CN103035583B - Chip box formed in stretching mode and good in welding performance and producing method thereof - Google Patents

Chip box formed in stretching mode and good in welding performance and producing method thereof Download PDF

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Publication number
CN103035583B
CN103035583B CN201210538108.7A CN201210538108A CN103035583B CN 103035583 B CN103035583 B CN 103035583B CN 201210538108 A CN201210538108 A CN 201210538108A CN 103035583 B CN103035583 B CN 103035583B
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China
Prior art keywords
shaping
punching
product
box body
good
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CN201210538108.7A
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Chinese (zh)
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CN103035583A (en
Inventor
钱晓晨
骆兴顺
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Suzhou Helin Micro Technology Co ltd
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UIGREEN
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Priority to CN201210538108.7A priority Critical patent/CN103035583B/en
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Publication of CN103035583B publication Critical patent/CN103035583B/en
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Abstract

This invention discloses a chip box formed in a stretching mode and good in welding performance and a producing method of the chip box formed in the stretching mode and good in the welding performance. The chip box formed in the stretching mode and good in the welding performance comprises a box body with one face opened, the opened end of the box body is an integrally formed face, the inner side faces of the box body are of a straight face, and the surface of the integrally formed face is perpendicular to the inner side faces of the box body. The chip box formed in the stretching mode and good in the welding performance has the advantages that the welding performances of the chip box can be effectively improved, the reject ratio of the whole product is lowered, and the practicability is strong.

Description

Drawing and forming chip cartridges that welding performance is good and preparation method thereof
Technical field
The present invention relates to the chip cartridges of the good drawing and forming of a kind of welding performance.
Background technology
Existing electronics vigour chip shell used be generally through Multi-step forming stretch after obtained, then shell welding used on circuit boards by welding procedure, the area for the soffit plane degree and bottom surface that weld shell largely determines shell welding performance on circuit boards.Mostly existing Product Process is direct blanking after stretching shaping completes, can not have a direct impact product appearance, but as shown in Figure 1, position due to blank is inclined-plane 11, product end surface 1 width that metal material belt is formed after die-cut blanking is less, during welding, effect is general, easily because the welding performance of product causes the increase of product fraction defective.
Summary of the invention
Object of the present invention solves the problems of the technologies described above, and proposes a kind ofly can improve chip cartridges with shaping surface of Product jointing performance and preparation method thereof.
The present invention is achieved through the following technical solutions.
The drawing and forming chip cartridges that welding performance is good, comprises the box body of an opening, and the openend of described box body is shaping surface, and the medial surface of described box body is face directly, and the surface of described shaping surface is vertical with the medial surface of box body.
Preferably, the manufacture method of the drawing and forming chip cartridges that described welding performance is good, comprises the steps,
Step one, punching, treat on shaping flitch and find basic point accurately, do preliminary punching;
Step 2, to puncture, the flitch of punching punctures it;
Step 3, stretching, carry out stretching and punching to flitch;
Step 4, shaping, the product formed stretching carries out the shaping of the burr on surface etc.;
Step 5, blanking are collected, and carry out blanking and collect the waste material produced after flitch punching press the product after punching stretch;
Wherein, the step of the punching stretch end face of product being carried out to smooth shaping is also included between described step 4 and step 5, during the step of described smooth shaping, smooth formation shaping surface is carried out to the product stretching end face after shaping, make the lateral vertical of described shaping surface and product.
Beneficial effect of the present invention is mainly reflected in: the welding performance that effectively can improve chip cartridges, reduces the fraction defective of whole product, practical.
Accompanying drawing explanation
Fig. 1: chip cartridges chamfered portion structural representation of the prior art.
Fig. 2: structural representation of the present invention.
The partial enlargement structural representation of A in Fig. 3: Fig. 2.
Embodiment
Below in conjunction with drawings and Examples, the invention will be further described:
Present invention is disclosed the drawing and forming chip cartridges that a kind of welding performance is good, as shown in Figure 2, comprise the box body of the opening formed by punching stretch, the openend of described box body is shaping surface 1, and the surface of described shaping surface 1 is vertical with the medial surface 21 of box body.Wherein, described medial surface 21 is for facing directly.
Below the processing technology of the lower described chip cartridges of summary, comprises the steps,
Step one, punching, treat on shaping flitch and find basic point accurately, do preliminary punching;
Step 2, to puncture, the flitch of punching punctures it;
Step 3, stretching, carry out stretching and punching to flitch;
Step 4, shaping, the product formed stretching carries out the shaping of the burr on surface etc.; Above step is consistent with prior art, therefore repeats no more.
Unlike the prior art, make the step that this chip cartridges also comprises smooth shaping, to the step that the punching stretch end face of product carries out, smooth formation shaping surface is carried out to the product stretching end face after step 4 shaping, make described shaping surface 1 vertical with the side 21 of product.This smooth shaping can be first the height of the product to punching stretch will carry out the lengthening of appropriateness, and the inclined-plane excision then will formed, the chip cartridges height finally obtained is consistent with required chip cartridges height.
Last blanking is collected, and carries out blanking and collect respectively the waste material 3 produced after flitch punching press and chip cartridges the product after punching stretch.
Due to after smooth shaping step, original oblique surface machining is become to face directly, broadened the weld width of chip cartridges, made welding performance better.
The present invention still has numerous embodiments, all employing equivalents or equivalent transformation and all technical schemes formed, and all drops within protection scope of the present invention.

Claims (1)

1. the drawing and forming chip cartridges that welding performance is good, comprises the box body of an opening, and the openend of described box body is shaping surface, and the medial surface of described box body is for facing directly, and the surface of described shaping surface is vertical with the medial surface of box body; It is characterized in that:
Comprise the steps,
Step one, punching, treat on shaping flitch and find basic point accurately, do preliminary punching;
Step 2, to puncture, the flitch of punching punctures it;
Step 3, stretching, carry out stretching and punching to flitch;
Step 4, shaping, the product formed stretching carries out the shaping of the burr on surface;
Step 5, blanking are collected, and carry out blanking and collect the waste material produced after flitch punching press and chip cartridges the product after punching stretch;
The step of the punching stretch end face of product being carried out to smooth shaping is also included between described step 4 and step 5, during the step of described smooth shaping, smooth formation shaping surface is carried out to the product stretching end face after shaping, make the lateral vertical of described shaping surface and product.
CN201210538108.7A 2012-12-13 2012-12-13 Chip box formed in stretching mode and good in welding performance and producing method thereof Active CN103035583B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210538108.7A CN103035583B (en) 2012-12-13 2012-12-13 Chip box formed in stretching mode and good in welding performance and producing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210538108.7A CN103035583B (en) 2012-12-13 2012-12-13 Chip box formed in stretching mode and good in welding performance and producing method thereof

Publications (2)

Publication Number Publication Date
CN103035583A CN103035583A (en) 2013-04-10
CN103035583B true CN103035583B (en) 2015-06-24

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CN201210538108.7A Active CN103035583B (en) 2012-12-13 2012-12-13 Chip box formed in stretching mode and good in welding performance and producing method thereof

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3543996A4 (en) * 2016-11-18 2020-07-08 Guangdong Wlight Visual Health Research Institute Method and display apparatus for dynamically adjusting luminescence parameters of display

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201829476U (en) * 2010-06-22 2011-05-11 宇芯(成都)集成电路封装测试有限公司 Straight-side metal cover semiconductor package

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09181230A (en) * 1995-12-22 1997-07-11 Sumitomo Electric Ind Ltd Metal case for semiconductor device and manufacture thereof
CN1366336A (en) * 2001-01-15 2002-08-28 禄庆实业股份有限公司 Method for making SMD electronic elements
CN202996805U (en) * 2012-12-13 2013-06-12 苏州和林精密科技有限公司 Stretching formed chip box with good welding performance

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201829476U (en) * 2010-06-22 2011-05-11 宇芯(成都)集成电路封装测试有限公司 Straight-side metal cover semiconductor package

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Effective date of registration: 20170126

Address after: The 215000 Jiangsu province high tech District of Suzhou City Road No. 80

Patentee after: Suzhou Helin Micro-Nano Technology Co., Ltd.

Address before: Suzhou City, Jiangsu province 215121 Industrial Park Weiting Double Road No. 2

Patentee before: SUZHOU UIGREEN PRECISION TECHNOLOGIES Co.,Ltd.

CP01 Change in the name or title of a patent holder

Address after: 215000 Emei Mountain Road, 80 hi tech Zone, Jiangsu, Suzhou

Patentee after: Suzhou Helin Micro Technology Co.,Ltd.

Address before: 215000 Emei Mountain Road, 80 hi tech Zone, Jiangsu, Suzhou

Patentee before: Suzhou Helin Micro-Nano Technology Co., Ltd.

CP01 Change in the name or title of a patent holder