CN102984890B - A kind of component mounter location structure and localization method - Google Patents
A kind of component mounter location structure and localization method Download PDFInfo
- Publication number
- CN102984890B CN102984890B CN201210403747.2A CN201210403747A CN102984890B CN 102984890 B CN102984890 B CN 102984890B CN 201210403747 A CN201210403747 A CN 201210403747A CN 102984890 B CN102984890 B CN 102984890B
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- Prior art keywords
- solder mask
- component mounter
- square
- wire casing
- described solder
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Links
- 238000000034 method Methods 0.000 title claims abstract description 14
- 230000004807 localization Effects 0.000 title claims abstract description 10
- 229910000679 solder Inorganic materials 0.000 claims abstract description 53
- 238000007665 sagging Methods 0.000 claims abstract description 7
- 238000009434 installation Methods 0.000 claims abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 239000011889 copper foil Substances 0.000 claims description 8
- 230000003064 anti-oxidating effect Effects 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 abstract 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of component mounter location structure, comprise the PCB for mount components, described PCB comprises solder mask, on described solder mask, the projection line of profile on described solder mask along element to be installed offers sagging wire casing, forms solder mask windowed thread.Also disclose a kind of corresponding component mounter localization method, when changing element, treat installation elements by described solder mask windowed thread and implement location.The present invention can improve element positioning precision when changing element and the PCBA scrappage caused manually is reprocessed in reduction, reduces PCB cost.
Description
Technical field
The present invention relates to hardware electronic, particularly relate to a kind of component mounter location structure and localization method.
Background technology
Along with the development of electronic product, electronic devices and components are more and more less, and placement accuracy requires more and more higher.Often need in electronic product maintenance process to change electronic component.As shown in Figure 1, for BGA(ball grid array) structure, traditional scheme is normally at PCB(printed circuit board (PCB)) and the position of upper installation elements 4, silk-screen white oil line 6 on solder mask 3, form white oil silk-screen frame, implement location when element is installed with reference to this white oil silk-screen frame.But white oil line has certain tolerance, be difficult to precise positioning, easily cause element to paste partially, cause rosin joint, time serious, even can cause product rejection.Meanwhile, PCB needs silk-screen one deck white oil, add cost.
Summary of the invention
Main purpose of the present invention is exactly for the deficiencies in the prior art, provides a kind of component mounter location structure and localization method, improves positioning precision and saves cost.
For achieving the above object, the present invention is by the following technical solutions:
A kind of component mounter location structure, comprise the PCB for mount components, described PCB comprises solder mask, and on described solder mask, the projection line of profile on described solder mask along element to be installed offers sagging wire casing, forms solder mask windowed thread.
Preferably, described solder mask windowed thread is made up of discrete several wire casings.
Preferably, the live width of each bar wire casing is not less than 0.125mm, and length is not less than 1mm.
Preferably, the projection line of described element profile on described solder mask is square, described solder mask windowed thread comprises the first straight-line groove be positioned on square first limit, be positioned at the second straight-line groove on the Second Edge adjacent with square first limit, and be positioned at the tri linear groove on angle that square 3rd limit becomes with quadrangle.
Preferably, described wire casing exposes the copper foil layer below described solder mask, and the copper foil layer surface in described wire casing is coated with metal that is anti-oxidation and corrosion.
Preferably, gold-plated in described wire casing.
A kind of component mounter localization method, said method comprising the steps of:
Along the projection line of element profile to be installed on the solder mask of PCB, described solder mask offers sagging wire casing, form solder mask windowed thread;
When changing element, treat installation elements by described solder mask windowed thread and implement location.
Preferably, described solder mask windowed thread is made up of discrete several wire casings.
Preferably, the projection line of described element profile on described solder mask is square, described solder mask windowed thread comprises the first straight-line groove be positioned on square first limit, be positioned at the second straight-line groove on the Second Edge adjacent with square first limit, and be positioned at the tri linear groove on angle that square 3rd limit becomes with quadrangle.
Preferably, gold-plated in described wire casing.
The technique effect that the present invention is useful is:
The present invention utilizes solder mask windowed thread on PCB to locate components and parts, and welding resistance is windowed and formed welding resistance line mark, and its positioning precision far above the precision of silk-screen white oil frame, will be conducive to the precise positioning of element when changing element.The present invention easily pastes when can solve component maintenance partially and causes the problem of rosin joint, reduces when manually reprocessing because the PCB scrappage being forbidden to cause located by element.In addition, owing to PCB having economized one deck silk-screen white oil layer, PCB cost has been reduced.
Accompanying drawing explanation
Fig. 1 is the cutaway view of traditional element attachment location structure;
Fig. 2 is the schematic top plan view of traditional element attachment location structure;
Fig. 3 is the cutaway view of a component mounter location structure of the present invention embodiment;
Fig. 4 is the schematic top plan view of a component mounter location structure of the present invention embodiment.
Embodiment
By reference to the accompanying drawings the present invention is described in further detail by the following examples.
Refer to Fig. 3, in some embodiments, component mounter location structure comprises the PCB for mount components, described PCB comprises base material 1, copper foil layer 2 and solder mask 3, on described solder mask 3, the projection line of profile on described solder mask 3 along element 4 to be installed offers sagging wire casing 5, forms solder mask windowed thread.
Can be gold-plated in described wire casing.
Described wire casing 5 can be the groove hollowing out described solder mask and expose the copper foil layer 2 below described solder mask 3, and the copper foil layer surface in described wire casing 5 is coated with metal that is anti-oxidation and corrosion.Preferably gold-plated, can available protecting copper foil layer, solder mask can be formed again and to window gold thread, be convenient to identify.
Preferably, described solder mask windowed thread is made up of discrete several wire casings.The concrete number of wire casing can be determined according to element profile.
As shown in Figure 4, for BGA structure, the projection line of element profile on described solder mask is square, described solder mask windowed thread comprises the first straight-line groove 501 be positioned on square first limit, be positioned at the second straight-line groove 502 on the Second Edge adjacent with square first limit, and be positioned at the tri linear groove 503 on angle that square 3rd limit becomes with quadrangle.
Form solder mask by shorter discontinuous wire casing instead of continuous print wire casing to window, convenient making, saves cost of manufacture, improves efficiency of windowing.
The live width of wire casing and length should be convenient to identify.Preferably, the live width of each bar wire casing is not less than 0.125mm, and length is not less than 1mm.
In an embodiment, component mounter localization method comprises the following steps:
Along the projection line of element profile to be installed on the solder mask of PCB, described solder mask offers sagging wire casing, form solder mask windowed thread;
When changing element, treat installation elements by described solder mask windowed thread and implement location.
Preferably, described solder mask windowed thread is made up of discrete several wire casings.
Above content is in conjunction with concrete preferred implementation further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, some simple deduction or replace can also be made, all should be considered as belonging to protection scope of the present invention.
Claims (8)
1. a component mounter location structure, comprise the PCB for mount components, described PCB comprises solder mask, it is characterized in that, on described solder mask, the projection line of profile on described solder mask along element to be installed offers sagging wire casing, and form solder mask windowed thread, described solder mask windowed thread is made up of discrete several wire casings.
2. component mounter location structure as claimed in claim 1, it is characterized in that, the live width of each bar wire casing is not less than 0.125mm, and length is not less than 1mm.
3. component mounter location structure as claimed in claim 1, it is characterized in that, the projection line of described element profile on described solder mask is square, described solder mask windowed thread comprises the first straight-line groove be positioned on square first limit, be positioned at the second straight-line groove on the Second Edge adjacent with square first limit, and be positioned at the tri linear groove on angle that square 3rd limit becomes with quadrangle.
4. the component mounter location structure as described in any one of claims 1 to 3, is characterized in that, described wire casing exposes the copper foil layer below described solder mask, and the copper foil layer surface in described wire casing is coated with metal that is anti-oxidation and corrosion.
5. the component mounter location structure as described in any one of claims 1 to 3, is characterized in that, gold-plated in described wire casing.
6. a component mounter localization method, is characterized in that, said method comprising the steps of:
Along the projection line of element profile to be installed on the solder mask of PCB, described solder mask offers sagging wire casing, form solder mask windowed thread, described solder mask windowed thread is made up of discrete several wire casings;
When changing element, treat installation elements by described solder mask windowed thread and implement location.
7. component mounter localization method as claimed in claim 6, it is characterized in that, the projection line of described element profile on described solder mask is square, described solder mask windowed thread comprises the first straight-line groove be positioned on square first limit, be positioned at the second straight-line groove on the Second Edge adjacent with square first limit, and be positioned at the tri linear groove on angle that square 3rd limit becomes with quadrangle.
8. the component mounter localization method as described in any one of claim 6 to 7, is characterized in that, gold-plated in described wire casing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210403747.2A CN102984890B (en) | 2012-10-22 | 2012-10-22 | A kind of component mounter location structure and localization method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210403747.2A CN102984890B (en) | 2012-10-22 | 2012-10-22 | A kind of component mounter location structure and localization method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102984890A CN102984890A (en) | 2013-03-20 |
| CN102984890B true CN102984890B (en) | 2015-08-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210403747.2A Expired - Fee Related CN102984890B (en) | 2012-10-22 | 2012-10-22 | A kind of component mounter location structure and localization method |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105934074B (en) * | 2016-06-28 | 2019-02-12 | Oppo广东移动通信有限公司 | Pcb board and mobile terminal with it |
| CN106413243A (en) * | 2016-10-31 | 2017-02-15 | 努比亚技术有限公司 | Substrate and circuit board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080068308A (en) * | 2007-01-19 | 2008-07-23 | 엘지이노텍 주식회사 | Module pcb and manufacturing method thereof |
| CN101231983A (en) * | 2007-01-23 | 2008-07-30 | 南茂科技股份有限公司 | Thin film crystal-covering package substrate |
| CN202374560U (en) * | 2011-12-15 | 2012-08-08 | 群光电子(苏州)有限公司 | Chip attachment printed circuit board (PCB) |
| CN202444693U (en) * | 2011-12-15 | 2012-09-19 | 群光电子(苏州)有限公司 | Chip mounting PCB |
| CN202889803U (en) * | 2012-10-22 | 2013-04-17 | 广东欧珀移动通信有限公司 | Mounting and positioning structure of element |
-
2012
- 2012-10-22 CN CN201210403747.2A patent/CN102984890B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080068308A (en) * | 2007-01-19 | 2008-07-23 | 엘지이노텍 주식회사 | Module pcb and manufacturing method thereof |
| CN101231983A (en) * | 2007-01-23 | 2008-07-30 | 南茂科技股份有限公司 | Thin film crystal-covering package substrate |
| CN202374560U (en) * | 2011-12-15 | 2012-08-08 | 群光电子(苏州)有限公司 | Chip attachment printed circuit board (PCB) |
| CN202444693U (en) * | 2011-12-15 | 2012-09-19 | 群光电子(苏州)有限公司 | Chip mounting PCB |
| CN202889803U (en) * | 2012-10-22 | 2013-04-17 | 广东欧珀移动通信有限公司 | Mounting and positioning structure of element |
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| Publication number | Publication date |
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| CN102984890A (en) | 2013-03-20 |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
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Granted publication date: 20150819 |