CN103009237A - Pyramid grinding plate - Google Patents

Pyramid grinding plate Download PDF

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Publication number
CN103009237A
CN103009237A CN2012105306885A CN201210530688A CN103009237A CN 103009237 A CN103009237 A CN 103009237A CN 2012105306885 A CN2012105306885 A CN 2012105306885A CN 201210530688 A CN201210530688 A CN 201210530688A CN 103009237 A CN103009237 A CN 103009237A
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China
Prior art keywords
grinding
sword
abrasive disk
pyramid
matrix
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CN2012105306885A
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CN103009237B (en
Inventor
李卫中
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DONGGUAN RUNMING ELECTRONICS TECH Co Ltd
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DONGGUAN RUNMING ELECTRONICS TECH Co Ltd
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Publication of CN103009237A publication Critical patent/CN103009237A/en
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Abstract

The invention relates to the technical field of a grinding device, in particular to a pyramid grinding plate. The pyramid grinding plate comprises a cylindrical base body, wherein at least one bottom surface of the base body is connected with a grinding layer, the grinding layer comprises a grinding bottom layer and a plurality of grinding blades, the grinding bottom layer and the grinding blades are integrally formed, the grinding bottom layer is positioned between the base body and the grinding blades, the grinding blades are annular bulges centering on a circle center of the base body, the grinding blades are connected with the grinding bottom layer through root parts, and distances between every two adjacent grinding blades are equal; and new end parts can be formed by exposed parts after end parts of the grinding blades are abraded during processing, and a workpiece can be grinded, thus certain roughness can be kept by the end parts of the grinding blades, and the grinding can be continuously carried out by the grinding blades. Therefore, according to the pyramid grinding plate disclosed by the invention, the grinding in a high cutting rate can be carried out and can be kept for a longer time, stable and continuous processing can be carried out due to almost the same pressure conditions applied by an operator during a whole grinding process, the processing is convenient, and good and consistent accurate grinding effect can be easily obtained.

Description

The pyramid abrasive disk
Technical field
The present invention relates to the milling apparatus technical field, particularly relate to a kind of pyramid abrasive disk that can finish grind crystalline materials such as jewel, silicon chip, wafers.
Background technology
In industry, often need to process the surface of workpiece, make it reach certain flatness, especially for crystalline materials such as sapphire, silicon chip, wafer, substrate slices, its surface-treated requires higher.Therefore, need to be equipped with lapping liquid by abrasive disk grinding is carried out on the surface of workpiece.
From microcosmic, the surface of general solid-state material has certain roughness and porosity characteristic, and for abrasive disk, its surface has small, sharp lug boss, during relative motion, these sharp lug bosses can carry out grinding to the surface of workpiece to abrasive disk on workpiece.In the prior art usually with granular material compression molding, form discoid abrasive disk, its working face is a plane, can strengthen like this work area of grinding, but after its work a period of time, the chip that workpiece and abrasive disk are worn is filled in the surface of abrasive disk, reduced its surperficial roughness, so that the stock removal rate of abrasive disk descends rapidly, force the operator to apply larger pressure, this can increase operator's labour intensity and increase the excessively danger of cutting.
Summary of the invention
The object of the invention is to for the deficiencies in the prior art, and a kind of pyramid abrasive disk that can finish grind crystalline materials such as jewel, silicon chip, wafers is provided, its scientific structure is simple, process of lapping steadily, continuously, grinding effect is good.
The technical solution adopted for the present invention to solve the technical problems is: a kind of pyramid abrasive disk, it comprises columniform matrix, at least one bottom surface of described matrix is connected with grinding layer, described grinding layer comprise grind bottom, several grind sword, described grinding bottom and described grinding sword are one-body molded, described grinding bottom is between described matrix, grinding sword, described grinding sword is the annular protrusion centered by the center of circle of matrix, described grinding sword is connected with described grinding bottom by root, and the spacing of described adjacent grinding sword equates.
Wherein, the spacing of described adjacent grinding sword is 1~3mm, and the height of described grinding sword is 0.1~0.3mm.
Preferably.The spacing of described adjacent grinding sword is 2mm, and the height of described grinding sword is 0.2mm.
Wherein, the thickness of described grinding bottom is 8~10mm.
Preferably, the cross sectional shape of described grinding sword is triangle, and this leg-of-mutton base is for grinding the root of sword.
Perhaps, the cross sectional shape of described grinding sword is trapezoidal, and this trapezoidal bottom is for grinding the root of sword.
Wherein, the middle part of described matrix is provided with the connecting hole of perforation.
Further, described matrix is the copper dish.
Further, described matrix also comprises iron pan or aluminium dish, and described iron pan or aluminium dish be and concentric cylindrical of described copper dish, and a bottom surface of described copper dish is connected with grinding layer, and another bottom surface is connected with described iron pan or aluminium dish.
Described iron pan or aluminium sheet and described copper dish by bonding, welding or bolted one or more be connected.
The invention has the beneficial effects as follows: a kind of pyramid abrasive disk, its grinding layer comprises the grinding bottom, several grind sword, described grinding bottom and described grinding sword are one-body molded, described grinding sword is the annular protrusion centered by the center of circle of matrix, the spacing of described adjacent grinding sword equates, add man-hour, after grinding the end wear of sword, the part of exposing forms new end, can grind workpiece, thereby keep certain roughness so that grind the end of sword, can proceed to grind, therefore, pyramid abrasive disk of the present invention can grind and keeps the long period with high stock removal rate, and the operator applies almost identical pressure condition in the overall process of grinding, can carry out stably, continuous processing, made things convenient for processing, and the consistent correct grinding effect that easily obtains.
Description of drawings
Fig. 1 is the structural representation of pyramid abrasive disk of the present invention.
Fig. 2 is the structural representation of grinding sword of the present invention.
Fig. 3 is the partial cutaway schematic of grinding sword of the present invention, grinding bottom.
Fig. 4 is the partial cutaway schematic of the another kind of embodiment of grinding sword of the present invention, grinding bottom.
Fig. 5 is the partial cutaway schematic of another embodiment of grinding sword of the present invention, grinding bottom.
Description of reference numerals:
1---matrix 11---connecting hole
12---copper dish 13---iron pan
2---grinding bottom 3---are ground sword.
The specific embodiment
The present invention is further detailed explanation below in conjunction with the drawings and specific embodiments, is not practical range of the present invention is limited to this.
Such as Fig. 1, Fig. 2, shown in Figure 3, the pyramid abrasive disk of the present embodiment, it comprises columniform matrix 1, at least one bottom surface of described matrix 1 is connected with grinding layer, during use, matrix 1 is connected with milling apparatus, grinding layer is towards workpiece to be processed, milling apparatus drives matrix 1 and rotates, thereby by grinding layer workpiece is ground, and is holistic disk with respect to the pyramid abrasive disk of prior art, the present invention is divided into two parts matrix 1 with the pyramid abrasive disk, grinding layer two parts, after using a period of time, the grinding layer after the wearing and tearing can be replaced, and matrix 1 can reuse.And, described grinding layer comprises grinding bottom 2, several grind sword 3, described grinding bottom 2 and described grinding sword 3 are one-body molded, described grinding bottom 2 is positioned at described matrix 1, grind between the sword 3, grind bottom 2 identical with the material that grinds sword 3, but its shape is different, grinding bottom 2 is writing board shape, mainly play a supportive role, mainly play abrasive actions and grind sword 3, described grinding sword 3 is the annular protrusion centered by the center of circle of matrix 1, described grinding sword 3 is connected with described grinding bottom 2 by root, the spacing of described adjacent grinding sword 3 equates, grinding the cross-sectional width of sword 3 from root to the end diminishes gradually, during use, after grinding the end wear of sword 3, the part of exposing forms new end, can grind workpiece, the chip of grinding sword 3 and workpiece falls into the groove between the adjacent grinding sword 3, and then discharge with lapping liquid, thereby keep certain roughness so that grind the end of sword 3, can proceed to grind, therefore, pyramid abrasive disk of the present invention can grind and keeps the long period with high stock removal rate, and the operator applies almost identical pressure condition in the overall process of grinding, can carry out stably, continuous processing, made things convenient for processing, and the consistent correct grinding effect that easily obtains.
For the present invention, the spacing a of described adjacent grinding sword 3 is 1~3mm, and the height b of described grinding sword 3 is 0.1~0.3mm, and preferred, the spacing of described adjacent grinding sword 3 is 2mm, and the height of described grinding sword 3 is 0.2mm.The thickness c of described grinding bottom 2 is 8~10mm.
For the present invention, the cross sectional shape of described grinding sword 3 can adopt numerous embodiments, is preferably triangle, and as shown in Figure 3, this leg-of-mutton base is for grinding the root of sword 3.
As shown in Figure 4, the cross sectional shape of described grinding sword 3 can also be for trapezoidal, and this trapezoidal bottom is for grinding the root of sword 3.As shown in Figure 5, the cross sectional shape of described grinding sword 3 can also be similar leg-of-mutton shape, and this leg-of-mutton upper drift angle is fillet.
For the present invention, the middle part of described matrix 1 is provided with the connecting hole 11 of perforation, and milling apparatus is by contiguous block 11 fixing bases 1.
Because the effect of matrix 1 is to play a supportive role, so matrix 1 can select on-deformable metal, and requires this metal to be easy to be connected with grinding layer, and preferably, described matrix 1 is copper dish 12.
Because the price of copper is higher, the one side that matrix 1 does not contact with grinding layer can also adopt other metals, such as iron, aluminium and alloy thereof, preferably, as shown in Figure 1, described matrix 1 also comprises iron pan 13, and described iron pan 13 is and concentric cylindrical of described copper dish 12, a bottom surface of described copper dish 12 is connected with grinding layer, and another bottom surface is connected with described iron pan 13.
Described iron pan 13 or aluminium sheet and described copper dish 12 by bonding, welding or bolted one or more be connected.
Should be noted that at last; above embodiment is only in order to illustrate technical scheme of the present invention; but not limiting the scope of the invention; although with reference to preferred embodiment the present invention has been done to explain; those of ordinary skill in the art is to be understood that; can make amendment or be equal to replacement technical scheme of the present invention, and not break away from essence and the scope of technical solution of the present invention.

Claims (10)

1. pyramid abrasive disk, it is characterized in that: comprise columniform matrix, at least one bottom surface of described matrix is connected with grinding layer, described grinding layer comprise grind bottom, several grind sword, described grinding bottom and described grinding sword are one-body molded, and described grinding bottom is between described matrix, grinding sword, and described grinding sword is the annular protrusion centered by the center of circle of matrix, described grinding sword is connected with described grinding bottom by root, and the spacing of described adjacent grinding sword equates.
2. pyramid abrasive disk according to claim 2, it is characterized in that: the spacing of described adjacent grinding sword is 1~3mm, the height of described grinding sword is 0.1~0.3mm.
3. pyramid abrasive disk according to claim 2, it is characterized in that: the spacing of described adjacent grinding sword is 2mm, the height of described grinding sword is 0.2mm.
4. pyramid abrasive disk according to claim 1, it is characterized in that: the thickness of described grinding bottom is 8~10mm.
5. pyramid abrasive disk according to claim 1, it is characterized in that: the cross sectional shape of described grinding sword is triangle, this leg-of-mutton base is for grinding the root of sword.
6. pyramid abrasive disk according to claim 1, it is characterized in that: the cross sectional shape of described grinding sword is trapezoidal, this trapezoidal bottom is for grinding the root of sword.
7. pyramid abrasive disk according to claim 1, it is characterized in that: the middle part of described matrix is provided with the connecting hole of perforation.
8. pyramid abrasive disk according to claim 1, it is characterized in that: described matrix is the copper dish.
9. pyramid abrasive disk according to claim 8, it is characterized in that: described matrix also comprises iron pan or aluminium dish, described iron pan or aluminium dish be and concentric cylindrical of described copper dish, and a bottom surface of described copper dish is connected with grinding layer, and another bottom surface is connected with described iron pan or aluminium dish.
10. pyramid abrasive disk according to claim 9 is characterized in that: described iron pan or aluminium sheet and described copper dish by bonding, welding or bolted one or more be connected.
CN201210530688.5A 2012-12-11 2012-12-11 Pyramid grinding plate Expired - Fee Related CN103009237B (en)

Priority Applications (1)

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CN103009237B CN103009237B (en) 2018-04-06

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3036518A1 (en) * 1979-10-04 1981-04-16 Arthur Werner Pieterlen Bern Stähli FLAT LACING OR POLISHING DISC
JPS60217062A (en) * 1985-02-28 1985-10-30 Kanebo Ltd Surface polishing device
JPH08118240A (en) * 1994-10-18 1996-05-14 Yano Kazuya Grinding wheel and its manufacture
US20070122548A1 (en) * 2005-11-09 2007-05-31 Hiroshi Inaba Lapping tool and method for manufacturing the same
CN201483357U (en) * 2009-09-02 2010-05-26 四川欧曼机械有限公司 Mirror surface grinding disk
CN201799943U (en) * 2010-09-30 2011-04-20 郑州三祥科技有限公司 Diamond flexible disc
CN202278508U (en) * 2011-10-08 2012-06-20 苏州赛琅泰克高技术陶瓷有限公司 Grinding disc for grinding ceramic water valve plate
CN203092379U (en) * 2012-12-11 2013-07-31 东莞润明电子科技有限公司 Pyramid grinding disc

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3036518A1 (en) * 1979-10-04 1981-04-16 Arthur Werner Pieterlen Bern Stähli FLAT LACING OR POLISHING DISC
JPS60217062A (en) * 1985-02-28 1985-10-30 Kanebo Ltd Surface polishing device
JPH08118240A (en) * 1994-10-18 1996-05-14 Yano Kazuya Grinding wheel and its manufacture
US20070122548A1 (en) * 2005-11-09 2007-05-31 Hiroshi Inaba Lapping tool and method for manufacturing the same
CN201483357U (en) * 2009-09-02 2010-05-26 四川欧曼机械有限公司 Mirror surface grinding disk
CN201799943U (en) * 2010-09-30 2011-04-20 郑州三祥科技有限公司 Diamond flexible disc
CN202278508U (en) * 2011-10-08 2012-06-20 苏州赛琅泰克高技术陶瓷有限公司 Grinding disc for grinding ceramic water valve plate
CN203092379U (en) * 2012-12-11 2013-07-31 东莞润明电子科技有限公司 Pyramid grinding disc

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
陈延君等: "国内外砂带技术的发展及应用", 《航空制造技术》 *

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