CN102956597A - Lead frame structure - Google Patents

Lead frame structure Download PDF

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Publication number
CN102956597A
CN102956597A CN2012104710335A CN201210471033A CN102956597A CN 102956597 A CN102956597 A CN 102956597A CN 2012104710335 A CN2012104710335 A CN 2012104710335A CN 201210471033 A CN201210471033 A CN 201210471033A CN 102956597 A CN102956597 A CN 102956597A
Authority
CN
China
Prior art keywords
lead frame
frame structure
bonding area
bonding region
middle pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN2012104710335A
Other languages
Chinese (zh)
Other versions
CN102956597B (en
Inventor
黄铁军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Dezhou Precision Electronic Co ltd
Original Assignee
WUXI WEIHAIDA MACHINERY MANUFACTURING Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WUXI WEIHAIDA MACHINERY MANUFACTURING Co Ltd filed Critical WUXI WEIHAIDA MACHINERY MANUFACTURING Co Ltd
Priority to CN201210471033.5A priority Critical patent/CN102956597B/en
Publication of CN102956597A publication Critical patent/CN102956597A/en
Application granted granted Critical
Publication of CN102956597B publication Critical patent/CN102956597B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The invention discloses a lead frame structure. The upper part of a middle pin is additionally provided with a bonding area structure, an inner lead bonded on a frame bottom plate is bonded on the middle pin, a bonding area of the frame bottom plate is replaced by a tube pin bonding area, the bonding area structure is in a rectangle shape, and one corner of the bonding area structure is provided with a chamfer notch. The lead frame structure provided by the invention has the advantage that the accurate positioning of the middle pin part is realized by the chamfer notch of the bonding area structure.

Description

A kind of lead frame structure
Technical field
The present invention relates to the semi-conductor discrete device sealed in unit, particularly a kind of lead frame structure.
Background technology
In the lead frame structure of first to file 201120002305-middle pin, a kind of lead frame structure by going between at middle pin and connecting is disclosed, this stabilized structure is good, but connected mode and technical process are not easy operation, particularly location difficulty.
Summary of the invention
Problem for the lead frame structure location difficulty that solves prior art the invention provides a kind of lead frame structure.
Purpose of the present invention is come specific implementation by the following technical programs:
A kind of lead frame structure, increase the bonding region domain structure on middle pin top, to be bonded in leading wire bonding on the chassis base on middle pin, substituted the chassis base bonding region with the pin bonding region, described bonding region domain structure is that rectangle and an angle therein are provided with the breach of cutting sth. askew.
Lead frame structure provided by the invention can realize accurate location to silver-colored angular position, centre by the breach of cutting sth. askew of bonding region domain structure setting.
Description of drawings
The below is described in further detail the present invention with embodiment with reference to the accompanying drawings.
Fig. 1 is the structure chart of the described lead frame structure of the embodiment of the invention.
Embodiment
As shown in Figure 1, the described a kind of lead frame structure 1 of the embodiment of the invention, increase bonding region domain structure 11 on middle pin top, to be bonded in leading wire bonding on the chassis base on middle pin, substituted the chassis base bonding region with the pin bonding region, described bonding region domain structure 11 is provided with the breach of cutting sth. askew for rectangle and an angle therein.
Lead frame structure provided by the invention can realize accurate location to silver-colored angular position, centre by the breach of cutting sth. askew of bonding region domain structure setting.

Claims (1)

1. lead frame structure, it is characterized in that, increase the bonding region domain structure on middle pin top, to be bonded in leading wire bonding on the chassis base on middle pin, substituted the chassis base bonding region with the pin bonding region, described bonding region domain structure is that rectangle and an angle therein are provided with the breach of cutting sth. askew.
CN201210471033.5A 2012-11-20 2012-11-20 A kind of lead frame structure Expired - Fee Related CN102956597B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210471033.5A CN102956597B (en) 2012-11-20 2012-11-20 A kind of lead frame structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210471033.5A CN102956597B (en) 2012-11-20 2012-11-20 A kind of lead frame structure

Publications (2)

Publication Number Publication Date
CN102956597A true CN102956597A (en) 2013-03-06
CN102956597B CN102956597B (en) 2016-05-11

Family

ID=47765204

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210471033.5A Expired - Fee Related CN102956597B (en) 2012-11-20 2012-11-20 A kind of lead frame structure

Country Status (1)

Country Link
CN (1) CN102956597B (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008028154A (en) * 2006-07-21 2008-02-07 Sumitomo Metal Mining Package Materials Co Ltd Lead frame for optical semiconductor device
CN201904329U (en) * 2010-12-22 2011-07-20 日立电线(苏州)精工有限公司 Lead frame
CN201956341U (en) * 2011-01-06 2011-08-31 无锡市玉祁红光电子有限公司 Lead framework structure of middle pin

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008028154A (en) * 2006-07-21 2008-02-07 Sumitomo Metal Mining Package Materials Co Ltd Lead frame for optical semiconductor device
CN201904329U (en) * 2010-12-22 2011-07-20 日立电线(苏州)精工有限公司 Lead frame
CN201956341U (en) * 2011-01-06 2011-08-31 无锡市玉祁红光电子有限公司 Lead framework structure of middle pin

Also Published As

Publication number Publication date
CN102956597B (en) 2016-05-11

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C06 Publication
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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CB03 Change of inventor or designer information
CB03 Change of inventor or designer information

Inventor after: Fan Yafu

Inventor after: Lu Shensheng

Inventor after: Cheng Quanming

Inventor after: Chu Zhenwei

Inventor after: Yu Yang

Inventor after: Li Guoqian

Inventor before: Huang Tiejun

TR01 Transfer of patent right

Effective date of registration: 20170905

Address after: 063300, 302, building 2, room 3, Qingnian Road youth building, Fengnan District, Hebei, Tangshan City

Co-patentee after: Lu Shensheng

Patentee after: Fan Yafu

Co-patentee after: Cheng Quanming

Co-patentee after: Chu Zhenwei

Co-patentee after: Yu Yang

Co-patentee after: Li Guoqian

Address before: 214000, No. 28, glue Road, anzhen Town, Xishan District, Jiangsu, Wuxi

Patentee before: WUXI WEIHAIDA MACHINERY MANUFACTURING Co.,Ltd.

TR01 Transfer of patent right
CB03 Change of inventor or designer information

Inventor after: Liu Li

Inventor after: Han Yuqi

Inventor after: Guo Cai

Inventor after: Zhang Caixia

Inventor after: Wan Huilin

Inventor after: Lu Shensheng

Inventor after: Li Guoqian

Inventor before: Fan Yafu

Inventor before: Lu Shensheng

Inventor before: Cheng Quanming

Inventor before: Chu Zhenwei

Inventor before: Yu Yang

Inventor before: Li Guoqian

CB03 Change of inventor or designer information
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20180103

Address after: 063300, 302, building 2, room 3, Qingnian Road youth building, Fengnan District, Hebei, Tangshan City

Co-patentee after: Han Yuqi

Patentee after: Liu Li

Co-patentee after: Guo Cai

Co-patentee after: Zhang Caixia

Co-patentee after: Wan Huilin

Co-patentee after: Lu Shensheng

Co-patentee after: Li Guoqian

Address before: 063300, 302, building 2, room 3, Qingnian Road youth building, Fengnan District, Hebei, Tangshan City

Co-patentee before: Lu Shensheng

Patentee before: Fan Yafu

Co-patentee before: Cheng Quanming

Co-patentee before: Chu Zhenwei

Co-patentee before: Yu Yang

Co-patentee before: Li Guoqian

TR01 Transfer of patent right

Effective date of registration: 20180319

Address after: 102600, No. 3, building 2, building 4, Paradise Road, Beijing, Daxing District, 1, unit 317

Patentee after: BEIJING ZHITOUJIA INTELLECTUAL PROPERTY OPERATION CO.,LTD.

Address before: 063300, 302, building 2, room 3, Qingnian Road youth building, Fengnan District, Hebei, Tangshan City

Co-patentee before: Han Yuqi

Patentee before: Liu Li

Co-patentee before: Guo Cai

Co-patentee before: Zhang Caixia

Co-patentee before: Wan Huilin

Co-patentee before: Lu Shensheng

Co-patentee before: Li Guoqian

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20180504

Address after: 315113 East Village, Wu Town, Yinzhou District, Ningbo, Zhejiang

Patentee after: NINGBO GANGBO ELECTRONICS CO.,LTD.

Address before: 102600 3 floor, 2 building, No. 4 Daxing District Garden Road, Beijing, 1 unit 317

Patentee before: BEIJING ZHITOUJIA INTELLECTUAL PROPERTY OPERATION CO.,LTD.

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20220217

Address after: 315194 Li Huaqiao village, Shounan street, Yinzhou District, Ningbo City, Zhejiang Province (Xinxing Industrial Development Park)

Patentee after: NINGBO DEZHOU PRECISION ELECTRONIC CO.,LTD.

Address before: 315113 East Village, Wu Town, Yinzhou District, Ningbo, Zhejiang

Patentee before: NINGBO GANGBO ELECTRONICS CO.,LTD.

TR01 Transfer of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160511

CF01 Termination of patent right due to non-payment of annual fee