reuse a most young waiter in a wineshop or an inn
Multiply l (l≤m) order polynomial relation that fitting is set up between first stage line of coefficients vector sum temperature AD values:Wherein, Ck, Ck-1..., C1, C0For the first rank
Section fitting coefficient, C0,0~Ck,lFor temperature compensation coefficient, TADFor temperature AD values, k is the first stage to be fitted number of times, and l is second-order
Section fitting number of times, then calculates the coefficient square of model of temperature compensation by using the least square fitting function in MATLAB again
Battle array be:
Step 2, the coefficient matrix of the model of temperature compensation is stored in the EPROM of pressure transmitter, is typically by institute
The coefficient matrix for stating model of temperature compensation is stored in the EPROM of pressure transmitter as double-precision floating pointses in the form of 16 systems
In;
Step 3, the coefficient according to input pressure measurement AD values, ambient temperature measurement AD values and the model of temperature compensation
Pressure value after the compensation of matrix computations output temperature.
In the actual measurement process of silicon piezoresistance type pressure transmitter, environment temperature A D values, and pressure are measured first
Measurement AD values (pressure value for not considering the influence of environment temperature factor), then by reading the model of temperature compensation coefficient in EPROM
Matrix, by formulaRevised pressure value is calculated to be exported.
Below, the silicon piezoresistance type pressure of the invention based on two benches least square fitting is illustrated with a specific embodiment
Transmitter temperatures compensation method step:
Step 1, it is -40KPa-40KPa to a certain measurement range, operating temperature range is -20 DEG C -70 DEG C of monocrystalline silicon pressure
Resistance pressure transmitter carries out model of temperature compensation modeling, comprises the following steps:
Step 101, monocrystalline silicon piezoresistance formula pressure transmitter is put into high-low temperature chamber, pressure gas source is connected with tracheae, led to
Over-pressed apparatus for adjusting force provides steady pressure input, and 17 pressure measurement points (n=17), i.e. P are taken by step pitch of 5KPacal, take-
20 DEG C, 0 DEG C, 25 DEG C, 50 DEG C, 70 DEG C of grades, 5 temperature spots (m=5), i.e. Tcal, 17*5 totally 85 pressure transmitters are gathered altogether
Measurement output AD, i.e. Ucal, averaged wherein each exporting sampled point and measuring three times, after inputoutput data is normalized
To sampled data.
Step 102, setting first stage fitting coefficient are 3, using MATLAB mathematical softwares for 5 demarcation temperature spot knots
Close sampled data and use least square fitting function, calculating acquisition first stage coefficient matrix is:
Step 103, setting second stage fitting coefficient are 2, according to first stage coefficient matrix CUP4 column vectors it is (every
Individual column vector includes 5 elements) and 5 temperature calibration temperature AD data, using least square fitting function, calculate and obtain the list
The coefficient matrix C of crystal silicon piezoresistive pressure transmitter model of temperature compensationfitFor:
Step 2, the EPROM that the coefficient matrix of the model of temperature compensation is stored in the monocrystalline silicon piezoresistance formula pressure transmitter
In;
Step 3, the coefficient according to input pressure measurement AD values, ambient temperature measurement AD values and the model of temperature compensation
Pressure value after the compensation of matrix computations output temperature.
In the actual measurement process of silicon piezoresistance type pressure transmitter, environment temperature A D values, and pressure are measured first
Measurement AD values (pressure value for not considering the influence of environment temperature factor), then by reading the model of temperature compensation coefficient in EPROM
Matrix, by formulaRevised pressure value is calculated to be exported.
Technical scheme take into account the nonlinear characteristic of pressure transmitter output, by introducing least square
Method, ensures that all interpolation points reach the lower limit of a compensation precision on the whole, i.e., maximum compensation error can be controlled,
So as to solve existing subsection linearity inser value method can not embody pressure sensor output nonlinear characteristic, interpolation point with
It is outer the problem of can not ensureing higher compensation precision.
In above-described embodiment, the method according to piecewise linear interpolation is needed by experiment in 5 temperature spots (T) and 17
The correspondence output (U) measured under individual pressure spot (P) is constituted in 85 class values deposit internal memory, and the form of every group of data is (P, T, U), its
Middle P, T are input, and U is output.Each data are so that in 16 system single precision floating datums deposit internal memory, each single-precision number evidence is accounted for
According to 4 bytes, 4*3*85=1020 byte is needed altogether.And technical scheme only needs to be stored in internal memory multinomial
12 related coefficient values, each coefficient represents that each double precision datum occupies 8 bytes, altogether with the system number of double precision 16
The memory size of occupancy is 8*12=96 byte, greatly reduces EMS memory occupation.
The compensation precision of existing piecewise linear interpolation algorithm and the interpolation point taken are proportional, when compensation precision will
, it is necessary to carry out substantial amounts of calibration experiment when asking higher, calibration cost is too high.This interpolation method is substantially to be tabled look-up, and works as benefit
Repaying computation of table lookup when rear precision is improved will carry out many times, completing to obtain the straight line where the operating point of actual measurement after tabling look-up
Section, the data measured are substituted into the corresponding pressure output of this section of straight line calculating as input can complete compensation.And the present invention
Technical scheme only needs to measure the coefficient of AD values, ambient temperature measurement AD values and the model of temperature compensation by input pressure
Matrix can once calculate the pressure value after output temperature compensation, substantially increase temperature-compensating computational efficiency.
It is that a kind of silicon piezoresistance type pressure transmitter temperature based on two benches least square fitting of the present invention is mended such as Fig. 3
Structure drawing of device is repaid, including:
First processing module, for carrying out model of temperature compensation modeling by two benches least square method;
Wherein, the model of temperature compensation is:Wherein, P is compensation pressure value, unit Pa, UAD
For pressure measxurement AD values, CfitFor the coefficient matrix of model of temperature compensation, TADFor temperature survey AD values.
Second processing module, for the coefficient matrix of the model of temperature compensation to be stored in the EPROM of pressure transmitter;
3rd processing module, is mended for measuring AD values, ambient temperature measurement AD values and the temperature according to input pressure
The coefficient matrix for repaying model calculates the pressure value after output temperature compensation.
It is a kind of first processing module structure chart of the present invention such as Fig. 4, including:
First processing units, under m assigned temperature value, the pressure under n normal pressure input value to be gathered respectively
AD values are measured, m*n pressure measxurement AD value is obtained;Present treatment unit is used for collecting sample data, to calculate temperature-compensating mould
The coefficient matrix of type.
Second processing unit, for for each assigned temperature value, being surveyed to n normal pressure input value and n pressure
Amount AD values are fitted the least square fitting that number of times is k, obtain standard pressure input and pressure under the assigned temperature value
Measure the polynomial function mapping relations and first stage coefficient matrix of AD values;
When environment temperature keeps constant, due to the disturbance of some manufacturing process, silicon piezoresistance type pressure transmitter
Measuring pressure AD values and input pressure value might not be identical, exists between them and can be expressed as polynomial function
Determination Nonlinear Mapping relation, it is considered to the functional relation between pressure input and pressure measxurement AD values is:Then standard pressure input is surveyed with pressure under m assigned temperature value
Amount AD values polynomial function mapping relations be:
Wherein, P is input reference pressure value, unit Pa;UADFor pressure measxurement AD values, Ci,kFor fitting coefficient, i=1,
2 ..., m, k are the first stage to be fitted number of times.At this moment, the least square fitting function in MATLAB mathematical computations storehouse can be used
Calculating standard pressure input and the polynomial function coefficient matrix of pressure measxurement AD values under assigned temperature value is:
3rd processing unit, for being m to the length in m assigned temperature AD value and the first stage coefficient matrix
Coefficient row vector be fitted the least square fitting that number of times is l, obtain the temperature AD values and first stage line of coefficients to
The polynomial function mapping relations of amount and the coefficient matrix of the model of temperature compensation.
If vector form will be expressed as about being fitted the coefficient of order in first stage coefficient matrix, i.e. the first stage is
Matrix number can also vector form be expressed as C=[C (k), C (k-1) ..., C (1), C (0)], wherein vector C (k)=[C1,k,…
Ci,k,…,Cm,k]TRepresent when temperature grade is m, the coefficient before kth time item.
L (l≤m) the order polynomial relation set up again between first stage line of coefficients vector sum temperature AD values:Wherein, Ck, Ck-1..., C1, C0For the first rank
Section fitting coefficient, C0,0~Ck,lFor temperature compensation coefficient, TADFor temperature AD values, k is the first stage to be fitted number of times, and l is second-order
Section fitting number of times, then calculates the coefficient square of model of temperature compensation by using the least square fitting function in MATLAB again
Battle array be:
Simply technical scheme is explained in detail for above-mentioned embodiment, the present invention not only only office
It is limited to above-described embodiment, every any improvement or replacement according to the principle of the invention all should be within protection scope of the present invention.
Claims (10)
1. a kind of silicon piezoresistance type pressure transmitter temperature compensation based on two benches least square fitting, it is characterised in that
Comprise the following steps:
Model of temperature compensation modeling is carried out by two benches least square method;
In the EPROM that the coefficient matrix of the model of temperature compensation is stored in pressure transmitter;
The coefficient matrix for measuring AD values, ambient temperature measurement AD values and the model of temperature compensation according to input pressure calculates defeated
The pressure value gone out after temperature-compensating.
2. the silicon piezoresistance type pressure transmitter temperature-compensating side as claimed in claim 1 based on two benches least square fitting
Method, it is characterised in that the model of temperature compensation is:Wherein, P is to compensate pressure value, unit Pa,
UADFor pressure measxurement AD values, CfitFor the coefficient matrix of model of temperature compensation, TADFor temperature survey AD values.
3. the silicon piezoresistance type pressure transmitter temperature-compensating side as claimed in claim 1 based on two benches least square fitting
Method, it is characterised in that described " model of temperature compensation modeling is carried out by two benches least square method ", be specially:
Under m assigned temperature value, the pressure measxurement AD values under n normal pressure input value are gathered respectively, m*n pressure is obtained
Measure AD values;
For each assigned temperature value, number of times is fitted to n normal pressure input value and n pressure measxurement AD value for k
Least square fitting, obtain standard pressure input and the polynomial function of pressure measxurement AD values under the assigned temperature value and reflect
Penetrate relation and first stage coefficient matrix;
Length in m assigned temperature AD value and the first stage coefficient matrix is fitted for m coefficient row vector
Number of times is l least square fitting, and the polynomial function mapping for obtaining the temperature AD values and first stage coefficient row vector is closed
System and the coefficient matrix of the model of temperature compensation.
4. the silicon piezoresistance type pressure transmitter temperature-compensating side as claimed in claim 3 based on two benches least square fitting
Method, it is characterised in that standard pressure input and the polynomial function mapping of pressure measxurement AD values are closed under the assigned temperature value
It is to be:
Normal pressure is defeated under the assigned temperature value
The polynomial function coefficient matrix for entering value and pressure measxurement AD values is:Wherein, P is input
Reference pressure value, unit Pa;UADFor pressure measxurement AD values, Ci,kFor fitting coefficient, i=1,2 ..., m, k is fitted for the first stage
Number of times.
5. the silicon piezoresistance type pressure transmitter temperature-compensating side as claimed in claim 3 based on two benches least square fitting
Method, it is characterised in that the polynomial function mapping relations of the temperature AD values and first stage coefficient row vector are:The coefficient matrix of the model of temperature compensation
For:Wherein, Ck, Ck-1..., C1, C0For first stage fitting coefficient, C0,0~k,lFor
Temperature compensation coefficient, TADFor temperature AD values, k is to be fitted number of times the first stage, and l is that second stage is fitted number of times.
6. a kind of silicon piezoresistance type pressure transmitter temperature compensation means based on two benches least square fitting, it is characterised in that
Including:
First processing module, for carrying out model of temperature compensation modeling by two benches least square method;
Second processing module, for the coefficient matrix of the model of temperature compensation to be stored in the EPROM of pressure transmitter;
3rd processing module, for measuring AD values, ambient temperature measurement AD values and the temperature-compensating mould according to input pressure
The coefficient matrix of type calculates the pressure value after output temperature compensation.
7. the silicon piezoresistance type pressure transmitter temperature-compensating based on two benches least square fitting is filled as claimed in claim 6
Put, it is characterised in that the model of temperature compensation is:Wherein, P is to compensate pressure value, unit Pa,
UADFor pressure measxurement AD values, CfitFor the coefficient matrix of model of temperature compensation, TADFor temperature survey AD values.
8. the silicon piezoresistance type pressure transmitter temperature-compensating based on two benches least square fitting is filled as claimed in claim 6
Put, it is characterised in that the first processing module, including:
First processing units, under m assigned temperature value, the pressure measxurement under n normal pressure input value to be gathered respectively
AD values, obtain m*n pressure measxurement AD value;
Second processing unit, for for each assigned temperature value, to n normal pressure input value and n pressure measxurement AD
Value is fitted the least square fitting that number of times is k, obtains standard pressure input and pressure measxurement under the assigned temperature value
The polynomial function mapping relations and first stage coefficient matrix of AD values;
3rd processing unit, for being for m to the length in m assigned temperature AD value and the first stage coefficient matrix
Several rows of vectors are fitted the least square fitting that number of times is l, obtain the temperature AD values and first stage coefficient row vector
The coefficient matrix of polynomial function mapping relations and the model of temperature compensation.
9. the silicon piezoresistance type pressure transmitter temperature-compensating based on two benches least square fitting is filled as claimed in claim 8
Put, it is characterised in that standard pressure input and the polynomial function mapping of pressure measxurement AD values are closed under the assigned temperature value
It is to be:
Normal pressure is defeated under the assigned temperature value
The polynomial function coefficient matrix for entering value and pressure measxurement AD values is:Wherein, P is input
Reference pressure value, unit Pa;UADFor pressure measxurement AD values, Ci,kFor fitting coefficient, i=1,2 ..., m, k is fitted for the first stage
Number of times.
10. the silicon piezoresistance type pressure transmitter temperature-compensating based on two benches least square fitting is filled as claimed in claim 8
Put, it is characterised in that the polynomial function mapping relations of the temperature AD values and first stage coefficient row vector are:The coefficient matrix of the model of temperature compensation
For:Wherein, Ck, Ck-1..., C1, C0For first stage fitting coefficient, C0,0~k,lFor
Temperature compensation coefficient, TADFor temperature AD values, k is to be fitted number of times the first stage, and l is that second stage is fitted number of times.
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