CN102956597A - Lead frame structure - Google Patents
Lead frame structure Download PDFInfo
- Publication number
- CN102956597A CN102956597A CN2012104710335A CN201210471033A CN102956597A CN 102956597 A CN102956597 A CN 102956597A CN 2012104710335 A CN2012104710335 A CN 2012104710335A CN 201210471033 A CN201210471033 A CN 201210471033A CN 102956597 A CN102956597 A CN 102956597A
- Authority
- CN
- China
- Prior art keywords
- lead frame
- frame structure
- bonding area
- bonding region
- middle pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210471033.5A CN102956597B (en) | 2012-11-20 | 2012-11-20 | A kind of lead frame structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210471033.5A CN102956597B (en) | 2012-11-20 | 2012-11-20 | A kind of lead frame structure |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102956597A true CN102956597A (en) | 2013-03-06 |
CN102956597B CN102956597B (en) | 2016-05-11 |
Family
ID=47765204
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210471033.5A Expired - Fee Related CN102956597B (en) | 2012-11-20 | 2012-11-20 | A kind of lead frame structure |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102956597B (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008028154A (en) * | 2006-07-21 | 2008-02-07 | Sumitomo Metal Mining Package Materials Co Ltd | Lead frame for optical semiconductor device |
CN201904329U (en) * | 2010-12-22 | 2011-07-20 | 日立电线(苏州)精工有限公司 | Lead frame |
CN201956341U (en) * | 2011-01-06 | 2011-08-31 | 无锡市玉祁红光电子有限公司 | Lead framework structure of middle pin |
-
2012
- 2012-11-20 CN CN201210471033.5A patent/CN102956597B/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008028154A (en) * | 2006-07-21 | 2008-02-07 | Sumitomo Metal Mining Package Materials Co Ltd | Lead frame for optical semiconductor device |
CN201904329U (en) * | 2010-12-22 | 2011-07-20 | 日立电线(苏州)精工有限公司 | Lead frame |
CN201956341U (en) * | 2011-01-06 | 2011-08-31 | 无锡市玉祁红光电子有限公司 | Lead framework structure of middle pin |
Also Published As
Publication number | Publication date |
---|---|
CN102956597B (en) | 2016-05-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2013247131A5 (en) | Semiconductor device | |
JP2012058243A5 (en) | ||
CN103522221A (en) | Device for bidirectionally positioning and clamping wafer | |
CN102956597A (en) | Lead frame structure | |
CN103926487B (en) | A kind of pick-up unit of two pole electronic devices and components | |
CN204365578U (en) | A kind of point gum machine positioning plate for inductor | |
CN201956341U (en) | Lead framework structure of middle pin | |
JP2015035554A5 (en) | ||
CN203826365U (en) | Sheet-type diode | |
CN103436998B (en) | Combing machine top combing spring bearer plate device | |
CN204375731U (en) | A kind of COB substrate and COB light source | |
CN205028921U (en) | Chip carrier installation device of chip mounting machine | |
MY172913A (en) | Gold die bond sheet preform | |
CN202394842U (en) | Semiconductor graphite die | |
CN102931563B (en) | A kind of automotive connector press fit device | |
CN203536425U (en) | Novel structure used for fixing heat radiation copper sheet | |
CN202343726U (en) | Fixing plate of ejector of blanking and punching compound die | |
CN203572505U (en) | Sensor sealing structure | |
CN203536410U (en) | Supporting leg for bent-foot radiating fin used for semiconductor packaging part | |
CN102956600A (en) | Lead frame structure | |
CN202384327U (en) | Small-size chip package structure | |
CN202632419U (en) | Intelligent integrated circuit (IC) card gas meter | |
CN203277354U (en) | Single-arm rectification module | |
CN102117754B (en) | The turnover mould device of installing spacing sheet of thyristor anode | |
CN203061720U (en) | Upper die base used for automobile die |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Fan Yafu Inventor after: Lu Shensheng Inventor after: Cheng Quanming Inventor after: Chu Zhenwei Inventor after: Yu Yang Inventor after: Li Guoqian Inventor before: Huang Tiejun |
|
TR01 | Transfer of patent right |
Effective date of registration: 20170905 Address after: 063300, 302, building 2, room 3, Qingnian Road youth building, Fengnan District, Hebei, Tangshan City Co-patentee after: Lu Shensheng Patentee after: Fan Yafu Co-patentee after: Cheng Quanming Co-patentee after: Chu Zhenwei Co-patentee after: Yu Yang Co-patentee after: Li Guoqian Address before: 214000, No. 28, glue Road, anzhen Town, Xishan District, Jiangsu, Wuxi Patentee before: WUXI WEIHAIDA MACHINERY MANUFACTURING Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
CB03 | Change of inventor or designer information |
Inventor after: Liu Li Inventor after: Han Yuqi Inventor after: Guo Cai Inventor after: Zhang Caixia Inventor after: Wan Huilin Inventor after: Lu Shensheng Inventor after: Li Guoqian Inventor before: Fan Yafu Inventor before: Lu Shensheng Inventor before: Cheng Quanming Inventor before: Chu Zhenwei Inventor before: Yu Yang Inventor before: Li Guoqian |
|
CB03 | Change of inventor or designer information | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180103 Address after: 063300, 302, building 2, room 3, Qingnian Road youth building, Fengnan District, Hebei, Tangshan City Co-patentee after: Han Yuqi Patentee after: Liu Li Co-patentee after: Guo Cai Co-patentee after: Zhang Caixia Co-patentee after: Wan Huilin Co-patentee after: Lu Shensheng Co-patentee after: Li Guoqian Address before: 063300, 302, building 2, room 3, Qingnian Road youth building, Fengnan District, Hebei, Tangshan City Co-patentee before: Lu Shensheng Patentee before: Fan Yafu Co-patentee before: Cheng Quanming Co-patentee before: Chu Zhenwei Co-patentee before: Yu Yang Co-patentee before: Li Guoqian |
|
TR01 | Transfer of patent right |
Effective date of registration: 20180319 Address after: 102600, No. 3, building 2, building 4, Paradise Road, Beijing, Daxing District, 1, unit 317 Patentee after: BEIJING ZHITOUJIA INTELLECTUAL PROPERTY OPERATION CO.,LTD. Address before: 063300, 302, building 2, room 3, Qingnian Road youth building, Fengnan District, Hebei, Tangshan City Co-patentee before: Han Yuqi Patentee before: Liu Li Co-patentee before: Guo Cai Co-patentee before: Zhang Caixia Co-patentee before: Wan Huilin Co-patentee before: Lu Shensheng Co-patentee before: Li Guoqian |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180504 Address after: 315113 East Village, Wu Town, Yinzhou District, Ningbo, Zhejiang Patentee after: NINGBO GANGBO ELECTRONICS CO.,LTD. Address before: 102600 3 floor, 2 building, No. 4 Daxing District Garden Road, Beijing, 1 unit 317 Patentee before: BEIJING ZHITOUJIA INTELLECTUAL PROPERTY OPERATION CO.,LTD. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220217 Address after: 315194 Li Huaqiao village, Shounan street, Yinzhou District, Ningbo City, Zhejiang Province (Xinxing Industrial Development Park) Patentee after: NINGBO DEZHOU PRECISION ELECTRONIC CO.,LTD. Address before: 315113 East Village, Wu Town, Yinzhou District, Ningbo, Zhejiang Patentee before: NINGBO GANGBO ELECTRONICS CO.,LTD. |
|
TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160511 |
|
CF01 | Termination of patent right due to non-payment of annual fee |