CN103010487B - Heat control device and heat control method of pico-satellite in isothermal design - Google Patents
Heat control device and heat control method of pico-satellite in isothermal design Download PDFInfo
- Publication number
- CN103010487B CN103010487B CN201210394687.2A CN201210394687A CN103010487B CN 103010487 B CN103010487 B CN 103010487B CN 201210394687 A CN201210394687 A CN 201210394687A CN 103010487 B CN103010487 B CN 103010487B
- Authority
- CN
- China
- Prior art keywords
- satellite
- heat
- shell
- skin
- tetrad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Waveguide Aerials (AREA)
Abstract
The invention discloses a heat control device and a heat control method of a pico-satellite in an isothermal design. A shell of the pico-satellite which is in a regular square body structure is formed by connecting a four-connecting body structure of a shell of a satellite with a left side board and a right side board, heat conduction material is positioned in a contact position, the four-connecting body structure, the left side board and the right side board are coated with heat insulation materials, the inner part of the four-connecting body structure is provided with a U-shaped frame structure which is integrally processed, multiple PCB (Printed Circuit Boards) which are provided with electronic components are parallelly positioned in the U-shaped frame structure at the inner part of the satellite and are connected through aluminum bars, the aluminum bars and the PCB which are provided with the electronic components as well as the U-shaped frame structure at the inner part of the satellite are respectively connected through screws, the heat conduction materials are positioned on contact surfaces, the U-shaped frame structure at the inner part of the satellite and the four-connecting body structure are connected through screws, and glass steel in low heat conduction efficiencies is arranged on the contact surfaces. According to the heat control device and the heat control method, disclosed by the invention, the isothermal design is realized at the inner part of the pico-satellite, the isothermal designs at the inner part and the outer part of the pico-satellite cannot be mutually affected, thus the temperature of the satellite is within a suitable range, and the service life of the satellite is prolonged.
Description
Technical field
The invention belongs to space flight and use field, particularly relate to the thermal control of skin satellite.
Background technology
Due to the small volume of skin satellite, quality is light, the feature that thermal capacity is little and thermal capacitance density is large, and it is very limited that this makes satellite be supplied to the resource of thermal control subsystem.First restriction dimensionally makes the electronics integrated level in unit are higher, and heat flow density is very large, is easy to cause localized hyperthermia.Secondly because micro-satellite thermal capacity is little, be easily subject to the impact of transient thermal loading and space heat flux, cause satellite temperature level to fluctuate comparatively large, this makes thermal control design become a difficult point of skin design of satellites.
The major technique present situation of current skin satellite thermal control is the communication functions of some skin satellites in order to verifying satellites, and the life requirements for satellite is not high, does not thus adopt thermal control measure.The satellite high to life requirements, does not carry out due to thermal control measure thus the temperature of skin satellite can not be made to be within OK range, and thus the life-span in orbit of satellite receives impact.
Summary of the invention
In order to overcome the deficiencies in the prior art, the object of this invention is to provide skin satellite heat control device and the heat control method of a kind of isothermalization design.
The skin satellite heat control device of isothermalization design, comprise the tetrad structure of the outer shell integrated processing of satellite,
The U-shaped mount structure of the left plate of satellite shell, the right plate of satellite shell, inside satellite overall processing, the outer tetrad structure of shell integrated processing of satellite and the left side plate of satellite shell connect to form the skin satellite shell of positive tetragonal body structure, the tetrad structure of the outer shell integrated processing of satellite, the left plate of satellite shell and the right plate internal package of satellite shell heat-barrier material, the screw that passes on left of the tetrad structure of the outer shell integrated processing of satellite is connected with the left plate of satellite shell, the right side of the tetrad structure of the outer shell integrated processing of satellite is connected by the right plate of screw with satellite shell, at contact surface, place puts into Heat Conduction Material, the inside of the tetrad structure of the outer shell integrated processing of satellite is provided with the U-shaped mount structure of inside satellite overall processing, polylith has installed the parallel U-shaped mount structure putting into inside satellite overall processing of pcb board of electronic devices and components, connected by aluminum strip, be connected respectively by screw between aluminum strip with the U-shaped mount structure of the pcb board installing electronic devices and components, inside satellite overall processing, Heat Conduction Material is put in contact position, the U-shaped mount structure of inside satellite overall processing is connected by screw with integrated tetrad structure of processing, and is provided with the fiberglass of lower thermal conductivity at contact surface place.
The U-shaped mount structure of described inside satellite, aluminum strip adopt black anodizing process, improve slin emissivity, strengthen heat-sinking capability.
A heat control method for the skin satellite heat control device of isothermalization design, when the temperature meeting of skin satellite shell
By surrounding environment influence, its some occurs that temperature significantly changes, this face can have the face of the temperature difference to carry out heat compensation with other each, tetrad is processed due to integration, so each heat trnasfer is rapid, is connected by screw between the tetrad structure of the left plate of satellite shell and the right plate of satellite shell and the outer shell integrated processing of satellite, has Heat Conduction Material to promote heat conduction therebetween, achieve the isothermal of celestial body shell, make satellite skin temperature maintain within suitable scope; In skin inside satellite, the heat that the pcb board 8 that certain block has installed electronic devices and components produces passes to the U-shaped mount structure of inside satellite overall processing by aluminum strip, U-shaped frame is due to overall processing, heat conduction is rapid, form heat trnasfer between the U-shaped mount structure of inside satellite overall processing and other pcb board having installed electronic devices and components, this makes the structure of stellar interior realize isothermal; In skin inside satellite, the tetrad form touch place of the U-shaped mount structure of inside satellite overall processing and the outer shell integrated processing of satellite is provided with the fiberglass of low heat conductivity, tetrad structure and the left side plate inside of the outer shell integrated processing of satellite cover heat-barrier material, reduce the heat trnasfer between larger skin satellite shell affected by environment and the U-shaped mount structure of inside satellite overall processing, achieve skin satellite shell isothermalization and control to be independent of each other with the heat-transmission of skin inside satellite isothermal.
Beneficial effect of the present invention is that the tetrad structure of the outer shell integrated processing of satellite can carry out quick conductive, additional two pieces of left side plates, put into Heat Conduction Material between the joint face of the tetrad of the outer shell integrated processing of itself and satellite and help heat conduction, achieve the isothermalization design of skin satellite shell, and the U-shaped mount structure of inside satellite that tetrad structure has conveniently installed pcb board is put into, simplify the structural design of satellite, also achieve thermal control requirement well.In skin inside satellite, because the U-shaped frame heat conduction of aluminium alloy overall processing is rapid, pcb board difference arranged parallel is in the U-shaped frame by the unified processing of aluminium alloy, this has saved the structure space of inside satellite effectively, pcb board is connected with the U-shaped frame of overall processing by aluminum strip, increases contact area, and puts into Heat Conduction Material on the contact surface, effectively enhance the thermal conductivity between them, achieve the isothermalization design of inside satellite.The U-shaped mount structure body of overall processing, aluminum strip etc. all adopt black anodizing process, improve its emissivity, and the temperature of stellar interior is controlled within suitable scope.The heat-barrier material in tetrad internal package, and the U-shaped frame of overall processing adopts the fiberglass of low heat conductivity with the connection of the integrated tetrad processed, and this makes structure of two isothermalizations designs be independent of each other, and reaches the object of satellite thermal control.Realize isothermalization design in celestial body outside, stellar interior realizes isothermalization design, and the isothermalization design of inside and outside is independent of each other, and the temperature of satellite is within suitable scope, extends the service life of satellite.
Accompanying drawing explanation
Fig. 1 is the three-dimensional general assembly structural representation of skin satellite heat control device of isothermalization design;
Fig. 2 is skin satellite shell isothermal project organization schematic diagram of the present invention;
Fig. 3 is the front view that skin inside satellite isothermal of the present invention designs U-shaped mount structure;
Fig. 4 is the left view that skin inside satellite isothermal of the present invention designs U-shaped mount structure;
Description of reference numerals: the 1. tetrad structure of the outer shell integrated processing of satellite; 2. the left plate of satellite shell; 3. the right plate of satellite shell; 4. the U-shaped mount structure of inside satellite overall processing; 5. Heat Conduction Material; 6. fiberglass; 7. aluminum strip; 8. the pcb board of electronic devices and components has been installed.
Detailed description of the invention
Below in conjunction with accompanying drawing, the present invention is further illustrated.
The skin satellite heat control device of isothermalization design comprises tetrad structure 1, the left plate 2 of satellite shell, the right plate 3 of satellite shell, the U-shaped mount structure 4 of inside satellite overall processing of the outer shell integrated processing of satellite, the outer shell integrated processing tetrad structure 1 of satellite and the left side plate of satellite shell connect to form the skin satellite shell of positive tetragonal body structure, the outer shell integrated processing tetrad structure 1 of satellite, the left plate 2 of satellite shell and right plate 3 internal package of satellite shell heat-barrier material, the screw that passes on left of the tetrad structure 1 of the outer shell integrated processing of satellite is connected with the left plate 2 of satellite shell, the right side of the tetrad structure 1 of the outer shell integrated processing of satellite is connected with the right plate 3 of satellite shell by screw, at contact surface, place puts into Heat Conduction Material, the inside of the tetrad structure 1 of the outer shell integrated processing of satellite is provided with the U-shaped mount structure 4 of inside satellite, the U-shaped mount structure 4 of inside satellite is formed by aluminium alloy overall processing, polylith has installed the parallel U-shaped mount structure 4 putting into inside satellite overall processing of pcb board 8 of electronic devices and components, connected by aluminum strip 7, last aluminum strip 7 and the pcb board 8 having installed electronic devices and components, connect respectively by screw between the U-shaped mount structure 4 of inside satellite overall processing, be provided with Heat Conduction Material 5 in junction and strengthen heat conduction, the U-shaped mount structure 4 of inside satellite overall processing is connected by screw with integrated tetrad structure 1 of processing, and the fiberglass 6 of lower thermal conductivity is provided with at contact surface place.
U-shaped mount structure 4, the aluminum strip 7 of described inside satellite integration processing adopt black anodizing process, improve slin emissivity, strengthen heat-sinking capability.
The heat control method of the skin satellite heat control device of isothermalization design is: when the temperature of skin satellite shell
Surrounding environment influence can be subject to, its some occurs that temperature significantly changes, this face can have the face of the temperature difference to carry out heat compensation with other each, tetrad is processed due to integration, so each heat trnasfer is rapid, is connected by screw between the tetrad structure 1 of the left plate 2 of satellite shell and the right plate 3 of satellite shell and the outer shell integrated processing of satellite, has Heat Conduction Material to promote heat conduction therebetween, achieve the isothermal of celestial body shell, make satellite skin temperature maintain within suitable scope; In skin inside satellite, the heat that the pcb board 8 that certain block has installed electronic devices and components produces passes to the U-shaped mount structure 4 of inside satellite overall processing by aluminum strip 7, U-shaped frame is due to overall processing, heat conduction is rapid, form heat trnasfer between the U-shaped mount structure 4 of inside satellite overall processing and other pcb board 8 having installed electronic devices and components, this makes the structure of stellar interior realize isothermal; In skin inside satellite, U-shaped mount structure 4 and tetrad structure 1 contact position of the outer shell integrated processing of satellite of inside satellite overall processing are provided with the fiberglass 6 of low heat conductivity, the outer shell integrated processing tetrad structure 1 of satellite covers heat-barrier material with left side plate inside, reduce the heat trnasfer between larger skin satellite shell affected by environment and the U-shaped mount structure 4 of inside satellite overall processing, achieve skin satellite shell isothermalization and control to be independent of each other with the heat-transmission of skin inside satellite isothermal.See Fig. 1-Fig. 4, present invention achieves the outside isothermalization design of skin satellite and design with inner isothermalization.Adopt the tetrad structure 1 of integration processing to be connected by screw with left plate structure 2 right plate structure 3 respectively and form satellite shell, realize the isothermalization design of satellite shell.The pcb board 8 having installed electronic devices and components placed by the inner U-shaped frame 4 of overall processing that adopts, and achieves the isothermalization design of inside satellite, and two isothermalization designs are independent of each other.
Structure 1 in Fig. 1 is tetrad structure, this structure is that LD10 almag aluminium sheet adopts Linear cut unification to process, this compares and to be connected by screw by single face that to form heat conductivility better, and tetrad structure is simple, satellite external structure is simplified, biside plate 2, 3 are connected by screw the external structure forming satellite with the integrated tetrad processed, Heat Conduction Material 5 is put in junction, strengthen the capacity of heat transmission between tetrad and biside plate, heat-barrier material is sticked in whole inside satellite structure, to reduce the radiation effect of satellite skin temperature to internal electronic device.Like this when some the direct irradiation due to the sun of satellite or the extremely cold environment of entered environment temperature, some of satellite outside can to other each, realize the isothermalization design of satellite shell, reach the object of thermal control by transferring heat rapidly.
U-shaped frame 4 in Fig. 3 is formed by aluminium alloy overall processing, and each piece of pcb board 8 is parallel puts into U-shaped frame 4, is connected between them by aluminum strip 7, and put into Heat Conduction Material 5 in contact position and strengthen heat conduction, connects finally by screw.Such structure has not only saved the space of inside satellite, and the heating of the electronic device on a certain pcb board can be delivered to U-shaped frame by aluminum strip 7 and Heat Conduction Material rapidly, U-shaped frame overall processing, heat conduction is rapid, be passed to other pcb board each by the U-shaped frame of overall processing again, thus achieve the design of stellar interior isothermalization.The U-shaped frame 4 of inside satellite overall processing is put into integrated tetrad structure 1 of processing and is connected by screw, and puts into the fiberglass 6 of lower thermal conductivity at contact surface, weakens the heat transmission between satellite shell and the U-shaped frame of inner overall processing.The connectors such as the U-shaped frame 4 of stellar interior overall processing and aluminum strip 7 all adopt black anodizing process, can improve the emissivity of the structure of inside satellite like this, make the temperature stabilization of inside satellite within suitable scope.
The above, be only preferred embodiment of the present invention, can not limit practical range of the present invention with this, therefore the displacement etc. of equivalent change and equivalent elements, all still should belong to the category that patent protection of the present invention is contained.
Claims (3)
1. a skin satellite heat control device for isothermalization design, is characterized in that: it comprises tetrad structure (1), the left plate (2) of satellite shell, the right plate (3) of satellite shell, the U-shaped mount structure of inside satellite overall processing (4) of the outer shell integrated processing of satellite, the outer shell integrated processing tetrad structure (1) of satellite and the left side plate of satellite shell connect to form the skin satellite shell of positive tetragonal body structure, the outer shell integrated processing tetrad structure (1) of satellite, the left plate (2) of satellite shell and right plate (3) internal package of satellite shell heat-barrier material, the screw that passes on left of the tetrad structure (1) of the outer shell integrated processing of satellite is connected with the left plate (2) of satellite shell, the right side of the tetrad structure (1) of the outer shell integrated processing of satellite is connected with the right plate (3) of satellite shell by screw, at contact surface, place puts into Heat Conduction Material, the inside of the tetrad structure (1) of the outer shell integrated processing of satellite is provided with the U-shaped mount structure of inside satellite (4), the U-shaped mount structure of inside satellite (4) is formed by aluminium alloy overall processing, polylith has installed the parallel U-shaped mount structure (4) putting into inside satellite overall processing of pcb board (8) of electronic devices and components, connected by aluminum strip (7), last aluminum strip (7) and the pcb board (8) having installed electronic devices and components, connect respectively by screw between the U-shaped mount structure (4) of inside satellite overall processing, be provided with Heat Conduction Material (5) in junction and strengthen heat conduction, the U-shaped mount structure (4) of inside satellite overall processing is connected by screw with integrated tetrad structure (1) of processing, and the fiberglass (6) of lower thermal conductivity is provided with at contact surface place.
2. the skin satellite heat control device of isothermalization design as claimed in claim 1, it is characterized in that: U-shaped mount structure (4), the aluminum strip (7) of described inside satellite integration processing adopt black anodizing process, improve slin emissivity, strengthen heat-sinking capability.
3. the heat control method of the skin satellite heat control device of an isothermalization design as claimed in claim 1, it is characterized in that: when the temperature of skin satellite shell can be subject to surrounding environment influence, its some occurs that temperature significantly changes, this face can have the face of the temperature difference to carry out heat compensation with other each, tetrad is processed due to integration, so each heat trnasfer is rapid, be connected by screw between the tetrad structure (1) of the left plate (2) of satellite shell and the right plate (3) of satellite shell and the outer shell integrated processing of satellite, Heat Conduction Material is had to promote heat conduction therebetween, achieve the isothermal of celestial body shell, satellite skin temperature is made to maintain within suitable scope, in skin inside satellite, the heat that the pcb board (8) that certain block has installed electronic devices and components produces passes to the U-shaped mount structure (4) of inside satellite overall processing by aluminum strip 7, U-shaped frame is due to overall processing, heat conduction is rapid, form heat trnasfer between the U-shaped mount structure of inside satellite overall processing (4) and other pcb board (8) having installed electronic devices and components, this makes the structure of stellar interior realize isothermal, in skin inside satellite, U-shaped mount structure (4) and tetrad structure (1) contact position of the outer shell integrated processing of satellite of inside satellite overall processing are provided with the fiberglass (6) of low heat conductivity, the outer shell integrated processing tetrad structure (1) of satellite covers heat-barrier material with left side plate inside, reduce the heat trnasfer between larger skin satellite shell affected by environment and the U-shaped mount structure (4) of inside satellite overall processing, achieve skin satellite shell isothermalization and control to be independent of each other with the heat-transmission of skin inside satellite isothermal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210394687.2A CN103010487B (en) | 2012-10-17 | 2012-10-17 | Heat control device and heat control method of pico-satellite in isothermal design |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210394687.2A CN103010487B (en) | 2012-10-17 | 2012-10-17 | Heat control device and heat control method of pico-satellite in isothermal design |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103010487A CN103010487A (en) | 2013-04-03 |
| CN103010487B true CN103010487B (en) | 2015-04-29 |
Family
ID=47959711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210394687.2A Active CN103010487B (en) | 2012-10-17 | 2012-10-17 | Heat control device and heat control method of pico-satellite in isothermal design |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103010487B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103455060B (en) * | 2013-08-08 | 2015-09-23 | 上海卫星工程研究所 | A kind of scanning mechanism of isothermalization design |
| CN105035365A (en) * | 2015-07-31 | 2015-11-11 | 上海卫星工程研究所 | Satellite temperature control method allowing rapid responding and multi-orbit adaption |
| CN113423246B (en) * | 2021-06-29 | 2023-01-10 | 长光卫星技术股份有限公司 | Light device for efficient heat dissipation of cubic satellite electronic equipment |
| CN115367151B (en) * | 2022-10-20 | 2023-03-21 | 哈尔滨工大卫星技术有限公司 | Active thermal control device and method for spacecraft |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2736710Y (en) * | 2004-09-20 | 2005-10-26 | 李文 | Electronic refrigeration icebox |
| CN101508349A (en) * | 2009-03-17 | 2009-08-19 | 北京航空航天大学 | Fluid circuit control device suitable of nano-satellite hot control system |
| CN101607604A (en) * | 2009-07-02 | 2009-12-23 | 哈尔滨工业大学 | Satellite attitude control and heat control integrated executive mechanism and control method thereof |
| CN102514730A (en) * | 2011-12-21 | 2012-06-27 | 哈尔滨工业大学 | Electromechanical and thermal integrated satellite structure |
-
2012
- 2012-10-17 CN CN201210394687.2A patent/CN103010487B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2736710Y (en) * | 2004-09-20 | 2005-10-26 | 李文 | Electronic refrigeration icebox |
| CN101508349A (en) * | 2009-03-17 | 2009-08-19 | 北京航空航天大学 | Fluid circuit control device suitable of nano-satellite hot control system |
| CN101607604A (en) * | 2009-07-02 | 2009-12-23 | 哈尔滨工业大学 | Satellite attitude control and heat control integrated executive mechanism and control method thereof |
| CN102514730A (en) * | 2011-12-21 | 2012-06-27 | 哈尔滨工业大学 | Electromechanical and thermal integrated satellite structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103010487A (en) | 2013-04-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103010487B (en) | Heat control device and heat control method of pico-satellite in isothermal design | |
| CN105828572B (en) | A kind of radiator and electronic equipment | |
| US8031470B2 (en) | Systems and methods for thermal management | |
| CN1953646A (en) | Heat radiator capable of preventing electromagnetic interference | |
| CN207099513U (en) | A kind of good degree of protection of heat sinking function is up to 65 grades and the electric cabinet of the above | |
| CN104244677B (en) | The phase-change temperature control device of electronic heating component and manufacture method thereof | |
| CN102711416B (en) | Radiating treatment device and mobile terminal | |
| EP3986101A1 (en) | Heat conduction device and terminal device | |
| CN205071566U (en) | Heat dissipation buffering shielding composite structure of mobile electronic device | |
| CN109219319A (en) | A kind of isothermal integral heat dissipation device suitable for micro-nano satellite | |
| US20220104398A1 (en) | Heat pipe, heat dissipation module, and terminal device | |
| CN106877629A (en) | A kind of power supply adaptor of pin radiating | |
| CN204377305U (en) | A kind of heat abstractor, circuit board and terminal | |
| CN202841807U (en) | Heat resistance element structure | |
| CN203722977U (en) | Mobile device heat radiation structure | |
| CN105828569A (en) | Heat radiation device and electronic equipment | |
| CN204179076U (en) | A kind of reinforcing radiating module structure | |
| CN203775589U (en) | Novel fin cooling device | |
| CN114173540B (en) | Thermal control structure and device for satellite-borne on-orbit information processing and service load | |
| CN203313575U (en) | Heat resistant structure with heat conduction function | |
| CN204425843U (en) | Navigation neceiver cabinet | |
| CN214190171U (en) | Heat dissipation assembly for cabin and spacecraft | |
| CN108091962A (en) | A kind of new soft pack cell heat conduction module | |
| CN112911028A (en) | Temperature equalization plate, terminal equipment and manufacturing method of temperature equalization plate | |
| CN114180104A (en) | High-precision temperature control device of space optical remote sensing satellite star sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |