CN102984885A - Laminating method of printed circuit board with ultra-thickness copper foil on the surface of core plate - Google Patents
Laminating method of printed circuit board with ultra-thickness copper foil on the surface of core plate Download PDFInfo
- Publication number
- CN102984885A CN102984885A CN2012104592057A CN201210459205A CN102984885A CN 102984885 A CN102984885 A CN 102984885A CN 2012104592057 A CN2012104592057 A CN 2012104592057A CN 201210459205 A CN201210459205 A CN 201210459205A CN 102984885 A CN102984885 A CN 102984885A
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- China
- Prior art keywords
- copper foil
- prepreg
- core plate
- circuit board
- printed circuit
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Abstract
The invention relates to a printed circuit board, in particular to a laminating method of printed circuit board with ultra-thickness copper foil on the surface of a core plate. The laminating method includes the following steps: taking the core plate, wherein the thickness of the copper foil on the surface of the core plate is more than 140 microns, the copper foil is etched; filling prepreg powder in an etching groove on the surface of the copper foil; heating the core plate after the last step, enabling the prepreg powder to solute as well as not fall down from the etching groove; quickly cooling so as to enable the prepreg powder to be solidified and not to fall down; placing a prepreg layer on the surface of the core plate and placing a copper foil layer on the surface of the prepreg layer; and laminating the last step through a press machine. The laminating method is reasonable, and bits and pieces of prepregs are rubbed into powder shape, and the powder shaped prepregs are used to fill the etching groove. Then the prepreg layer is in press fit with the core plate, and the bits and pieces of the prepreg layer are utilized, materials are saved, and the lamination is tight, insulation performance is good. Electrical reliability of the printed circuit board is improved.
Description
Technical field
The present invention relates to a kind of printed circuit board (PCB), specifically relate to the compression method that a kind of central layer surface has the printed circuit board of super thick Copper Foil.
Background technology
The compression method of existing printed circuit board is the direct pressing of prepreg and central layer, if the Copper Foil on central layer surface is than book, during less than 140 microns, this direct compression method is all right, but when Copper Foil during greater than 140 microns, the groove of etween the lines will be very dark, be difficult in the pressing heating process effectively make the prepreg resin glue fully tamp densely etching bath, especially when line-spacing after a hour prepreg is heated flowability own will variation is as easy as rolling off a log produce cavity or bubble at etween the lines, cause printed circuit board when HAL or terminal SMT, to be subject to high temperature and produce plate bursting or layering.
Summary of the invention
Therefore, the object of the present invention is to provide a kind of good insulation preformance, pressing resin to fill out and rush the compression method that central layer surface closely knit and saving prepreg material has the printed circuit board of super thick Copper Foil.
The object of the present invention is achieved like this.
A kind of central layer surface has the compression method of the printed circuit board of super thick Copper Foil, and A gets central layer, and central layer surface copper thickness surpasses 140 microns, and Copper Foil is through etching; B fills the prepreg powder in the etching bath of copper foil surface; The central layer heating of C after with the B step makes the dissolving of prepreg powder and can not drop from etching bath to get final product; Then D cools rapidly, and the prepreg powder is not solidified can drop; E places layer of prepreg on the central layer surface again, places copper foil layer on the layer of prepreg surface; F is by forcing press pressing E step.
Said method also can be done further perfect.
Heating-up temperature in the described C step is 75-100 ℃, and be 1-3 minute heating time.
The inventive method is reasonable, be twisted into powdery by the leftover pieces prepreg, utilize the prepreg of powdery to fill first etching bath, again layer of prepreg and central layer pressing, utilize the leftover bits of layer of prepreg, economical with materials, pressing is closely knit, good insulation preformance has improved the electric reliability of printed circuit board.
Description of drawings
The layer structure decomposing schematic representation of Fig. 1 embodiment.
Embodiment
The present invention is done further perfect below in conjunction with drawings and Examples.
Embodiment, in conjunction with Fig. 1, a kind of central layer surface has the compression method of the printed circuit board of super thick Copper Foil, and A central layer 1 surface is provided with the Copper Foil 2 that thickness surpasses 140 microns, and Copper Foil 2 is through etching; B fills the prepreg powder in the etching bath on Copper Foil 2 surfaces; Central layer 1 heating of C after with the B step makes the dissolving of prepreg powder and can not drop from etching bath to get final product, and heating-up temperature is 75-100 ℃, and be 1-3 minute heating time; D is rapidly cooling then, and the prepreg powder is solidified; E places layer of prepreg 3 on the central layer surface again, places copper foil layer 4 on layer of prepreg 3 surfaces; F is by forcing press pressing E step.
Claims (2)
1. a central layer surface has the compression method of the printed circuit board of super thick Copper Foil, and it is characterized in that: A gets central layer, and central layer surface copper thickness surpasses 140 microns, and Copper Foil is through etching; B fills the prepreg powder in the etching bath of copper foil surface; The central layer heating of C after with the B step makes the dissolving of prepreg powder and can not drop from etching bath to get final product; Then D cools rapidly, and the prepreg powder is not solidified can drop; E places layer of prepreg on the central layer surface again, places copper foil layer on the layer of prepreg surface; F is by forcing press pressing E step.
2. described central layer surface has the compression method of the printed circuit board of super thick Copper Foil according to claim 1, and it is characterized in that: the heating-up temperature in the described C step is 75-100 ℃, and be 1-3 minute heating time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104592057A CN102984885A (en) | 2012-11-15 | 2012-11-15 | Laminating method of printed circuit board with ultra-thickness copper foil on the surface of core plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104592057A CN102984885A (en) | 2012-11-15 | 2012-11-15 | Laminating method of printed circuit board with ultra-thickness copper foil on the surface of core plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102984885A true CN102984885A (en) | 2013-03-20 |
Family
ID=47858497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012104592057A Pending CN102984885A (en) | 2012-11-15 | 2012-11-15 | Laminating method of printed circuit board with ultra-thickness copper foil on the surface of core plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102984885A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105101683A (en) * | 2015-08-06 | 2015-11-25 | 深圳市五株科技股份有限公司 | Multilayer heavy copper circuit board and manufacturing method thereof |
| CN106686912A (en) * | 2016-12-21 | 2017-05-17 | 皆利士多层线路版(中山)有限公司 | Thick-bottom copper multilayered circuit board and preparation method therefor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000151113A (en) * | 1998-11-06 | 2000-05-30 | Hitachi Chem Co Ltd | Manufacture of multilayer printed wiring board and multilayer printed wiring board manufactured thereby |
| CN102056425A (en) * | 2010-12-23 | 2011-05-11 | 北大方正集团有限公司 | Method for manufacturing multilayer printed circuit board (PCB) |
| US20110214907A1 (en) * | 2008-09-11 | 2011-09-08 | Doosan Corporation | Multi layer circuit board and manufacturing method of the same |
-
2012
- 2012-11-15 CN CN2012104592057A patent/CN102984885A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000151113A (en) * | 1998-11-06 | 2000-05-30 | Hitachi Chem Co Ltd | Manufacture of multilayer printed wiring board and multilayer printed wiring board manufactured thereby |
| US20110214907A1 (en) * | 2008-09-11 | 2011-09-08 | Doosan Corporation | Multi layer circuit board and manufacturing method of the same |
| CN102056425A (en) * | 2010-12-23 | 2011-05-11 | 北大方正集团有限公司 | Method for manufacturing multilayer printed circuit board (PCB) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105101683A (en) * | 2015-08-06 | 2015-11-25 | 深圳市五株科技股份有限公司 | Multilayer heavy copper circuit board and manufacturing method thereof |
| CN106686912A (en) * | 2016-12-21 | 2017-05-17 | 皆利士多层线路版(中山)有限公司 | Thick-bottom copper multilayered circuit board and preparation method therefor |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C05 | Deemed withdrawal (patent law before 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130320 |