CN1366336A - Method for making SMD electronic elements - Google Patents
Method for making SMD electronic elements Download PDFInfo
- Publication number
- CN1366336A CN1366336A CN 01100828 CN01100828A CN1366336A CN 1366336 A CN1366336 A CN 1366336A CN 01100828 CN01100828 CN 01100828 CN 01100828 A CN01100828 A CN 01100828A CN 1366336 A CN1366336 A CN 1366336A
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- Prior art keywords
- connecting pin
- conductive connecting
- electronic component
- strip
- pin
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Abstract
The invention relates to a method for manufacturing SMD electronic part. The method includes following steps: Conducting connection pins are fixed on continuous material strip. Encapsulating semiconductor forms packaged case. Electronic parts are cut out from the material strip, and the upper conducting connecting pin is bent down slightly. Cylindrical conducting connection pin is stamped to flat; its appearance is trimmed; at least two times of bending process makes the pin be moulded. The invented method possesses merits of fast speed, saving of labor, preventing inside electric connection point from damage.
Description
The invention belongs to the manufacture method of electronic component, particularly a kind of manufacture method of SMD electronic component.
At present, the method for making of known semiconductor electronic part, for this electronic component in finish on the strip that wafer is electrically connected and the encapsulation of glue shell after, to the forming method and the step of its conductive connecting pin be: at first with this part by downcutting on the strip; Again conductive connecting pin is struck out flat; Then revise the outward appearance of conductive connecting pin; Last bending process moulding repeatedly.
Known has two kinds to the method for electronic component when the punching press conductive connecting pin becomes flat and integer: a kind of system is with the synchronous punching press one-shot forming of the half-finished two conductive connecting pin ends of electronic component; Its advantage coefficient saving of labor, quick, and during shortcoming to be two conductive connecting pin ends synchronous punching press, the flow of metal that terminal produces through punching press (being that cold draw changes) can press to the electric terminal in glue shell inside simultaneously, cause Yi Zaiqi to be electrically connected the position generation and break or come off, and it is higher to form fraction defective.Another kind then is earlier to carrying out punching press and plastic operation on one side, another side is loosened or unsettled; After treating to machine on one side, the processing of changing sides again, in view of the above, though the destructive power that can avoid two ends punching press simultaneously that inner electric terminal is produced, it is comparatively time-consuming, take a lot of work, and difficult fixing and easily produce error situations.
The purpose of this invention is to provide a kind of saving of labor, fast, avoid destroying the manufacture method of the SMD electronic component of internal electric contact.
The present invention includes following steps:
Step 1
Connect and establish conductive connecting pin
Tie respectively in the semiconductor both sides and to establish conductive connecting pin;
Fixing
Conductive connecting pin is fixed on the continuous strip;
Step 3
Encapsulation
Encapsulated semiconductor forms encapsulating housing;
Cut off
Electronic component is downcut on strip; And make simultaneously that conductive connecting pin slightly is bent downwardly on it;
Step 5
Punch forming
Cylindric conductive connecting pin is struck out flat;
Step 6
Finishing
The outward appearance of finishing conductive connecting pin;
Step 7
Repeatedly bending
Conductive connecting pin is carried out secondary bending process moulding at least.
Since the present invention includes connect establish conductive connecting pin, with conductive connecting pin be fixed on the continuous strip, encapsulated semiconductor forms encapsulating housing, conductive connecting pin slightly is bent downwardly it on from downcutting on the strip and making simultaneously, outward appearance that cylindric conductive connecting pin is struck out flat, finishing conductive connecting pin reaches conductive connecting pin is carried out secondary bending process moulding at least with electronic component.The present invention makes to prebend between conductive connecting pin and the encapsulating housing when electronic component is downcut on strip and forms a low-angle, the conductive connecting pin of being convenient to be positioned at the encapsulating housing both sides is synchronously by cylindric when striking out flat, the extension of the flow of metal that produces and impulsive force make that encapsulating housing is whole upwards to be floated, and then can eliminate because of punching press, the impulsive force that institute's flow of metal that produces pushes to central authorities in finishing and the bending operation, produce the situation that comes off or damage with the electric terminal of avoiding inner conductive pin and semiconductor conducting, and adding man-hour, be easy to fix, thereby can improve the stability that process velocity and enhancement add man-hour, saving of labor not only, fast, and avoid destroying the internal electric contact, thereby reach purpose of the present invention.
Fig. 1, be electronic component semi-finished product structural representation stereogram with the present invention processing.
Fig. 2, be electronic component structural representation stereogram with the present invention processing.
Fig. 3, for manufacturing process vertical view of the present invention.
Fig. 4, for manufacturing process end view of the present invention.
Fig. 5, be the present invention's metal extruding schematic diagram when punch process.
Below in conjunction with accompanying drawing the present invention is further elaborated.
The present invention includes following steps:
Step 1
Connect and establish conductive connecting pin
As shown in Figure 1, weld the conductive connecting pin 2 that knot is made as copper cash respectively in semiconductor element 1 both sides such as diode, electric crystal and integrated circuits;
Fixing
Conductive connecting pin 2 is fixed on the continuous strip 3;
Step 3
Encapsulation
The plastic material of casting in Jet forming machine forms encapsulating housing 4 with semiconductor elements 1 such as encapsulation diode, electric crystal and integrated circuits, makes semiconductor electronic part semi-finished product as shown in Figure 1;
Cut off
As shown in Figure 3, Figure 4, the electronic component semi-finished product are downcut on strip; And make simultaneously that conductive connecting pin 2 slightly is bent downwardly on it;
Step 5
Punch forming
As shown in Figure 3, Figure 4, cylindric conductive connecting pin 2 is struck out flat;
Step 6
Finishing
As shown in Figure 3, Figure 4, the outward appearance of finishing conductive connecting pin 2;
Step 7
Repeatedly bending
As shown in Figure 3, Figure 4, conductive connecting pin 2 is carried out three bending process moulding semiconductor electronic part as shown in Figure 2.
Because the electronic component semi-finished product are made the low-angle of formation that prebends between conductive connecting pin 2 and the encapsulating housing 4 when downcutting on the strip 3, be convenient to be positioned at the conductive connecting pin 2 of encapsulating housing 4 both sides synchronously by the cylindric flat that strikes out, therefore the extension and the impulsive force of the flow of metal that produces when carrying out punch process, can make as shown in Figure 5 encapsulating housing 4 is whole upwards floats, and then can eliminate because of the impulsive force of flow of metal that punching press produces to central authorities' extruding, produce the situation that the button that comes off damages to avoid the conductive connecting pin 2 and the internal electric contact of silicon wafer or semiconductor element 1 conducting.Comprise its follow-up finishing to conductive connecting pin 2 and also same during operation such as bending, and adding man-hour, be easy to fix, thereby can improve the stability that process velocity and enhancement add man-hour.
In sum, the pinch shock power when the present invention can reach the flow of metal that is produced in the operations such as eliminating punching press and finishing really avoids the internal electric contact to produce purpose and the economic worth that comes off or damage to reach.
Claims (1)
1, a kind of manufacture method of SMD electronic component, it comprises the steps:
Step 1
Connect and establish conductive connecting pin
Tie respectively in the semiconductor both sides and to establish conductive connecting pin;
Step 2
Fixing
Conductive connecting pin is fixed on the continuous strip;
Step 3
Encapsulation
Encapsulated semiconductor forms encapsulating housing;
Step 4
Cut off
Electronic component is downcut on strip;
Step 5
Punch forming
Cylindric conductive connecting pin is struck out flat;
Step 6
Finishing
The outward appearance of finishing conductive connecting pin;
Step 7
Repeatedly bending
Conductive connecting pin is carried out at least once the bending process of secondary at least moulding;
It is characterized in that described step 4; When being downcut, electronic component makes that conductive connecting pin slightly is bent downwardly on it on strip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01100828 CN1366336A (en) | 2001-01-15 | 2001-01-15 | Method for making SMD electronic elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01100828 CN1366336A (en) | 2001-01-15 | 2001-01-15 | Method for making SMD electronic elements |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1366336A true CN1366336A (en) | 2002-08-28 |
Family
ID=4651924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01100828 Pending CN1366336A (en) | 2001-01-15 | 2001-01-15 | Method for making SMD electronic elements |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1366336A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103035583A (en) * | 2012-12-13 | 2013-04-10 | 苏州和林精密科技有限公司 | Chip box formed in stretching mode and good in welding performance and producing method thereof |
-
2001
- 2001-01-15 CN CN 01100828 patent/CN1366336A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103035583A (en) * | 2012-12-13 | 2013-04-10 | 苏州和林精密科技有限公司 | Chip box formed in stretching mode and good in welding performance and producing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |