CN101508093A - Planet grinding device - Google Patents
Planet grinding device Download PDFInfo
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- CN101508093A CN101508093A CNA2009100965210A CN200910096521A CN101508093A CN 101508093 A CN101508093 A CN 101508093A CN A2009100965210 A CNA2009100965210 A CN A2009100965210A CN 200910096521 A CN200910096521 A CN 200910096521A CN 101508093 A CN101508093 A CN 101508093A
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- layer
- grinding
- convex tendon
- clathrum
- abrasive disk
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Abstract
The planet grinding machine, which comprises a grinding disc, wherein the grinding disc consists of a tool player provided with a plurality of tool counter bores and a plurality of liquid holes and a grinding layer provided with radially and uniformly distributed grinding fluid embedded grooves with axial depth. The tool layer and the grinding layer are split and connected into a whole through a fastening piece, the grinding layer consists of a grinding liquid embedded groove layer, a solid layer and a convex rib grid layer, the solid layer is provided with through holes corresponding to the liquid holes, the liquid holes are communicated with the grinding fluid embedded grooves through the through holes, and convex ribs on the convex rib grid layer are provided with a plurality of connecting counter bores which are uniformly distributed. In the planet grinding machine, an integral grinding disc made of cast iron or carbon steel is horizontally divided into two independent parts connected by a fastening piece without changing the overall shape and size of the prior grinding disc, the grinding layer can be changed independently after being worn, and the material is saved; and the grinding layer is insusceptible to thermal deformation, the factors influencing the internal stress are reduced, and the flatness, parallelism and service life of the grinding layer are ensured.
Description
[technical field]
The invention belongs to a kind of star lapping machine, especially relate to a kind of high accuracy of all semiconductor wafers and sheetings such as various crystal, optics that is applicable to and grind or polish the star lapping machine of usefulness.
[background technology]
The semiconductor wafer that integrated circuit uses is made by the semiconductor billet cutting processing.When cutting, inner circle cutting machine or wire cutting machine are because of the variation of cutting condition, the thin slice that cuts into tends to exist deviation on thickness and flatness, even causes darker damage layer, and these all need to eliminate by grinding deviation, the elimination damage layer thickness of thickness and flatness.Along with development in science and technology, the requirement of precision advances to micron and nanometer, has higher requirement to grinding and polishing.
Before the present invention made, the grinder kind mainly contained disc type grinder, rotary shaft grinder and various special grinder.Wherein, the disc type grinder divides two kinds of single-deck and double plates so that abrasive disk quantity is different, and the application of two-lap lapping machine is the most common.When the planet two-lap lapping machine grinds, the workpiece hole of a carrier on the abrasive disk under a plurality of workpiece are put into simultaneously and are positioned on the machine.During operation, top lap can descend abrasive disk to make vertical lift relatively and horizontally rotate motion, down abrasive disk can relative top lap does that opposite direction horizontally rotates, carrier is under the forward and reverse driving of outer tooth disk, interior fluted disc teeth wall, carry workpiece and doing revolution and rotation on the abrasive disk down, under the effect of the extruding of upper and lower abrasive disk and lapping liquid, finish grinding.
Abrasive disk is most principal work parts in the star lapping machine, usually make by cast iron or carbon steel, the structure of top lap, following abrasive disk is basic identical, the grinding working face is oppositely arranged, they are respectively that a monoblock type that has center mounting hole is circular dull and stereotyped, its thickness varies in size according to disk track and difference to some extent, grinds the lapping liquid caulking groove that has axial depth, radially divides equally on the working face, and the lapping liquid caulking groove communicates with fluid hole on the tool layer that is located at grinding working face top.Described tool layer is provided with several frock counterbores for top lap, top lap can be mounted on the support by the frock counterbore, realizes oscilaltion.
There is following problems in existing star lapping machine: abrasive disk is subject to internal stress influence and is out of shape, under high speed grinding or polishing condition, abrasive disk is heated yielding, thereby influences the workpiece planarization degree and the depth of parallelism (TTV) in the course of the work, causes workpiece accuracy, quality to descend; Grinding working face is need make integral replacing after the grinding layer wearing and tearing, grinds the cost height.
[summary of the invention]
For solving the problems referred to above that prior art exists, the present invention aims to provide a kind of star lapping machine, the abrasive disk of this grinder can not be subjected to internal stress influence and be out of shape, using under grinding or the polishing condition at a high speed, having is heated does not need to do the advantage of integral replacing after anti-deformation is good, grinding layer weares and teares, thereby help economical with materials, reduce and grind cost, and effectively improve precision, quality and the production efficiency of grinding work-piece.
The technical scheme that realizes above-mentioned purpose is as follows:
The structure of this star lapping machine, comprise transmission mechanism, liquid supplying device, abrasive disk, and the interior fluted disc and the outer tooth disk that drive the abrasive disk motion, described abrasive disk is by the tool layer that is provided with several frock counterbores, a plurality of fluid holes, and be provided with axial depth, the grinding layer of radially dividing equally the lapping liquid caulking groove constitutes; It is characterized in that: described tool layer and grinding layer split, be connected into integral body by securing member, described grinding layer is made of lapping liquid caulking groove layer, physical layer and convex tendon clathrum, physical layer is provided with and the corresponding through hole of described fluid hole, described fluid hole via through holes communicates with the lapping liquid caulking groove, and the convex tendon of convex tendon clathrum is provided with a plurality of connection counterbores.
Aforesaid star lapping machine is characterized in that: described a plurality of connection counterbores are the uniform shape of symmetry.
Aforesaid star lapping machine is characterized in that: the height of every convex tendon of described convex tendon clathrum is consistent, and locates in one plane.
Aforesaid star lapping machine is characterized in that: the thickness of described physical layer is the 4-8 millimeter.
Aforesaid star lapping machine is characterized in that: the convex tendon angle of adjacent straight wire is 90 degree in the described convex tendon clathrum.
Aforesaid star lapping machine is characterized in that: the convex tendon angle of adjacent straight wire is 60 degree or 120 degree in the described convex tendon clathrum.
Beneficial effect: compared with prior art, the present invention is under the prerequisite that does not change existing abrasive disk global shape, size, the monoblock type abrasive disk level that cast iron or carbon steel are made is divided into two independent parts, connect by securing member, therefore, after the grinding layer wearing and tearing, as long as change grinding layer, tool layer then can be used continuously and not need to do integral replacing, can save nearly half of materials.After grinding layer adopts the monolithic construction of lapping liquid caulking groove layer, physical layer and convex tendon clathrum formation, when abradant surface generates heat because of grinding, heat spreads in gradient, owing to there is cavity around the convex tendon in the convex tendon clathrum, the convex tendon heating degree is different from the dull and stereotyped entity structure of prior art monoblock type, makes convex tendon become the reinforcement of abradant surface, has obtained the effect of similar umbrella frame, help guaranteeing the flatness and the depth of parallelism of abradant surface, long service life.Moreover physical layer thickness has only the 4-8 millimeter, is thinner than the thickness of monoblock type abrasive disk in the prior art far away, and under the effect of convex tendon and lapping liquid caulking groove, internal stress can not cause the grinding layer distortion.
[description of drawings]
Fig. 1 is a kind of structural representation of planet two-lap lapping machine.
Fig. 2 is the perspective view of top lap among Fig. 1.
Fig. 3 is the plan structure schematic diagram of grinding layer among Fig. 2.
Fig. 4 is the cutting plane structural representation of A among Fig. 3-A line.
Among the figure: frock counterbore 1, convex tendon 2, installing hole 3, lapping liquid caulking groove 4, cylindrical convex tendon 5, cavity 6, through hole 7, fluid hole 8 connects counterbore 9, tool layer 10, grinding layer 11; Cylinder 101, stirring motor 102, mill liquid bucket 103, support 104, top lap 105, following abrasive disk 106, interior fluted disc 107, outer tooth disk 108, on coil transmission separator 109, clutch slot 1091, control cabinet 110.
[specific embodiment]
Referring to Fig. 1, and in conjunction with Fig. 2.Figure 1 shows that a kind of planet two-lap lapping machine, following abrasive disk 106 is used to place carrier, and carrier structure is rounded, and its upper and lower faces is the plane, and outline is provided with tooth spare, and the middle part has a plurality of workpiece hole that are used to place grinding workpiece.During use, multichip carrier is periphery on following abrasive disk 106, and carrier tooth spare meshes with the interior fluted disc 107 of following abrasive disk 106 middle parts, periphery and the teeth wall of outer tooth disk 108 respectively.In the motion process, carrier is under the forward and reverse driving of inside and outside teeth wall, and top lap 105, under the extruding of following abrasive disk 106 and the lapping liquid effect, is being with workpiece to do revolution on following abrasive disk 106 and rotation is ground.Meanwhile, the lapping liquid in the mill liquid bucket 103 is under stirring motor 102 effects, and the groove that flows into support 104 napexes is interior and dirty through pipeline.Referring to the structure of top lap shown in Figure 2 105, dirty lapping liquid makes in the crisscross lapping liquid caulking groove 4 and is rich in lapping liquid in the lapping liquid caulking groove 4 of a plurality of fluid hole 8 percolations to top lap 105 grinding layers 11, guarantees that workpiece grinds to use liquid.Because from face shaping, look down upon greatly, top lap 105 of the present invention, down abrasive disk 106 is identical with prior art products, installation method is in full accord, therefore, its operation principle no longer is described in detail, structural difference is: top lap 105 of the present invention (descending abrasive disk 106 in other words) is made of tool layer 10 and grinding layer 11 two parts, is connected into integral body through securing member.
Be that example is described its internal structure in detail with top lap 105 below, this is innovation of the present invention place.
Referring to Fig. 3, and in conjunction with Fig. 2, Fig. 4.Figure 3 shows that top lap 105 removes the plan structure of the grinding layer 11 after the tool layer 10.The shape of tool layer 10, size are consistent with grinding layer 11, and it is that a positive and negative is the circular entity flat board that plane, middle part have installing hole 3, and frock counterbore 1, fluid hole 8 etc. are all consistent with prior art.For reaching identical fastening with grinding layer 11, correspondingly have some on the tool layer 10 and connect and use screwed holes, so that tool layer 10 and grinding layer 11 connections are tightened together through bolt.The middle part of grinding layer 11 is provided with installing hole 3, be evenly equipped with on the cylindrical convex tendon 5 at installing hole 3 peripheries, great circle periphery and middle part, the convex tendon 2 and connect counterbore 9, connect counterbore 9 corresponding to the connection screwed hole on the tool layer 10, the quantity, pore size, the distribution that connect counterbore 9 are decided on the lap diameter size, with uniform, firmly be principle.The through hole 7 that docks with the fluid hole 8 of tool layer 10 is located in the cavity 6 that convex tendon 2 surrounds, and also protruding circle should be set around the through hole 7, docks to realize sealing with the fluid hole 8 of tool layer 10.Certainly, through hole 7 also can be arranged on the convex tendon 2, can flow in the lapping liquid caulking groove 4 as long as guarantee lapping liquid.
Referring to Fig. 4, in conjunction with Fig. 3.From the thickness of grinding layer 11 to, the bottom upwards is followed successively by lapping liquid caulking groove layer, physical layer and convex tendon clathrum, there is cavity 6 between the convex tendon 2, and the angle between the convex tendon 2 of adjacent straight wire is 90 degree, forms rectangular mesh shape cavity 6, certainly, the angle that also can make the convex tendon 2 of adjacent straight wire as required is 60 degree or 120 degree, form the latticed cavity 6 of prismatic, perhaps other latticed cavity 6, principle is to guarantee that convex tendon 2 can play uniform reinforcement effect.The height of the every convex tendon 2 of described convex tendon clathrum is consistent, and locates in one plane, docks to guarantee to coincide with the lower plane of described tool layer 10.Above-mentioned physical layer is meant a plane between lapping liquid caulking groove layer and convex tendon clathrum, and its thickness is the 4-8 millimeter, decides on the lap diameter size.Lapping liquid caulking groove layer, physical layer and convex tendon clathrum are formed by cast iron or carbon steel integral cast.
In addition, the project organization of abrasive disk of the present invention not only is applicable to top lap 105 of the prior art, also be applicable to down abrasive disk 106, but also be applicable to for rotary shaft grinder and the abrasive disk of various special grinder use and the polishing disk architecture advances of polishing machine.On this design basis, similar improvement or the distortion done should be subjected to the protection of this patent.
Claims (6)
1, a kind of star lapping machine, comprise transmission mechanism, liquid supplying device, abrasive disk, and the interior fluted disc (107) and the outer tooth disk (108) that drive the abrasive disk motion, described abrasive disk is by the tool layer (10) that is provided with several frock counterbores (1), a plurality of fluid hole (8), and be provided with axial depth, the grinding layer (11) of radially dividing equally lapping liquid caulking groove (4) constitutes; It is characterized in that: described tool layer (10) and grinding layer (11) split, be connected into integral body by securing member, described grinding layer (11) is made of lapping liquid caulking groove layer, physical layer and convex tendon clathrum, physical layer is provided with and the corresponding through hole of described fluid hole (8) (7), described fluid hole (8) via through holes (7) communicates with lapping liquid caulking groove (4), and the convex tendon of convex tendon clathrum (2) is provided with a plurality of connection counterbores (9).
2, star lapping machine as claimed in claim 1 is characterized in that: described a plurality of connection counterbores (9) are the uniform shape of symmetry.
3, star lapping machine as claimed in claim 1 is characterized in that: the height of the every convex tendon (2) of described convex tendon clathrum is consistent, and locates in one plane.
4, star lapping machine as claimed in claim 1 is characterized in that: the thickness of described physical layer is the 4-8 millimeter.
5, star lapping machine as claimed in claim 1 or 2 is characterized in that: the angle of the convex tendon (2) of adjacent straight wire is 90 degree in the described convex tendon clathrum.
6, star lapping machine as claimed in claim 1 or 2 is characterized in that: the angle of the convex tendon (2) of adjacent straight wire is 60 degree or 120 degree in the described convex tendon clathrum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2009100965210A CN101508093A (en) | 2009-03-05 | 2009-03-05 | Planet grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2009100965210A CN101508093A (en) | 2009-03-05 | 2009-03-05 | Planet grinding device |
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|---|---|
| CN101508093A true CN101508093A (en) | 2009-08-19 |
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| CNA2009100965210A Pending CN101508093A (en) | 2009-03-05 | 2009-03-05 | Planet grinding device |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101966695A (en) * | 2010-08-30 | 2011-02-09 | 兰州瑞德实业集团有限公司 | Upper polishing disk of polishing machine |
| CN107097121A (en) * | 2017-07-04 | 2017-08-29 | 大连桑姆泰克工业部件有限公司 | Optical polish apparatus and system |
| CN108340271A (en) * | 2018-04-18 | 2018-07-31 | 海宁市三鑫剃须刀剪有限公司 | A kind of automatic plane grinder |
| CN108550535A (en) * | 2018-04-03 | 2018-09-18 | 韩赛 | A kind of lathe of crystal column surface processing |
| CN110744440A (en) * | 2019-10-22 | 2020-02-04 | 西安奕斯伟硅片技术有限公司 | Double-side grinding device and method |
-
2009
- 2009-03-05 CN CNA2009100965210A patent/CN101508093A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101966695A (en) * | 2010-08-30 | 2011-02-09 | 兰州瑞德实业集团有限公司 | Upper polishing disk of polishing machine |
| CN101966695B (en) * | 2010-08-30 | 2012-10-31 | 兰州瑞德实业集团有限公司 | Upper polishing disk of polishing machine |
| CN107097121A (en) * | 2017-07-04 | 2017-08-29 | 大连桑姆泰克工业部件有限公司 | Optical polish apparatus and system |
| CN108550535A (en) * | 2018-04-03 | 2018-09-18 | 韩赛 | A kind of lathe of crystal column surface processing |
| CN108550535B (en) * | 2018-04-03 | 2020-09-18 | 游精学 | Machine tool for processing surface of wafer |
| CN108340271A (en) * | 2018-04-18 | 2018-07-31 | 海宁市三鑫剃须刀剪有限公司 | A kind of automatic plane grinder |
| CN110744440A (en) * | 2019-10-22 | 2020-02-04 | 西安奕斯伟硅片技术有限公司 | Double-side grinding device and method |
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Open date: 20090819 |