CN103044742B - A kind of packaging plastic substrate film that contains epoxyfuoic-oleic - Google Patents

A kind of packaging plastic substrate film that contains epoxyfuoic-oleic Download PDF

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Publication number
CN103044742B
CN103044742B CN201210482128.7A CN201210482128A CN103044742B CN 103044742 B CN103044742 B CN 103044742B CN 201210482128 A CN201210482128 A CN 201210482128A CN 103044742 B CN103044742 B CN 103044742B
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powder
epoxyfuoic
oleic
modified
plastic substrate
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CN201210482128.7A
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CN103044742A (en
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王立新
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Shantou Qishan Rubber Plastic Co., Ltd.
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Hefei Hongjie New Material Science And Technology Co Ltd
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Abstract

The invention discloses a kind of packaging plastic substrate film that contains epoxyfuoic-oleic, it is to be made by the raw material of following weight parts: SG-1 type polyvinyl chloride 10-15, chlorinated paraffin wax 4-6, Tissuemat E powder 2-3, isopropyl distearyl acyl-oxygen base Aluminate 1-2, modified alta-mud 6-7, mLLDPE metallocene linear polyethylene 30-35, LDPE low density polyethylene (LDPE) 40-45, polyisobutene 2.2-3.5, poly--4-methyl-1-pentene 0.5-1, modified Nano fluorite powder 0.5-1, crosslinking agent TAC2.6-3.7, epoxyfuoic-oleic 1-2, octyl epoxy stearate 1.5-3, zinc stearate 0.5-1, modified straw ash 1-2. barrier of the present invention and air-tightness are good, and resistance to pressure and resistance to impact are outstanding, have again the feature that heat seal strength is high, heat sealability is good simultaneously.

Description

A kind of packaging plastic substrate film that contains epoxyfuoic-oleic
Technical field
The present invention relates to packaging material field, is exactly a kind of packaging plastic substrate film that contains epoxyfuoic-oleic.
Background technology
China is that world's packaging is manufactured and consumption big country, and the ratio of plastics package in the Packaging Industry gross output value exceeded 30%, becomes the fresh combatants in Packaging Industry, bringing into play irreplaceable effect in food, beverage, commodity and industrial and agricultural production every field. In recent years, packaging product, the packaging material of plastics package industry grow steadily, and new packaging materials, new technology, new technology, new product continue to bring out. Food packing plastic substrate film is produced with polyethylene raw material conventionally, has the polyethylene raw material that can be used for making food packing plastic substrate film of multiple superior performance on Vehicles Collected from Market. From main plastics variety, in plastics package field, the consumption of density polyethylene film with high will continue steady growth. The polyethylene film of individual layer is poor to the barrier of the gases such as oxygen, while packing the food such as fried class, easily cause sealing part to pollute, general flexible package punch polyethylene film is poor to the sealing property of this type of packaging, can not meet its technology of the package and the requirement of connection with wrapping of piece storage period, therefore must adopt barrier property and be mingled with all good multilaminar polyethylene modified film or laminated films of sealing property.
Summary of the invention
The object of the present invention is to provide a kind of packaging plastic substrate film that contains epoxyfuoic-oleic, this material heat sealability is good.
Above-mentioned purpose realizes by following scheme:
A kind of packaging plastic substrate film that contains epoxyfuoic-oleic, it is characterized in that: it is to be made by the raw material of following weight parts: SG-1 type polyvinyl chloride 10-15, chlorinated paraffin wax 4-6, Tissuemat E powder 2-3, isopropyl distearyl acyl-oxygen base Aluminate 1-2, modified alta-mud 6-7, mLLDPE metallocene linear polyethylene 30-35, LDPE low density polyethylene (LDPE) 40-45, polyisobutene 2.2-3.5, poly--4-methyl-1-pentene 0.5-1, modified Nano fluorite powder 0.5-1, crosslinking agent TAC2.6-3.7, epoxyfuoic-oleic 1-2, octyl epoxy stearate 1.5-3, zinc stearate 0.5-1, modified straw ash 1-2,
The preparation method of described modified Nano Fluorspar Powder is: the hydrochloric acid solution that is 10-12% by fluorite concentration soaks 4-6 hour, dry, at 600-700 DEG C, calcine 4-6 hour again, the hydrogen peroxide solution that pulverize is 8-10% by concentration soaks 4-6 hour, dries, cross 200-400 mesh sieve, mix with the epoxy cottonseed oil that is equivalent to powder weight 3-5% again, after stirring, grind to form nanometer powder, to obtain final product;
Described method for preparing modified bentonite is: bentonite is calcined to 2-4 hour at 500-600 DEG C, soak 5-7 hour with the hydrogen peroxide solution of 10-15% afterwards, dry, mix with the chlorinated paraffin wax that is equivalent to bentonite weight 3-5%, be ground into 400-500 object powder, and get final product;
The preparation method of described modified straw ash is: bentonite is calcined to 2-4 hour at 500-600 DEG C, soak 5-7 hour with the hydrogen peroxide solution of 10-15% afterwards, dry, mix with the chlorinated paraffin wax that is equivalent to bentonite weight 3-5%, be ground into 400-500 object powder, and get final product.
Described a kind of packaging plastic substrate film that contains epoxyfuoic-oleic, is characterized in that: preparation method comprises the following steps:
(1) chlorinated paraffin wax, Tissuemat E powder are joined in batch mixer, be warming up to 80-85 DEG C, add SG-1 type polyvinyl chloride to stir after 4-8 minute, add isopropyl distearyl acyl-oxygen base Aluminate to stir after 12-16 minute, add again modified Nano Fluorspar Powder, epoxyfuoic-oleic, be heated to 100-110 DEG C, stir 25-35 minute;
(2) after adding, again other raw material to stir, send into extrusion machine fused mass and extrude, melt temperature is 180-190 DEG C; Carry out the sizing of die head blown film, die head temperature is to raise gradually from bottom to top, and its scope control is at 185-200 DEG C; Then traction cutting; Last rolling, to obtain final product.
Described a kind of packaging plastic substrate film that contains epoxyfuoic-oleic, is characterized in that: the rotating speed of described extruder is controlled at 85-95r/min.
Beneficial effect of the present invention is: barrier of the present invention and air-tightness are good, and resistance to pressure and resistance to impact are outstanding, has again the feature that heat seal strength is high, heat sealability is good simultaneously.
Detailed description of the invention
A packaging plastic substrate film that contains epoxyfuoic-oleic, it is to be made by the raw material of following weight parts (kg): SG-1 type polyvinyl chloride 15, chlorinated paraffin wax 6, Tissuemat E powder 3, isopropyl distearyl acyl-oxygen base Aluminate 1.7, modified alta-mud 6.2, mLLDPE metallocene linear polyethylene 35, LDPE low density polyethylene (LDPE) 45, polyisobutene 3.5, poly--4-methyl-1-pentene 0.7, modified Nano fluorite powder 0.8, crosslinking agent TAC3.7, epoxyfuoic-oleic 1.1, octyl epoxy stearate 1.9, zinc stearate 0.9, modified straw ash 1.9;
The preparation method of described modified Nano Fluorspar Powder is: the hydrochloric acid solution that is 12% by fluorite concentration soaks 6 hours, dry, at 700 DEG C, calcine 6 hours again, the hydrogen peroxide solution that pulverize is 10% by concentration soaks 4-6 hour, dries, cross 200 mesh sieves, mix with the epoxy cottonseed oil that is equivalent to powder weight 4% again, after stirring, grind to form nanometer powder, to obtain final product;
Described method for preparing modified bentonite is: bentonite is calcined 3.3 hours at 600 DEG C, and the hydrogen peroxide solution of rear use 15% soaks 6 hours, dries, and mixes with the chlorinated paraffin wax that is equivalent to bentonite weight 3%, is ground into 500 object powder, and get final product;
The preparation method of described modified straw ash is: bentonite is calcined 2 hours at 500 DEG C, and the hydrogen peroxide solution of rear use 15% soaks 5 hours, dries, and mixes with the chlorinated paraffin wax that is equivalent to bentonite weight 3%, is ground into 400 object powder, and get final product.
Described a kind of packaging plastic substrate film that contains epoxyfuoic-oleic, preparation method comprises the following steps:
(1) chlorinated paraffin wax, Tissuemat E powder are joined in batch mixer, be warming up to 80 DEG C, add SG-1 type polyvinyl chloride to stir after 8 minutes, add isopropyl distearyl acyl-oxygen base Aluminate to stir after 16 minutes, add again modified Nano Fluorspar Powder, epoxyfuoic-oleic, be heated to 110 DEG C, stir 35 minutes;
(2) after adding, again other raw material to stir, send into extrusion machine fused mass and extrude, the rotating speed of extruder is controlled at 95r/min, and melt temperature is 190 DEG C; Carry out the sizing of die head blown film, die head temperature is to raise gradually from bottom to top, and its scope control is at 200 DEG C; Then traction cutting; Last rolling, to obtain final product.
The performance parameter of the product that the present embodiment is produced is: hot strength: 59Mpa; Elongation at break: 1029%; Heat seal strength: 12.4; Coefficient of friction: 0.211.

Claims (3)

1. a packaging plastic substrate film that contains epoxyfuoic-oleic, it is characterized in that: it is to be made by the raw material of following weight parts: SG-1 type polyvinyl chloride 10-15, chlorinated paraffin wax 4-6, Tissuemat E powder 2-3, isopropyl distearyl acyl-oxygen base Aluminate 1-2, modified alta-mud 6-7, mLLDPE metallocene linear polyethylene 30-35, LDPE low density polyethylene (LDPE) 40-45, polyisobutene 2.2-3.5, poly--4-methyl-1-pentene 0.5-1, modified Nano fluorite powder 0.5-1, crosslinking agent TAC2.6-3.7, epoxyfuoic-oleic 1-2, octyl epoxy stearate 1.5-3, zinc stearate 0.5-1, modified straw ash 1-2,
The preparation method of described modified Nano Fluorspar Powder is: the hydrochloric acid solution that is 10-12% by fluorite concentration soaks 4-6 hour, dry, at 600-700 DEG C, calcine 4-6 hour again, the hydrogen peroxide solution that pulverize is 8-10% by concentration soaks 4-6 hour, dries, cross 200-400 mesh sieve, mix with the epoxy cottonseed oil that is equivalent to powder weight 3-5% again, after stirring, grind to form nanometer powder, to obtain final product;
Described method for preparing modified bentonite is: bentonite is calcined to 2-4 hour at 500-600 DEG C, soak 5-7 hour with the hydrogen peroxide solution of 10-15% afterwards, dry, mix with the chlorinated paraffin wax that is equivalent to bentonite weight 3-5%, be ground into 400-500 object powder, and get final product.
2. a kind of packaging plastic substrate film that contains epoxyfuoic-oleic according to claim 1, is characterized in that: preparation method comprises the following steps:
(1) chlorinated paraffin wax, Tissuemat E powder are joined in batch mixer, be warming up to 80-85 DEG C, add SG-1 type polyvinyl chloride to stir after 4-8 minute, add isopropyl distearyl acyl-oxygen base Aluminate to stir after 12-16 minute, add again modified Nano Fluorspar Powder, epoxyfuoic-oleic, be heated to 100-110 DEG C, stir 25-35 minute;
(2) after adding, again other raw material to stir, send into extrusion machine fused mass and extrude, melt temperature is 180-190 DEG C; Carry out the sizing of die head blown film, die head temperature is to raise gradually from bottom to top, and its scope control is at 185-200 DEG C; Then traction cutting; Last rolling, to obtain final product.
3. a kind of packaging plastic substrate film that contains epoxyfuoic-oleic according to claim 2, is characterized in that: the rotating speed of described extruder is controlled at 85-95r/min.
CN201210482128.7A 2012-11-25 2012-11-25 A kind of packaging plastic substrate film that contains epoxyfuoic-oleic Active CN103044742B (en)

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CN107540982A (en) * 2017-08-04 2018-01-05 合肥盛鼎包装材料有限公司 A kind of plastic packing box and preparation method thereof

Citations (3)

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Publication number Priority date Publication date Assignee Title
CN1475522A (en) * 2003-06-27 2004-02-18 华南理工大学 Packaging material direct mixed with gross rubber raw material and its application
CN102514328A (en) * 2011-12-01 2012-06-27 宁波华丰包装有限公司 Polyamide/ polypropylene medical packaging film
CN102717573A (en) * 2012-07-03 2012-10-10 浙江金石包装有限公司 Modified polyethylene film and composite film made of same

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Publication number Priority date Publication date Assignee Title
JP4906019B2 (en) * 2001-07-11 2012-03-28 電気化学工業株式会社 Stretch film

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1475522A (en) * 2003-06-27 2004-02-18 华南理工大学 Packaging material direct mixed with gross rubber raw material and its application
CN102514328A (en) * 2011-12-01 2012-06-27 宁波华丰包装有限公司 Polyamide/ polypropylene medical packaging film
CN102717573A (en) * 2012-07-03 2012-10-10 浙江金石包装有限公司 Modified polyethylene film and composite film made of same

Non-Patent Citations (1)

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Address after: 515000, No. 38 down road, Qishan street, Jinping District, Guangdong, Shantou

Patentee after: Shantou Qishan Rubber Plastic Co., Ltd.

Address before: 230031 Hefei high tech Zone, Zhejiang Province, venture building, room A-914

Patentee before: Hefei Hongjie New Material Science and Technology Co., Ltd