CN102956662A - Vacuum sealing packaging structure and packaging method for infrared focal plane detector chip - Google Patents
Vacuum sealing packaging structure and packaging method for infrared focal plane detector chip Download PDFInfo
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- CN102956662A CN102956662A CN2012104787322A CN201210478732A CN102956662A CN 102956662 A CN102956662 A CN 102956662A CN 2012104787322 A CN2012104787322 A CN 2012104787322A CN 201210478732 A CN201210478732 A CN 201210478732A CN 102956662 A CN102956662 A CN 102956662A
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Abstract
The invention relates to a vacuum sealing packaging structure and a packaging method for an infrared focal plane detector chip. The packaging method comprises the following specific steps of: firstly, mounting the infrared focal plane detector chip and a getter in a chamber of a packaging casing and enabling the getter to be positioned between the infrared focal plane detector chip and the bottom of the packaging casing; and secondly, connecting an optical window with the packaging casing in a sealing manner to form a vacuum sealing chamber. According to the vacuum sealing packaging structure and the packaging method disclosed by the invention, the volume of the vacuum sealing packaging structure of the infrared focal plane detector chip is remarkably reduced; a traditional parallel mounting mode of the infrared focal plane detector chip and the getter is changed into a vertical mounting mode; and the requirement of portable infrared thermal imaging application to the packaging structure of the infrared focal plane detector chip on miniaturization is met. In addition, the packaging structure also provides a concise and effective thermal insulating structure and realizes an insulated work mode of the concise and effective thermal insulating structure; and the packaging structure is concise in structure and low in cost.
Description
Technical field
The present invention relates to the semi-conductor photoelectronic field, particularly a kind of infrared focal plane detector chip vacuum encapsulation structure and method for packing.
Background technology
Infrared imagery technique is applied to industrial sensor, visual monitoring, auto industry, fire-fighting search and rescue even the fields such as military navigation and night vision more and more widely.The infrared focal plane detector manufacturing technology is the core of thermal imaging realization technology, and infrared focal plane array seeker chip seal encapsulation techniques is to realize the key link of Infrared Detectors imaging, the infrared focal plane array seeker chip need to be worked in the sealed environment under the vacuum, otherwise can't bring into play the imaging function of its bolometer.Generally speaking, infrared focal plane array seeker high vacuum encapsulation technology adopts metal shell as annular seal space, its typical structure as shown in Figure 1, housing 2 is the cuboid cavity of an opening, made ceramic structures 3 on its sidewall, carried out seal welding through the cermet co-firing technology between ceramic structures 3 and the housing 2, made metal pad 31 on the ceramic structures 3, metal pad 31 is electric connections with the metal lead wire 32 that housing 2 sidewalls are attached to outward on the ceramic structures 3, like this, infrared focal plane detector chip 1 is through spun gold 4 and the outside electric connection that forms, realize the signal communication and control, infrared focal plane detector chip 1 is mounted on the thermoelectric refrigerating unit (TEC) 5, thermoelectric refrigerating unit (TEC) 5 is mounted on housing 2 base plates, thermoelectric refrigerating unit (TEC) 5 can make infrared focal plane detector chip 1 work under the stable temperature condition, seal welding between optical window 6 and the housing 2, like this, infrared focal plane detector chip 1 just is sealed in the closed environment, the external optical signal incides infrared focal plane detector chip 1 by optical window 6, optical window 6 need to keep high vacuum state with the seal chamber that housing 2 forms, in the product use procedure, in order to guarantee the high vacuum long term life, getter 7 need to be installed in cavity adsorb the gas that cavity inner wall and inner member discharge, getter 7 with the thermoelectric refrigerating unit 5 of infrared focal plane detector chip 1 is installed in a plane, the space that so just causes housing 2 internal cavities must increase the horizontal plane direction just can hold numerous elements such as lower getter 7 and thermoelectric refrigerating unit 5, this encapsulating structure inner member is many, volume is large, and along with the development of infrared thermal imaging technique, market demands infrared thermal imaging equipment volume is as far as possible smaller, especially some portable infrared thermal imaging apparatus, existing encapsulating structure can't satisfy the requirement of cramped construction, and this encapsulating structure element is many, power consumption is high, with high costs difficult with manufacture craft.And for some infrared focal plane detector chips, in some cases, need to the better environment of extraneous thermal insulation under work, above-mentioned existing encapsulating structure is difficult to satisfy application requirements.
Summary of the invention
Technical problem to be solved by this invention provides a kind of infrared focal plane detector chip vacuum encapsulation structure and method for packing, implementation structure compactness, miniaturization, the encapsulation of cost low vacuum.
The technical scheme that the present invention solves the problems of the technologies described above is as follows on the one hand: a kind of infrared focal plane detector chip vacuum encapsulation structure, comprise encapsulating housing, getter, infrared focal plane detector chip, optical window, described encapsulating housing and described optical window form a vacuum seal cavity, described infrared focal plane detector chip and described getter are installed in the described vacuum seal cavity, and described getter is between infrared focal plane detector chip and encapsulating housing bottom.
On the basis of technique scheme, the present invention can also do following improvement:
Further, described encapsulating housing is provided with two metal platforms in the middle of the bottom, the metal stitch electric connection that described two metal platforms and encapsulating housing outside are provided with, described two metal platforms weld with described getter two ends respectively, four jiaos of places are provided with four chain-wales in the described encapsulating shell body cavity, four bights of described infrared focal plane detector chip are installed on described four chain-wales, metal pad on the described infrared focal plane detector chip is electrically connected with metal pad on the encapsulating housing by spun gold, metal pad on the described encapsulating housing and metal stitch electric connection, the stepped ramp type welding region of described optical window edge and encapsulating housing inboard is tightly connected.
Further, described encapsulating housing material of main part is pottery.
Further, described getter is electric activation type getter, and the activated degasser of can switching on to keep it to the suction-operated of inside cavity residual gas, guarantees that the seal chamber environment is steady in a long-term, especially keeps the vacuum degree of vacuum environment.
Further, four bights of described infrared focal plane detector chip and four chain-wales connect or the solder welding by the gluing of low venting rate, and described optical window edge and encapsulating housing inner side step type welding region be bonding or solder welding by the sealing of sealing adhesives.
Further, described infrared focal plane detector chip periphery leaves the slit with four inwalls of encapsulating housing, the infrared focal plane detector chip is unsettled to be fixed in the encapsulating housing, form a good thermal insulation structure with the external world, guaranteed that infrared focal plane detector chip upper space is communicated with lower space in the seal chamber, made the vacuum hold facility of getter effective in whole seal chamber.
The technical scheme that the present invention solves the problems of the technologies described above is as follows on the other hand: a kind of infrared focal plane detector chip vacuum encapsulation method, it is characterized in that comprising,
Step 1: infrared focal plane detector chip and getter are installed in the cavity of encapsulating housing, and make getter between infrared focal plane detector chip and encapsulating housing bottom;
Step 2: optical window and encapsulating housing be tightly connected forms a vacuum seal cavity.
Further, described a kind of infrared focal plane detector chip vacuum encapsulation method, characterized by further comprising the preparation encapsulating housing, make described encapsulating housing comprise metal stitch, the metal pad of encapsulating housing inboard and the metal stitch electric connection of metal pad, encapsulating housing inner side step type welding region and the encapsulating housing outside of two middle metal platforms of encapsulating housing bottom, interior four jiaos of four chain-wales locating of encapsulating shell body cavity, encapsulating housing inboard.
Further, described step 1 specifically comprises:
The getter two ends are welded on described two metal platforms;
Four bights of infrared focal plane detector chip are connect by low venting rate gluing or solder is welded on described four chain-wales, by spun gold the metal pad on the infrared focal plane detector chip is electrically connected with the metal pad of encapsulating housing inboard.
Further, described getter makes electricity consumption activation type getter.
Further, described infrared focal plane detector chip periphery leaves the slit with four inwalls of encapsulating housing.
Further, described step 2 is specially, and seals bonding or a solder welding formation vacuum seal cavity by sealing adhesives optical window and encapsulating housing inner side step type welding region.
Further, described encapsulating housing material of main part uses pottery.
The invention has the beneficial effects as follows: the present invention greatly dwindles the seal chamber inner space, the infrared focal plane detector chip is changed into the at right angle setting mode with getter by traditional parallel mounting means, reduced the volume of encapsulating structure, realized that the Portable thermal imaging applications is to infrared focal plane detector encapsulating structure miniaturization requirement, and, this encapsulating structure also provides succinct effectively thermal insulation structure for the infrared focal plane detector chip, realizes its thermal insulation mode of operation.The present invention has also significantly simplified the encapsulating structure of infrared focal plane array seeker chip, has reduced packaging cost.
Description of drawings
Fig. 1 is existing infrared focal plane detector chip sealed package typical structure schematic diagram;
Fig. 2 is existing infrared focal plane detector chip sealed package typical structure blast structural representation;
Fig. 3 is infrared focal plane detector chip encapsulation structure schematic diagram of the present invention;
Fig. 4 is infrared focal plane detector chip encapsulation structure blast structural representation of the present invention;
Fig. 5 is encapsulated shell structural schematic diagram of the present invention.
In the accompanying drawing, the list of parts of each label representative is as follows:
A, encapsulating housing, B, infrared focal plane detector chip, C, optical window, D, getter, E, spun gold.
Embodiment
Below in conjunction with accompanying drawing principle of the present invention and feature are described, institute gives an actual example and only is used for explaining the present invention, is not be used to limiting scope of the present invention.
As depicted in figs. 1 and 2, existing infrared focal plane array seeker high vacuum encapsulation technology adopts metal shell as seal chamber, housing 2 is the cuboid cavity of an opening, made ceramic structures 3 on its sidewall, carried out seal welding through the cermet co-firing technology between ceramic structures 3 and the housing 2, made metal pad 31 on the ceramic structures 3, metal pad 31 is electric connections with the metal lead wire 32 that housing 2 sidewalls are attached to outward on the ceramic structures 3, like this, infrared focal plane detector chip 1 is through spun gold 4 and the outside electric connection that forms, realize the signal communication and control, infrared focal plane detector chip 1 is mounted on the thermoelectric refrigerating unit (TEC) 5, thermoelectric refrigerating unit (TEC) 5 is mounted on housing 2 base plates, thermoelectric refrigerating unit (TEC) 5 can make infrared focal plane detector chip 1 work under the stable temperature condition, seal welding between optical window 6 and the housing 2, like this, infrared focal plane detector chip 1 just is sealed in the closed environment, the external optical signal incides infrared focal plane detector chip 1 by optical window 6, optical window 6 need to keep high vacuum state with the seal chamber that housing 2 forms, in the product use procedure, in order to guarantee the high vacuum long term life, getter 7 need to be installed in cavity adsorb the gas that cavity inner wall and inner member discharge, getter 7 with the thermoelectric refrigerating unit 5 of infrared focal plane detector chip 1 is installed in a plane.
Such as Fig. 3, Fig. 4 and shown in Figure 5, encapsulating housing A and optical window C form a closed cavity, infrared focal plane detector chip B is sealed in the vacuum environment, encapsulating housing A material of main part is generally pottery, encapsulating housing A is provided with two metal platform A2 in the middle of the bottom, electricity activation type getter D is welded on two metal platform A2 of encapsulating housing A interior bottom portion, the metal stitch A5 of these two metal platform A2 and encapsulating housing A outside also is electric connection, like this, metal stitch A5 by the outside, activated degasser D just can switch on, to keep the suction-operated to the inside cavity residual gas, guarantee that the seal chamber environment is steady in a long-term, especially the vacuum keep during vacuum environment, four jiaos are provided with four chain-wales A1 in the encapsulating housing A chamber, four bights of infrared focal plane detector chip B are installed on four chain-wales A1 of encapsulating housing A, can come bonding by glue or the solder of low venting rate, the infrared focal plane detector chip is fixed among the encapsulating housing A with regard to unsettled like this, form a good thermal insulation structure with the external world, metal pad B1 on the infrared focal plane detector chip B is electrically connected by the formation of the pad A3 on spun gold E and the encapsulating housing A, and be the internal electrical conducting between the pad A3 on the encapsulating housing A and its outside metal stitch A5, thereby realization infrared focal plane detector chip B is electrically connected with external circuit, optical window C forms hermetically-sealed construction by the stepped ramp type welding region A4 that sealing adhesives or solder are welded on the encapsulating housing A, the mid portion of infrared focal plane detector chip B is the pixel array, can pass through infrared optical window C, receive the radiation of outer scene, to obtain the external heat image, the inwall of encapsulating housing A is a bit larger tham infrared focal plane detector chip B, four inwalls at infrared focal plane detector chip B periphery and encapsulating housing A form some slits like this, so both saved to greatest extent the space of encapsulating housing A inside, dwindle the volume of whole encapsulating structure, also guaranteed in the hermetically-sealed construction infrared focal plane detector chip B upper space and lower space together with, make the vacuum hold facility of getter D effective in whole seal chamber.
The above only is preferred embodiment of the present invention, and is in order to limit the present invention, within the spirit and principles in the present invention not all, any modification of doing, is equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (13)
1. infrared focal plane detector chip vacuum encapsulation structure, it is characterized in that comprising, encapsulating housing, getter, infrared focal plane detector chip, optical window, described encapsulating housing and described optical window form a vacuum seal cavity, described infrared focal plane detector chip and described getter are installed in the described vacuum seal cavity, and described getter is between infrared focal plane detector chip and encapsulating housing bottom.
2. described a kind of infrared focal plane detector chip vacuum encapsulation structure according to claim 1, it is characterized in that, described encapsulating housing is provided with two metal platforms in the middle of the bottom, the metal stitch electric connection that described two metal platforms and encapsulating housing outside are provided with, described two metal platforms weld with described getter two ends respectively, four jiaos of places are provided with four platforms in the described encapsulating shell body cavity, four bights of described infrared focal plane detector chip are installed on the described four platforms, metal pad on the described infrared focal plane detector chip is electrically connected with metal pad on the encapsulating housing by spun gold, metal pad on the described encapsulating housing and metal stitch electric connection, the stepped ramp type welding region of described optical window edge and encapsulating housing inboard is tightly connected.
3. described a kind of infrared focal plane detector chip vacuum encapsulation structure according to claim 1 and 2 is characterized in that, described encapsulating housing material of main part is pottery.
4. described a kind of infrared focal plane detector chip vacuum encapsulation structure according to claim 1 and 2 is characterized in that, described getter is electric activation type getter.
5. described a kind of infrared focal plane detector chip vacuum encapsulation structure according to claim 2, it is characterized in that, four bights of described infrared focal plane detector chip and four platforms connect or the solder welding by the gluing of low venting rate, and described optical window edge and encapsulating housing inner side step type welding region be bonding or solder welding by the sealing of sealing adhesives.
6. according to claim 2 or 5 described a kind of infrared focal plane detector chip vacuum encapsulation structures, it is characterized in that, described infrared focal plane detector chip periphery leaves the slit with four inwalls of encapsulating housing.
7. an infrared focal plane detector chip vacuum encapsulation method is characterized in that comprising,
Step 1: infrared focal plane detector chip and getter are installed in the cavity of encapsulating housing, and make getter between infrared focal plane detector chip and encapsulating housing bottom;
Step 2: optical window and encapsulating housing be tightly connected forms a vacuum seal cavity.
8. described a kind of infrared focal plane detector chip vacuum encapsulation method according to claim 7, characterized by further comprising the preparation encapsulating housing, make described encapsulating housing comprise metal stitch, the metal pad of encapsulating housing inboard and the metal stitch electric connection of metal pad, encapsulating housing inner side step type welding region and the encapsulating housing outside of two middle metal platforms of encapsulating housing bottom, the interior four jiaos of four platformses located of encapsulating shell body cavity, encapsulating housing inboard.
9. described a kind of infrared focal plane detector chip vacuum encapsulation method according to claim 8 is characterized in that, described step 1 specifically comprises,
The getter two ends are welded on described two metal platforms;
Four bights of infrared focal plane detector chip are connect by low venting rate gluing or solder is welded on the described four platforms, by spun gold the metal pad on the infrared focal plane detector chip is electrically connected with the metal pad of encapsulating housing inboard.
10. according to claim 7 or 9 described a kind of infrared focal plane detector chip vacuum encapsulation methods, it is characterized in that, described getter makes electricity consumption activation type getter.
11. according to claim 7 or 9 described a kind of infrared focal plane detector chip vacuum encapsulation methods, it is characterized in that, described infrared focal plane detector chip periphery leaves the slit with four inwalls of encapsulating housing.
12. described a kind of infrared focal plane detector chip vacuum encapsulation method according to claim 8, it is characterized in that, described step 2 is specially, and seals bonding or a solder welding formation vacuum seal cavity by sealing adhesives optical window and encapsulating housing inner side step type welding region.
13. described a kind of infrared focal plane detector chip vacuum encapsulation method is characterized in that according to claim 8, described encapsulating housing material of main part uses pottery.
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105244384A (en) * | 2015-08-27 | 2016-01-13 | 无锡伊佩克科技有限公司 | Vacuum packaging structure of infrared imaging chip |
| CN106404187A (en) * | 2016-10-21 | 2017-02-15 | 云南北方昆物光电科技发展有限公司 | Non-refrigerated focal plane infrared detector chip vacuum packaging structure and process |
| CN107275415A (en) * | 2017-05-27 | 2017-10-20 | 中国科学院上海技术物理研究所 | The focal plane infrared detector module encapsulating structure of integrated multilevel TEC |
| CN109449215A (en) * | 2018-09-20 | 2019-03-08 | 中国电子科技集团公司第十研究所 | A kind of infrared detector electricity ejector |
| CN109599388A (en) * | 2018-10-26 | 2019-04-09 | 陈彭 | A kind of encapsulating structure for encapsulating antenna |
| CN109979883A (en) * | 2019-04-30 | 2019-07-05 | 烟台艾睿光电科技有限公司 | A kind of integrated device mould group |
| CN110047858A (en) * | 2019-03-25 | 2019-07-23 | 江苏鼎茂半导体有限公司 | A kind of packaging method of wafer scale infrared detecting chip |
| CN111327809A (en) * | 2020-03-23 | 2020-06-23 | 中国科学院长春光学精密机械与物理研究所 | Circuit structure for realizing vacuum refrigeration of imaging terminal |
| CN111370498A (en) * | 2020-03-23 | 2020-07-03 | 中国科学院长春光学精密机械与物理研究所 | Small permanent high-vacuum cavity of detector and preparation method |
| CN111360357A (en) * | 2020-04-19 | 2020-07-03 | 大连优迅科技有限公司 | Welding device and method for thermoelectric refrigerator with double-sided gold-tin solder |
| CN112670250A (en) * | 2020-12-25 | 2021-04-16 | 广东先导稀材股份有限公司 | Manufacturing method of infrared detector module |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6040625A (en) * | 1997-09-25 | 2000-03-21 | I/O Sensors, Inc. | Sensor package arrangement |
| US20090229181A1 (en) * | 2004-10-27 | 2009-09-17 | Kyocer Corporation | Fuel reformer housing container and fuel reforming apparatus |
| US20110156190A1 (en) * | 2009-03-27 | 2011-06-30 | Kyocera Corporation | Electronic component |
-
2012
- 2012-11-22 CN CN201210478732.2A patent/CN102956662B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6040625A (en) * | 1997-09-25 | 2000-03-21 | I/O Sensors, Inc. | Sensor package arrangement |
| US20090229181A1 (en) * | 2004-10-27 | 2009-09-17 | Kyocer Corporation | Fuel reformer housing container and fuel reforming apparatus |
| US20110156190A1 (en) * | 2009-03-27 | 2011-06-30 | Kyocera Corporation | Electronic component |
Cited By (17)
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|---|---|---|---|---|
| CN105244384A (en) * | 2015-08-27 | 2016-01-13 | 无锡伊佩克科技有限公司 | Vacuum packaging structure of infrared imaging chip |
| CN106404187A (en) * | 2016-10-21 | 2017-02-15 | 云南北方昆物光电科技发展有限公司 | Non-refrigerated focal plane infrared detector chip vacuum packaging structure and process |
| CN107275415A (en) * | 2017-05-27 | 2017-10-20 | 中国科学院上海技术物理研究所 | The focal plane infrared detector module encapsulating structure of integrated multilevel TEC |
| CN107275415B (en) * | 2017-05-27 | 2023-05-05 | 中国科学院上海技术物理研究所 | Focal plane infrared detector assembly packaging structure of integrated multi-stage thermoelectric refrigerator |
| CN109449215A (en) * | 2018-09-20 | 2019-03-08 | 中国电子科技集团公司第十研究所 | A kind of infrared detector electricity ejector |
| CN109599388A (en) * | 2018-10-26 | 2019-04-09 | 陈彭 | A kind of encapsulating structure for encapsulating antenna |
| CN110047858A (en) * | 2019-03-25 | 2019-07-23 | 江苏鼎茂半导体有限公司 | A kind of packaging method of wafer scale infrared detecting chip |
| CN109979883A (en) * | 2019-04-30 | 2019-07-05 | 烟台艾睿光电科技有限公司 | A kind of integrated device mould group |
| CN111370498A (en) * | 2020-03-23 | 2020-07-03 | 中国科学院长春光学精密机械与物理研究所 | Small permanent high-vacuum cavity of detector and preparation method |
| CN111327809B (en) * | 2020-03-23 | 2021-06-25 | 中国科学院长春光学精密机械与物理研究所 | Circuit structure for realizing vacuum refrigeration of imaging terminal |
| CN111370498B (en) * | 2020-03-23 | 2022-05-31 | 中国科学院长春光学精密机械与物理研究所 | Small permanent high-vacuum cavity of detector and preparation method |
| CN111327809A (en) * | 2020-03-23 | 2020-06-23 | 中国科学院长春光学精密机械与物理研究所 | Circuit structure for realizing vacuum refrigeration of imaging terminal |
| CN111360357A (en) * | 2020-04-19 | 2020-07-03 | 大连优迅科技有限公司 | Welding device and method for thermoelectric refrigerator with double-sided gold-tin solder |
| CN112670250A (en) * | 2020-12-25 | 2021-04-16 | 广东先导稀材股份有限公司 | Manufacturing method of infrared detector module |
| CN112670250B (en) * | 2020-12-25 | 2022-04-08 | 东莞先导先进科技有限公司 | Manufacturing method of infrared detector module |
| CN114975684A (en) * | 2022-05-16 | 2022-08-30 | 东莞先导先进科技有限公司 | Infrared detector packaging method |
| CN114975684B (en) * | 2022-05-16 | 2023-06-09 | 东莞先导先进科技有限公司 | Infrared detector packaging method |
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Address after: 264006 Yantai economic and Technological Development Zone, Guiyang, No. 11 main street, Shandong Patentee after: Yantai Rui micro nano technology Limited by Share Ltd Address before: 264006 Yantai economic and Technological Development Zone, Guiyang, No. 11 main street, Shandong Patentee before: Yantai Raytron Technology Co., Ltd. |